LTC3355 - 20V 1A Buck DC/DC with Integrated SCAP Charger and Backup Regulator

LTC3355
20V 1A Buck DC/DC with
Integrated SCAP Charger
and Backup Regulator
FEATURES
DESCRIPTION
VIN Voltage Range: 3V to 20V
nn V
OUT Voltage Range: 2.7V to 5V
nn 1A Current Mode Buck Main Regulator
nn 5A Boost Backup Regulator Powered from Single
Supercapacitor
nn Boost Regulator Operates Down to 0.5V for
Maximum Utilization of Supercapacitor Energy
nn Programmable Supercapacitor Charge Current to
1A with Overvoltage Protection
nn Charger Supports Single Cell CC/CV Battery Charging
nn Programmable V Current Limit
IN
nn Programmable Boost Current Limit
nn V Power Fail Indicator
IN
nn V
CAP Power Good Indicator
nn V
OUT Power On Reset Output
nn Compact 20-Lead 4mm × 4mm QFN Package
The LTC®3355 is a complete input power interrupt ridethrough DC/DC system. The part charges a supercapacitor
while delivering load current to VOUT, and uses energy from
the supercapacitor to provide continuous VOUT backup
power when VIN power is lost. The LTC3355 contains a
nonsynchronous constant frequency current mode monolithic 1A buck switching regulator to provide a 2.7V to 5V
regulated output voltage from an input supply of up to 20V.
nn
A 1A programmable CC/CV linear charger charges the
supercapacitor from VOUT. When the VIN supply drops
below the PFI threshold, the devices’s constant frequency
nonsynchronous current mode 5A boost switching
regulator delivers power from the supercapacitor to VOUT.
A thermal regulation loop maximizes charge current while
limiting the die temperature to 110°C. The IC has boost,
charger and VIN programmable current limits. The LTC3355
is available in a 20-lead 4mm × 4mm QFN surface mount
package.
APPLICATIONS
nn
nn
Ride-Through “Dying Gasp” Supplies
Power Meters/Industrial Alarms/Solid State Drives
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners.
TYPICAL APPLICATION
Supercapacitor Charger and Ride-Through Power Supply
10µF
10µF
1µF
5
VIN
SW1
6 VINM5
VINS
4
PFO
2.49M
BUCK VOUT
1 PFI
200k
15
402k
100k
10 PFOB
VCAP
13 RSTB
SW2
BOOST
14
16
3.3µH
17
8 EN_CHG
665k
2.4V
SCAP
1F TO 50F
CFB 11
3 MODE
INTVCC
18
1µF
ICHG
IBSTPK
12
20
60.4k
10
154k
VIN
8
6
VOUT
4
VCAP
2
0
332k
VCBST 19
CAPACITOR = 3F
IVOUT = 0.125A
12
VOUT
4V
47µF 1A (MAX)
FB 2
LTC3355
9 CPGOOD
14
7
4.7pF
1A
Backup Operation
6.8µH
VOLTAGE (V)
VIN
12V
0.091Ω
0
5
10
15
20
TIME (SECONDS)
3355 TA01b
220pF
200k
3355 TA01a
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1
LTC3355
PIN CONFIGURATION
VIN, VINS, VINM5.........................................................22V
VIN ±VINS................................................................... 0.1V
VSW1........................................................... –0.4V to 22V
VSW2............................................................. –0.4V to 6V
VOUT, INTVCC, PFOB, RSTB,
CPGOOD, VCAP.............................................. –0.3V to 6V
PFI, EN_CHG, MODE, FB............................... –0.3V to 6V
CFB.............................................–0.3V to INTVCC + 0.3V
ICPGOOD, IPFOB, IRSTB.................................................1mA
Operating Junction Temperature Range
(Notes 2, 3)............................................. –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
SW2
SW2
INTVCC
VCBST
IBSTPK
TOP VIEW
20 19 18 17 16
PFI 1
15 VOUT
FB 2
14 VCAP
21
GND
MODE 3
VINS 4
13 RSTB
12 ICHG
11 CFB
8
9 10
PFOB
7
CPGOOD
6
EN_CHG
VIN 5
SW1
(Note 1)
VINM5
ABSOLUTE MAXIMUM RATINGS
UF PACKAGE
20-LEAD (4mm × 4mm) PLASTIC QFN
TJMAX = 125°C, θJA = 47°C/W
EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3355EUF#PBF
LTC3355EUF#TRPBF
3355
20-Lead (4mm × 4mm) Plastic QFN
–40°C to 125°C
LTC3355IUF#PBF
LTC3355IUF#TRPBF
3355
20-Lead (4mm × 4mm) Plastic QFN
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
2
3355fb
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LTC3355
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 12V unless otherwise noted. (Note 2)
SYMBOL
PARAMETER
VIN
VIN Operating Voltage Range
IQ
VIN Quiescent Current
VOUT Quiescent Current
VFB
FB Reference Voltage
FB Line Regulation
IFB
FB Input Bias Current
VVOUT
VOUT Voltage Range
CONDITIONS
Charger Off, Not Switching, VOUT = 3.3V, No
Load, In Regulation, Supercapacitor Charged
MIN
l
3
l
l
60
110
l
0.775
VOUT = 2.7V to 5V
TYP
120
265
MAX
V
215
420
µA
µA
0.825
V
0.1
l
UNITS
20
%/V
–20
20
nA
2.7
5
V
VOUT Overvoltage Limit
Buck or Boost Enabled
5.4
5.65
5.95
V
VOUT Undervoltage Lockout Threshold
Boost Enabled
1.8
2
2.2
V
VIN > 7V
VINM5
VIN-VINM5
VINTVCC
INTVCC Internal Voltage Power Supply
2
5
V
VVCAP
VCAP Voltage Range
0
5
V
IVCAP
VCAP Current Accuracy
–10
10
%
VCAP Programmable Current Range
EN_CHG = High
0.1
1
A
VICHG
ICHG Reference Voltage
EN_CHG = High
0.78
0.82
V
RICHG
ICHG Set Resistor Range
60.4
604
kΩ
ICFB
CFB Input Bias Current
20
nA
VCFB
CFB Reference Voltage
EN_CHG = High
0.82
V
CFB Hysteresis
EN_CHG = High
CFB Overvoltage Hysteretic Comparator
Switch Point
CFB Rising
CFB Falling
IICL
VIN Input Current Limit
VINS-VIN to Disable Charger
VINS-VIN to Disable Buck
VINS(CMI)
VINS Common Mode Range
fSW
Switching Frequency
FB ≥ 0.5V
Foldback Frequency (Buck Only)
FB ≤ 0.3V
VPFI
4.65
VCAP = 2V, VOUT = 3.3V, IVCAP = 1A
EN_CHG = High
–20
0.78
30
37
42
0.75
V
V
43
50
3.0
PFI Falling Threshold
mV
VCFB+0.035
VCFB
20
1
1.25
100
l
0.775
PFI Hysteresis
IPFI
0.8
V
0.8
–20
V
MHz
kHz
0.825
17
PFI Leakage Current
mV
mV
V
mV
20
nA
2
A
A
1A Buck Regulator
ISW1
SW1 Peak Current
tSS
Soft-Start Time
DC Max
Maximum Duty Cycle
RPMOS
PMOS On-Resistance
ILEAKP
PMOS Leakage Current
PWM Mode (Note 5)
Burst Mode® (Note 5)
1.3
1.65
0.5
1000
FB = 0V
100
%
0.5
Buck Disabled
µs
–2
1
Ω
2
µA
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3
LTC3355
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 12V unless otherwise noted. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
80
160
280
µA
4.5
5
1.5
5.5
A
A
5A Boost Regulator
IVOUT
VOUT Quiescent Current
VOUT = 3.3V, No Load, In Regulation, No
Switching, Burst Mode
ISW2
SW2 Peak Current
RIBSTPK = 200k, PWM Mode
RIBSTPK = 200k, Burst Mode
RNMOS
NMOS On-Resistance
ILEAKN
NMOS Leakage Current
DC Max
Boost Maximum Duty Cycle
VSBOOST
Boost Input Supply Voltage Range
l
70
Boost Disabled
–5
88
92
0.75
mΩ
5
µA
98
%
5
V
Boost Minimum Input Supply
VOUT(MAX) = 4V
0.5
V
AV
Boost Error Amplifier Voltage Gain
(Note 5)
gm
Boost Error Amplifier Transconductance
VIBSTPK
IBSTPK Reference Voltage
0.775
0.825
V
RIBSTPK
IBSTPK Set Resistor Range
200
1000
kΩ
850
V/V
27
μS
Logic (MODE, EN_CHG, CPGOOD, RSTB, PFOB)
VIL
Input Low Logic Voltage
MODE, EN_CHG
VIH
Input High Logic Voltage
MODE, EN_CHG
1.2
0.4
-1
V
V
IIL, IIH
Input Low/High Current
MODE, EN_CHG
1
µA
VOL
Output Logic Low Voltage
PFOB, CPGOOD, RSTB; Sink 100µA
50
mV
IOH
Logic High Leakage Current
PFOB, CPGOOD, RSTB; 5V
1
µA
CPGOOD Rising Threshold
VCAP as a % of Final Target
CPGOOD Hysteresis
∆VCAP as a % of Final Value
RSTB Falling Threshold
VOUT as a % of Final Target
RSTB Hysteresis
∆VOUT as a % of Final Value
RSTB Delay
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3355 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3355E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3355I is guaranteed over the –40°C to 125°C operating junction
temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
impedance and other environmental factors. The junction temperature
(TJ, in °C) is calculated from the ambient temperature (TA, in °C) and
power dissipation (PD, in Watts) according to the formula:
TJ = TA + (PD • θJA)
where θJA = 47°C/W for the UF package.
4
90
92.5
95
2.5
90
92.5
%
%
95
%
2.5
%
250
ms
Note 3: The LTC3355 has a thermal regulation loop that limits the
maximum junction temperature to 110°C by limiting the charger current.
Note 4: The current limit features of this part are intended to protect the
IC from short-term or intermittent fault conditions. Continuous operation
above the maximum specified pin current may result in device degradation
or failure.
Note 5: Guaranteed by design and/or correlation to static test.
Note 6: The LTC3355 has a thermal shutdown that will shut down the part
when the die temperature reaches 155°C.
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LTC3355
TYPICAL PERFORMANCE CHARACTERISTICS
Boost Efficiency
100
90
90
80
80
70
70
60
50
40
VOUT = 4V
MODE = HIGH
VIN = 18V
VIN = 12V
VIN = 6V
30
20
10
0
1.00
60
50
40
VCAP = 2.4V
MODE = HIGH
VOUT = 3.3V
VOUT = 4V
VOUT = 5V
30
20
10
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
LOAD CURRENT (A)
0
Maximum Buck Load Current
1.20
0
0.8
0.6
0.4
0.2
2.75
3.25
1200
600
1150
400
300
200
4.6
1000
900
0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
FB (V)
3355 G07
75
50
25
TEMPERATURE (°C)
0
100
125
3355 G06
6.3
VOUT = 3.3V
L = 6.8µH
INPUT CURRENT SET RESISTOR = 0.05Ω
Typical Minimum Buck Input
Voltage (VOUT = 5V)
VOUT = 5V
L = 6.8µH
INPUT CURRENT SET RESISTOR = 0.05Ω
6.1
5.9
4.2
5.7
4.0
3.8
3.6
3.0
20
950
800
–50 –25
Typical Minimum Buck Input
Voltage (VOUT = 3.3V)
5.5
5.3
5.1
4.9
3.2
100
18
1000
0 100 200 300 400 500 600 700 800 900 1000
SWITCH CURRENT (mA)
3.4
200
16
1050
VIN (V)
INPUT VOLTAGE (V)
FREQUENCY (kHz)
800
300
12 14
VIN (V)
850
4.4
400
10
3355 G05
Buck Frequency
vs Feedback Voltage
500
8
900
3355 G04
600
6
1100
500
0
3.75
700
4
Oscillator Frequency
vs Temperature
100
2.25
VOUT = 4V
L = 6.8µH
INPUT CURRENT SET RESISTOR = 0Ω
3355 G03
700
VCAP (V)
0
0
FREQUENCY (kHz)
SW VOLTAGE DROP (mV)
LOAD CURRENT (A)
1.0
1.75
0.40
Buck Switch Voltage Drop
VOUT = 4V
1.25
0.60
3355 G02
Maximum Boost Load Current
0
0.75
0.80
0.20
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
LOAD CURRENT (A)
3355 G01
1.2
LOAD CURRENT (A)
100
EFFICIENCY (%)
EFFICIENCY (%)
Buck Efficiency
TA = 25°C unless otherwise noted
4.7
1
10
100
VOUT LOAD CURRENT (mA)
1000
3355 G08
4.5
1
10
100
VOUT LOAD CURRENT (mA)
1000
3355 G09
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5
LTC3355
TYPICAL PERFORMANCE CHARACTERISTICS
Buck Switch Current Limit vs
Temperature
5.2
1.8
5.1
VOUT = 3.3V
4.9
4.8
VOUT = 5V
4.7
VIN = 12V
4.6
3.5
VOUT = 5V
1.7
VOUT = 4V
CURRENT (A)
CURRENT (A)
5.0
VOUT vs VINS-VIN
4.0
3.0
VOUT = 4V
1.6
VOUT = 3.3V
VOUT (V)
Boost Switch Current Limit vs
Temperature
TA = 25°C unless otherwise noted
1.0
1.5
100
1.4
–50
125
–25
50
25
0
75
TEMPERATURE (°C)
100
600
400
200
800
250
RICHG = 60.4k
600
400
200
0
30 32 34 36 38 40 42 44 46 48 50
VINS-VIN (mV)
300
VIN = 7V
VOUT = 3.3V
1000
CHARGE CURRENT (mA)
CHARGE CURRENT (mA)
800
0
0
–50 –25
100 200 300 400 500 600 700 800
VOUT-VCAP (mV)
4.045
4.040
4.040
4.035
4.035
4.030
4.030
VOUT (V)
4.025
4.020
PWM MODE
VIN = 18V
VIN = 12V
VIN = 6V
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
LOAD CURRENT (A)
3355 G16
50
25
75
0
TEMPERATURE (°C)
125
Boost Load Regulation
4.050
PWM MODE
4.045
IOUT = 50mA
4.040
4.035
IOUT = 500mA
4.025
4.020
4.030
4.025
4.020
4.015
4.015
4.010
4.010
4.005
4.005
4.000
100
3355 G15
VOUT (V)
4.045
VOUT (V)
4.050
0
100
Buck Line Regulation
Buck Load Regulation
4.005
150
3355 G14
4.050
4.010
200
50
RICHG = 604k
3355 G13
4.015
3355 G12
Charge Current
vs Junction Temperature
Charge Current vs VOUT-VCAP
1200
VIN = 7V
VOUT = 3.3V
1000
40 41 42 43 44 45 46 47 48 49 50
VINS-VIN (mV)
3355 G11
Charge Current vs VINS-VIN
1200
0
125
CHARGE CURRENT (mA)
75
50
25
TEMPERATURE (°C)
0
3355 G10
6
VIN = 7V
VOUT = 3.3V
IVOUT = 200mA
0.5
4.4
–50 –25
4.000
2.0
1.5
4.5
0
2.5
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
VIN (V)
3355 G17
4.000
0.001
PWM MODE
VCAP = 3.6V
VCAP = 2.4V
VCAP = 1.5V
0.01
0.1
LOAD CURRENT (A)
1
3355 G18
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LTC3355
TYPICAL PERFORMANCE CHARACTERISTICS
Logic Input Threshold vs
Temperature (EN_CHG, MODE)
Boost Line Regulation
4.045
PWM MODE
950
4.040
805
900
4.035
50mA
4.030
THRESHOLD (mV)
VOUT (V)
PFI Threshold vs Temperature
810
1000
500mA
4.025
4.020
4.015
THRESHOLD (mV)
4.050
TA = 25°C unless otherwise noted
850
800
750
795
700
4.010
800
650
4.005
4.000
0.75
1.25
1.75
2.25 2.75
VCAP (V)
3.75
3.25
600
–50 –25
75
50
25
TEMPERATURE (°C)
0
100
3355 G19
790
–50
125
75
0
25
50
TEMPERATURE (°C)
Buck Load Step Burst Mode
Operation
VOUT
100mV/DIV
AC-COUPLED
VOUT
100mV/DIV
AC-COUPLED
LOAD
CURRENT
500mA/DIV
LOAD
CURRENT
500mA/DIV
LOAD
CURRENT
500mA/DIV
3355 G23
50µs/DIV
LOAD STEP = 100mA to 600mA
VIN = 12V
VOUT = 4V
Boost Load Step Burst Mode
Operation
125
Boost Load Step PWM
VOUT
100mV/DIV
AC-COUPLED
3355 G22
100
3355 G21
3355 G20
Buck Load Step PWM
50µs/DIV
LOAD STEP = 100mA to 600mA
VIN = 12V
VOUT = 4V
–25
3355 G24
50µs/DIV
LOAD STEP = 100mA to 600mA
VCAP = 2.4V
VOUT = 4V
Boost Error Amplifier Voltage
Gain vs Temperature
Boost Error Amplifier
Transconductance vs Temperature
30
750
TRANSCONDUCTANCE (µS)
29
VOUT
100mV/DIV
AC-COUPLED
GAIN (V/V)
700
LOAD
STEP
500mA/DIV
50µs/DIV
LOAD STEP = 100mA to 600mA
VCAP = 2.4V
VOUT = 4V
650
3355 G25
600
28
27
26
25
24
23
22
21
550
–50
–25
75
0
25
50
TEMPERATURE (°C)
100
125
3355 G30
20
–50
–25
50
25
0
75
TEMPERATURE (°C)
100
125
3355 G27
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7
LTC3355
PIN FUNCTIONS
PFI (Pin 1): Input to the Power-Fail Comparator. The input
voltage below which the PFOB pin indicates a power-fail
condition can be programmed by connecting this pin to
an external resistor divider between VIN and ground.
FB (Pin 2): Sets the VOUT voltage for both the buck and
boost voltage control loops via an external resistor divider.
The reference voltage is 0.8V.
MODE (Pin 3): This pin sets the buck and boost switching modes. A low is PWM mode, a high is Burst Mode
operation.
VINS (Pin 4): Input Current Limit Sense Voltage Pin. Connect a sense resistor from VINS to VIN. Must be locally
bypassed with a low ESR ceramic capacitor. Connect to
VIN if input current limit is not needed.
VIN (Pin 5): Input Power Pin Supplies Current to the Internal Regulator and Buck Power Switch. Must be locally
bypassed with a low ESR ceramic capacitor.
VINM5 (Pin 6): This pin is used to filter an internal supply
regulator which generates a voltage of VIN – 4.65V. Connect a 1µF ceramic capacitor from VINM5 to VIN.
SW1 (Pin 7): Buck Output of the Internal Power Switch.
Connect this pin to the catch diode and inductor. Minimize
trace area at this pin to reduce EMI.
EN_CHG (Pin 8): A high on this pin enables the supercapacitor charger.
CPGOOD (Pin 9): Open-drain output is high impedance
when the VCAP voltage is higher than 92.5% of the programmed voltage.
PFOB (Pin 10): Open Drain of the Power-Fail Comparator.
Pulled low and enables the boost converter when the PFI
input has determined that the input supply has dropped out.
8
CFB (Pin 11): This pin is used to program the VCAP voltage via an external resistor divider. The reference voltage
is 0.8V.
ICHG (Pin 12): This pin programs the VCAP charge current
by connecting a resistor to ground.
RSTB (Pin 13): Open-drain reset output is high impedance when the VOUT voltage is higher than 92.5% of the
programmed regulation voltage.
VCAP (Pin 14): This pin is the constant current, constant
voltage linear charger output and connects to the supercapacitor.
VOUT (Pin 15): The Output Voltage Supply. The buck powers
this supply from VIN when the input voltage is present and
the boost powers this supply from VCAP when the input
voltage has dropped out.
SW2 (Pin 16, 17): Boost Output of the Internal Power
Switch. Connect these pins to the rectifier diode and
inductor. Minimize trace area at these pins to reduce EMI.
INTVCC (Pin 18): This pin is used to filter an internal supply.
Connect a 1µF ceramic capacitor from this pin to ground.
INTVCC is 2.5V during start-up until VOUT exceeds 2.5V
then INTVCC follows VOUT.
VCBST (Pin 19): This pin is the output of the boost internal
error amplifier. The voltage on this pin controls the peak
switch current for the boost regulator. Connect an RC
series network from this pin to ground to compensate
the boost control loop.
IBSTPK (Pin 20): This pin programs the boost peak current
limit by connecting a resistor to ground.
GND (Exposed Pad Pin 21): Ground. The exposed pad must
be connected to a continuous ground plane on the second
layer of the printed circuit board by several vias directly
under the part to achieve optimum thermal conduction.
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LTC3355
SIMPLIFIED BLOCK DIAGRAM
VOUT
COUT
R1
CVINM5
15
6
VOUT
VIN
+
–
OVP
UVLO
START-UP
VIN
INTVCC
2
VINM5
CAP REG
0.8V
3
FB
R2
5
VIN
MODE
ENB
CLK
OVP
EN
1A
LOGIC
SW1
VC
+
–
0.8V
R7
1
FB
PFI
R8
7
D1
SS
D2
PFOB
ILIM
+
–
13
ENB
0.8V
RSTB
OVP
ENB
MODE
FB
EN
CPGOOD
+
–
0.74V
+
–
9
CLK
FB
0.8V
D
INTVCC
0.8V
0.74V
CFB
18
LOGIC
EN_CHG
11
8
IOUT
IREF
VCAP
14
R4
0.8V
BOOST
VINS
SW2
MAIN
INPUT
CIN SUPPLY
4
16
17
V TO I
L2
VCBST
ICHG
12
R3
C1
5A
BILIM
VREF
EN
VIN
SW2
–
+
CC/CV CHARGER
CLK
250ms
DELAY
UVLO
+
–
10
CVIN
RSENSE
BUCK
+
–
VLOGIC
L1
19
R5
IBSTPK
20
RC
SCAP
R6
CC
3355 F01
Figure 1. LTC3355 Block Diagram
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For more information www.linear.com/LTC3355
9
LTC3355
OPERATION
The LTC3355 is a 1A buck regulator with a built-in
backup boost converter to allow temporary backup, or
ride-through, of VOUT during a sudden loss of VIN power.
The device contains all functions necessary to provide
seamless charging of a supercapacitor (or other storage
element), monitoring of VIN, VOUT and VCAP, and automatic
switch-over to backup power. When the buck is disabled
an internal circuit blocks reverse current between VOUT
and VIN.
Start-Up
When the part first starts up the only voltage available
is VIN since VOUT and VCAP are at zero volts. An internal
2.5V regulator powers INTVCC from VIN during start-up.
INTVCC powers all of the low voltage circuits. The buck
regulator is enabled and will drive VOUT positive through
an inductor until the feedback voltage at FB equals 0.8V.
When VOUT exceeds 2.5V INTVCC will exactly track VOUT
and the current for the internal low voltage circuits will
now be supplied from VOUT instead of VIN. A 1µF external
ceramic capacitor is required for INTVCC to filter internal
switching noise.
Buck Switching Regulator
The LTC3355 uses a 1MHz constant frequency peak current mode nonsynchronous monolithic buck regulator
with internal slope compensation to control the voltage at
VOUT when VIN is available. An error amplifier compares
the divided output voltage at FB with a reference voltage
of 0.8V and adjusts the peak inductor current accordingly.
Burst Mode operation can also be selected to optimize efficiency at low load currents via the MODE pin. The buck
is in PWM mode when the MODE pin is low and in Burst
Mode operation when the MODE pin is high. The buck
is internally compensated and can operate over an input
voltage range of 3V to 20V. An internal soft-start ramp
limits inrush current during start-up. Frequency foldback
protection helps to prevent inductor current runaway
during start-up or short-circuit conditions.
Input Current Limit
The (optional) input current limit is programmed via an
external sense resistor connected between VINS and VIN.
As the input current limit is reached the charge current
10
will be reduced. If the charge current has been reduced to
zero and the input current continues to increase the buck
regulator current drive capability will be reduced. The
maximum sense voltage is 50mV. The input current limit
includes the LTC3355 quiescent current for high accuracy
over a wide current range.
Boost Switching Regulator
When VIN is not available, a monolithic 1MHz constant
frequency peak current mode boost regulator with internal
slope compensation is enabled and the buck regulator
is disabled via the PFI pin. The boost regulator uses the
voltage stored at VCAP as an input supply and regulates
the VOUT voltage. An error amplifier compares the divided
output voltage at FB with a reference voltage of 0.8V and
adjusts the peak inductor current accordingly. The IBSTPK
pin sets the peak boost current over a range of 1A to 5A
allowing for lower current backup applications. The boost
switching regulator is compensated by adding a series RC
network from the VCBST pin to ground. The boost regulator
can operate over an input voltage range (VCAP) of 0.5V
to 5V. The boost regulator uses the same feedback pin
and error amplifier as the buck and regulates to the same
VOUT voltage. The MODE pin is used to control the boost
switching regulator mode. The boost is in PWM mode
when the MODE pin is low and in Burst Mode operation
when the MODE pin is high. In PWM mode as the load
current is decreased, the switch turns on for a shorter
period each cycle. If the load current is further decreased,
the boost converter will skip cycles to maintain output
voltage regulation.
Charger
The supercapacitor is charged by an internal 1A constant
current/constant voltage linear charger that supplies
current from VOUT to VCAP. The charger will be enabled
when VIN is above a programmable voltage via the PFI
pin, when the EN_CHG pin is high and when VOUT is in
regulation. The value of the resistor on the ICHG pin determines the charger current. An internal amplifier servos
the ICHG voltage to 0.8V to create the reference current
for the charge. The VCAP voltage is divided down by an
external resistor divider that is connected to the CFB pin.
A hysteretic comparator compares the CFB voltage to a
For more information www.linear.com/LTC3355
3355fb
LTC3355
OPERATION
0.8V reference voltage and turns the charger off when
these voltages are the same. The VCAP voltage represents
the fully charged supercapacitor voltage available to supply the boost regulator when VIN has dropped out. When
CFB decays to 30mV below the CFB reference voltage the
charger will be turned on. The LTC3355 includes a softstart circuit to minimize the inrush current at the start of
charge. When the charger is enabled, the charge current
ramps from zero to full-scale over a period of approximately
1ms. This has the effect of minimizing the transient load
current on VOUT.
The VCAP output also has an overvoltage protection circuit which monitors the CFB voltage. If the CFB voltage
increases above the CFB reference voltage by 35mV a
hysteretic comparator switches in an 8k resistor from
VCAP to ground. This will bleed any excess charge from
the supercapacitor. When the CFB voltage decays to the
CFB reference voltage the comparator will remove the
8k bleed resistor. Excess charge can come from leakage
currents associated with the boost rectifier diode.
VCAP Status Monitor
The CPGOOD pin is a 5V open-drain output. An internal
comparator determines when VCAP has reached 92.5% of
the programmed regulation voltage which then switches
the CPGOOD pin high. CPGOOD is normally connected to a
low voltage supply (VOUT) via an external pull-up resistor.
Thermal Regulation
As the die temperature increases due to internal power
dissipation, a thermal regulator will limit the die temperature to 110°C by reducing the charger current. The
thermal regulation protects the LTC3355 from excessive
temperature and allows the user to push the limits of the
power handling capability of a given circuit board without
the risk of damaging the LTC3355. Another feature is that
the charge current can be set according to typical, rather
than worst-case ambient temperatures for a given application with the assurance that the charger will automatically
reduce the charge current in worst-case conditions.
Thermal Shutdown
VIN Status Monitor
The PFI input always monitors the VIN voltage and determines when VIN is in dropout. VIN is divided down
by an external resistor divider and this voltage is then
compared to a reference voltage of 0.8V. If the PFI voltage is below the reference voltage the buck regulator and
the charger will be disabled and the boost regulator will
be enabled. The PFOB pin is a 5V open-drain output. This
pin is driven internally by the PFI comparator. When the
PFI comparator determines that VIN has dropped out the
PFOB output switches low. PFOB is normally connected
to a low voltage supply, via an external pull-up resistor.
The pull-up resistor for this output can be connected to
VOUT if another supply is not available.
The LTC3355 includes a thermal shutdown circuit in addition to the thermal regulator. If for any reason, the die
temperature exceeds 155°C, the entire part shuts down.
The part will resume normal operation once the temperature
drops about 15°C, to approximately 140°C.
VOUT Overvoltage, Undervoltage Lockout
The LTC3355 includes an overvoltage protection circuit
to ensure that VOUT does not exceed 5.65V (nominal).
An internal resistor divider from VOUT is connected to an
amplifier that will regulate VOUT as the overvoltage limit
is reached. The LTC3355 includes undervoltage lockout
which disables the boost when VOUT is < 2V typical.
VOUT Status Monitor
The RSTB pin is a 5V open-drain output. An internal
comparator determines when VOUT has reached 92.5% of
the programmed regulation voltage which then switches
the RSTB pin high. RSTB is normally connected to a low
voltage supply (VOUT) via an external pull-up resistor.
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For more information www.linear.com/LTC3355
11
LTC3355
APPLICATIONS INFORMATION
FB Resistor Network
IBSTPK Set Resistor
The VOUT voltage is programmed with a resistor divider
between the VOUT pin and the FB pin. Choose the resistor
values according to:
The boost peak current limit is set by connecting a resistor from IBSTPK to ground. Choose the resistor value
according to:
⎛V
⎞
R1= R2 ⎜ OUT – 1⎟
⎝ 0.8V ⎠
Boost Peak Current Limit (Amps) =
1E6
R6
Reference designators refer to the Block Diagram. 1%
resistors are recommended to maintain output voltage
accuracy.
Reference designators refer to the Block Diagram. 1%
resistors are recommended to maintain boost peak current accuracy.
CFB Resistor Network
PFI Resistor Network
The VCAP voltage is programmed with a resistor divider
between the VCAP pin and the CFB pin. Choose the resistor
values according to:
The VIN dropout voltage is programmed with a resistor
divider between the VIN pin and PFI pin. Choose the resistor values according to:
⎛V
⎞
R3 = R4 ⎜ CAP – 1⎟
⎝ 0.8V ⎠
⎛ V
⎞
R7 = R8 ⎜ IN – 1⎟
⎝ 0.8V ⎠
Reference designators refer to the Block Diagram. 1%
resistors are recommended to maintain the capacitor float
voltage accuracy.
Reference designators refer to the Block Diagram. 1%
resistors are recommended to maintain the PFI threshold
voltage accuracy.
ICHG Set Resistor
The VIN voltage must be greater than the buck dropout
voltage (100% duty cycle) when the PFI level is reached
to ensure that VOUT stays in regulation.
The charge current at VCAP is set by connecting a resistor
from ICHG to ground. Choose the resistor value according to:
60400
Charger Current (Amps) =
R5
Reference designators refer to the Block Diagram. 1%
resistors are recommended to maintain charge current
accuracy.
12
Input Voltage Range
The minimum input voltage is determined by the dropout
of the buck regulator. The dropout is dependent on the
maximum load current and the buck internal switch resistance. The minimum input voltage due to buck dropout is:
VIN(MIN) = VOUT + (ISW(PEAK) • 1Ω)
3355fb
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LTC3355
APPLICATIONS INFORMATION
Buck Inductor L1 Selection and
Maximum Output Current
A good starting point for the inductor value is:
L = ( VOUT + VD ) •
1.8
fSW
where fSW is the switching frequency in MHz, VOUT is the
buck output voltage, VD is the catch diode drop (~0.5V)
and L is the inductor value in µH.
The inductor’s RMS current rating must be greater than
the maximum load current and its saturation current
should be 30% higher. To keep the efficiency high, the
series resistance (DCR) should be less than 0.1Ω, and
the core material should be intended for high frequency
applications. Table 1 lists several inductor vendors.
For robust operation and fault conditions (start-up or
short-circuit) and high input voltage (>15V), the saturation
current should be chosen high enough to ensure that the
inductor peak current does not exceed 2.2A.
The current in the inductor is a triangle wave with an average value equal to the load current. The peak inductor
and switch current is:
ISW(PEAK) =IL(PEAK) =IOUT(MAX) +
When the switch is off, the potential across the inductor
is the output voltage plus the catch diode drop. This gives
the peak-to-peak ripple current in the inductor:
ΔIL
2
where IL(PEAK) is the peak inductor current, IOUT(MAX) is the
maximum output load current and ∆IL is the inductor ripple
current. The LTC3355 limits the switch current in order to
protect the part. Therefore, the maximum output current
that the buck will deliver depends on the switch current
limit, the inductor value, the input and output voltages.
ΔIL = (1–DC) •
VOUT + VD
L • fSW
where fSW is the switching frequency of the buck, DC is
the duty cycle and L is the value of the inductor.
To maintain output regulation, the inductor peak current
must be less than the buck switch current limit. The
maximum output current is:
IOUT(MAX) =ILIM –
ΔIL
2
Choosing an inductor value so that the ripple current is
small will allow a maximum output current near the switch
current limit.
Table 1. Inductor Vendors
VENDOR
URL
PART SERIES
TYPE
Murata
www.murata.com
LQH5BPB
Shielded
TDK
www.tdk.com
LTF5022T
Shielded
Toko
www.toko.com
FDS50xx
Shielded
Coilcraft
www.coilcraft.com
XAL40xx, LPS40xx Shielded
Sumida
www.sumida.com
DCRH5D, CDRH6D Shielded
Viashay
www.vishay.com
IHLP2020
Shielded
One approach to choosing the inductor is to start with
the simple rule above, look at the available inductors, and
choose one to meet cost or space goals. Then use the
equations to check that the buck will be able to deliver the
required output current. These equations assume that the
inductor current is continuous. Discontinuous operation
occurs when IOUT is less than ∆IL/2.
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13
LTC3355
APPLICATIONS INFORMATION
Buck Input Capacitor
Bypass VIN and VINS with a ceramic capacitor of X7R or
X5R type. A 10µF to 22µF ceramic capacitor is adequate for
bypassing. Note that a larger VINS bypass capacitor may
be required if the input power supply source impedance
is high or there is significant inductance due to long wires
or cables. This can be provided with a lower performance
electrolytic capacitor in parallel with the ceramic capacitor.
Buck regulators draw current from the input supply in
pulses with very fast rise and fall times. The input capacitors
are required to reduce the resulting voltage ripple at VINS
and VIN and to force this very high frequency switching
into a tight local loop, minimizing EMI. The capacitors
must be placed close to the LTC3355 pins.
Output Capacitor and Output Ripple
The output capacitor has two essential functions. Along
with the inductor, it filters the square wave generated by
the buck regulator to produce the DC output. In this role
it determines the output ripple, and low impedance at the
switching frequency is important. The second function is to
store energy in order to satisfy transient loads and stabilize
the buck regulator control loop. Ceramic capacitors have
very low equivalent series resistance (ESR) and provide
the best ripple performance. A good starting value is:
⎛ 100 ⎞
COUT = fSW ⎜
⎝ VOUT ⎟⎠
where fSW is in MHz and COUT is the recommended output
capacitance in µF. Use X5R or X7R types. This choice will
provide low output ripple and good transient response.
When choosing a capacitor look carefully through the
data sheet to find out what the actual capacitance is under
14
operating conditions (applied voltage and temperature).
A physically larger capacitor, or one with a higher voltage
rating, may be required. High performance tantalum or
electrolytic capacitors can be used for the output capacitor.
Low ESR is important, so choose one that is intended for
use in switching regulators. The ESR should be specified
by the supplier, and should be 0.05Ω or less. Table 2 lists
several capacitor vendors.
Table 2. Capacitor Vendors
VENDOR
URL
PART SERIES
COMMANDS
Panasonic
www.panasonic.com
Ceramic, Polymer,
Tantalum
EEF Series,
POSCAP
Kemet
www.kemet.com
Ceramic, Tantalum
T494, T495
Murata
www.murata.com
Ceramic
AVX
www.avxcorp.com
Ceramic, Tantalum
TPS Series
Taiyo Yuden www.taiyo-yuden.com Ceramic
Buck Catch Diode Selection
The catch diode (D1 in the Block Diagram) conducts current only during the switch-off time. The average forward
current in normal operation can be calculated from:
ID(AVG) = IOUT(1 – DC)
where DC is the duty cycle. The only reason to consider
a diode with a larger current rating than necessary for
nominal operation is for the case of shorted or overloaded
output conditions. For the worst case of shorted output
the diode average current will then increase to a value that
depends on the switch current limit.
If operating at high temperatures select a Schottky diode
with low reverse leakage current.
3355fb
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LTC3355
APPLICATIONS INFORMATION
Audible Noise
Table 3. Schottky Diode Vendors
Ceramic capacitors are small, robust and have very low
ESR. However, ceramic capacitors can sometimes cause
problems when used with switching regulators. Both the
buck and boost can run in Burst Mode operation and the
switching frequency will depend on the load current which
at very light loads can excite the ceramic capacitors at
audio frequencies, generating audible noise. Since the
buck and boost operate at lower current limits in Burst
Mode operation, the noise is typically very quiet. Use a
high performance tantalum or electrolytic at the output if
the noise level is unacceptable.
Buck Soft-Start
When the buck is enabled soft-start is engaged. Soft-start
reduces the inrush current by taking more time to reach
the final output voltage. This is achieved by limiting the
buck output current over a 1ms period.
Boost Rectifier Diode
A Schottky rectifier diode (D2 in the Block Diagram) is
recommended for the boost rectifier diode. The diode
should have low forward drop at the peak operating
current, low reverse current and fast reverse recovery
times. The current rating should take into account power
dissipation as well as output current requirements. The
diode current rating should be equal to or greater than the
average forward current which is normally equal to the
output current. The reverse breakdown voltage should be
greater than the VOUT voltage plus the peak ringing voltage
that is generated at the SW2 pin. Generally higher reverse
breakdown diodes will have lower reverse currents. Refer
to Table 3 for Schottky diode vendors.
PART NUMBER
VR (V) IAVE (A)
VF AT 1A VF AT 2A
(mV)
(mV)
IR AT 5V
85°C (µA)
Diodes Inc.
B130
30
1
B230
30
2
30
1
60
2.1
460
20
430
100
Rohm
RSX201VA-30
360
600
Vishay
VS-20MQ060
Boost Inductor L2 Selection and
Maximum Output Current
The boost inductor L2 should be 3.3µH to ensure fast
transfer of power from the buck to the boost after a VIN
power outage. Refer to Table 1 for inductor vendors.
Boost Frequency Compensation
The LTC3355 boost switching regulator uses current mode
control to regulate VOUT. This simplifies loop compensation and ceramic output capacitors can be used. The boost
regulator does not require the ESR of the output capacitor for stability. Frequency compensation is provided by
the components connected to the VCBST pin. Generally a
capacitor (CC) and resistor (RC) in series to ground are
used as shown in the Block Diagram.
Loop compensation determines the stability and transient
performance. Optimizing the design of the compensation
network depends on the application and type of output
capacitor. A practical approach is to start with one of the
circuits in this data sheet that is similar to your application and tune the compensation network to optimize the
performance. Stability should then be checked across all
3355fb
For more information www.linear.com/LTC3355
15
LTC3355
APPLICATIONS INFORMATION
Low Ripple Burst Mode Operation
operating conditions, including load current, input voltage
and temperature. Figure 2 shows an equivalent circuit for
the boost regulator control loop. The error amplifier is a
transconductance amplifier with a finite output impedance.
The power section consisting of a modulator, power switch
and inductor, is modeled as a transconductance amplifier
generating an output current proportional to the voltage
at the VCBST pin. Note that the output capacitor integrates
this current, and that the capacitor on the VCBST pin (CC)
integrates the error amplifier output current, resulting in
two poles in the loop. In most cases a zero is required
and comes from either the ESR of the output capacitor or
from a resistor RC in series with CC. This simple model
works well as long as the inductor value is not too high
and the loop crossover frequency is much lower than the
switching frequency. A phase lead capacitor across the
feedback divider may improve the transient response. A
small capacitor from VCBST to ground may have to be
added if phase lead is used.
To enhance efficiency at light loads the buck and boost
regulator can run in low ripple Burst Mode operation which
keeps the output capacitor charged to the proper voltage
while minimizing the input quiescent current. Setting the
MODE pin high sets both the buck and boost into Burst
Mode operation. During Burst Mode operation, the enabled
regulator delivers single cycle bursts of current to the output capacitor followed by sleep periods where the power
is delivered to the load by the output capacitor. Since the
power to the output is delivered with single, low current
pulses, the output ripple is kept below 15mV for typical
applications. As the load current falls towards a no-load
condition, the percentage of time in sleep mode increases
and the average input current is greatly reduced resulting
in high efficiency even at very light loads. At higher load
currents the regulators will seamlessly transition into
PWM mode.
BOOST LOOP
SW2
CURRENT MODE POWER STAGE
OUTPUT
gm = 4mhos
R1
FB
–
gm = 27μS
+
32M
VCBST
CF
CPL
0.8V
ESR
COUT
R2
COUT
CERAMIC
POLYMER,
TANTALUM
OR
ELECTROLYTIC
GND
RC
CC
3355 F02
Figure 2. Model for Boost Loop Response
16
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For more information www.linear.com/LTC3355
LTC3355
APPLICATIONS INFORMATION
PCB Layout
High Temperature Considerations
For proper operation and minimum EMI, care must be
taken during printed circuit board layout. Large switched
currents flow in the VIN, SW1, SW2 and paddle ground
pins, the buck catch diode, boost rectifier diode and the
input capacitor. The loop formed by these components
should be as small as possible. These components, along
with the inductors and output capacitor, should be placed
on the same side of the circuit board, and their connections should be made on that layer. All connections to
GND should be made at a common star ground point or
directly to a local, unbroken ground plane below these
components. SW1 and SW2 nodes should be laid out
carefully to avoid interference. Keep the FB, PFI, ICHG,
IBSTPK, VCBST and CFB nodes small so that the ground
traces will shield them from the switching nodes. To
keep thermal resistance low, extend the ground plane as
much as possible and add thermal vias under and near the
paddle. Keep in mind that the thermal design must keep
the junctions of the LTC3355 below the specified absolute
maximum temperature.
The PCB must provide heat sinking to keep the LTC3355
cool. The exposed pad on the bottom of the package
may be soldered to a copper area which should be tied
to large copper layers below with thermal vias; these
layers will spread the heat dissipated by the LTC3355.
Place additional vias to reduce thermal resistance
further. With these steps, the thermal resistance from
the die (or junction) to ambient can be reduced to
θJA = 47°C/W or less. With 100 LFPM airflow, this resistance can fall by another 25%.
The LTC3355 has two thermal circuits. The first thermal
circuit is operational when the buck and charger are enabled.
If the die temperature exceeds 110°C the charge current
will be reduced. When the LTC3355 is in boost mode the
high current thermal shutdown will turn the boost off when
the die temperature reaches 155°C. The high temperature
shutdown is active in all modes of operation.
TYPICAL APPLICATIONS
Tantalum Capacitor Charger and Ride-Through Backup Supply
VIN
12V
RS
1Ω
CIN
10µF
CVIN
10µF
R7
2.49M
R8
200k
CCAP
1µF
5
VIN
SW1
L1
6.8µH
7
D1
6 VINM5
VINS
4
PFO
BUCK VOUT
15
R1
523k
FB 2
1 PFI
D2
LTC3355
10 PFOB
VCAP
13 RSTB
SW2
9 CPGOOD
BOOST
14
16
R3
1.05M
CFB 11
3 MODE
INTVCC
18
C1
1µF
VCBST 19
ICHG
IBSTPK
12
20
R5
604k
R6
1M
R2
100k
L2 3.3µH
17
8 EN_CHG
VOUT
5V
47µF 10mA
RC
154k
CC
220pF
+
5V
1000µF
6.3V
TANT
R4
200k
3355 TA02
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For more information www.linear.com/LTC3355
17
LTC3355
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UF Package
20-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1710 Rev A)
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.00 REF
2.45 ±0.05
2.45 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
0.75 ±0.05
R = 0.05
TYP
R = 0.115
TYP
19 20
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
4.00 ±0.10
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
BOTTOM VIEW—EXPOSED PAD
1
2.00 REF
2.45 ±0.10
2
2.45 ±0.10
(UF20) QFN 01-07 REV A
0.200 REF
0.00 – 0.05
0.25 ±0.05
0.50 BSC
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
18
3355fb
For more information www.linear.com/LTC3355
LTC3355
REVISION HISTORY
REV
DATE
DESCRIPTION
A
08/14
Modified VOUT Overvoltage, Undervoltage Lockout section
11
Modified Input Voltage Range equation
12
Modified ICHG Set Resistor section
12
Modified IBSTPK Set Resistor section
12
B
4/15
PAGE NUMBER
Updated conditions for ISW1, ISW2 and IVOUT
3 and 4
Updated units for Boost Error Amplifier Transconductance
4
Updated units for Boost Error Amplifier Transconductance vs Temperature Graph
7
Update TSTB (Pin 13), CPGOOD (Pin 9), PFOB (Pin 10)
8
Updated Block Diagram
9
Updated CFB Resistor Network and PFI Resistor Network
12
Updated Table 2: Capacitor Vendors
14
Updated Boost Error Amplifier Transconductance unit in Figure 2
16
3355fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LTC3355
19
LTC3355
TYPICAL APPLICATION
NiMH Trickle Charger and Ride-Through Backup Supply
VIN
5V
RS*
0.27Ω
CIN
10µF
CCAP
1µF
CVIN*
10µF
R7
931k
5
VIN
SW1
7
D1
6 VINM5
VINS
4
PFO
BUCK VOUT
15
D2
LTC3355
VCAP
14
10 PFOB
MICROPROCESSOR
SW2
13 RSTB
24 HOURS
9 CPGOOD
BOOST
R3
499k
CFB 11
3 MODE
INTVCC
18
ICHG
12
C1
1µF
VCBST 19
IBSTPK
20
R5
604k
R6
909k
R2
100k
200Ω
L2 3.3µH
17
8 EN_CHG
*OPTIONAL
16
VOUT
3.3V
47µF 50mA (MAX)
R1
316k
FB 2
1 PFI
R8
200k
L1
4.7µH
RC
154k
CC
220pF
+
1.4V
NiMH
2000mAhr
R4
499k
3355 TA03
RELATED PARTS
PART
NUMBER
DESCRIPTION
COMMENTS
LTC3225/
LTC3225-1
150mA Supercapacitor Charger
Low Noise, Constant Frequency Charging of Two Series Supercapacitors. Automatic
Cell Balancing Prevents Capacitor Overvoltage During Charging. Programmable Charge
Current (Up to 150mA). 2mm × 3mm DFN Package
LTC3226
2-Cell Supercapacitor Charger with Backup
PowerPath™ Controller
1×/2× Multimode Charge Pump Supercapacitor Charger Ideal Diode Main PowerPath™
Controller, Internal 2A LDO Back-Up Supply, 16-Lead (3mm × 3mm) QFN Package
LT3485
Photoflash Capacitor Chargers with Output
Voltage Monitor and Integrated IGBT Drive
Integrated IGBT Driver; Voltage Output Monitor; Uses Small Transformers: 5.8mm
× 5.8mm × 3mm. Operates from Two AA Batteries, Single Cell Li-Ion or Any Supply
from 1.8V Up to 10V. No Output Voltage Divider Needed; No External Schottky Diode
Required. Charges Any Size Photoflash Capacitor; 10-Lead (3mm × 3mm) DFN Package
LTC3625/
LTC3625-1
1A High Efficiency 2-Cell Supercapacitor
Charger with Automatic Cell Balancing
High Efficiency Step-Up/Step-Down Charging of Two Series Supercapacitors. Automatic
Cell Balancing Prevents Capacitor Overvoltage During Charging. Programmable
Charging Current Up to 500mA (Single Inductor), 1A (Dual Inductor). VIN = 2.7V to
5.5V, Low No-Load Quiescent Current: 23µA. 12-lead 3mm × 4mm DFN Package
LT®3750
Capacitor Charger Controller
Charges Any Size Capacitor; Easily Adjustable Output Voltage. Drives High Current
NMOS FETs; Primary-Side Sense—No Output Voltage Divider Necessary. Wide Input
Range: 3V to 24V; Drives Gate to VCC – 2V. 10-Lead MS Package
LT3751
High Voltage Capacitor Charger Controller with
Regulation
Charges Any Size Capacitor; Low Noise Output in Voltage Regulation Mode. Stable
Operation Under a No-Load Condition; Integrated 2A MOSFET Gate Driver with
Rail-to-Rail Operation for VCC ≤ 8V. Wide Input VCC Voltage Range
(5V to 24V). 20-Pin QFN 4mm × 5mm and 20-Lead TSSOP Packages
LTC4425
Supercapacitor Charger with Current Limited
Ideal Diode
Constant-Current/Constant-Voltage Linear Charger for 2-cell Series Supercapacitor
Stack. VIN: Li-Ion/Polymer Battery, a USB Port, or a 2.7V to 5.5V Current-Limited
Supply. 2A Charge Current, Auto Cell Balancing, 20µA Quiescent Current, Shutdown
Current <2µA. Low Profile 12-Pin 3mm × 3mm DFN or a 12-Lead MSOP Package
20 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTC3355
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTC3355
3355fb
LT 0415 REV B • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2014