INFINEON BTS7811K

TrilithIC
BTS 7811K
Data Sheet
1
Overview
1.1
Features
• Quad D-MOS switch
• Free configurable as bridge or quad-switch
• Optimized for DC motor management applications
• Low RDS ON: 26 mΩ high-side switch, 14 mΩ low-side
switch (typical values @ 25 °C)
P-TO263-15-1
• Maximum peak current: typ. 42 A @ 25 °C
• Very low quiescent current: typ. 4 µA @ 25 °C
• Small outline, thermal optimized PowerPak
• Load and GND-short-circuit-protection
• Operates up to 40 V
• Status flag for over temperature
• Open load detection in Off-mode
• Overtemperature shut down with hysteresis
• Internal clamp diodes
• PWM capability up to 25kHz
• Cross current free operation up to 13A load current (typ. value @ 12V/150°C)
• Under-voltage detection with hysteresis
Type
Package
BTS 7811K
P-TO263-15-1
1.2
Description
The BTS 7811K is part of the TrilithIC family containing three dies in one package:
One double high-side switch and two low-side switches. The drains of these three
vertical DMOS chips are mounted on separated leadframes. The sources are connected
to individual pins, so the BTS 7811K can be used in H-bridge- as well as in any other
configuration. The double high-side is manufactured in SMART SIPMOS® technology
which combines low RDS ON vertical DMOS power stages with CMOS control circuit. The
protected high-side switch contains the control and diagnosis circuit. To achieve low
RDS ON and fast switching performance, the low-side switches are manufactured in SFET 2 logic level technology.
Data Sheet
1
Rev. 2.0, 2006-07-18
BTS 7811K
1.3
Pin Configuration
(top view)
Molding
Compound
NC
1
Heat-Slug 1
SL1
2
IL1
3
NC
4
IH1
5
ST1
6
SH1
7
DHVS
8
GND
9
IH2
10
ST2
11
SH2
12
18
DL1
Heat-Slug 2
17
DHVS
Heat-Slug 3
IL2
13
16
SL2
14
NC
15
DL2
Figure 1: Pin Assignment
Data Sheet
2
Rev. 2.0, 2006-07-18
BTS 7811K
1.4
Pin Definitions and Functions
Pin No.
Symbol
Function
1
NC
Not connected
2
SL1
Source of low-side switch 1
3
IL1
Analog input of low-side switch 1
4
NC
Not connected
5
IH1
Digital input of high-side switch 1
6
ST1
Status of high-side switch 1; open Drain output
7
SH1
Source of high-side switch 1
8
DHVS
Drain of high-side switches and power supply voltage
9
GND
Ground of high-side switches
10
IH2
Digital input of high-side switch 2
11
ST2
Status of high-side switch 2; open Drain output
12
SH2
Source of high-side switch 2
13
IL2
Analog input of low-side switch 2
14
SL2
Source of low-side switch 2
15
NC
Not connected
16
DL2
Drain of low-side switch 2
Heat-Slug 3
17
DHVS
Drain of high-side switches and power supply voltage
Heat-Slug 2
18
DL1
Drain of low-side switch 1
Heat-Slug 1
Pins written in bold type need power wiring.
Data Sheet
3
Rev. 2.0, 2006-07-18
BTS 7811K
1.5
Functional Block Diagram
DHVS
6
8, 17
ST1
ST2
IH1
IH2
11
5
10
Diagnosis
Biasing and Protection
Driver
IN OUT
0 0 L L
0 1 L H
1 0 H L
1 1 H H
RO1
RO2
12
16
SH2
DL2
9
GND
7
18
SH1
DL1
3
IL1
13
IL2
2
SL1
14
SL2
Figure 2: Block Diagram
Data Sheet
4
Rev. 2.0, 2006-07-18
BTS 7811K
1.6
Circuit Description
Input Circuit
The control inputs IH1,2 consist of TTL/CMOS compatible Schmitt-Triggers with
hysteresis. Buffer amplifiers are driven by these stages and convert the logic signal into
the necessary form for driving the power output stages. The inputs are protected by ESD
clamp-diodes. The inputs IL1 and IL2 are connected to the gates of the standard Nchannel vertical power-MOS-FETs.
Output Stages
The output stages consist of a low RDS ON Power-MOS H-bridge. In H-bridge
configuration, the D-MOS body diodes can be used for freewheeling when commutating
inductive loads. If the high-side switches are used as single switches, positive and
negative voltage spikes which occur when driving inductive loads are limited by
integrated power clamp diodes.
Short Circuit Protection
The outputs are protected against
– output short circuit to ground
– overload (load short circuit).
An internal OP-amp controls the Drain-Source-voltage by comparing the DS-voltagedrop with an internal reference voltage. Above this trippoint the OP-Amp reduces the
output current depending on the junction temperature and the drop voltage.
Overtemperature Protection
The high-side switches incorporate an overtemperature protection circuit with hysteresis
which switches off the output transistors and sets the status output to low.
Undervoltage-Lockout (UVLO)
When VS reaches the switch-on voltage VUVON the IC becomes active with a hysteresis.
The high-side output transistors are switched off if the supply voltage VS drops below the
switch off value VUVOFF.
Open Load Detection
The open load detection of the BTS 7811K works in OFF condition and is based on a
voltage measurement at the source of the high side switch. In order to use the open load
detection a pull up resistor to 5V has to be connected to source of one of the high side
switches. Because in ON condition this pull up resistor would connect the bridge output
to the µC supply it needs to be disconnected by a transistor when the high side switch is
Data Sheet
5
Rev. 2.0, 2006-07-18
BTS 7811K
on. In the data sheet application example (Figure 5) the open load detection would be
used the following way:
• Set IH1 = IH2 = LOW (both high side switches off)
• Set IL2 = LOW, IL1 = HIGH (only low side switch 1 is on)
• Connect Rol (open load pull up) to 5V via transistor
If the load is connected properly it will pull down the voltage at SH2 to a value close to 0V.
If the load is disconnected the resistor will pull the voltage at SH2 to value close to 5V.
If the voltage at SH2 is higher than the open load detection voltage (VOUT(OL)) then
ST2 will be pulled down.
Status Flag
The two status flag outputs are an open drain output with Zener-diode which require a
pull-up resistor, c.f. the application circuit on page 16. ST1 and ST2 provide separate
diagnosis for each high-side switch. Various errors as listed in the table “Diagnosis” are
detected by switching the open drain output ST1/2 to low. Forward current in the
integrated body diode of the highside switch may cause undefined voltage levels at the
corresponding status output. The open load detection can be used to detect a short to
Vs as long as both lowside switches are off and ROL is disconnected from 5V by
BCR192W.
Data Sheet
6
Rev. 2.0, 2006-07-18
BTS 7811K
2
Truthtable and Diagnosis (valid only for the High-Side-Switches)
Flag
IH1
IH2
SH1
Inputs
SH2
ST1 ST2 Remarks
Outputs
0
0
1
1
0
1
0
1
L
L
H
H
L
H
L
H
1
1
1
1
1
1
1
1
stand-by mode
switch2 active
switch1 active
both switches
active
0
1
X
X
X
X
0
1
Z
H
X
X
X
X
Z
H
0
1
1
1
1
1
0
1
detected
Overtemperature high-side switch1 0
1
X
X
L
L
X
X
1
0
1
1
detected
Overtemperature high-side switch2 X
X
0
1
X
X
L
L
1
1
1
0
detected
Overtemperature both high-side
switches
0
0
1
1
0
1
0
1
L
L
L
L
L
L
L
L
1
1
0
0
1
0
1
0
detected
detected
detected
Undervoltage
X
X
L
L
1
1
not detected
Normal operation;
identical with functional truth table
Open load at high-side switch 1
Open load at high-side switch 2
detected
Note: * multiple simultaneous errors are not shown in this table
Inputs:
Outputs:
Status:
0 = Logic LOW
Z = Output in tristate condition
1 = No error
1 = Logic HIGH
L = Output in sink condition
0 = Error
X = don’t care
H = Output in source condition
X = Voltage level undefined
Data Sheet
7
Rev. 2.0, 2006-07-18
BTS 7811K
3
Electrical Characteristics
3.1
Absolute Maximum Ratings
– 40 °C < Tj < 150 °C
Parameter
Symbol
Limit Values
min.
Unit Remarks
max.
High-Side-Switches (Pins DHVS, IH1,2 and SH1,2)
Supply voltage
Supply voltage for full short
circuit protection
HS-drain current
HS-input current
HS-input voltage
VS
VS(SCP)
– 0.3
IS
IIH
VIH
42
V
–
28
V
–
– 14
*
A
TC = 125°C; DC
–5
5
mA
Pin IH1 and IH2
– 10
16
V
Pin IH1 and IH2
– 0.3
5.4
V
–
–5
5
mA
Pin ST1 or ST2
Note: * internally limited
Status Output ST (Pins ST1 and ST2)
Status pull up voltage
Status Output current
VST
IST
Low-Side-Switches (Pins DL1,2, IL1,2 and SL1,2)
Drain- source break down
voltage
VDSL
55
–
V
LS-drain current
IDL
IDL
–21
26
A
–
42
A
–
67
A
VIL = 0 V, ID ≤ 1 mA,
Tj = 25°C
TC = 125°C; DC
tp < 100 ms; ν < 0.1
tp < 1 ms; ν < 0.1
VIL
– 20
20
V
Pin IL1 and IL2
Tj
Tstg
– 40
150
°C
–
– 55
150
°C
–
LS-drain current
TC = 85°C
LS-input voltage
Temperatures
Junction temperature
Storage temperature
Data Sheet
8
Rev. 2.0, 2006-07-18
BTS 7811K
3.1
Absolute Maximum Ratings (cont’d)
– 40 °C < Tj < 150 °C
Parameter
Symbol
Limit Values
min.
Unit Remarks
max.
Thermal Resistances (one HS-LS-Path active)
LS-junction case
HS-junction case
Junction ambient
Rthja = Tj(HS)/(P(HS)+P(LS))
RthjC L
RthjC H
Rthja
–
1.05
K/W
–
1.45
K/W
–
35
K/W device soldered to
reference PCB with
6 cm2 cooling area
ESD Protection (Human Body Model acc. MIL STD 883D, method 3015.7 and EOS/
ESD assn. standard S5.1 - 1993)
Input LS-Switch
Input HS-Switch
Status HS-Switch
Output LS and HS-Switch
VESD
VESD
VESD
VESD
0.5
kV
1
kV
2
kV
4
kV
all other pins connected
to Ground
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
3.2
Operating Range
– 40 °C < Tj < 150 °C
Parameter
Symbol
Limit Values
Unit
Remarks
VUVOFF 42
V
After VS rising
above VUVON
8
18
V
–
– 0.3
15
V
–
– 0.3
20
V
–
0
2
mA
–
– 40
150
°C
–
min.
Supply voltage
VS
Supply voltage for PWM operation VS(PWM)
Input voltages HS
Input voltages LS
Status output current
Junction temperature
VIH
VIL
IST
TjHS
max.
Note: In the operating range the functions given in the circuit description are fulfilled.
Data Sheet
9
Rev. 2.0, 2006-07-18
BTS 7811K
3.3
Electrical Characteristics
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min.
typ.
max.
–
4
9
µA
IH1 = IH2 = 0 V
Tj = 85 °C
–
–
20
µA
IH1 = IH2 = 0 V
–
4
8
mA
IH1 or IH2 = 5 V
–
8
16
mA
IH1 and IH2 = 5 V
–
–
7
µA
2.2
10
mA
VIH = VSH = 0 V
Tj = 85 °C, Vs = 12V
IFH =5 A
Current Consumption HS-switch
Quiescent current
Supply current
IS Q
IS
Leakage current of
highside switch
ISH LK
Leakage current through
logic GND in free
wheeling condition
ILKCL =
–
IFH + ISH
Vs = 12V
Current Consumption LS-switch
Input current
IIL
–
10
100
nA
Leakage current of
lowside switch
IDL LK
–
–
12
µA
VIL = 20 V
VDSL = 0 V
VIL = 0 V
VDSL = 40 V
Tj = 85 °C
Under Voltage Lockout (UVLO) HS-switch
Switch-ON voltage
Switch-OFF voltage
Switch ON/OFF
hysteresis
Data Sheet
VUVON
VUVOFF
VUVHY
–
–
5
V
1.8
–
4.5
V
–
1
–
V
10
VS increasing
VS decreasing
VUVON – VUVOFF
Rev. 2.0, 2006-07-18
BTS 7811K
3.3
Electrical Characteristics (cont’d)
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
min.
typ.
max.
Unit Test Condition
Output Stages
Inverse diode of highside switch; Forwardvoltage
VFH
–
0.8
1.2
V
IFH = 5 A
Inverse diode of lowside
switch; Forward-voltage
VFL
–
0.8
1.2
V
IFL = 5 A
RDS ON H
Static drain-source
on-resistance of highside
switch
–
26
35
mΩ
ISH = 5 A
Tj = 25 °C
RDS ON L
–
14
17
mΩ
ISL = 5 A;
VIL = 5 V
Tj = 25 °C
Static path on-resistance RDS ON
–
–
100
mΩ
Maximum load current for ILmax ccf
cross current free
operation
VIL= 7V; RGate = 50Ω
5
8
–
A
–
10
–
A
–
13
–
A
RDS ON H + RDS ON L
ISH = 5 A; Vs = 12V
Vs > 8V, Tj = 150 °C
Vs = 10V, Tj = 150 °C
Vs = 12V, Tj = 150 °C
Static drain-source
on-resistance of lowside
switch
Note:
Vs = 12V
The device is regarded as cross current free if the reverse flowing charge through the high side switch
is less than 1µC.
i_cross_start
60
20V
IL A
16V
40
12V
30
8V
20
10
0
20
40
60
80
100
120
°C
Tj
160
Figure 3: Start of Cross Conduction vs. IL, VS and junction Temperature Tj
Data Sheet
11
Rev. 2.0, 2006-07-18
BTS 7811K
3.3
Electrical Characteristics (cont’d)
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
min.
Unit Test Condition
typ.
max.
35
48
65
A
–
42
–
A
25
32
42
A
Short Circuit of Highside Switch to GND
Initial peak SC current
tdel = 150µs; VS = 12 V;
VDSH = 12V
Note:
ISCP H
Tj = – 40 °C
Tj = + 25 °C
Tj = + 150 °C
Integrated protection functions are designed to prevent IC destruction under fault conditions. Protection
functions are not designed for continuous or repetitive operation.
Peak short circuit current is significantly lower at VS > 18V.
Short Circuit of Highside Switch to VS
Output pull-down-resistor RO
7
14
42
kΩ
VDSL = 3 V
Thermal Shutdown
Thermal shutdown
junction temperature
Tj SD
155
180
190
°C
–
Thermal switch-on
junction temperature
Tj SO
150
170
180
°C
–
Temperature hysteresis
∆T
–
10
–
°C
∆T = TjSD – TjSO
IST = 1.6 mA
VST = 5 V
IST = 1.6 mA
Status Flag Output ST of Highside Switch
VST L
IST LK
VST Z
td(SToffo+)
–
0.2
0.6
V
–
–
5
µA
–
V
–
–
20
µs
Status change after
td(SToffo-)
negative input slope with
open load 1)
–
–
700
µs
Low output voltage
Leakage current
Zener-limit-voltage
Status change after
positive input slope with
open load 1)
5.4
1)Defined by design. Not subject to production test.
Data Sheet
12
Rev. 2.0, 2006-07-18
BTS 7811K
3.3
Electrical Characteristics (cont’d)
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min.
typ.
max.
td(STofft+)
–
1.6
10
µs
RST = 47 kΩ
Status change after
td(STofft-)
negative input slope with
overtemperature 1)
–
14
100
µs
RST = 47 kΩ
3
4
V
VS = 12 V
RLoad = 12 Ω
VS = 12 V
Status change after
positive input slope with
overtemperature 1)
Open Load Detection in Off Condition
Open Load Detection
Voltage
VOUT(OL)
2
Switching Times of High Side Switch
Turn-On-Time
to 90% VSH
tON
–
100
220
µs
Turn-Off-time
to 10% VSH
tOFF
–
120
250
µs
Slew Rate On
10 to 30% VSH
dV/dtON –
0.5
1.1
V/µs
Slew Rate Off
70 to 40% VSH
-dV/
dtOFF
0.7
1.3
V/µs
–
20
–
ns
–
85
–
ns
–
60
–
ns
–
80
–
ns
–
Switching Times of Low Side Switch
Turn-ON Delay Time1)
Rise Time1)
Switch-Off Delay Time1)
Fall Time1)
td(on)
tr
td(off)
tf
resistive load
ISL = 10 A; VDSL = 12 V
VIL = 5V; RGate= 16Ω
1)Defined by design. Not subject to production test.
Data Sheet
13
Rev. 2.0, 2006-07-18
BTS 7811K
3.3
Electrical Characteristics (cont’d)
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min.
typ.
max.
–
4.5
–
nC
–
12
–
nC
Input charge total
QIS
QID
QI
–
30
60
nC
Input plateau voltage1)
Vplateau
–
2.6
–
V
ISL = 10 A; VS = 12 V
ISL = 10 A; VS = 12 V
ISL = 10 A; VS = 12 V
VIL = 0 to 5 V
ISL = 10 A; VS = 12 V
Gate Charge Characteristics
Input to source charge1)
Input to drain charge1)
1)
Control Inputs of High Side Switches IH1, IH2
H-input voltage
L-input voltage
Input voltage hysterese
H-input current
L-input current
Input series resistance
Zener limit voltage
VIH High
VIH Low
VIH HY
IIH High
IIH Low
RI
VIH Z
–
–
3.0
V
–
1
–
–
V
–
–
0.5
–
V
–
5
30
65
µA
5
14
25
µA
VIH = 5 V
VIH = 0.4 V
2.7
4
6
kΩ
–
5.4
–
–
V
IIH = 1.6 mA
VIL th
–
1.9
3.0
V
–
1.7
–
0.8
1.1
–
Tj = – 40 °C
Tj = + 25 °C
Tj = + 150 °C
Control Inputs IL1, IL2
Gate-threshold-voltage
IDL = 1 mA
1)
Defined by design. Not subject to production test.
Note: The listed characteristics are ensured over the operating range of the integrated
circuit. Typical characteristics specify mean values expected over the production
spread. If not otherwise specified, typical characteristics apply at TA = 25 °C and
VS = 12 V.
Data Sheet
14
Rev. 2.0, 2006-07-18
BTS 7811K
IS
VS
CL
100µF
CS
470nF
IFH1,2
IST LK1
DHVS
IST1
ST1
6
8, 17
IST LK2
IST2
ST2
11
IH1
5
IH2
10
Diagnosis
VDSH2
VDSH1
-VFH2
-VFH1
Biasing and Protection
VST1
VSTL1
VSTZ1
IIH1
VST2
VSTL2
VSTZ2
RO1
IIH1
VIH1
VIH2
Gate
Driver
GND
RO2
Gate
Driver
12
16
SH2
ISH2
DL2
IDL2
IDL LK 2
VUVON
SH1
ISH1
VUVOFF
DL1
IDL1
6
IGND
7
ILKCL
18
IDL LK 1
VIL1
IIL1
IL1
3
IIL2
IL2
13
VIL th 1
VIL2
VIL th 2
2
14
VDSL1
VDSL2
SL1
SL2
-VFL1
-VFL2
ISCP L 1
ISCP L 2
ISL1
ISL2
Figure 4: Test Circuit
HS-Source-Current
Named during Short
Circuit
Named during LeakageCond.
ISH1,2
ISCP H
IDL LK
Data Sheet
15
Rev. 2.0, 2006-07-18
BTS 7811K
Watchdog
Reset
Q
RQ
100 kΩ
RQ
100 kΩ
WD R
CQ
22µF
VCC
TLE
4278G
I
D
CS
10µF
D01
Z39
CD
47nF
DHVS
ST1
RS
VS=12V
6
BCR192W
8, 17
10 kΩ
to µC
RS
ST2 11
Diagnosis
Biasing and Protection
10 kΩ
Can be replaced
by diode when
Short to Vs
detection is not
needed
ROL
560Ohm
IH1
5
IH2
10
optional for
open load
in off
Gate
Driver
RO1
GND
Gate
Driver
RO2
12
SH2
DL2
16
9
µP
7
18
IL1
3
IL2
13
GND
2
14
SL1
SL2
SH1
M
DL1
Figure 5: Application Circuit
Data Sheet
16
Rev. 2.0, 2006-07-18
BTS 7811K
4
Package Outlines
P-TO263-15-1
(Plastic
Footprint
Footprint
Sorts of Packing
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/packages..
SMD = Surface Mounted Device
Data Sheet
17
Dimensions in mm
Rev. 2.0, 2006-07-18
BTS 7811K
Edition June 2006
Published by Infineon Technologies AG,
Am Campeon 1-12,
87559 Neubiberg, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this Data Sheet shall in no event be regarded as a guarantee of conditions
or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including
without limitation warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on
the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the
express written approval of Infineon Technologies, if a failure of such components can reasonably
be expected to cause the failure of that life-support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted
in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet
18
Rev. 2.0, 2006-07-18