IRF IRLML6402PBF

PD - 95060A
IRLML6402PbF
HEXFET® Power MOSFET
Ultra Low On-Resistance
P-Channel MOSFET
l SOT-23 Footprint
l Low Profile (<1.1mm)
l Available in Tape and Reel
l Fast Switching
l Lead-Free
Description
l
D
l
VDSS = -20V
G
RDS(on) = 0.065Ω
S
These P-Channel MOSFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET®
power MOSFETs are well known for, provides the designer with
an extremely efficient and reliable device for use in battery and
load management.
A thermally enhanced large pad leadframe has been incorporated
into the standard SOT-23 package to produce a HEXFET Power
MOSFET with the industry's smallest footprint. This package,
dubbed the Micro3™, is ideal for applications where printed
circuit board space is at a premium. The low profile (<1.1mm)
of the Micro3 allows it to fit easily into extremely thin application
environments such as portable electronics and PCMCIA cards.
The thermal resistance and power dissipation are the best
available.
Micro3™
Absolute Maximum Ratings
Parameter
VDS
ID @ TA = 25°C
ID @ TA= 70°C
IDM
PD @TA = 25°C
PD @TA = 70°C
EAS
VGS
TJ, TSTG
Drain- Source Voltage
Continuous Drain Current, VGS @ -4.5V
Continuous Drain Current, VGS @ -4.5V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Single Pulse Avalanche Energy„
Gate-to-Source Voltage
Junction and Storage Temperature Range
Max.
Units
-20
-3.7
-2.2
-22
1.3
0.8
0.01
11
± 12
-55 to + 150
V
A
W
W/°C
mJ
V
°C
Thermal Resistance
Parameter
RθJA
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Maximum Junction-to-Ambientƒ
Typ.
Max.
Units
75
100
°C/W
1
02/15/05
IRLML6402PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
∆V(BR)DSS/∆TJ
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V(BR)DSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Min.
-20
–––
–––
–––
-0.40
6.0
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max. Units
Conditions
––– –––
V
VGS = 0V, ID = -250µA
-0.009 ––– V/°C Reference to 25°C, I D = -1mA ‚
0.050 0.065
VGS = -4.5V, ID = -3.7A ‚
Ω
0.080 0.135
VGS = -2.5V, ID = -3.1A ‚
-0.55 -1.2
V
VDS = VGS , ID = -250µA
––– –––
S
VDS = -10V, ID = -3.7A ‚
––– -1.0
VDS = -20V, VGS = 0V
µA
––– -25
VDS = -20V, VGS = 0V, TJ = 70°C
––– -100
VGS = -12V
nA
––– 100
VGS = 12V
8.0
12
ID = -3.7A
1.2 1.8
nC
VDS = -10V
2.8 4.2
VGS = -5.0V ‚
350 –––
VDD = -10V
48 –––
ID = -3.7A
ns
588 –––
RG = 89Ω
381 –––
RD = 2.7Ω
633 –––
VGS = 0V
145 –––
pF
VDS = -10V
110 –––
ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Min. Typ. Max. Units
–––
–––
-1.3
–––
–––
-22
–––
–––
–––
–––
29
11
-1.2
43
17
A
V
ns
nC
Conditions
MOSFET symbol
showing the
G
integral reverse
p-n junction diode.
TJ = 25°C, IS = -1.0A, VGS = 0V
TJ = 25°C, IF = -1.0A
di/dt = -100A/µs ‚
D
S
‚
Notes:
 Repetitive rating; pulse width limited by
ƒ Surface mounted on 1" square single layer 1oz. copper FR4 board,
max. junction temperature.
‚ Pulse width ≤ 400µs; duty cycle ≤ 2%.
„ Starting TJ = 25°C, L = 1.65mH
steady state.
RG = 25Ω, IAS = -3.7A.
** For recommended footprint and soldering techniques refer to application note #AN-994.
2
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IRLML6402PbF
100
100
VGS
-7.00V
-5.00V
-4.50V
-3.50V
-3.00V
-2.70V
-2.50V
BOTTOM -2.25V
-I D , Drain-to-Source Current (A)
-I D , Drain-to-Source Current (A)
10
-2.25V
20µs PULSE WIDTH
TJ = 25 °C
1
0.1
1
10
10
-2.25V
100
RDS(on) , Drain-to-Source On Resistance
(Normalized)
-I D , Drain-to-Source Current (A)
2.0
TJ = 25 ° C
TJ = 150 ° C
V DS = -15V
20µs PULSE WIDTH
5.0
6.0
7.0
8.0
-VGS , Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
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10
100
Fig 2. Typical Output Characteristics
100
4.0
1
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
3.0
20µs PULSE WIDTH
TJ = 150 °C
1
0.1
-VDS , Drain-to-Source Voltage (V)
10
2.0
VGS
-7.00V
-5.00V
-4.50V
-3.50V
-3.00V
-2.70V
-2.50V
BOTTOM -2.25V
TOP
TOP
ID = -3.7A
1.5
1.0
0.5
0.0
-60 -40 -20
VGS = -4.5V
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( °C)
Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRLML6402PbF
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
C, Capacitance(pF)
800
Coss = Cds + Cgd
Ciss
600
400
Coss
200
Crss
10
-VGS , Gate-to-Source Voltage (V)
1000
ID = -3.7A
VDS =-10V
8
6
4
2
0
FOR TEST CIRCUIT
SEE FIGURE 13
0
1
10
0
100
3
VDS, Drain-to-Source Voltage (V)
12
100
100
OPERATION IN THIS AREA LIMITED
BY RDS(on)
-IID , Drain Current (A)
-ISD , Reverse Drain Current (A)
9
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
10
TJ = 150 ° C
1
TJ = 25 ° C
0.1
0.2
0.6
0.8
1.0
Fig 7. Typical Source-Drain Diode
Forward Voltage
10us
10
100us
1ms
1
10ms
V GS = 0 V
0.4
-VSD ,Source-to-Drain Voltage (V)
4
6
QG , Total Gate Charge (nC)
1.2
TC = 25 ° C
TJ = 150 ° C
Single Pulse
0.1
0.1
1
10
100
-VDS , Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
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IRLML6402PbF
25
EAS , Single Pulse Avalanche Energy (mJ)
-ID , Drain Current (A)
4.0
3.0
2.0
1.0
0.0
25
50
75
100
125
150
ID
-1.7A
-3.0A
BOTTOM -3.7A
TOP
20
15
10
5
0
25
TC , Case Temperature ( °C)
50
75
100
125
150
Starting TJ , Junction Temperature ( °C)
Fig 9. Maximum Drain Current Vs.
Case Temperature
Fig 10. Maximum Avalanche Energy
Vs. Drain Current
Thermal Response (Z thJA )
1000
100
D = 0.50
0.20
0.10
10
0.05
PDM
0.02
0.01
t1
SINGLE PULSE
(THERMAL RESPONSE)
1
0.1
0.00001
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJA + TA
0.0001
0.001
0.01
0.1
1
10
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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5
RDS ( on ) , Drain-to-Source On Resistance ( Ω )
IRLML6402PbF
RDS(on) , Drain-to -Source Voltage ( Ω )
0.14
0.12
0.10
0.08
Id = -3.7A
0.06
0.04
0.02
2.0
3.0
4.0
5.0
6.0
-VGS, Gate -to -Source Voltage ( V )
Fig 12. Typical On-Resistance Vs.
Gate Voltage
6
7.0
0.20
VGS = -2.5V
0.16
0.12
0.08
VGS = -4.5V
0.04
0.00
0
5
10
15
20
25
30
-I D , Drain Current ( A )
Fig 13. Typical On-Resistance Vs.
Drain Current
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IRLML6402PbF
Micro3 (SOT-23/TO-263AB) Package Outline
Dimensions are shown in millimeters (inches)
S
Y
M
B
O
L
6
5
D
6
3
A
A1
A2
b
c
E
E1
1
ccc
2
B
e
DIME NS IONS
MILLIME TE RS
MIN
MAX
0.89
1.12
0.01
0.10
1.02
0.88
0.50
0.30
0.20
0.08
2.80
3.04
2.64
2.10
1.20
1.40
0.95 BS C
1.90 BS C
0.40
0.60
0.25 BS C
0°
8°
0.10
0.20
0.15
C B A
D
E
E1
e
5
e1
L
L1
0
aaa
e1
bbb
ccc
4
INCHES
MIN
MAX
.044
.036
.0004
.0039
.035
.040
.0196
.0119
.0078
.0032
.119
.111
.103
.083
.048
.055
.0375 BS C
.075 BS C
.0158
.0236
.0118 BS C
0°
8°
.004
.008
.006
H
A A2
L1
A1
3X b
bbb
aaa C
C A B
3 S URF
0
7
3X L
RECOMMENDED FOOT PRINT
NOT ES
1. DIME NS IONING AND T OLE RANCING PE R AS ME Y14.5M-1994.
2. DIME NS IONS ARE S HOWN IN MILLIMET ERS AND INCHES .
3X
3. CONTROLLING DIMENS ION: MILLIMETE R.
0.972
[.038]
4 DAT UM PLANE H IS LOCAT ED AT THE MOLD PART ING LINE.
5 DAT UM A AND B T O BE DET ERMINED AT DAT UM PLANE H.
2.742
[.1079]
6 DIMENS IONS D AND E1 ARE MEAS URED AT DAT UM PLANE H.
7 DIMENS ION L IS T HE LEAD LENGTH FOR S OLDERING T O A S UBS T RAT E.
8. OUTLINE CONFORMS T O JEDEC OUTLINE T O-236AB.
3X
0.95
[.0375]
0.802
[.031]
1.90
[.075]
Micro3 (SOT-23/TO-236AB) Part Marking Information
W = (1-26) IF PRECEDED B Y LAS T DIGIT OF CALENDAR YEAR
PART NUMBER
Y = YEAR
W = WEEK
L OT
CODE
PART NUMB ER CODE REFERENCE:
A=
B=
C=
D=
E=
F=
G=
H=
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IRLML 2402
IRL ML2803
IRL ML6302
IRL ML5103
IRLML6402
IRLML6401
IRLML2502
IRL ML5203
YEAR
Y
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000
1
2
3
4
5
6
7
8
9
0
WORK
WEEK
W
01
02
03
04
A
B
C
D
24
25
26
X
Y
Z
W = (27-52) IF PRECEDED BY A LETTER
YEAR
Y
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000
A
B
C
D
E
F
G
H
J
K
WORK
WEEK
W
27
28
29
30
A
B
C
D
50
51
52
X
Y
Z
7
IRLML6402PbF
Micro3™(SOT-23/TO-263AB) Tape & Reel Information
Dimensions are shown in millimeters (inches)
2.05 ( .080 )
1.95 ( .077 )
1.6 ( .062 )
1.5 ( .060 )
4.1 ( .161 )
3.9 ( .154 )
TR
FEED DIRECTION
1.85 ( .072 )
1.65 ( .065 )
3.55 ( .139 )
3.45 ( .136 )
4.1 ( .161 )
3.9 ( .154 )
1.32 ( .051 )
1.12 ( .045 )
8.3 ( .326 )
7.9 ( .312 )
0.35 ( .013 )
0.25 ( .010 )
1.1 ( .043 )
0.9 ( .036 )
178.00
( 7.008 )
MAX.
9.90 ( .390 )
8.40 ( .331 )
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 02/05
8
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