INFINEON BSO203SP

BSO203SP
Preliminary data
OptiMOS-P Small-Signal-Transistor
Product Summary
Feature
• P-Channel
• Enhancement mode
• Super Logic Level (2.5 V rated)
VDS
-20
V
RDS(on)
21
mΩ
ID
-9
A
• 150°C operating temperature
• Avalanche rated
S
1
8
D
• dv/dt rated
S
2
7
D
S
3
6
D
G
4
5
D
Top View
Type
Package
Ordering Code
BSO203SP
SO 8
Q67042-S4083
SIS00062
Maximum Ratings,at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
Unit
A
TA=25°C
-9
TA=70°C
-7.2
ID puls
-36
EAS
97
mJ
dv/dt
-6
kV/µs
Gate source voltage
VGS
±12
V
Power dissipation
Ptot
2.35
W
-55... +150
°C
Pulsed drain current
TA=25°C
Avalanche energy, single pulse
ID =-9 A , VDD=-10V, RGS =25Ω
Reverse diode dv/dt
IS =-9A, VDS=-16V, di/dt=200A/µs, Tjmax =150°C
TA=25°C
Operating and storage temperature
Tj , Tstg
IEC climatic category; DIN IEC 68-1
55/150/56
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2004-06-03
BSO203SP
Preliminary data
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
-
-
35
@ min. footprint, t < 10s
-
-
110
@ 6 cm 2 cooling area
-
-
53
Characteristics
Thermal resistance, junction - soldering point
RthJS
SMD version, device on PCB:
RthJA
1)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
-20
-
-
VGS(th)
-0.6
0.9
-1.2
Static Characteristics
Drain-source breakdown voltage
V
VGS =0, ID=-250µA
Gate threshold voltage, VGS = VDS
ID =-100µA
Zero gate voltage drain current
µA
IDSS
VDS =-20V, VGS =0, Tj =25°C
-
-0.1
-1
VDS =-20V, VGS =0, Tj =150°C
-
-10
-100
IGSS
-
-10
-100
nA
RDS(on)
-
22.3
34
mΩ
RDS(on)
-
12.9
21
Gate-source leakage current
VGS =-12V, VDS =0
Drain-source on-state resistance
VGS =-2.5V, ID =-7.1A
Drain-source on-state resistance
VGS =-4.5V, ID =-9A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air; t ≤10 sec.
Page 2
2004-06-03
BSO203SP
Preliminary data
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
16
33
-
S
pF
Dynamic Characteristics
Transconductance
gfs
çVDS ç≥2*çIDç*RDS(on)max
ID =-7.2A
Input capacitance
Ciss
VGS =0, VDS =-15V,
-
2265
-
Output capacitance
Coss
f=1MHz
-
890
-
Reverse transfer capacitance
Crss
-
728
-
Turn-on delay time
td(on)
VDD =-10V, VGS =-4.5V,
-
15.6
23
Rise time
tr
ID =-1A, RG=6Ω
-
27
40
Turn-off delay time
td(off)
-
58
77
Fall time
tf
-
69
104
-
-3.8
-5.7
-
-15.6
-23.4
-
-33.6
-50.4
V(plateau) VDD =-15V, ID =-9A
-
-1.6
-
V
IS
-
-
-3
A
-
-
-36
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =-15V, ID =-9A
VDD =-15V, ID =-9A,
nC
VGS =0 to -4.5V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TA=25°C
forward current
Inverse diode direct current,
ISM
pulsed
Inverse diode forward voltage
VSD
VGS =0, |IF | = |ID |
-
-0.82
Reverse recovery time
trr
VR =-10V, |IF | = |lD |,
-
34
42
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
16.7
21
nC
Page 3
-1.25 V
2004-06-03
BSO203SP
Preliminary data
1 Power dissipation
2 Drain current
Ptot = f (TA )
ID = f (TA )
parameter: |VGS |≥ 4.5 V
2.6
BSO203SP
-10
W
BSO203SP
A
2.2
-8
2
-7
ID
Ptot
1.8
1.6
-6
1.4
-5
1.2
1
-4
0.8
-3
0.6
-2
0.4
-1
0.2
0
0
20
40
60
80
100
120
°C
0
0
160
20
40
60
80
100
120
TA
4 Transient thermal impedance
ID = f ( VDS )
ZthJS = f (tp)
parameter : D = 0 , TA = 25 °C
parameter : D = t p/T
2 BSO203SP
D
10 2
BSO203SP
K/W
/I
DS
V
=
A
160
TA
3 Safe operating area
-10
°C
tp = 120.0µs
R
DS
(
on
)
10 1
ID
Z thJS
1 ms
-10 1
10 0
10 -1
10 ms
D = 0.50
0.20
-10
0
10
-2
0.10
0.05
0.02
10 -3
0.01
single pulse
-10 -1 -1
-10
-10
0
DC
1
-10
V
-10
2
VDS
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
tp
Page 4
2004-06-03
0
BSO203SP
Preliminary data
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS ); Tj=25°C
RDS(on) = f (ID )
parameter: tp = 80 µs
parameter: VGS
0.05
90
Vgs = -3.5V
A
Vgs = -2.5V
Vgs = -3V
Ω
Vgs = -3V
60
RDS(on)
- ID
70
Vgs = -4V
Vgs = -4.5V
Vgs = -7V
Vgs = -10V
50
0.03
Vgs = -2.5V
40
0.02
30
20
Vgs = -2V
Vgs= - 3.5V
Vgs = - 4V
Vgs = - 4.5V
Vgs= - 7V
Vgs = - 10V
0.01
10
0
0
2
4
6
0
0
10
V
10
20
30
40
50
60
A
- V DS
80
- ID
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); |VDS |≥ 2 x |ID| x RDS(on)max
gfs = f(ID); Tj=25°C
parameter: tp = 80 µs
parameter: tp = 80 µs
35
60
A
S
- ID
g fs
25
40
20
30
15
20
10
10
5
0
0
0.5
1
1.5
2
V
0
0
3
- V GS
5
10
15
20
25
35
A
- ID
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2004-06-03
BSO203SP
Preliminary data
9 Drain-source on-resistance
10 Typ. gate threshold voltage
RDS(on) = f(Tj )
VGS(th) = f (Tj)
parameter: ID = -9 A, VGS = -4.5 V
parameter: VGS = VDS
30
1.5
V
98%
- VGS(th)
RDS(on)
mΩ
20
typ.
98%
1
0.75
typ.
15
0.5
2%
10
0.25
5
-60
-20
20
60
100
0
-60
°C 160
Tj
-20
20
60
100
°C 160
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD)
parameter: VGS =0, f=1 MHz
parameter: Tj , tp = 80 µs
10
4
-10 2
BSO203SP
A
pF
C iss
C
IF
-10 1
Coss
10 3
-10 0
C rss
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
10 2
0
5
V
15
- V DS
-10 -1
0
-0.4
-0.8
-1.2
-1.6
-2
-2.4 V
-3
VSD
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2004-06-03
BSO203SP
Preliminary data
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj ), par.: ID = -9 A
|VGS| = f (QGate )
VDD = -10 V, RGS = 25 Ω
parameter: ID = -9 A pulsed
100
12
V
mJ
10
80
- VGS
E AS
9
70
60
8
7
50
6
40
5
0.2 VDS max.
0.5 VDS max.
0.8 VDS max.
4
30
3
20
2
10
1
0
25
50
75
100
150
°C
Tj
0
0
10
20
30
40
nC
60
|QGate |
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
-24.5
BSO203SP
V
V (BR)DSS
-23.5
-23
-22.5
-22
-21.5
-21
-20.5
-20
-19.5
-19
-18.5
-18
-60
-20
20
60
100
°C
180
Tj
Page 7
2004-06-03
Preliminary data
BSO203SP
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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characteristics.
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regarding circuits, descriptions and charts stated herein.
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For further information on technology, delivery terms and conditions and prices please contact your nearest
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
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written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
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or system Life support devices or systems are intended to be implanted in the human body, or to support
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2004-06-03