IRF IRLR3717

PD - 94718B
IRLR3717
IRLU3717
Applications
l High Frequency Synchronous Buck
Converters for Computer Processor Power
l High Frequency Isolated DC-DC
Converters with Synchronous Rectification
for Telecom and Industrial Use
HEXFET® Power MOSFET
VDSS RDS(on) max
4.0m:
20V
Benefits
l Very Low RDS(on) at 4.5V VGS
l Ultra-Low Gate Impedance
l Fully Characterized Avalanche Voltage
and Current
D-Pak
IRLR3717
Qg
21nC
I-Pak
IRLU3717
Absolute Maximum Ratings
Max.
Units
VDS
Drain-to-Source Voltage
Parameter
20
V
VGS
Gate-to-Source Voltage
± 20
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
120
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
81
IDM
Pulsed Drain Current
460
PD @TC = 25°C
Maximum Power Dissipation
89
PD @TC = 100°C
Maximum Power Dissipation
44
TJ
Linear Derating Factor
Operating Junction and
TSTG
Storage Temperature Range
c
f
f
A
W
W/°C
°C
0.59
-55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Thermal Resistance
Parameter
RθJA
Junction-to-Case †
Junction-to-Ambient (PCB Mount)
RθJA
Junction-to-Ambient †
RθJC
g
†
Typ.
Max.
Units
–––
1.69
°C/W
–––
50
–––
110
Notes  through † are on page 11
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1
1/24/05
IRLR/U3717
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
BVDSS
Drain-to-Source Breakdown Voltage
20
∆ΒVDSS/∆TJ
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
V
Conditions
–––
–––
VGS = 0V, ID = 250µA
–––
12
–––
–––
3.4
4.0
mV/°C Reference to 25°C, ID = 1mA
mΩ VGS = 10V, ID = 15A
–––
4.6
5.5
VGS = 4.5V, ID = 12A
VGS(th)
Gate Threshold Voltage
1.55
2.0
2.45
V
∆VGS(th)/∆TJ
Gate Threshold Voltage Coefficient
–––
-6.4
–––
mV/°C
IDSS
Drain-to-Source Leakage Current
µA
VDS = 16V, VGS = 0V
nA
VGS = 20V
IGSS
gfs
Qg
–––
–––
1.0
–––
–––
150
Gate-to-Source Forward Leakage
–––
–––
100
Gate-to-Source Reverse Leakage
–––
–––
-100
Forward Transconductance
49
–––
–––
e
e
VDS = VGS, ID = 250µA
VDS = 16V, VGS = 0V, TJ = 125°C
VGS = -20V
S
VDS = 10V, ID = 12A
nC
VGS = 4.5V
Total Gate Charge
–––
21
31
Qgs1
Pre-Vth Gate-to-Source Charge
–––
6.4
–––
Qgs2
Post-Vth Gate-to-Source Charge
–––
1.9
–––
Qgd
Gate-to-Drain Charge
–––
7.2
–––
ID = 12A
Qgodr
–––
5.5
–––
See Fig. 16
Qsw
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
–––
9.1
–––
Qoss
Output Charge
–––
13
–––
td(on)
Turn-On Delay Time
–––
14
–––
tr
Rise Time
–––
14
–––
td(off)
Turn-Off Delay Time
–––
5.8
–––
tf
Fall Time
–––
16
–––
Ciss
Input Capacitance
–––
2830
–––
Coss
Output Capacitance
–––
920
–––
Crss
Reverse Transfer Capacitance
–––
420
–––
VDS = 10V
nC
VDS = 10V, VGS = 0V
VDD = 10V, VGS = 4.5V
ns
e
ID = 12A
Clamped Inductive Load
VGS = 0V
pF
VDS = 10V
ƒ = 1.0MHz
Avalanche Characteristics
EAS
Parameter
Single Pulse Avalanche Energy
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
c
d
c
Typ.
Max.
Units
–––
460
mJ
–––
12
A
–––
8.9
mJ
Diode Characteristics
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
–––
ISM
(Body Diode)
Pulsed Source Current
–––
–––
VSD
(Body Diode)
Diode Forward Voltage
–––
trr
Reverse Recovery Time
–––
Qrr
Reverse Recovery Charge
–––
ton
Forward Turn-On Time
2
c
120
f
Conditions
MOSFET symbol
A
D
460
showing the
integral reverse
–––
1.0
V
p-n junction diode.
TJ = 25°C, IS = 12A, VGS = 0V
22
33
ns
13
19
nC
G
S
e
TJ = 25°C, IF = 12A, VDD = 10V
di/dt = 100A/µs
e
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
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IRLR/U3717
1000
1000
100
BOTTOM
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
10V
6.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
10
1
2.5V
0.1
0.1
1
10
10
2.5V
20µs PULSE WIDTH
Tj = 175°C
20µs PULSE WIDTH
Tj = 25°C
0.01
1.0
0.1
100
1
10
100
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID, Drain-to-Source Current (Α)
BOTTOM
100
VGS
10V
6.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
T J = 175°C
100
10
T J = 25°C
1
VDS = 25V
20µs PULSE WIDTH
0.1
ID = 30A
VGS = 10V
1.5
1.0
0.5
0
2
4
6
VGS, Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
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8
-60 -40 -20 0
20 40 60 80 100 120 140 160 180
T J , Junction Temperature (°C)
Fig 4. Normalized On-Resistance
vs. Temperature
3
IRLR/U3717
100000
6.0
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
C rss = C gd
VGS, Gate-to-Source Voltage (V)
ID= 12A
C, Capacitance(pF)
C oss = C ds + C gd
10000
Ciss
Coss
1000
Crss
5.0
VDS= 16V
VDS= 10V
4.0
3.0
2.0
1.0
0.0
100
1
10
100
0
VDS, Drain-to-Source Voltage (V)
5
10
1000.00
25
30
10000
ID, Drain-to-Source Current (A)
T J = 25°C
ISD, Reverse Drain Current (A)
20
Fig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance vs.
Drain-to-Source Voltage
T J = 175°C
100.00
10.00
OPERATION IN THIS AREA
LIMITED BY R DS(on)
1000
100
100µsec
10
1msec
Tc = 25°C
Tj = 175°C
Single Pulse
VGS = 0V
1.00
10msec
1
0.0
0.5
1.0
1.5
2.0
VSD, Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
15
QG Total Gate Charge (nC)
2.5
0
1
10
100
1000
VDS, Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
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IRLR/U3717
125
VGS(th) Gate threshold Voltage (V)
3.0
Limited By Package
ID, Drain Current (A)
100
75
50
25
2.5
2.0
ID = 250µA
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
-75 -50 -25
175
0
25
50
75 100 125 150 175 200
T J , Temperature ( °C )
T C , Case Temperature (°C)
Fig 9. Maximum Drain Current vs.
Case Temperature
Fig 10. Threshold Voltage vs. Temperature
Thermal Response ( Z thJC )
10
1
D = 0.50
0.20
0.10
0.05
0.1
τJ
0.02
0.01
R1
R1
τJ
τ1
τ1
R2
R2
τ2
R3
R3
τ3
τ2
Ci= τi/Ri
Ci= τi/Ri
τC
τ
τ3
Ri (°C/W) τi (sec)
0.771
0.000430
0.629
0.291
0.006491
0.072119
0.01
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
12
2000
EAS , Single Pulse Avalanche Energy (mJ)
( Ω)
RDS (on), Drain-to -Source On Resistance m
IRLR/U3717
ID = 15A
10
8
6
TJ = 125°C
4
TJ = 25°C
2
2.0
4.0
6.0
8.0
10.0
ID
8.2A
9.7A
BOTTOM 12A
TOP
1500
1000
500
0
25
VGS, Gate-to-Source Voltage (V)
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
Fig 12. Typical On-Resistance Vs. Gate Voltage
Fig 13a. Maximum Avalanche Energy
vs. Drain Current
LD
VDS
15V
+
L
VDS
D.U.T
RG
VGS
20V
IAS
tp
DRIVER
+
V
- DD
VDD D.U.T
VGS
A
Pulse Width < 1µs
Duty Factor < 0.1%
0.01Ω
Fig 13b. Unclamped Inductive Test Circuit
V(BR)DSS
tp
Fig 14a. Switching Time Test Circuit
VDS
90%
10%
VGS
I AS
Fig 13c. Unclamped Inductive Waveforms
6
td(on)
tr
td(off)
tf
Fig 14b. Switching Time Waveforms
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IRLR/U3717
D.U.T
Driver Gate Drive
P.W.
+
ƒ
+
‚
-
-
„
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
+

RG
•
•
•
•
dv/dt controlled by R G
Driver same type as D.U.T.
I SD controlled by Duty Factor "D"
D.U.T. - Device Under Test
V DD
P.W.
Period
VGS=10V
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D=
Period
+
-
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
VDD
Forward Drop
Inductor Curent
ISD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
Id
Current Regulator
Same Type as D.U.T.
Vds
Vgs
50KΩ
12V
.2µF
.3µF
D.U.T.
+
V
- DS
Vgs(th)
VGS
3mA
IG
ID
Current Sampling Resistors
Fig 16a. Gate Charge Test Circuit
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Qgs1 Qgs2
Qgd
Qgodr
Fig 16b. Gate Charge Waveform
7
IRLR/U3717
Power MOSFET Selection for Non-Isolated DC/DC Converters
Control FET
Synchronous FET
Special attention has been given to the power losses
in the switching elements of the circuit - Q1 and Q2.
Power losses in the high side switch Q1, also called
the Control FET, are impacted by the Rds(on) of the
MOSFET, but these conduction losses are only about
one half of the total losses.
The power loss equation for Q2 is approximated
by;
*
Ploss = Pconduction + Pdrive + Poutput
(
2
Ploss = Irms × Rds(on)
)
Power losses in the control switch Q1 are given
by;
+ (Qg × Vg × f )
Ploss = Pconduction+ Pswitching+ Pdrive+ Poutput
⎛Q
⎞
+ ⎜ oss × Vin × f + (Qrr × Vin × f )
⎝ 2
⎠
This can be expanded and approximated by;
*dissipated primarily in Q1.
Ploss = (Irms 2 × Rds(on ) )
⎛
Qgd
+⎜I ×
× Vin ×
ig
⎝
⎞
⎞ ⎛
Qgs 2
f⎟ + ⎜ I ×
× Vin × f ⎟
ig
⎠ ⎝
⎠
+ (Qg × Vg × f )
+
⎛ Qoss
× Vin × f ⎞
⎝ 2
⎠
This simplified loss equation includes the terms Qgs2
and Qoss which are new to Power MOSFET data sheets.
Qgs2 is a sub element of traditional gate-source
charge that is included in all MOSFET data sheets.
The importance of splitting this gate-source charge
into two sub elements, Qgs1 and Qgs2, can be seen from
Fig 16.
Qgs2 indicates the charge that must be supplied by
the gate driver between the time that the threshold
voltage has been reached and the time the drain current rises to Idmax at which time the drain voltage begins to change. Minimizing Q gs2 is a critical factor in
reducing switching losses in Q1.
Qoss is the charge that must be supplied to the output capacitance of the MOSFET during every switching cycle. Figure A shows how Qoss is formed by the
parallel combination of the voltage dependant (nonlinear) capacitance’s Cds and Cdg when multiplied by
the power supply input buss voltage.
For the synchronous MOSFET Q2, Rds(on) is an important characteristic; however, once again the importance of gate charge must not be overlooked since
it impacts three critical areas. Under light load the
MOSFET must still be turned on and off by the control IC so the gate drive losses become much more
significant. Secondly, the output charge Qoss and reverse recovery charge Qrr both generate losses that
are transfered to Q1 and increase the dissipation in
that device. Thirdly, gate charge will impact the
MOSFETs’ susceptibility to Cdv/dt turn on.
The drain of Q2 is connected to the switching node
of the converter and therefore sees transitions between ground and Vin. As Q1 turns on and off there is
a rate of change of drain voltage dV/dt which is capacitively coupled to the gate of Q2 and can induce
a voltage spike on the gate that is sufficient to turn
the MOSFET on, resulting in shoot-through current .
The ratio of Qgd/Qgs1 must be minimized to reduce the
potential for Cdv/dt turn on.
Figure A: Qoss Characteristic
8
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IRLR/U3717
D-Pak (TO-252AA) Package Outline
Dimensions are shown in millimeters (inches)
D-Pak (TO-252AA) Part Marking Information
EXAMPLE: T HIS IS AN IRFR120
WITH AS SEMBLY
LOT CODE 1234
ASSEMBLED ON WW 16, 1999
IN THE ASS EMBLY LINE "A"
PART NUMBER
INTERNAT IONAL
RECTIF IER
LOGO
Note: "P" in assembly line position
indicates "Lead-Free"
IRFU120
12
916A
34
AS SEMBLY
LOT CODE
DATE CODE
YEAR 9 = 1999
WEEK 16
LINE A
OR
PART NUMBER
INTERNATIONAL
RECT IFIER
LOGO
IRFU120
12
ASSEMBLY
LOT CODE
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34
DATE CODE
P = DES IGNATES LEAD-F REE
PRODUCT (OPT IONAL)
YEAR 9 = 1999
WEEK 16
A = AS SEMBLY SIT E CODE
9
IRLR/U3717
I-Pak (TO-251AA) Package Outline
Dimensions are shown in millimeters (inches)
I-Pak (TO-251AA) Part Marking Information
EXAMPLE: T HIS IS AN IRF U120
WIT H AS SEMBLY
LOT CODE 5678
AS SEMBLE D ON WW 19, 1999
IN T HE ASSEMBLY LINE "A"
PART NUMBER
INT E RNAT IONAL
RECT IFIER
LOGO
IRFU120
919A
56
78
ASSE MBLY
LOT CODE
Note: "P" in as s embly line
pos ition indicates "Lead-F ree"
DAT E CODE
YEAR 9 = 1999
WEEK 19
LINE A
OR
INT ERNAT IONAL
RECT IFIER
LOGO
PART NUMBER
IRF U120
56
ASS EMBLY
LOT CODE
10
78
DAT E CODE
P = DESIGNAT ES LEAD-FREE
PRODUCT (OPT IONAL)
YEAR 9 = 1999
WEEK 19
A = ASS EMBLY SIT E CODE
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IRLR/U3717
D-Pak (TO-252AA) Tape & Reel Information
Dimensions are shown in millimeters (inches)
TR
TRR
16.3 ( .641 )
15.7 ( .619 )
12.1 ( .476 )
11.9 ( .469 )
FEED DIRECTION
TRL
16.3 ( .641 )
15.7 ( .619 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
13 INCH
16 mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481.
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature.
‚ Starting TJ = 25°C, L = 6.4mH, RG = 25Ω,
IAS = 12A.
ƒ Pulse width ≤ 400µs; duty cycle ≤ 2%.
„ Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 30A.
… When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to
application note #AN-994.
† Rθ is measured at TJ approximately 90°C
Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 01/05
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