Fiber Optics Small Form Factor Single Mode 1300 nm Multirate up to 155 Mbit/s Transceiver 2x5 Pinning with LC™ Connector V23818-C18-Lxx/L4xx Features • • • • • • • • • • • • • • • • 1) 2) Small Form Factor transceiver Multisource 2x5 footprint, SFF MSA compliant1) Small footprint for high port density RJ-45 style LC™ connector system Half the size of SC Duplex 1x9 transceiver Single power supply (3.3 V) Extremely low power consumption, 600 mW typical Leading performance for receiver sensitivity, –34 dBm typical Loss of optical signal indicator Laser disable, LVTTL input LVPECL differential inputs and outputs Suitable for multirate applications up to 155 Mbit/s – Fast Ethernet (FE) compatible Class 1 FDA and IEC laser safety compliant UL 94 V-0 certified Compliant with FCC (Class B) and EN 55022 Distance up to 15 km/21 km on single mode fiber (SMF)2) File: 1119 File: 1120 Current MSA documentation can be found at www.infineon.com/fiberoptics. IR (Intermediate Reach): up to 15 km (ITU-T G.957), up to 21 km (Telcordia GR-253). For ordering information see next page. LCTM is a trademark of Lucent. Data Sheet 1 2003-06-06 V23818-C18-Lxx/L4xx Ordering Information Ordering Information Part Number Range1) Signal Detect Stock Products V23818-C18-L47 IR LVTTL V23818-C18-L46 Products on Request V23818-C18-L37 IR LVPECL V23818-C18-L36 V23818-C18-L45 IR LVTTL V23818-C18-L49 V23818-C18-L35 IR LVPECL V23818-C18-L39 V23818-C18-L436 IR LVPECL 1) Temperature Data Outputs Collar In- Outif SD is Low put put 0°C...70°C –40°C...85°C Switched to Low yes AC AC 0°C...70°C –40°C...85°C 0°C...70°C –40°C...85°C 0°C...70°C –40°C...85°C –40°C...85°C Switched to Low yes DC DC Switched to Low no AC AC Switched to Low no DC DC Active DC DC yes IR (Intermediate Reach): up to 15 km (ITU-T G.957), up to 21 km (Telcordia GR-253). Data Sheet 2 2003-06-06 V23818-C18-Lxx/L4xx Pin Configuration Pin Configuration Tx MS HL HL 10 9 8 7 6 TOP VIEW Rx MS 1 2 3 4 5 HL HL File: 1331 Figure 1 Pin Description Pin No. Symbol Level/Logic Description 1 Ground Receiver signal ground 2 VEEr VCCr Power supply Receiver power supply 3 SD LVTTL or LVPECL output1) Receiver optical input level monitor 4 RD– LVPECL output Receiver data out bar 5 RD+ LVPECL output Receiver data out 6 Power supply Transmitter power supply 7 VCCt VEEt Ground Transmitter signal ground 8 TDis LVTTL input Transmitter disable 9 TD+ LVPECL input Transmitter data in 10 TD– LVPECL input Transmitter data in bar MS Mounting studs HL Housing leads 1) LVPECL output active high for V23818-C18-L3x/L436. LVTTL output active high for V23818-C18-L4x. Data Sheet 3 2003-06-06 V23818-C18-Lxx/L4xx Pin Configuration VEEr / VEEt Connect pins 1 and 7 to signal ground. VCCr / VCCt A 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD– Transmitter data LVPECL level inputs. For V23818-C18-L4x terminated and AC coupled internally. For V23818-C18-L3x/L436 use termination and coupling as shown in the termination scheme. RD– / RD+ Receiver data LVPECL level outputs. For V23818-C18-L4x biased and AC coupled internally. For V23818-C18-L3x/L436 use termination and coupling as shown in the termination scheme. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output for V23818-C18-L4x. LVPECL output for V23818-C18-L3x/L436. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground. Data Sheet 4 2003-06-06 V23818-C18-Lxx/L4xx Description Description This data sheet describes the Infineon single mode ATM transceiver, which complies with the ATM Forum’s Network Compatible ATM for Local Network Applications document and ANSI’s Broadband ISDN - Customer Installation Interfaces, Physical Media Dependent Specification, T1E1.2, compliant to SONET OC-3, IR-1 (Telcordia GR-253-CORE) and SDH STM-1/S-1.1 (ITU-T G.957). This transceiver is also suitable for multirate applications. The performance at lower datarates may vary from application to application and is link dependent. Refer to Infineon Application Note 97 for more information. ATM was developed to facilitate solutions in multimedia applications and real time transmission. The data rate is scalable, and the ATM protocol is the basis of the broadband public networks being standardized in the International Telecommunications Union (ITU), the former International Telegraph and Telephone Consultative Committee (CCITT). ATM can also be used in local private applications. The Infineon single mode ATM transceiver is a single unit comprised of a transmitter, a receiver, and an LC receptacle. This design frees the customer from many alignment and PC board layout concerns. The module is designed for low cost LAN and WAN applications. It can be used as the network end device interface in workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, and intelligent hubs, as well as local and wide area ATM switches. This transceiver operates at up to 155.520 Mbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible. Data Sheet 5 2003-06-06 V23818-C18-Lxx/L4xx Description Functional Description of SFF 2x5 Pin Row Transceiver This transceiver is designed to transmit serial data via single mode fiber. Automatic Shut-Down Tx Coupling Unit TDis TD− TD+ e/o Laser Driver Laser o/e Power Control Monitor Rx Coupling Unit RD− RD+ Limiting Amp TIA Single Mode Fiber o/e SD File: 1351 Figure 2 Functional Diagram The receiver component converts the optical serial data into LVPECL compatible electrical data (RD+ and RD–). The Signal Detect (SD, active high) shows whether an optical signal is present. The transmitter converts LVPECL compatible electrical serial data (TD+ and TD–) into optical serial data. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser eye safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage (VCCt) drops below the reset threshold (VTH). It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A high signal on TDis enables the transmitter. If TDis is low or not connected the transmitter is not affected. Data Sheet 6 2003-06-06 V23818-C18-Lxx/L4xx Description Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) Class 1C Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 18 GHz (13.97) *) .550 *) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches Figure 3 Data Sheet File: 1501 Transceiver Pitch 7 2003-06-06 V23818-C18-Lxx/L4xx Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Package Power Dissipation Supply Voltage Data Input Levels Differential Data Input Voltage Swing Storage Ambient Temperature Hand Lead Soldering Temp/Time Wave Soldering Temp/Time Aqueous Wash Pressure VCC–VEE VIDpk-pk Limit Values min. max. 0.9 4 VCC+0.5 VCC–0.5 5 –40 85 260/10 260/10 < 110 Unit W V V V °C °C/s °C/s psi Exceeding any one of these values may destroy the device immediately. Data Sheet 8 2003-06-06 V23818-C18-Lxx/L4xx Technical Data Recommended Operating Conditions Parameter Symbol 1) 3) Ambient Temperature Ambient Temperature2) 3) Power Supply Voltage Transmitter Supply Current Tx4) Data Input High Voltage DC/DC Differential Data Input Voltage Swing AC/AC5) Data Input Low Voltage DC/DC Input Data Rise/Fall, 10% - 90% Receiver Supply Current Rx4) Output Current Input Center Wavelength 1) 2) 3) 4) 5) min. 0 –40 3.14 TAMB VCC–VEE ICCt VIH–VCC VIDpk-pk VIL–VCC tR , tF ICCr IO λC Limit Values typ. max. 70 85 3.3 3.46 Unit °C V –1165 500 110 –880 3200 mA mV mV –1810 0.4 –1475 1.3 mV ns 1260 130 25 1360 mA mA nm Only for V23818-C18-Lx5/Lx7. Only for V23818-C18-Lx6/Lx9/L436. Ambient operating temperature requires a 2 ms–1 airflow over the device. For VCC–VEE (min., max.). 50% duty cycle. The supply current does not include the load drive current of the receiver output. Add max. 45 mA for the three outputs. Load is 50 Ω to VCC–2 V. V23818-C18-L4x are internally AC coupled. External coupling capacitors required for V23818-C18-L3x/L436. The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 9 2003-06-06 V23818-C18-Lxx/L4xx Technical Data Transmitter Electro-Optical Characteristics Transmitter Symbol Limit Values min. typ. Unit max. Output Power (Average)1) PO –15 –8 dBm Center Wavelength λC 1260 1360 nm Spectral Width (FWHM) Dl 7.7 nm Extinction Ratio (Dynamic) ER 8.2 Output Rise Time 0.6 2.5 ns Output Fall Time tR tF 0.6 3 ns Reset Threshold for VCCt 2) VTH 2.7 V Power on Delay 2) tRES 30 ms Eye Diagram3) ED Jitter Generation JGEpk-pk JGERMS TDis Assert Voltage LVTTL VTDH TDis Deassert Voltage LVTTL VTDL TDis Assert Time4) tASS tDAS TDis Deassert Time5) 1) 2) 3) 4) 5) dB ITU-T G.957 mask pattern 0.1 UI 0.01 UI 2 V 0.8 V 0.4 1 ms 0.06 10 µs Into single mode fiber, 9 µm diameter. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. Transmitter meets ANSI T1E1.2, SONET OC-3, and ITU-T G.957 mask patterns. TDis assertion to laser shutdown. TDis reassertion to laser startup. Jitter The transceiver is specified to meet the SONET/SDH Jitter performance as outlined in ITU-T G.958 and Telcordia GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The Jitter Generation specifications are referenced to the optical OC-3 signals. If no or minimum jitter is applied to the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter on the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI RMS, maximum and 0.1 UI pk-pk, maximum. For SDH, 10 mUI RMS, maximum. Both are measured with a 12 kHz 1.3 MHz filter in line. A UI is a Unit Interval, which is equivalent to one bit slot. At OC-3, the bit slot is 6.4 ns, so the Jitter Generation specification translates to 64 ps RMS, max. and 640 ps pk-pk, max. Data Sheet 10 2003-06-06 V23818-C18-Lxx/L4xx Technical Data Receiver Electro-Optical Characteristics Receiver Symbol Limit Values min. Sensitivity (Average Power)1) Saturation (Average Power) Signal Detect Assert Level2) Signal Detect Deassert Level3) Signal Detect Hysteresis Signal Detect Assert Time Signal Detect Deassert Time Data Output High Voltage DC/DC 4) PIN PSAT PSDA PSDD PSDA –PSDD tASS tDAS VOH–VCC typ. max. –34 –29 –8 –45 dBm dBm 3 Differential Data Output Voltage VODpk-pk 1000 Swing AC/AC dBm dBm –29 –1110 Unit dB 100 µs 350 µs –650 mV 2000 mV –1300 mV VCC mV Data Output Low Voltage DC/DC4) VOL–VCC Signal Detect Output High Voltage LVPECL5) 6) VSDH–VEE VCC Signal Detect Output Low Voltage LVPECL5) 6) VSDL–VEE VCC Signal Detect Output High Voltage LVTTL5) 7) VSDH Signal Detect Output Low Voltage LVTTL5) 7) VSDL 0.5 V Output Data Rise/Fall Time, 20% - 80% tR , tF 1 ns Output SD Rise/Fall Time tR , tF 40 ns 1) 2) 3) 4) 5) 6) 7) –1800 –1200 –1900 –820 VCC mV –1580 2.4 V Minimum average optical power at which the BER is less than 1x10–10. Measured with a 223–1 NRZ PRBS. Worst case receiver sensitivity at 25°C is –31 dBm (beginning of life). An increase in optical power of data signal above the specified level will cause the Signal Detect to switch from a low state to a high state (high active output). A decrease in optical power of data signal below the specified level will cause the Signal Detect to switch from a high state to a low state. Load is 100 Ω differential. Measured under DC conditions at 25°C. For dynamic measurements a tolerance of 50 mV should be added. Only for V23818-C18-L3x/L436. Only for V23818-C18-L4x. Data Sheet 11 2003-06-06 V23818-C18-Lxx/L4xx Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 1300 nm Total Output Power (as defined by IEC: 7 mm aperture at 14 mm distance) 2 mW Total Output Power (as defined by FDA: 7 mm aperture at 20 cm distance) 180 µW Beam Divergence 4° FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 4 Required Labels Indication of laser aperture and beam 10 9 8 7 6 Tx Top view Rx 1 2 3 4 5 File: 1332 Figure 5 Data Sheet Laser Emission 12 2003-06-06 V23818-C18-Lxx/L4xx EMI-Recommendations EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When high speed components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows: for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an εr of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. Data Sheet 13 2003-06-06 V23818-C18-Lxx/L4xx Recommended Termination Schemes Recommended Termination Schemes 2x5 DC/DC Transceiver 9 100 Ω VCC C6 TD− 10 C8 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − L1 VCC 3.3 V C1 Serializer/ Deserializer L2 C3 C10 C2 SD C4 R1 SerDat In − C9 C5 SerDat In + Receiver PLL etc. R3 Signal Detect Limiting Amplifier C7 ECL/ PECL Driver TDis SFF Transceiver PreAmp SerDat Out + R5 TD+ VCC SerDes R4 7 R2 Laser Driver VEEt C1/2/3 = 4.7 ... 10 µF C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1 = 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip). = 150 Ω R2/3 = Biasing for outputs depending on Serializer. R4/5 Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1392 Figure 6 Data Sheet 14 2003-06-06 V23818-C18-Lxx/L4xx Recommended Termination Schemes 2x5 AC/AC Transceiver VCC SerDes 7 VCC TD+ 9 SerDat Out + TD− 10 C4 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − TDis L1 VCC 3.3 V C1 SFF Transceiver Serializer/ Deserializer L2 C3 C6 C2 SerDat In − C5 Receiver PLL etc. R4 SerDat In + R3 Limiting Amplifier R2 SD R1 Signal Detect PreAmp ECL/ PECL Driver R6 100 Ω R5 Laser Driver VEEt C1/2/3 C4/5/6 = 4.7 ... 10 µF = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1393 Figure 7 Data Sheet 15 2003-06-06 V23818-C18-Lxx/L4xx Package Outlines Package Outlines a) recommended bezel position Drawing shown is with collar Dimensions in mm [inches] File: 1212 Figure 8 Data Sheet 16 2003-06-06 V23818-C18-Lxx/L4xx Revision History: 2003-06-06 Previous Version: 2002-01-01 Page DS1 Subjects (major changes since last revision) Document completely revised; V23818-C18-L79 deleted, V23818-C18-L7xx separated For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-06-06 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.