INTEGRATED CIRCUITS DATA SHEET TDA7052A/AT 1 W BTL mono audio amplifier with DC volume control Product specification File under Integrated circuits, IC01 July 1994 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT FEATURES GENERAL DESCRIPTION • DC volume control The TDA7052A/AT are mono BTL output amplifiers with DC volume control. They are designed for use in TV and monitors, but also suitable for battery-fed portable recorders and radios. • Few external components • Mute mode • Thermal protection • Short-circuit proof Missing Current Limiter (MCL) • No switch-on and off clicks A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended). • Good overall stability • Low power consumption • Low HF radiation • ESD protected on all pins QUICK REFERENCE DATA SYMBOL PARAMETERS VP positive supply voltage range PO output power CONDITIONS MIN. TYP. MAX. UNIT 4.5 − 18 V TDA7052A RL = 8 Ω; VP = 6 V 1.0 1.1 − W TDA7052AT RL = 16 Ω; VP = 6 V 0.5 0.55 − W Gv maximum total voltage gain 34.5 35.5 36.5 dB φ gain control range 75 80 − dB IP total quiescent current VP = 6 V; RL = ∞ − 7 12 mA THD total harmonic distortion TDA7052A PO = 0.5 W − 0.3 1 % TDA7052AT PO = 0.25 W − 0.3 1 % ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA7052A 8 DIL plastic SOT97(1) TDA7052AT 8 mini-pack plastic SOT96A(2) Notes 1. SOT97-1; 1996 September 10. 2. SOT96-1; 1996 September 10. July 1994 2 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT VP handbook, full pagewidth 1 n.c. positive input DC volume control 7 TDA7052A TDA7052AT I + i 5 I – i 8 positive output 2 4 STABILIZER Vref negative output TEMPERATURE PROTECTION 3 6 MCD385 - 1 power ground signal ground Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION VP 1 positive supply voltage IN+ 2 positive input GND1 3 signal ground VC 4 DC volume control OUT+ 5 positive output GND2 6 power ground n.c 7 not connected OUT− 8 negative output July 1994 handbook, halfpage VP 1 IN + 2 GND1 3 VC 4 TDA7052A TDA7052AT 8 OUT – 7 n.c. 6 GND2 5 OUT + MCD384 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT Thus a reduced power supply with smaller capacitors can be used which results in cost savings. FUNCTIONAL DESCRIPTION The TDA7052A/AT are mono BTL output amplifiers with DC volume control, designed for use in TV and monitors but also suitable for battery fed portable recorders and radios. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power. In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitors to keep the offset voltage low. The maximum gain of the amplifier is fixed at 35.5 dB. The DC volume control stage has a logarithmic control characteristic. In the TDA7052A/AT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required and yet a low offset voltage is maintained. At the same time the minimum supply remains low. The total gain can be controlled from 35.5 dB to −44 dB. If the DC volume control voltage is below 0.3 V, the device switches to the mute mode. The amplifier is short-circuit proof to ground, VP and across the load. Also a thermal protection circuit is implemented. If the crystal temperature rises above +150 °C the gain will be reduced, so the output power is reduced. The BTL principle offers the following advantages: • Lower peak value of the supply current • The frequency of the ripple on the supply voltage is twice the signal frequency. Special attention is given to switch on and off clicks, low HF radiation and a good overall stability. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage range − 18 V IORM repetitive peak output current − 1.25 A IOSM non-repetitive peak output current − 1.5 A Ptot total power dissipation Tamb ≤ 25% TDA7052A − 1.25 W TDA7052AT − 0.8 W +85 °C Tamb operating ambient temperature range −40 Tstg storage temperature range −55 +150 °C Tvj virtual junction temperature − +150 °C Tsc short-circuit time − 1 hr V2 input voltage pin 2 − 8 V V4 input voltage pin 4 − 8 V July 1994 4 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT THERMAL RESISTANCE SYMBOL Rth j-a PARAMETER THERMAL RESISTANCE from junction to ambient in free air TDA7052A 100 K/W TDA7052AT 155 K/W Notes to the thermal resistance TDA7052A: VP = 6 V; RL = 8 Ω. The maximum sine-wave dissipation is 0.9 W. Therefore Tamb(max) = 150 − 100 × 0.9 = 60 °C. TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W. Therefore Tamb(max) = 150 − 155 × 0.46 = 78 °C. July 1994 5 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT CHARACTERISTICS VP = 6 V; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 Ω; TDA7052AT: RL = 16 Ω; unless otherwise specified (see Fig.6). SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 4.5 − 18 V − 7 12 mA TDA7052A 1.0 1.1 − W TDA7052AT 0.5 0.55 − W − 0.3 1 % VP positive supply voltage range IP total quiescent current VP = 6 V; RL = ∞ note 1 Maximum gain; V4 = 1.4 V PO THD output power THD = 10% total harmonic distortion TDA7052A PO = 0.5 W TDA7052AT PO = 0.25 W Gv voltage gain VI input signal handling − 0.3 1 % 34.5 35.5 36.5 dB V4 = 0.8 V; THD < 1% 0.5 0.65 − V µV Vno(rms) noise output voltage (RMS value) f = 500 kHz; note 2 − 210 − B bandwidth −1 dB − 20 Hz to 300 kHz − SVRR supply voltage ripple rejection note 3 38 46 − dB |Voff| DC output offset voltage − 0 150 mV ZI input impedance (pin 2) 15 20 25 kΩ − −44 − dB note 4 − 20 30 µV V4 ≤ 0.3 V; VI = 600 mV − − 30 µV 75 80 − dB 60 70 80 µA Minimum gain; V4 = 0.5 V Gv voltage gain Vno(rms) noise output voltage (RMS value) Mute position VO output voltage in mute position DC volume control φ gain control range I4 control current V4 = 0.4 V Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage dividend by RL. 2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz. 3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value) is applied to the positive supply rail. 4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted. July 1994 6 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT MCD389 - 1 MCD388 1000 Vnoise (µV) 800 40 gain (dB) 20 handbook, halfpage handbook, halfpage 0 600 – 20 400 – 40 200 – 60 0 – 80 0 0.4 0.8 1.2 1.6 0 2.0 V4 (V) Fig.4 MCD390 - 1 100 handbook, halfpage I4 (µA) 60 20 – 20 – 60 – 100 Fig.5 July 1994 0.4 0.8 1.2 1.6 0.8 1.2 2.0 1.6 V4 (V) Fig.3 Gain control as a function of DC volume control. 0 0.4 2.0 V4 (V) Control current as a function of DC volume control. 7 Noise output voltage as a function of DC volume control. Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT APPLICATION INFORMATION (1) VP = 6 V handbook, full pagewidth 220 µF 100 nF 1 n.c. 7 TDA7052A TDA7052AT positive input 0.47 µF I + i 5 2 R L= 8 Ω 4 (TDA7052A) R L = 16 Ω (TDA7052A/AT) I – i RS 8 5 kΩ STABILIZER Vref TEMPERATURE PROTECTION DC volume control 3 6 MCD386 - 1 This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1. Fig.6 Test and application diagram. handbook, halfpage volume control 4 1 µF 1 MΩ MCD387 Fig.7 July 1994 Application with potentiometer as volume control; maximum gain = 30 dB. 8 ground Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN July 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 9 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA July 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 10 o 8 0o Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. July 1994 TDA7052A/AT 11 Philips Semiconductors Product specification 1 W BTL mono audio amplifier with DC volume control TDA7052A/AT DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 12