MA-COM MASW-000552

MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
FEATURES
♦ Ultra Broad Bandwidth: 50 MHz to 50 GHz
♦ Functional Bandwidth : 50 MHz to 70 GHz
♦ 0.7 dB Insertion Loss,
♦ 33 dB Isolation at 50 GHz
♦ Low Current consumption.
• -10mA for low loss state
•+10mA for Isolation state
♦ M/A-COM’s unique AlGaAs hetero-junction
anode technology.
♦ Silicon Nitride Passivation
♦ Polymer Scratch protection
Yellow areas indicate bond pads
DESCRIPTION
M/A-COM’s MA4AGSW2 is an Aluminum-GalliumArsenide, single pole, double throw (SPDT), PIN diode
switch. The switch features enhanced AlGaAs anodes
which are formed using M/A-COM’s patented heterojunction technology. AlGaAs technology produces a
switch with less loss than a device fabricated using
conventional GaAs processes. As much as a 0.3 dB
reduction in insertion loss can be realized at 50 GHz.
This device is fabricated on an OMCVD epitaxial wafer
using a process designed for high device uniformity
and extremely low parasitics. The diodes within the
chip exhibit low series resistance, low capacitance,
and fast switching speed. They are fully passivated
with silicon nitride and have an additional polymer
layer for scratch protection. The protective coating
prevents damage during handling and assembly to the
diode junction and the chip anode air-bridges. Off chip
bias circuitry is required.
APPLICATIONS
The high electron mobility of AlGaAs and the low
capacitance of the PIN diodes used makes this switch
ideal for fast response, high frequency, multi-throw
switch designs. AlGaAs PIN diode switches are an
ideal choice for switching arrays in radar systems,
radiometers, test equipment and other multi-assembly
components.
Absolute Maximum Ratings @ TAMB = +25°C
Parameter
Maximum Rating
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Incident C.W. RF Power
+23dBm C.W.
Breakdown Voltage
25V
Bias Current
± 25mA
Assembly Temperature
+300°C < 10 sec
Junction Temperature
+175°C
Maximum combined operating conditions for RF Power, D.C.
bias, and temperature: +23 dBm C.W. @ 10 mA (per diode) @
+85°C.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
Electrical Specifications @ TA = 25°C, +/-10mA bias current
(On-wafer measurements)
RF SPECIFICATIONS
PARAMETER
INSERTION LOSS
ISOLATION
INPUT RETURN LOSS
OUTPUT RETURN LOSS
FREQUENCY BAND
MIN
TYP
MAX
UNITS
0.05 - 18GHz
---
0.5
0.6
dB
18 - 50GHz
---
0.7
0.9
dB
0.05 - 18GHz
45
47
---
dB
18 - 50GHz
28
33
---
dB
0.05 - 18GHz
---
22
---
dB
18 - 50GHz
---
21
---
dB
0.05 - 18GHz
---
25
---
dB
18 - 50GHz
---
22
---
dB
10GHZ
---
20
---
nS
*
SWITCHING SPEED
( 10 % - 90 % RF VOLTAGE )
*Note:
Typical switching speed is measured from 10% to 90% of the detected RF voltage driven by a TTL
compatible driver. Driver output parallel RC network uses a capacitor between 390 pF - 560 pF and
a resistor between 150 - 220 Ohms to achieve 20 ns rise and fall times.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
Typical R.F. Performance (Probed on Wafer) @ +25°C
IL ( dB )
TYPICAL INSERTION LOSS @ -10 mA
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
0.00
10.00
20.00
30.00
40.00
50.00
40.00
50.00
FREQUENCY ( GHz )
J2
J3
TYPICAL ISOLATION @ +10 mA
0
-10
ISOL ( dB )
-20
-30
-40
-50
-60
-70
-80
0.00
10.00
20.00
30.00
FREQUENCY ( GHz )
J2
J3
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
Typical RF Performance (Probed on wafer) @ +25°C
TYPICAL OUTPUT RETURN LOSS @ -10 mA
0
ORL ( dB )
-5
-10
-15
-20
-25
-30
0.00
10.00
20.00
30.00
40.00
50.00
FREQUENCY ( GHz )
J2
J3
TYPICAL INPUT RETURN LOSS @ -10 mA
0
IRL ( dB )
-5
-10
-15
-20
-25
-30
0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
45.00
50.00
FREQUENCY ( GHz )
J2
J3
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
Operation of the MA4AGSW2 Switch
The simultaneous application of a negative DC current to the low loss port and positive DC current to the
remaining isolated switching port is required for the operation of the MA4AGSW2, AlGaAs, PIN switch. The
backside area of the die is the RF and DC return ground plane. The DC return is connected to the common port
J1. The forward bias voltage at J2 & J3 will not exceed ±1.6 volts and is typically ± 1.4 volts with supply current of
± 30mA). In the low loss state, the series diode must be forward biased and the shunt diode reverse biased. While
for the Isolated port, the shunt diode is forward biased and the series diode is reverse biased. The bias network
design shown below should yield > 30 dB RF to DC Isolation.
The lowest insertion loss, P1dB, IP3, and switching speed is achieved by using a voltage pull-up resistor in the DC
return path, (J1). A minimum value of | -2V | is recommended at this return node, which is achievable with a
standard, ± 5V TTL Controlled PIN Diode Driver.
MA4AGSW2 Schematic with a Typical External 2-18 GHz Bias Network
TYPICAL DRIVER CONNECTIONS
CONTROL LEVEL (DC CURRENT)
J2
J3
RF OUTPUT STATE
J2-J1
J3-J1
-10mA
+10mA
Low Loss
Isolation
+10mA
-10mA
Isolation
Low Loss
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
Chip Dimensions and bonding Pad Locations (In Yellow)
G
DIM
A
B
C
D
E
F
G
Thickness
Pads X-Y
Min.
mils
Typical
Max.
Min.
mm
Typical
Max.
48
29.7
17.3
13.7
20.3
3.7
3.7
3.5
3.5
49
30.7
17.8
13.9
20.5
4.0
3.9
4.0
4.0
50
31.7
18.3
14.1
20.7
4.3
4.3
4.5
4.5
1.219
0.754
0.439
0.348
0.516
0.094
0.094
0.089
0.089
1.245
0.780
0.452
0.358
0.521
0.102
0.099
0.102
0.102
1.270
0.805
0.465
0.358
0.526
0.109
0.109
0.114
0.114
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSW2
SPDT AlGaAs PIN Diode Switch
RoHS Compliant
Rev. V4
ASSEMBLY INSTRUCTIONS
CLEANLINESS
These chips should be handled in a clean environment.
STATIC SENSITIVITY
These Devices are considered ESD Class 1A, HBM. Proper ESD techniques should be used when handling
these devices.
GENERAL HANDLING
The protective polymer coating on the active areas of the die provides scratch and impact protection,
particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with
vacuum pickup tools, or alternatively with plastic tweezers.
ASSEMBLY TECHNIQUES
The MA4AGSW2, AlGaAs device is designed to be mounted with electrically conductive silver epoxy or with a
low temperature solder perform, which does not have a rich tin content.
SOLDER DIE ATTACH
Only solders which do not scavenge gold, such as 80/20, Au/Sn or Indalloy #2 is recommended. Do not
expose die to temperatures greater than 300°C for more than 10 seconds.
ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH
Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal
resistance. Cure epoxy per manufacturer’s schedule. Typically 150°C for 1 hour.
RIBBON/WIRE BONDING
Thermo-compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.
A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the
lowest inductance and best microwave performance. For more detailed handling and assembly
instructions, see Application Note M541, “Bonding and Handling Procedures for Chip Diode
Devices” at www.macom.com.
Ordering Information
Part Number
Package
MA4AGSW2
Waffle Pack
MASW-000552-13210G
Gel Pack
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.