INFINEON IL4218

IL4216
700 V IL4217
800 V IL4218
600 V
TRIAC DRIVER OPTOCOUPLER
FEATURES
• High Input Sensitivity IFT=1.3 mA
• 600/700/800 V Blocklng Voltage
• 300 mA On-State Current
• High Static dv/dt 10,000 V/µsec., typical
• Inverse Parallel SCRs Provide Commutating
dv/dt >10 KV/µsec
• Very Low Leakage <10 µA
• Isolation Test Voltage from Double Molded
Package 5300 VACRMS
• Package, 6-Pln DIP
• Underwriters Lab File #E52744
Dimensions in inches (mm)
Pin One ID.
3
2
High input sensitivity is achieved by using an emitter
follower phototransistor and a cascaded SCR predriver resulting in an LED trigger current of less than
1.3 mA (DC).
The IL421x uses two discrete SCRs resulting in a
commutating dv/dt of greater than 10KV/µs. The use
of a proprietary dv/dt clamp results in a static dv/dt of
greater than 10KV/µs. This clamp circuit has a MOSFET that is enhanced when high dv/dt spikes occur
between MT1 and MT2 of the TRIAC. The FET clamps
the base of the phototransistor when conducting, disabling the internal SCR predriver.
The blocking voltage of up to 800 V permits control of
off-line voltages up to 240 VAC, with a safety factor of
more than two, and is sufficient for as much as 380
VAC. Current handling capability is up to 300 mA
RMS, continuous at 25°C.
The IL421x isolates low-voltage logic from 120, 240,
and 380 VAC lines to control resistive inductive, or
capacitive loads including motors solenoids, high current thyristors or TRIAC and relays.
Applications include solid-state relays, industrial controls, office equipment, and consumer appliances.
LED 1
Anode
.248 (6.30)
.256 (6.50)
6 Triac
Anode 2
Substrate
5 do not
connect
Triac
4 Anode 1
LED 2
Cathode
4
5
6
NC
3
.335 (8.50)
.343 (8.70)
.039
(1.00)
min.
DESCRIPTION
The IL421x consists of an AlGaAs IRLED optically
coupled to a pair of photosensitive non-zero crossing
SCR chips and are connected inversely parallel to
form a TRIAC. These three semiconductors are
assembled in a six pin 0.3 inch dual in-line package,
using high insulation double molded, over/under leadframe construction.
1
4°
typ.
.018 (0.45)
.022 (0.55)
.300 (7.62)
typ.
.130 (3.30)
.150 (3.81)
18° typ.
.020 (.051) min.
.031 (0.80)
.035 (0.90)
.100 (2.54) typ.
.010 (.25)
.014 (.35)
.110 (2.79)
.150 (3.81)
.300 (7.62)
.347 (8.82)
Maximum Ratings
Emitter
Reverse Voltage ...................................................................................6 V
Forward Current ..............................................................................60 mA
Surge Current ....................................................................................2.5 A
Power Dissipation.........................................................................100 mW
Derate Linearly from 25°C ......................................................1.33 mW/°C
Thermal Resistance....................................................................750 °C/W
Detector
Peak Off-State Voltage
IL4216...........................................................................................600 V
IL4217...........................................................................................700 V
IL4218...........................................................................................800 V
RMS On-State Current...................................................................300 mA
Single Cycle Surge...............................................................................3 A
Total Power Dissipation ................................................................500 mW
Derate Linearly from 25°C ........................................................6.6 mW/°C
Thermal Resistance.....................................................................150°C/W
Package
Isolation Test Voltage........................................................... 5300 VACRMS
Storage Temperature......................................................–55°C to +150°C
Operating Temperature ..................................................–55°C to +100°C
Lead Soldering Temperature................................................ 260°C/5 sec.
Isolation Resistance
VIO=500 V, TA=25°C ................................................................. ≥1012 Ω
VIO=500 V, TA=100°C ............................................................... ≥1011 Ω
5–1
Characteristics (TA=25°C)
Parameter
Symbol
Min.
Typ.
Max.
1.3
1.5
6
30
Unit
Condition
Emitter
Forward Voltage
VF
Breakdown Voltage
VBR
V
IF=20 mA
V
IR=10 mA
Reverse Current
IR
0.1
µA
VR=6 V
Capacitance
CO
40
pF
VF=o V, f=1 MHz
Thermal Resistance, Junction to Lead
RTHJL
750
°C/W
10
Output Detector
Repetitive Peak Off-State Voltage
IL4216
IL4217
IL4218
VDRM
VDRM
VDRM
600
700
800
650
750
850
V
V
V
IDRM=100 µA
IDRM=100 µA
IDRM=100 µA
Off-State Voltage
IL4216
IL4217
IL4218
VD(RMS)
VD(RMS)
VD(RMS)
424
484
565
460
536
613
V
V
V
ID(RMS)=70 µA
ID(RMS)=70 µA
ID(RMS)=70 µA
Off-State Current
ID(RMS)
10
100
µA
VD=600 V, TA=100°C
Reverse Current
IR(RMS)
10
100
µA
VR=600 V, TA=100°C
On-State Voltage
VTM
1.7
3
V
IT=300 mA
On-State Current
ITM
300
mA
PF=1.0, VT(RMS)=1.7 V
Surge (Non-Repetitive) On-State Current
ITSM
3
A
f=50 Hz
Holding Current
IH
65
200
µA
VT=3 V
Latching Current
IL
5
mA
VT=2.2 V
LED Trigger Current
IFT
0.7
mA
VAK=5 V
Turn-On Time
tON
35
µs
VRM=VDM=424 VAC
Turn-Off Time
tOFF
50
µs
PF=1.0, IT=300 mA
Critical State of Rise: Off-State Voltage
dv(MT)/dt
10,000
2000
V/µs
V/µs
VRM, VDM=400 VAC, TA=25°C
VRM, VDM=400 VAC, TA=25°C
Commutating Voltage
dv(COM)/dt
10,000
V/µs
V/µs
VRM, VDM=400 VAC, TA=25°C
VRM, VDM=400 VAC, TA=25°C
IT=300 mA
2000
1.3
Off-State Current
di/dt
100
A/ms
Thermal Resistance, Junction to Lead
RTHJL
150
°C/W
Package
Critical Rate of Rise of Coupled Input-Output Voltage
dv(IO)/dt
5000
V/µs
IT=0 A, VRM=VDM=300 VAC
Common Mode Coupling Capacitor
Package Capacitance
CCM
0.01
pF
CIO
0.8
pF
f=1 MHz, VIO=0 V
Figure 2. Forward voltage versus forward current
Figure 1. LED forward current vs. forward voltage
IL4216/4217/4218
5–2
Power Factor Considerations
Figure 3. Peak LED current vs. duty factor, Tau
A snubber isn’t needed to eliminate false operation of the
TRIAC driver because of the IL411’s high static and commutating dv/dt with loads between 1 and 0.8 power factors. When
inductive loads with power factors less than 0.8 are being
driven, include a RC snubber or a single capacitor directly
across the device to damp the peak commutating dv/dt spike.
Normally a commutating dv/dt causes a turning-off device to
stay on due to the stored energy remaining in the turning-off
device.
But in the case of a zero voltage crossing optotriac, the commutating dv/dt spikes can inhibit one half of the TRIAC from
turning on. If the spike potential exceeds the inhibit voltage of
the zero cross detection circuit, half of the TRIAC will be heldoff and not turn-on. This hold-off condition can be eliminated
by using a snubber or capacitor placed directly across the
optotriac as shown in Figure 7. Note that the value of the
capacitor increases as a function of the load current.
Figure 4. Maximum LED power dissipation
The hold-off condition also can be eliminated by providing a
higher level of LED drive current. The higher LED drive provides a larger photocurrent which causer. the phototransistor
to turn-on before the commutating spike has activated the zero
cross network. Figure 8 shows the relationship of the LED drive
for power factors of less than 1.0. The curve shows that if a
device requires 1.5 mA for a resistive load, then 1.8 times (2.7
mA) that amount would be required to control an inductive load
whose power factor is less than 0.3.
Figure 7. Shunt capacitance versus load current
versus power factor
Figure 5. On-state terminal voltage vs. terminal current
Figure 6. Maximum output power dissipation
Figure 8. Normalized LED trigger current versus
power factor
IL4216/4217/4218
5–3