IRF HFA100MD60C

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PD-2.442
HFA100MD60C
TM
HEXFRED
Ultrafast, Soft Recovery Diode
Features
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
VR = 600V
LUG
LUG
LUG
TERMINAL TERMINAL TERMINAL
ANODE 1 CATHODE ANODE 2
VF = 1.4V
Qrr * = 780nC
di(rec)M/dt * = 240A/µs
* 125°C
BASE (ISOLATED)
Description
TM
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
TO-244AB
(ISOLATED)
Absolute Maximum Ratings (per Leg)
Parameter
VR
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
IAS
EAS
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Maximum Single Pulse Avalanche Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
Units
600
83
40
400
2.0
220
180
71
V
A
µJ
W
C
-55 to +150
Thermal - Mechanical Characteristics
Parameter
RθJC
RθCS
Wt
Note:
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Case-to-Sink, Flat , Greased Surface
Weight
Mounting Torque
See Fig. 12
Terminal Torque
Min.
Typ.
Max.
––––
––––
––––
––––
35 (4.0)
50 (5.7)
––––
––––
0.10
79 (2.8)
––––
––––
0.70
0.35
––––
––––
50 (5.7)
75 (8.5)
Units
°C/W
K/W
g (oz)
lbf•in
(N•m)
Limited by junction temperature
L = 100µH, duty cycle limited by max TJ
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HFA100MD60C
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
VBR
VFM
Min. Typ. Max. Units
Cathode Anode Breakdown Voltage
Max Forward Voltage
600
IRM
Max Reverse Leakage Current
CT
Junction Capacitance
–––
–––
1.2
1.4
1.1
4.0
1.0
140
LS
Series Inductance
–––
7.0
–––
–––
1.4
1.6
1.3
20
4.0
250
V
µA
mA
pF
–––
nH
V
Test Conditions
IR = 100µA
IF = 50A
IF = 100A
IF = 50A, TJ = 125°C
VR = VR Rated
TJ = 125°C, VR = 480V
VR = 200V
From top of terminal hole to mounting
plane
Dynamic Recovery Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
trr
trr1
trr2
IRRM1
IRRM2
Qrr1
Qrr2
di(rec)M/dt1
di(rec)M/dt2
Min. Typ. Max. Units
Reverse Recovery Time
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During tb
–––
–––
–––
–––
–––
–––
–––
–––
–––
33 –––
76 115
ns
130 200
8.0
15
A
12
22
300 900
nC
780 2200
340 –––
A/µs
240 –––
Test Conditions
IF = 1.0A, dif/dt = 200A/µs, VR = 30V
TJ = 25°C
TJ = 125°C
IF = 50A
TJ = 25°C
TJ = 125°C
VR = 200V
TJ = 25°C
TJ = 125°C
dif/dt = 200A/µs
TJ = 25°C
TJ = 125°C
80.01 (3.150)
40.26 (1.585)
39.75 (1.565)
20.32 (0.800)
17.78 (0.700)
7.49 (0.295)
6.99 (0.275)
(2 PLCS.)
LEAD ASSIGNMENTS
1 - ANODE
2 - CATHODE
3 - ANODE
DIA.
34.925 (1.375)
REF.
63.50 (2.500)
60.96 (2.400)
1
2
1/4-20 SLOTTED HEX
3
OUTLINE TO-244AB (ISOLATED)
Dimensions in Millimeters and (Inches)
23.55 (0.927)
20.42 (0.804)
15.75 (0.620)
14.99 (0.590)
92.71 (3.650)
90.17 (3.550)
3.35 (0.132)
3.02 (0.119)
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HFA100MD60C
10000
Reverse Current - I R (µA)
100
TJ = 150°C
TJ = 150°C
1000
TJ = 125°C
100
10
TJ = 25°C
1
TJ = 125°C
0.1
0
200
TJ = 25°C
400
600
Reverse Voltage - VR (V)
Fig. 2 - Typical Reverse Current vs. Reverse
Voltage, (per Leg)
10
Junction Capacitance - C T (pF)
Instantaneous Forward Current - I F (A)
1000
10000
A
1000
1
0.0
1.0
2.0
3.0
Forward Voltage Drop - V FM (V)
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current,
(per Leg)
TJ = 25°C
100
10
1
10
100
1000
Reverse Voltage - VR (V)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage, (per Leg)
Thermal Impedance - Z thJC (K/W)
1
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
PD M
D = 0.08
t
1
t2
0.01
0.001
0.00001
Single Pulse
(Thermal Resistance)
N otes:
1. D uty factor D = t / t
1 2
2. Peak TJ = PD M x Z thJC + T C
0.0001
0.001
0.01
0.1
1
t 1 , Rectangular Pulse Duration (Seconds)
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics, (per Leg)
To Order
10
100
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HFA100MD60C
100
200
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
I F = 100A
I F = 50A
I IRRM - (A)
t rr - (ns)
160
120
IF = 100A
I F = 50A
IF = 30A
10
I F = 30A
80
40
100
1
100
1000
di f /dt - (A/µs)
Fig. 5 - Typical Reverse Recovery vs. dif/dt,
(per Leg)
1000
Fig. 6 - Typical Recovery Current vs. dif/dt,
(per Leg)
3000
10000
VR = 200V
TJ = 125°C
TJ = 25°C
di(rec)M/dt - (A/µs)
VR = 200V
TJ = 125°C
TJ = 25°C
Q RR - (nC)
2000
IF = 100A
IF = 50A
1000
di f /dt - (A/µs)
I F = 30A
0
100
I F = 140A
1000
1000
di f /dt - (A/µs)
Fig. 7 - Typical Stored Charge vs. dif/dt,
(per Leg)
To Order
I F = 70A
IF = 30A
100
100
di f /dt - (A/µs)
Fig. 8 - Typical di(rec)M/dt vs. dif/dt,
(per Leg)
1000
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HFA100MD60C
3
t rr
IF
tb
ta
0
REVERSE RECOVERY CIRCUIT
Q rr
VR = 200V
2
I RRM
4
0.5 I RRM
di(rec)M/dt
0.01 Ω
L = 70µH
1
D.U.T.
dif/dt
ADJUST
4. Qrr - Area under curve defined by rtr
and IRRM
trr X IRRM
Qrr =
2. IRRM - Peak reverse recovery current
2
3. trr - Reverse recovery time measured
from zero crossing point of negative 5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
IRFP250
S
Fig. 9 - Reverse Recovery Parameter Test
Circuit
Fig. 10 - Reverse Recovery Waveform and
Definitions
I L(PK)
L = 100µH
HIGH-SPEED
SWITCH
DUT
Rg = 25 ohm
CURRENT
MONITOR
di f /dt
1. dif/dt - Rate of change of current
through zero crossing
D
G
5
0.75 I RRM
FREE-WHEEL
DIODE
+
DECAY
TIME
Vd = 50V
V (AVAL)
V R(RATED)
Fig. 11 - Avalanche Test Circuit and Waveforms
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Data and specifications subject to change without notice.
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