IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 OptiMOS®-P2 Power-Transistor Product Summary V DS -40 V R DS(on) (SMD Version) 9.1 mW ID -70 A Features • P-channel - Normal Level - Enhancement mode PG-TO263-3-2 • AEC qualified PG-TO262-3-1 PG-TO220-3-1 • MSL1 up to 260°C peak reflow • 175°C operating temperature • Green package (RoHS compliant) • 100% Avalanche tested Type Package Marking IPB70P04P4-09 PG-TO263-3-2 4P0409 IPI70P04P4-09 PG-TO262-3-1 4P0409 IPP70P04P4-09 PG-TO220-3-1 4P0409 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions Value T C=25°C, V GS=-10V -72 T C=100°C, V GS=-10V -50 Unit A Pulsed drain current2) I D,pulse T C=25°C -288 Avalanche energy, single pulse E AS I D=-36A 24 mJ Avalanche current, single pulse I AS - -72 A Gate source voltage V GS - ±20 V Power dissipation P tot T C=25 °C 75 W Operating and storage temperature T j, T stg - -55 ... +175 °C IEC climatic category; DIN IEC 68-1 - - 55/175/56 Rev. 1.3 page 1 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - - 2 Thermal resistance, junction ambient, leaded R thJA - - - 62 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area2) - - 40 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0V, I D= -1mA -40 - - Gate threshold voltage V GS(th) V DS=V GS, I D=-120µA -2.0 -3.0 -4.0 Zero gate voltage drain current I DSS V DS=-32V, V GS=0V, T j=25°C - -0.05 -1 T j=125°C2) - -20 -200 V DS=-32V, V GS=0V, V µA Gate-source leakage current I GSS V GS=-20V, V DS=0V - - -100 nA Drain-source on-state resistance R DS(on) V GS=-10V, I D=-70A - 6.9 9.4 mW V GS=-10V, I D=-70A, SMD version - 6.6 9.1 Rev. 1.3 page 2 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 Parameter Symbol Values Conditions Unit min. typ. max. - 3700 4810 - 1400 1820 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 40 80 Turn-on delay time t d(on) - 19 - Rise time tr - 15 - Turn-off delay time t d(off) - 24 - Fall time tf - 31 - Gate to source charge Q gs - 20 26 Gate to drain charge Q gd - 10 20 Gate charge total Qg - 54 70 Gate plateau voltage V plateau - -5.4 - V - - -72 A - - -288 - -1.0 -1.3 V - 50 - ns - 50 - nC V GS=0V, V DS=-25V, f =1MHz V DD=-20V, V GS=-10V, I D=-70A, R G=3.5W pF ns Gate Charge Characteristics2) V DD=-32V, I D=-70A, V GS=0 to -10V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD Reverse recovery time2) t rr Reverse recovery charge2) Q rr 1) T C=25°C V GS=0V, I F=-70A, T j=25°C V R=-20V, I F=-50A, di F/dt =-100A/µs Defined by design. Not subject to production test. 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.3 page 3 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 2 Drain current P tot = f(T C); V GS ≤ -6V I D = f(T C); V GS ≤ -6V; SMD 80 80 60 60 -I D [A] P tot [W] 1 Power dissipation 40 20 40 20 0 0 0 50 100 150 200 0 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0; SMD Z thJC = f(t p) parameter: t p parameter: D =t p/T 101 1000 1 µs 100 0.5 10 µs 100 Z thJC [K/W] 100 µs -I D [A] 1 ms 0.1 10-1 0.05 0.01 10 10-2 10-3 1 0.1 1 10 100 10-6 10-5 10-4 10-3 10-2 10-1 100 t p [s] -V DS [V] Rev. 1.3 single pulse page 4 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C; SMD R DS(on) = (I D); T j = 25 °C; SMD parameter: V GS parameter: V GS 60 300 -10V -5V -5.5V 50 40 -I D [A] R DS(on) [mW] -7V 200 -6.5V 100 30 20 -6V -6V -6.5V -5.5V 10 -7V -10V -5V 0 0 0 1 2 3 4 5 0 6 36 -V DS [V] 72 -I D [A] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = -6V R DS(on) = f(T j); I D = -70 A; V GS = -10 V; SMD parameter: T j 11 280 10 9 R DS(on) [mW] -I D [A] 210 140 8 7 70 6 175 °C 25 °C -55 °C 5 0 2 3 4 5 6 7 8 -20 20 60 100 140 180 T j [°C] -V GS [V] Rev. 1.3 -60 page 5 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 104 4 Ciss 3.6 3.2 Coss 103 2.8 C [pF] -V GS(th) [V] -1200µA -120µA 2.4 102 2 Crss 1.6 101 1.2 -60 -20 20 60 100 140 0 180 5 10 T j [°C] 15 20 25 30 140 180 -V DS [V] 11 Typical forward diode characteristicis 12 Drain-source breakdown voltage IF = f(VSD) V BR(DSS) = f(T j); I D = -1 mA parameter: T j 103 45 44 102 43 42 -I F [A] -V BR(DSS) [V] 101 100 41 40 39 38 37 175 °C 36 25 °C 35 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 -V SD [V] Rev. 1.3 -60 -20 20 60 100 T j [°C] page 6 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 13 Typ. gate charge 14 Gate charge waveforms V GS = f(Q gate); I D = -70 A pulsed parameter: V DD 10 -8V V GS 9 -32V Qg 8 7 -V GS [V] 6 5 4 3 2 Q gate 1 Q gs Q gd 0 0 20 40 60 Q gate [nC] Rev. 1.3 page 7 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2011 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.3 page 8 2011-02-14 IPB70P04P4-09 IPI70P04P4-09, IPP70P04P4-09 Revision History Version Rev. 1.3 Date Changes 1.1 02.09.2009 VGS(th): ID changed to 116uA 1.2 07.10.2009 VGS(th): ID changed to 120uA 1.2 07.10.2009 RDS(on): ID changed to 70A 1.2 07.10.2009 VSD: ID changed to 70A 1.2 07.10.2009 IGSS: VGS changed to 20V 1.3 04.02.2011 Final Data Sheet page 9 2011-02-14