n-Channel Power MOSFET OptiMOS™ BSC0902NS Data Sheet 2.0, 2011-03-01 Final Industrial & Multimarket OptiMOS™ Power-MOSFET BSC0902NS 1 Description OptiMOS™30V products are class leading power MOSFETs for highest power density and energy efficient solutions. Ultra low gate and output charges together with lowest on state resistance in small footprint packages make OptiMOS™ 30V the best choice for the demanding requirements of voltage regulator solutions in Servers, Datacom and Telecom applications. Super fast switching Control FETs together with low EMI Sync FETs provide solutions that are easy to design in. OptiMOS™ products are available in high performance packages to tackle your most challenging applications giving full flexibility in optimizing space, efficiency and cost. OptiMOS™ products are designed to meet and exceed the energy efficiency and power density requirements of the sharpened next generation voltage regulation standards in computing applications Features • • • • • • • • Optimized for high performance buck converters 100% avalanche tested Very low on-resistance RDS(on) @ VGS=4.5 V N-channel Qualified according to JEDEC1) for target applications Superior thermal resistance Pb-free plating; RoHS compliant Halogen-free according to IEC61249-2-21 Applications • • • • On board power for server Power managment for high performance computing Synchronous rectification High power density point of load converters Table 1 Key Performance Parameters Parameter Value Unit Related Links VDS 30 V IFX OptiMOS webpage RDS(on),max 2.6 mΩ IFX OptiMOS product brief ID 100 A IFX OptiMOS spice models QOSS 16 nC IFX Design tools Qg.typ 26 Type Package Marking BSC0902NS PG-TDSON-8 0902NS 1) J-STD20 and JESD22 Final Data Sheet 1 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS 2 Maximum ratings at Tj = 25 °C, unless otherwise specified. Table 2 Maximum ratings Parameter Symbol Values Unit Note / Test Condition A VGS=10 V, TC=25 °C Min. Typ. Max. - - 100 - - 67 VGS=10 V, TC=100 °C - - 91 VGS=4.5 V, TC=25 °C - - 58 VGS=4.5 V, TC=100 °C - - 24 VGS=10 V, TA=25 °C, RthJA=50 K/W1)) ID,pulse - - 400 TC=25 °C Avalanche current, single pulse IAS - - 50 Avalanche energy, single pulse EAS - - 40 mJ Gate source voltage VGS -20 - 20 V Power dissipation Ptot - - 48 W - - 2.5 -55 - 150 Continuous drain current ID Pulsed drain current2) 3) Operating and storage temperature Tj,Tstg ID=40 A,RGS=25 Ω TC=25 °C TA=25 °C, RthJA=50 K/W1)) °C IEC climatic category; DIN IEC 68-1 55/150/56 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 2) See figure 3 for more detailed information 3) See figure 13 for more detailed information 3 Thermal characteristics Table 3 Thermal characteristics Parameter Symbol Thermal resistance, junction - case RthJC Values Unit Min. Typ. Max. - - 2.6 - - 20 Note / Test Condition K/W top Device on PCB RthJA 50 6 cm2 cooling area1) 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air Final Data Sheet 2 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics 4 Electrical characteristics Electrical characteristics, at Tj=25 °C, unless otherwise specified. Table 4 Static characteristics Parameter Symbol Drain-source breakdown voltage V(BR)DSS Values Min. Typ. Max. 30 - - Unit Note / Test Condition V VGS=0 V, ID=1.0 mA Gate threshold voltage VGS(th) 1 - 2.2 Zero gate voltage drain current IDSS - 0.1 1 - 10 100 - 10 100 nA VGS=20 V, VDS=0 V - 2.8 3.5 mΩ VGS=4.5 V, ID=30 A, - 2.2 2.6 Gate-source leakage current IGSS Drain-source on-state resistance RDS(on) VDS=VGS, ID=250 µA VDS=30 V, VGS=0 V, Tj=125 °C VGS=10 V, ID=30 A, Gate resistance RG - 0.9 - Ω Transconductance gfs 55 110 - S Table 5 VDS=30 V, VGS=0 V, Tj=25 °C µA |VDS|>2|ID|RDS(on)max, ID=30 A Dynamic characteristics Parameter Symbol Values Min. Typ. Max. Input capacitance Ciss - 1700 - Output capacitance Coss - 600 - Reverse transfer capacitance Crss - 88 - Turn-on delay time td(on) - 4.2 - Rise time tr - 5.2 - Turn-off delay time td(off) - 21 - Fall time tf - 3.6 - Final Data Sheet 3 Unit Note / Test Condition pF VGS=0 V, VDS=15 V, f=1 MHz ns VDD=15 V, VGS=10 V, ID=30 A, RG= 1.6 Ω 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics Table 6 Gate charge characteristics1) Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition nC VDD=15 V, ID=30 A, VGS=0 to 4.5 V Gate to source charge Qgs - 4.4 - Gate charge at threshold Qg(th) - 2.7 - Gate to drain charge Qgd - 4 - Switching charge Qsw - 5.6 - Gate charge total Qg - 13 - Gate plateau voltage Vplateau - 2.6 - V Gate charge total Qg - 26 - nC Gate charge total, sync. FET Qg(sync) - 11 - VDS=0.1 V, VGS=0 to 4.5 V Output charge Qoss - 16 - VDD=15 V, VGS=0 V VDD=15 V, ID=30 A, VGS=0 to 10V 1) See figure 16 for gate charge parameter definition Table 7 Reverse diode characteristics Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition A TC=25 °C Diode continuous forward current Is - - 44 Diode pulse current IS,pulse - - 175 Diode forward voltage VSD - 0.83 1 V VGS=0 V, IF=30 A, Tj=25 °C Reverse recovery charge Qrr - 15 - nC VR=15 V, IF=Is, dIF/dt=400 A/µs Final Data Sheet 4 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics diagrams 5 Electrical characteristics diagrams Table 8 1 Power dissipation 2 Drain current Ptot = f(TC) ID=f(TC); parameter:VGS Table 9 3 Safe operating area TC=25 °C ID=f(VDS); Tj=25 °C; D=0; parameter: Tp Final Data Sheet 4 Max. transient thermal impedance Z(thJC)=f(tp); parameter: D=tp/T 5 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics diagrams Table 10 5 Typ. output characteristics TC=25 °C 6 Typ. drain-source on-state resistance ID=f(VDS); Tj=25 °C; parameter: VGS RDS(on)=f(ID); Tj=25 °C; parameter: VGS Table 11 7 Typ. transfer characteristics 8 Typ. forward transconductance ID=f(VGS); |VDS|>2|ID|RDS(on)max gfs=f(ID); Tj=25 °C Final Data Sheet 6 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics diagrams Table 12 9 Drain-source on-state resistance 10 Typ. gate threshold voltage RDS(on)=f(Tj); ID=30 A; VGS=10 V VGS(th)=f(Tj); VGS=VDS; ID=250 µA Table 13 11 Typ. capacitances 12 Forward characteristics of reverse diode C=f(VDS); VGS=0 V; f=1 MHz IF=f(VSD); parameter: Tj Final Data Sheet 7 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Electrical characteristics diagrams Table 14 13 Avalanche characteristics 14 Typ. gate charge IAS=f(tAV); RGS=25 Ω; parameter: Tj(start) VGS=f(Qgate); ID=30 A pulsed; parameter: VDD Table 15 15 Drain-source breakdown voltage 16 Gate charge waveforms VBR(DSS)=f(Tj); ID=1 mA Final Data Sheet 8 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Package outline 6 Package outline Figure 1 Outlines PG-TDSON-8, dimensions in mm/inches Final Data Sheet 9 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Package outline Figure 2 Outlines PG-TDSON-8 tape, dimension in mm/inches Final Data Sheet 10 2.0, 2011-03-01 OptiMOS™ Power-MOSFET BSC0902NS Revision History 7 Revision History Revision History: 2011-03-01, 2.0 Previous Revision: Revision Subjects (major changes since last revision) 0.4 Release of target data sheet 1.0 Release of Preliminary data sheet 2.0 Release of Final data sheet We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Edition 2011-03-01 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Final Data Sheet 11 2.0, 2011-03-01