INTEGRATED CIRCUITS DATA SHEET TDA9178 YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Preliminary specification File under Integrated Circuits, IC02 1999 Sep 24 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 FEATURES • Picture content dependent non-linear Y, U and V processing by luminance histogram analysis • Variable gamma control • Adaptive black and white stretch control • Skin tone correction The adaptive black stretch function of the TDA9178 offers the possibility of having a larger ‘weight’ for the black parts of the video signal; the white stretch function offers an additional overall gain for increased light production. • Green enhancement • Blue stretch • Luminance Transient Improvement (LTI) To maintain a proper colour reproduction, the saturation of the U- and V-colour difference signals is also controlled as a function of the actual non-linearity in the luminance channel. • Smart peaking for detail enhancement • Colour Transient Improvement (CTI) • SCAn VElocity Modulation (SCAVEM) output • Line Width Control (LWC) In the colour vector processor, the dynamic skin tone correction locally changes the hue of colours that match skin tones to the correct hue. The green enhancement circuit activates medium saturated green towards to more saturated green. The blue stretch circuit can be activated which shifts colours near white towards blue. • Video Dependent Coring (VDC) • Colour Dependent Sharpness (CDS) • Noise measurement • Feature Mode (FM) detector • Cue Flash (CF) detector The spectral processor provides 1D luminance transient improvement, luminance detail enhancement by smart peaking and a 1 D colour transient improvement. The TDA9178 can be used as a cost effective alternative to (but also in combination with) scan velocity modulation. • Three additional pins for access to 6-bit ADC and I2C-bus • Adjustable chrominance delay • TV standard independent In the spectral processor line width control (or aperture control) can be user defined. The TDA9178 is capable of adjusting the amount of coring according to the video level with the video dependent coring. The TDA9178 is also capable to give extra sharpness in the cases of saturated red and magenta parts of the screen using the colour dependent sharpness feature. • I2C-bus controlled • 1fH and 2fH • DEmonstration MOde (DEMO). GENERAL DESCRIPTION The TDA9178 is a transparent analog video processor with YUV input and output interfaces. It offers three main functions: luminance vector processing, colour vector processing and spectral processing. Beside these three main functions, there are some additional functions. An embedded noise detector measures noise during the field retrace in parts which are expected to be free from video or text information. With the noise detector a variety of ‘smart noise control’ architectures can be set up. A feature mode detector is available for detecting signal sources like VCR (in still picture mode) that re-insert the levels of the retrace part. For this kind of signals the noise measurement of the TDA9178 is not reliable. In the luminance vector processor, the luminance transfer function is controlled in a non-linear way by the distribution, in 5 discrete histogram sections, of the luminance values measured in a picture. As a result, the contrast ratio of the most important parts of the scene will be improved. Black restoration is available in the event of a set-up in the luminance signal. An output signal (on the I2C-bus and on a separate pin) is available that detects when the picture content has been changed significantly, called cue flash. A variable gamma function, after the histogram conversion, offers the possibilities of alternative brightness control or factory adjustment of the picture tube. An embedded 6-bit ADC can be used for interfacing three analog low frequency voltage signals (e.g. ambient light control or beam current voltage level) to the I2C-bus. 1999 Sep 24 2 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 In the demonstration mode all the features selected by the user are automatically toggled between on and off. The TDA9178 concept has a maximum flexibility which can be controlled by the embedded I2C-bus. The supply voltage is 8 V. The device is mounted in a 24-lead SDIP package, or in a 24-lead SO package. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage 7.2 8.0 8.8 V Vi(Y) luminance input voltage (excluding sync) AMS = 0 − 0.315 0.45 V AMS = 1 − 1.0 1.41 V Vi(UV) UV input voltage − − 1.9 V VFS(ADC) full-scale ADC input voltage − 2.0 − V ORDERING INFORMATION TYPE NUMBER TDA9178 TDA9178T 1999 Sep 24 PACKAGE NAME SDIP24 SO24 DESCRIPTION VERSION plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 13 luminance vector processing 21 spectral processing SOUT SMART PEAKING YIN UIN VIN 6 8 9 Y INPUT STAGE U, V LUMINANCE TRANSIENT IMPROVEMENT LUMINANCE PROCESSING VIDEO DEPENDENT CORING black stretch histogram processing gamma control VCC 4 VEE SC SATURATION CORRECTION 15 OUTPUT STAGE 19 17 16 DELAY CONTROL 20 18 SUPPLY 24 1 WINDOW GENERATION skin tone correction green enhancement blue stretch 23 COLOUR PROCESSING 22 NOISE MEASURING 10 CALIBRATE cue flash FEATURE MODE DETECTION SDA SCL ANALOG TO DIGITAL CONVERTER 3 4 5 n.c. n.c. CF n.c. ADEXT1 ADEXT2 ADEXT3 7 14 11 I2C-BUS CONTROL Fig.1 Block diagram. TDA9178 MGR897 Preliminary specification ADR UOUT VOUT COLOUR TRANSIENT IMPROVEMENT 2 TP YOUT COLOUR DEPENDENT SHARPNESS colour vector processing DECDIG + Philips Semiconductors 12 YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor n.c. BLOCK DIAGRAM handbook, full pagewidth 1999 Sep 24 n.c. Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 PINNING SYMBOL PIN SYMBOL DESCRIPTION PIN DESCRIPTION SC 1 sandcastle input n.c. 13 not connected n.c. 2 not connected SDA 14 serial data input/output (I2C-bus) ADEXT1 3 ADC input 1 DECDIG 15 decoupling digital supply ADEXT2 4 ADC input 2 VOUT 16 V signal output ADEXT3 5 ADC input 3 UOUT 17 U signal output YIN 6 luminance input VEE 18 ground ADR 7 address selection input YOUT 19 luminance output UIN 8 U signal input VCC 20 supply voltage VIN 9 V signal input SOUT 21 SCAVEM output TP 10 test pin CF 22 cue flash output SCL 11 serial clock input (I2C-bus) n.c. 23 not connected n.c. 12 not connected n.c. 24 not connected handbook, halfpage handbook, halfpage SC 1 24 n.c. SC 1 24 n.c. n.c. 2 23 n.c. n.c. 2 23 n.c. ADEXT1 3 22 CF ADEXT1 3 22 CF ADEXT2 4 21 SOUT ADEXT2 4 21 SOUT ADEXT3 5 20 VCC ADEXT3 5 20 VCC 19 YOUT YIN 6 TDA9178T 18 VEE ADR 7 18 VEE ADR 7 UIN 8 17 UOUT UIN 8 17 UOUT VIN 9 16 VOUT VIN 9 16 VOUT 15 DECDIG TP 10 SCL 11 n.c. 12 15 DECDIG TP 10 14 SDA SCL 11 13 n.c. n.c. 12 MGR898 14 SDA 13 n.c. MGR899 Fig.2 Pin configuration (SOT234-1). 1999 Sep 24 19 YOUT YIN 6 TDA9178 Fig.3 Pin configuration (SOT137-1). 5 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor FUNCTIONAL DESCRIPTION Each field the capacitors are discharged and the measurement starts all over again. Y input selection and amplification Parts in the scene that do not contribute to the information in that scene, like sub or side titles, should be omitted from the histogram measurement. No measurements are performed outside the internal fixed window period. The gain of the luminance input amplifier and output amplifier can be adjusted to signal amplitudes of 0.315 and 1.0 V typically (excluding sync) by I2C-bus bit AMS. The sync part is processed transparently to the output, independently of the feature settings. The Y, U and V input signals are clamped during the burstkey period, defined by the sandcastle reference and should be DC-coupled (the circuit uses internal clamp capacitors). During the clamp pulse (see Figs 7, 8, 9 and 10) an artificial black level is inserted in the Y input signal to correctly preset the internal circuitry. Very rapid picture changes, also related to the field interlace, can result in flicker effects. The histogram values are averaged at the field rate thus cancelling the flicker effects. Adaptive black stretch The so-called adaptive black stretch gain is one of the factors that control the gamma of the picture. This gain is controlled by the measured black offset value in the black stretch circuit and the I2C-bus adaptive black stretch DAC: bits BT5 to BT0. For pictures with no black offset the black stretch gain equals unity so the gamma is not changed and the DAC setting has no influence. In case of a black offset, the black stretch gain is increased so the gamma of the picture is reduced. This procedure results in a maximum of visible details over the whole range of luminances. However, depending on personal taste, sometimes higher values of gamma are preferred. Therefore the amount of gamma reduction can be adjusted by the DAC. Luminance vector processor In the luminance vector processor the transfer is controlled by a black stretch, the histogram processing and a gamma control circuit. The luminance vector processor also creates the cue flash signal. BLACK STRETCH A black detector measures and stores the level of the most black part of the scene within an internal defined fixed window in each field into a time constant. The time constant and the response time of the loop are internally fixed. Any difference between this value and the value measured during the clamp is regarded as black offset. In a closed loop offsets until a predefined value of the fullscale value are fed back to the input stage for compensation. The loop gain is a function of the histogram and variable gamma settings. The black offset correction can be switched on and off by the I2C-bus bit BON. Related to the corrected black offset the nominal signal amplitude is set again to 100% full scale through an amplitude stretch function. Luminance values beyond full scale are unaffected. Additionally, the measured black offset is also used to set the adaptive black stretch gain (see also Section “Adaptive black stretch”). Adaptive white-point stretching For pictures with many details in white parts, the histogram conversion procedure makes a transfer with large gain in the white parts. The amount of light coming out of the scene is reduced accordingly. The white stretcher introduces additional overall gain for increased light production, and so violating the principle of having a full-scale reference. The white-point stretching can be switched on or off by means of the I2C-bus bit WPO. Standard deviation For scenes in which segments of the histogram distribution are very dominant with respect to the others, the non-linear amplification should be reduced in comparison to scenes with a flat histogram distribution. The standard deviation detector measures the spread of the histogram distribution and modulates the user setting of the non-linear amplifier. HISTOGRAM PROCESSING For the luminance signal the histogram distribution is measured in real-time over five segments within an internally defined fixed window in each field. During the period that the luminance is in one segment, a corresponding internal capacitor is loaded by a current source. At the end of the field five segment voltages are stored into on-board memories. The voltages stored in the memories determine the non-linear processing of the luminance signal to achieve a picture with a maximum of information (visible details). 1999 Sep 24 TDA9178 Non-linear amplifier The stored segment voltages determine the individual gain of each segment in such a way that continuity is granted for the complete luminance range. 6 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor The maximum and minimum gain of each segment is limited. Apart from the adaptive white-point stretching the black and white references are not affected by the non-linear processing. The amount of non-linearity can be controlled by the I2C-bus non-linearity DAC: bits NL5 to NL0. TDA9178 It comprises three main processing units: the step improvement processor, the contour processor and the smart sharpness controller. Transient improvement processor The step improvement processor (see Fig.11) comprises two main functions: VARIABLE GAMMA • MINMAX generator On top of the histogram conversion a variable gamma function is applied for an alternative brightness control, or for factory adjustment. It is intended as an alternative for the DC-offset of the classic brightness user control. It maintains the black and white references. The gamma ranges from 0.5 to 1.5. The gamma can be set by the I2C-bus variable gamma DAC: bits VG5 to VG0. • MINMAX fader. The MINMAX generator utilizes all taps of an embedded luminance delay line to calculate the minimum and maximum envelope of all signals momentarily stored in the delay line. The MINMAX fader chooses between the minimum and maximum envelopes, depending on the polarity of a decision signal derived from the contour processor. Figures 12, 13 and 14 show some waveforms of the step improvement processor and illustrate that fast transients result with this algorithm. The MINMAX generator also outputs a signal that represents the momentary envelope of the luminance input signal. This envelope information is used by the smart sharpness controller. CUE FLASH In the present TV environment there is a lot of measured information like ambient light and noise. This information can be used to make an update of settings of the several algorithms after a picture has changed. The cue flash signal detects when a picture changes significantly. When the picture content has changed, the I2C-bus bit CF is set to logic 1 in the status register. After reading the status register, bit CF is reset to logic 0. On the output pin CF the cue flash information is present (active LOW) for only one line in the vertical retrace part. This pin is configured as an open drain output and therefore should be pulled up to the 5 V supply. Line width control (also called aperture control) can be performed by I2C-bus line width DAC: bits LW5 to LW0. This control can be used to compensate for horizontal geometry errors caused by the gamma, for blooming of the spot of the CRT, or for compensating SCAVEM. Contour processor Spectral processor The contour processor comprises two contour generators with different frequency characteristics. The contour generator generates a second-order derivative of the incoming luminance signal which is supplied to the smart sharpness controller. In the smart sharpness controller, this signal is added to the properly delayed original luminance input signal, making up the peaking signal for detail enhancement. The peaking path features a low peaking frequency of 2 MHz (at 1fH), or a high peaking frequency of 3 MHz (at 1fH), selectable by I2C-bus bit CFS. In the spectral processor the luminance transfer is controlled by smart peaking, colour dependent sharpness and luminance transient improvement, defined by the sharpness improvement processor. The colour transfer is controlled by a colour transient improvement circuit; an additional output is available to provide a SCAVEM circuit. ADJUSTABLE CHROMINANCE DELAY The colour vector processor drives a delay line for correcting delay errors between the luminance input signal and the chrominance input signals (U and V). The chrominance delay can be adjusted in 6 steps of 12 ns (1fH) or 6 ns (2fH) by the I2C-bus bits CD2 to CD0. The contour generators utilize three taps of the embedded luminance delay line. Figure 15 illustrates the normalized frequency transfer of the filter. SHARPNESS IMPROVEMENT PROCESSOR The sharpness improvement processor increases the slope of large luminance transients of vertical objects and enhances transients of details in natural scenes by contour correction. 1999 Sep 24 7 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Smart sharpness controller The smart peaking algorithm has been designed such that the luminance output amplitude will never exceed 110% of the luminance input signal amplitude. Therefore the normal peaking range (12 dB) will be reduced at large transients, and in case of colour dependent sharpness there is even more reduction. The smart sharpness controller (see Fig.16) is a fader circuit that fades between peaked luminance and step-improved luminance, controlled by the output of a step discriminating device known as the step detector. It also contains a variable coring level stage. However, by setting bit OSP (Overrule Smart Peaking) one can undo the extra peaking reduction in case of colour dependant sharpness. It must be emphasized that setting OSP may lead to unwanted large luminance output signals, for instance in details in red coloured objects. The step detector is basically a differentiator, so both amplitude of the step and its slope add to the detection criterion. The smart sharpness controller has four user controls: • Steepness control, performed by the I2C-bus DAC: bits SP5 to SP0 • Peaking control, performed by the bits PK5 to PK0 I2C-bus COLOUR TRANSIENT IMPROVEMENT DAC: The colour transient improvement circuit (see Fig.17) increases the slope of the colour transients of vertical objects. Each channel of the CTI circuit basically consists of two delay cells: an electronic potentiometer and an edge detector circuit that controls the wiper position of the potentiometer. Normally the wiper of the potentiometer will be in position B (mid position), so passing the input signal B to the output with a single delay. The control signal is obtained by the signals A and C. • Video dependent coring, switched on or switched off by the I2C-bus bit VDC • Coring level control, performed by the I2C-bus DAC: bits CR5 to CR0. The steepness setting controls the amount of steepness in the edge-correction processing path. The peaking setting controls the amount of contour correction for proper detail enhancement. The envelope signal generated by the step improvement processor modulates the peaking setting in order to reduce the amount of peaking for large sine wave excursions. When an edge occurs the value of the control signal will fade between +1 and −1 and finally will become zero again. A control signal value of +1 fades the wiper in position C, passing the two times delayed input signal to the output. A control signal of −1 fades the wiper in position A, so an undelayed input signal is passed to the output. The result is an output signal which has steeper edges than the input signal. Contrary to other existing CTI algorithms, the transients remain time correct with respect to the luminance signal, as the algorithm steepens edges proportionally, without discontinuity. With video dependent coring, it is possible to have more reduction of the peaking in the black parts of a scene than in the white parts, and therefore automatically reducing the visibility of the background noise. The coring setting controls the coring level in the peaking path for rejection of high-frequency noise. SCAVEM All four settings facilitate reduction of the impact of the sharpness features, e.g. for noisy luminance signals. A luminance output is available for SCAVEM processing. This luminance signal is not affected by the spectral processing functions. COLOUR DEPENDENT SHARPNESS The colour dependent sharpness circuit increases the luminance sharpness in saturated red and magenta parts of the screen. Because of the limited bandwidth of the colour signals, there is no need to increase the high frequencies of the colour signals. Instead, the details in the luminance signal will be enhanced. In this circuit a limited number of colours are enhanced (red and magenta). Contrary to normal peaking algorithm, extra gain is applied for low frequencies (2 MHz at 1fH). This is needed, because the information that is lacking below 2 MHz (at 1fH) is most important. In large coloured parts the normal peaking is still active to enhance the fine details. 1999 Sep 24 TDA9178 Colour vector processor The colour processing part contains skin tone correction, green enhancement and blue stretch. The colour vector processing is dependent on the amplitude and sign of the colour difference signals. Therefore, both the polarity and the nominal amplitude of the colour difference signals are relevant when using the colour vector processor facility. 8 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor The enclosed correction area can be increased to 140% by the I2C-bus bit SBL (so-called: Size). The blue stretch can be switched on or off by the I2C-bus bit DBL. SKIN TONE CORRECTION Skin tones are very sensitive for transmission (hue) errors, because we have an absolute feeling for skin tones. To make a picture look free of hue error, the goal is to make sure that skin tones are put at a correct colour. SATURATION CORRECTION The non-linear luminance processing done by the histogram modification and variable gamma, influences the colour reproduction; mainly the colour saturation. Therefore, the U and V signals are linear processed for saturation compensation. The dynamic skin tone correction circuit achieves this goal by instantaneously and locally changing the hue of those colours which are located in the area in the UV plane that matches skin tones (see Fig.4). The correction is dependent on luminance, saturation and distance to the preferred axis and can be done towards two different angles. The preferred angle can be chosen by bit ASK in the I2C-bus settings. The settings are 123° (ASK = 0) and 117° (ASK = 1). The enclosed correction area can be increased to 140% with the I2C-bus bit SSK (so-called: Size). The enclosed detection ‘angle’ of the correcting area can be increased to 160% with the I2C-bus bit WSK (so-called: Width). The skin tone correction can be switched on or off with the I2C-bus bit DSK. Noise measuring A video line which is supposed to be free from video information (‘empty line’) is used to measure the amount of noise. The measured RMS value of the noise can be used for reducing several features, by the I2C-bus interface, such as luminance vector processing and spectral processing. For the TDA9178 the empty line is chosen three lines after recognition of the vertical blanking from the sandcastle pulse input. Figures 7, 8, 9 and 10 show the measurement locations for different broadcast norms. GREEN ENHANCEMENT The noise detector is capable of measuring the signal-to-noise ratio between −45 and −20 dB. The output scale runs linearly with dB. The noise samples are averaged for over 20 fields to reduce the fluctuations in the measurement process. It is obvious, that for signal sources (like VCR in still picture mode) that re-insert the levels of the retrace part, the measurement is not reliable (see Section “Feature mode detector”). The result of the averaging process will update the contents of the I2C-bus register: bits ND5 to ND0 at a rate of 1⁄32 of the field frequency. If a register access conflict occurs, the data of the noise register is made invalid by setting the flag bit DV (Data Valid) to zero. The green enhancement circuit (see Fig.5) is intended to shift low saturated green colours towards more saturated green colours. This shift is achieved by instantaneously and locally changing those colours which are located in the area in the UV plane that matches low saturated green. The saturation shift is dependent on the luminance, saturation and distance to the detection axis of 208°. The direction of shift in the colour is fixed by hardware. The amount of green enhancement can be increased to 160% by the I2C-bus bit GGR. The enclosed detection ‘angle’ of the correcting area can be increased to 160% with the I2C-bus bit WGR (so-called: Width). The enclosed correction area can be increased to 140% with the I2C-bus bit SGR (so-called: Size). The green enhancement can be switched on or switched off with the I2C-bus bit DGR. Feature mode detector A detector is available for detecting signal sources (like VCR in still picture mode) that re-inserted the levels of the retrace part. For this kind of signals the noise measurement of the TDA9178 is not reliable, but this detector sets bit FM in the ND-register to logic 1. For normal video signals bit FM is set to logic 0. This circuit measures transients (like synchronization pulses) on the luminance input during the internal V-pulse. The feature mode detector is setting bit FM to logic 1 when no transients are present during 2 lines in the vertical retrace part over 3 fields (like the synchronization pulses). BLUE STRETCH The blue stretch circuit (see Fig.6) is intended to shift colours near white towards more blueish coloured white to give a brighter impression. This shift is achieved by instantaneously and locally changing those colours which are located in the area in the UV plane that matches colours near white. The shift is dependent on the luminance and saturation. The direction of shift (towards an angle of 330°) in the colour is fixed by hardware. The amount of blue stretch can be increased to 160% by the I2C-bus bit GBL. 1999 Sep 24 TDA9178 9 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 Successive approximation ADC I2C-bus Pins ADEXT1, ADEXT2 and ADEXT3 are connected to a 6-bit successive approximation ADC via a multiplexer. The multiplexer toggles between the inputs with each field. At each field flyback, a conversion is started for two of the three inputs and the result is stored in the corresponding bus register ADEXT1, ADEXT2 or ADEXT3. The input pin ADEXT1 is updated every field, while input fields ADEXT2 and ADEXT3 are updated once in two consecutive fields (see Figs 7, 8, 9 and 10). Once in 32 fields the ADEXT2 input is not updated, because then the noise measurement is updated. The I2C-bus is always in standby mode and responds on a properly addressed command. Bit PDD (Power-Down Detected) in the status register is set each time an interruption of the power supply occurs and is reset only by reading the status register. A 3-bit identification code can also be read from the status register, which code can be used to automatically configure the application by software. The input control registers can be written sequentially by the I2C-bus by the embedded automatic subaddress increment feature or by addressing them directly. The output control functions cannot be addressed separately. Reading out the output control functions always starts at subaddress 00H and all subsequent words are read out by the automatic subaddress increment procedure. In this way, any slow varying analog signal can be given access to the I2C-bus. If a register access conflict occurs, the data of that register is made invalid by setting the flag bit DV (Data Valid) to zero. Smart noise control The bits in the I2C-bus are preset to logic 0 at power-on except for bits AMS and VG5: therefore the TDA9178 is in 1.0 V luminance signal range and the variable gamma is set to 20H (gamma correction 0%). With the help of the internal noise detector and a user-preferred noise algorithm, the user can make a fully automatic I2C-bus feature reduction, briefly called ‘Smart Noise Control’. Demonstration mode I2C-BUS SPECIFICATION By the I2C-bus bit DEM all the picture improvement features can be demonstrated in one picture. By setting bit DEM to logic 1, all the features selected by the user are active for 5 s in 1fH mode (in 2fH mode: 2.5 s), and for another 5 s in 1fH mode (in 2fH mode: 2.5 s) all features selected are turned off (then the TDA9178 is ‘transparent’ to the incoming signal). The slave address of the IC is given in Table “Slave address”. If pin ADR of the TDA9178 is connected to ground, the I2C-bus address is 40H; if pin ADR is connected to pin DECDIG, the I2C-bus address is E0H. The circuit operates on clock frequencies up to 400 kHz. Slave address Internal window To determine the histogram levels and the black offset the TDA9178 performs several measurements. An internally defined window serves to exclude parts in the scene like ‘subtitling’ or ‘logos’. The internal window can be regarded as a weighting function which has a value of one within a square near the centre of the screen and which gradually decreases to zero towards the edges. A5 A4 A3 A2 A1 A0 R/W ADR 1 ADR 0 0 0 0 X Auto-increment mode is available for subaddresses. When bit WLB (Window Letter Box) is made logic 1, the height of the window is reduced by a factor of 2⁄3. This prevents the contribution of the black bars above and below a 16 : 9 scene to the measurements. 1999 Sep 24 A6 10 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 Control functions DATA BYTE FUNCTIONS TYPE SUBADDRESS D7 D6 D5 D4 D3 D2 D1 D0 00 DEM VDC WLB FHS CFS LDH 0 AMS Control 2 01 0 0 OSP WPO 0 CD2 CD1 CD0 Control 3 02 SGR WGR GGR DGR SSK WSK ASK DSK Control 4 03 0 0 BON CTI CDS SBL GBL DBL 04 0 0 BT5 BT4 BT3 BT2 BT1 BT0 Non-linearity amplifier 05 0 0 NL5 NL4 NL3 NL2 NL1 NL0 Variable gamma 06 0 0 VG5 VG4 VG3 VG2 VG1 VG0 Peaking 07 0 0 PK5 PK4 PK3 PK2 PK1 PK0 Inputs Control 1 Adaptive black stretch REG DAC Steepness 08 0 0 SP5 SP4 SP3 SP2 SP1 SP0 Coring 09 0 0 CR5 CR4 CR3 CR2 CR1 CR0 Line width 0A 0 0 LW5 LW4 LW3 LW2 LW1 LW0 00 X X X CF ID2 ID1 ID0 PDD Noise detection 01 FM DV ND5 ND4 ND3 ND2 ND1 ND0 ADEXT1 (output) 02 X DV AD5 AD4 AD3 AD2 AD1 AD0 ADEXT2 (output) 03 X DV AD5 AD4 AD3 AD2 AD1 AD0 ADEXT3 (output) 04 X DV AD5 AD4 AD3 AD2 AD1 AD0 Outputs Status 1999 Sep 24 REG 11 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Table 8 Input signals Table 1 Amplitude mode selection AMS FUNCTION 0 0.315 V luminance (black to white) at YIN 1 1.0 V luminance (black to white) at YIN Chrominance delay CD2 CD1 CD0 0 0 0 40 ns at 1fH or 20 ns at 2fH 1 1 1 −32 ns at 1fH or +16 ns at 2fH Table 9 FUNCTION Overrule smart peaking OSP Table 2 Luminance determined histogram LDH histogram segments fixed 1 histogram segments determined by peak white FUNCTION 0 smart peaking (maximum peaking reduced if Coxing) 1 overrule smart peaking FUNCTION 0 Table 10 White-point stretch on/off WPO Table 3 Contour filter selection CFS FUNCTION peaking frequency is 2 MHz at 1fH or 4 MHz at 2fH 0 1 Table 4 FUNCTION 1fH 1 2fH Table 5 FUNCTION normal internal window format 1 ‘Letterbox’ internal window format video dependent coring off 1 video dependent coring on 1 skin tone on DEMO off 1 DEMO on: auto-toggle selected features on/off (cycle is 10 s at 1fH or 5 s at 2fH) FUNCTION 0 angle correction 123° 1 angle correction 117° FUNCTION 0 default detection angle 1 60% increased detection angle SSK FUNCTION 0 1999 Sep 24 skin tone off Table 14 Dynamic skin tone size Demonstration mode on/off DEM 0 WSK FUNCTION 0 Table 7 FUNCTION Table 13 Dynamic skin tone width Video dependent coring on/off VDC white-point stretch off ASK 0 Table 6 white-point stretch on 1 Table 12 Dynamic skin tone angle Window letterbox format WLB 0 DSK Line frequency selection 0 FUNCTION Table 11 Dynamic skin tone on/off peaking frequency is 3 MHz at 1fH or 6 MHz at 2fH FHS TDA9178 FUNCTION 0 default area 1 40% increased area Table 15 Green enhancement on/off DGR 12 FUNCTION 0 green enhancement off 1 green enhancement on Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Table 16 Green enhancement gain GGR TDA9178 Table 24 Black offset compensation on/off FUNCTION BON FUNCTION 0 default enhancement 0 black offset compensation off 1 60% increased gain 1 black offset compensation on Table 17 Green enhancement width WGR Table 25 Adaptive black stretch FUNCTION BT5 BT4 BT3 BT2 BT1 BT0 FUNCTION 0 default detection angle 0 0 0 0 0 0 0% 1 60% increased detection angle 1 1 1 1 1 1 100% Table 18 Green enhancement size SGR Table 26 Non-linearity amplifier FUNCTION NL5 NL4 NL3 NL2 NL1 NL0 FUNCTION 0 default area 0 0 0 0 0 0 0% 1 40% increased area 1 1 1 1 1 1 100% Table 19 Blue stretch on/off DBL Table 27 Variable gamma FUNCTION VG5 VG4 VG3 VG2 VG1 VG0 FUNCTION 0 blue stretch off 0 0 0 0 0 0 −100% 1 blue stretch on 1 1 1 1 1 1 100% Table 20 Blue stretch gain GBL Table 28 Peaking amplitude FUNCTION PK5 PK4 PK3 PK2 PK1 PK0 FUNCTION 0 default gain 0 0 0 0 0 0 0% 1 60% increased gain 1 1 1 1 1 1 100% Table 21 Blue stretch size SBL Table 29 Steepness correction FUNCTION SP5 SP4 SP3 SP2 SP1 SP0 FUNCTION 0 default area 0 0 0 0 0 0 0% 1 40% increased area 1 1 1 1 1 1 100% Table 22 Colour dependent sharpness on/off CDS Table 30 Coring level FUNCTION CR5 CR4 CR3 CR2 CR1 CR0 FUNCTION 0 colour dependent sharpness off 0 0 0 0 0 0 0% 1 colour dependent sharpness on 1 1 1 1 1 1 30% Table 23 Colour transient improvement on/off CTI FUNCTION 0 colour transient improvement off 1 colour transient improvement on 1999 Sep 24 13 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Table 31 Line width correction Table 35 Noise detector LW5 LW4 LW3 LW2 LW1 LW0 0 0 1 0 1 1 0 1 TDA9178 0 0 1 1 FUNCTION ND5 ND4 ND3 ND2 ND1 ND0 33% duty factor at 2 MHz sine wave/1fH 0 0 0 0 0 0 −45 dB 1 1 1 1 1 1 −20 dB 67% duty factor at 2 MHz sine wave/1fH Table 36 ADEXT1, ADEXT2 and ADEXT3 AD5 AD4 AD3 AD2 AD1 AD0 0 0 0 0 0 0 external voltage = 0 V 1 1 1 1 1 1 external voltage = 2 V Output signals Table 32 Power-down detection PDD FUNCTION FUNCTION FUNCTION 0 no power-down detected since last read 1 power-down detected Table 37 Data valid bit of noise detector/ADEXT1, 2 and 3 registers Table 33 Identification code ID2 ID1 ID0 0 1 0 FUNCTION 0 data not valid because of possible register access collision 1 data is valid FUNCTION TDA9178/N1 Table 38 Feature mode detector Table 34 Cue flash CF DV FM FUNCTION FUNCTION 0 no cue flash since last read 0 normal video signal detected 1 cue flash detected 1 feature mode detected (noise detector is not reliable) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); all voltages referenced to ground. SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.5 +8.8 V Vn voltage on any pin −0.5 VCC + 0.5 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −10 +70 °C Tj operating junction temperature − 150 °C HANDLING All pins are protected against ESD by means of internal clamping diodes. The protection circuit meets the following specification: Human body model: C = 100 pF; R = 1.5 kΩ; all pins >3000 V Machine model: C = 200 pF; R = 0 Ω; all pins >200 V. At an ambient temperature of 90 °C, all pins meet the following specification: Itrigger > 100 mA or Vpin > 1.5VCC(max) Itrigger < −100 mA or Vpin < −0.5VCC(max) 1999 Sep 24 14 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA9178 (SDIP24) 56 K/W TDA9178T (SO24) 65 K/W thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with “SNW-FQ-611 part E”. CHARACTERISTICS VCC = 8 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply SUPPLY VOLTAGE (PIN VCC) VCC supply voltage ICC supply current 7.2 8.0 8.8 V 1fH mode − 100 − mA 2fH mode − 105 − mA DIGITAL SUPPLY DECOUPLING (PIN DECDIG) VDECDIG decoupling voltage − 5 − V IDECDIG decoupling load current − − 1 mA AMS = 0 − 0.315 0.45 V AMS = 1 − 1.0 1.41 V no clamp − − 0.1 µA output voltage level during clamping AMS = 1 − 2.7 − V AMS = 0 − 0.8 − V luminance gain input to output transparent at AMS = 1; at 1 V (p-p) 0.93 1.04 1.15 transparent at AMS = 0; at 0.3 V (p-p) 0.96 1.07 1.18 Input and output selection LUMINANCE INPUT (PIN YIN) Vi(Y) input voltage (excluding sync) Ii(bias)(Y) input bias current LUMINANCE OUTPUT (PIN YOUT) Vo(cl) GY(i-o) S/N(Y) signal-to-noise ratio of luminance output transparent 52 − − dB BY luminance bandwidth 1fH mode (−1 dB); transparent 5 − − MHz 2fH mode (−1 dB); transparent 6 − − MHz transparent −1.0 0 +1.0 % Ebl 1999 Sep 24 black level error 15 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor SYMBOL PARAMETER CONDITIONS TDA9178 MIN. TYP. − − output bias current 1.3 load capacitance − Ro output resistance Io(bias) CL MAX. UNIT 150 Ω − − mA − 15 pF COLOUR DIFFERENCE INPUTS U AND V (PINS UIN AND VIN) Vi(U)(p-p) input voltage U (peak-to-peak value) − 1.33 1.9 V Vi(V)(p-p) input voltage V (peak-to-peak value) − 1.05 1.9 V Ii(bias) input bias current − − 0.1 µA − 2.7 − V no clamp COLOUR DIFFERENCE OUTPUTS U AND V (PINS UOUT AND VOUT) Vo(cl) output voltage level during clamping GUV(i-o) gain inputs to output transparent 0.90 1.00 1.10 Eoffset offset error transparent −1 0 +1 % ∆Gtrack UV gain tracking error transparent − − 5 % BUV bandwidth 1fH mode; transparent (−3 dB) 2.5 − − MHz 2fH mode; transparent (−3 dB) 5 − − MHz − − 150 Ω Ro output resistance Io(bias) output bias current 1.3 − − mA CL load capacitance − − 15 pF 8 10 12 % maximum non-linearity setting gain − 1.1 − Luminance vector processing BLACK STRETCH BLOScor(i) input black offset correction HISTOGRAM White-point stretch GWP(max) maximum luminance gain for white stretch Non-linear amplifier Gnla(min) minimum segment gain maximum non-linearity setting gain − 0.4 − Gnla(max) maximum segment gain maximum non-linearity setting gain − 2.0 − Gnla non-linear control curve 63 steps − 0 to 100 − % VARIABLE GAMMA Gg(var)(min)L minimum variable gamma setting − 0.5 − Gg(var)(max) maximum variable gamma setting − 1.5 − Gnla non-linear control curve − 0 to 100 − 1999 Sep 24 63 steps 16 % Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor SYMBOL PARAMETER CONDITIONS MIN. TDA9178 TYP. MAX. UNIT Colour vector processing SKIN TONE; note 1 and Fig.4 ASK = 0; DSK = 1 − 123 − deg ASK = 1; DSK = 1 − 117 − deg correction range (or aperture angle) DSK = 1; SSK = 1; WSK = 0 − 45 − deg − 208 − deg − 45 − deg DBL = 1 − 330 − deg note 3 − 12 − dB 1fH mode; CFS = 0 − 2.0 − MHz 2fH mode; CFS = 0 − 4.0 − MHz 1fH mode; CFS = 1 − 3.0 − MHz 2fH mode; CFS = 1 − 6.0 − MHz 1fH mode − 1.18 − MHz 2fH mode − 2.36 − MHz peaking control curve 63 steps − 0 to 100 − % coring control curve 63 steps − 0 to 45 − % ϕcor correction angle ϕap GREEN ENHANCEMENT; note 1 and Fig.5 ϕcor correction angle ϕap correction range (or aperture angle) DGR = 1; SGR = 0; WGR = 0 DGR = 1 BLUE STRETCH; note 2 and Fig.6 ϕ(str) stretch angle Spectral processing GENERAL Qmax maximum contour amplitude at centre frequency Contour filter low frequency peaking fpc(l) peaking centre frequency Contour filter high frequency peaking fpc(h) peaking centre frequency Step detector fdc detection centre frequency PEAKING GPK CORING GCR LUMINANCE TRANSIENT IMPROVEMENT tr(min) minimum rise time 10% to 90% note 4 − 30 − ns GSP steepness control curve 63 steps − 0 to 100 − % 1fH mode − 140 − ns − 70 − ns − 33 to 67 − % Line width control tsd(max) maximum step displacement GLW line width control curve (duty factor) 63 steps at 1 MHz sine wave at 1fH 2fH mode 1999 Sep 24 17 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor SYMBOL PARAMETER CONDITIONS TDA9178 MIN. TYP. MAX. UNIT COLOUR TRANSIENT IMPROVEMENT tr(min) minimum rise time 10% to 90% note 5 − 50 − ns COLOUR DEPENDENT SHARPNESS fpc Qmax peaking centre frequency maximum contour amplitude at centre frequency 1fH mode − 2.0 − MHz 2fH mode − 4.0 − MHz note 3 − 6 − dB V SCAVEM SCAVEM OUTPUT (PIN SOUT) Vo(cl) output voltage level during clamping − 2.2 − GY gain luminance input to SCAVEM output 0.93 1.04 1.15 BY bandwidth 5 − − 6.0 − − MHz Ro output resistance − − 150 Ω Io(bias) output bias current 0.8 − − mA CL load capacitance − − 15 pF td(SOUT-YOUT) delay w.r.t. YOUT − −20 − ns − 2.0 − V 1fH mode (−1 dB) 2fH mode (−1 dB) MHz Successive approximation ADC ADC INPUTS (PINS ADEXT1, ADEXT2 AND ADEXT3) VFS full-scale input voltage range Ii(bias) input bias current − − 0.1 µA RES data path resolution − 6 − bit DLE differential linearity error − − 1 LSB ILE integral linearity error fcon conversion frequency Qadt conversion time (video lines) with respect to ground − − 1 LSB ADEXT1 − 1fV − Hz ADEXT2; ADEXT3 − 0.5fV − Hz each channel − 8 − lines − − 1 µA 0.9 1.15 1.40 V − 0.9Vtop − V 1fH mode 1.8 − − µs 2fH mode 0.9 − − µs lines Timing SANDCASTLE INPUT (PIN SC) Ii(bias) input bias current Vsc(bn) detection level for blank Vsc(bc) detection level for clamp tW(bk) burst key pulse width no clamping tV vertical retrace time 6 − − Vbk(var)(p-p) ripple on sandcastle burst key level (peak-to-peak value) − − 0.04Vtop V 1999 Sep 24 18 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor SYMBOL PARAMETER CONDITIONS TDA9178 MIN. TYP. MAX. UNIT Overall output group delay performance td(YUV) tdm(UV-Y) input to output delay of YUV signals 1fH mode; transparent − 300 − ns 2fH mode; transparent − 180 − ns 1fH mode; transparent −32 0 +40 ns 2fH mode; transparent −16 0 +20 ns see Figure 18 −45 − −20 dB − 32fV − s − − 5.5 V − − 1 mA adjustment delay U and V signals w.r.t. Y signal Noise measurement Rnoise range of noise detector tcon conversion time Cue flash CUE FLASH OUTPUT (PIN CF); OPEN COLLECTOR Vo(max) maximum output voltage Isink(max) maximum sink current pull-up to external supply Notes 1. The amount of correction depends on the parameters of the incoming YUV signals; therefore it is not possible to give exact figures for the correction angle. The aperture angle of the correction range of 45° (±22.5°) is just given as an indication and is valid for an input signal with a luminance signal amplitude of 75% and a colour saturation of 50%. 2. The amount of correction depends on the parameters of the incoming YUV signals; therefore it is not possible to give exact figures for the correction angle. 3. The contour signal cannot be measured separately from the luminance input signal. The contour signal is also processed by the smart noise controller. The frequency transfer in the peaking mode of the luminance signal can be derived from the frequency transfer of the selected contour signal, taking into account the summation of the contour signal and the luminance input signal. The frequency transfer is most easily measured by sine excitation with a relatively small signal amplitude of 10% of the selected dynamic range of the luminance input, to avoid interaction with the step detector. 4. Peaking set to minimum. Input signal is a sine wave with the nominal peak-to-peak amplitude corresponding to the selected input range. 5. Input signal is a 250 kHz block with a rise time of 260 ns and a nominal peak-to-peak amplitude corresponding to the selected input range. 1999 Sep 24 19 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth red V I-axis fully saturated colours yellow −U MGR900 Fig.4 Skin tone correction range for a correction angle of 123°. handbook, full pagewidth yellow −U detection-axis fully saturated colours −V green MGR901 Fig.5 Green enhancement correction range. 1999 Sep 24 20 TDA9178 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth U blue detection-axis fully saturated colours −V cyan MGR902 Fig.6 Blue stretch correction range. 1999 Sep 24 21 TDA9178 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... video input sandcastle input burst key pulse 22 clamping pulse internal V-pulse + FM detection noise detector measuring ADEXT1 conversion cue flash output Fig.7 Timing pulses for NTSC input signal, field A. TDA9178 MGR903 Preliminary specification ADEXT2, ADEXT3 conversion Philips Semiconductors YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth 1999 Sep 24 NTSC-signal, field A This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... video input sandcastle input burst key pulse 23 clamping pulse internal V-pulse + FM detection noise detector measuring ADEXT1 conversion Philips Semiconductors YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth 1999 Sep 24 NTSC-signal, field B ADEXT2, ADEXT3 conversion MGR904 TDA9178 Fig.8 Timing pulses for NTSC input signal, field B. Preliminary specification cue flash output This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... video input sandcastle input burst key pulse clamping pulse 24 internal V-pulse + FM detection noise detector measuring ADEXT1 conversion Philips Semiconductors YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth 1999 Sep 24 PAL-signal, field A ADEXT2, ADEXT3 conversion MGR933 TDA9178 Fig.9 Timing pulses for PAL and SECAM input signal, field A. Preliminary specification cue flash output This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... video input sandcastle input burst key pulse clamping pulse 25 internal V-pulse + FM detection noise detector measuring ADEXT1 conversion Philips Semiconductors YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, full pagewidth 1999 Sep 24 PAL-signal, field B ADEXT2, ADEXT3 conversion MGR934 TDA9178 Fig.10 Timing pulses for PAL and SECAM input signal, field B. Preliminary specification cue flash output Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 line width control handbook, full pagewidth MINMAX SELECTOR Yin DELAY CLAMPS FADER Ystep MINMAX Yenvelope MGR905 Fig.11 Block diagram of the step improvement processor. MGR906 1000 Vo (mV) handbook, halfpage (1) 800 600 400 (2) 200 0 0 0.5 1.0 1.5 t (µs) 2.0 (1) 90% of nominal amplitude. (2) 30% of nominal amplitude. Fig.12 Response signals for maximum step improvement, no peaking and nominal line width. 1999 Sep 24 26 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 MGR907 1000 Vo (mV) handbook, halfpage (1) 800 600 400 200 (2) 0 0 0.5 1.0 1.5 t (µs) 2.0 (1) 90% of nominal amplitude. (2) 30% of nominal amplitude. Fig.13 Response signals for maximum step improvement, no peaking and minimum line width. MGR908 1000 Vo (mV) handbook, halfpage (1) 800 600 400 (2) 200 0 0 0.5 1.0 1.5 t (µs) 2.0 (1) 90% of nominal amplitude. (2) 30% of nominal amplitude. Fig.14 Response signals for maximum step improvement, no peaking and maximum line width. 1999 Sep 24 27 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor MGR909 100 contour (%) handbook, halfpage (1) 80 60 (2) 40 20 0 105 106 f (Hz) 107 (1) 1fH mode. (2) 2fH mode. Fig.15 Frequency transfers of contour filter at f = 2.0 MHz. handbook, full pagewidth coring control STEP DETECTOR delay cells Yenvelope Ycontour CORING Yc FADER Ystep peaking steepness control control Ystep MGR910 Fig.16 Block diagram of smart sharpness controller. 1999 Sep 24 28 TDA9178 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor handbook, halfpage UVin DELAY DELAY A B C control MGR911 UVout Fig.17 Block diagram of colour transient improvement. MGR912 80 handbook, halfpage DACvalue 60 40 20 0 −50 −40 −30 −20 S/N (dB) −10 Fig.18 Typical noise measurement curve of input noise (dB) versus DAC-value. 1999 Sep 24 29 TDA9178 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 TEST AND APPLICATION INFORMATION The TDA9178 is especially designed for YUV applications. A typical application diagram is shown in Fig.19. handbook, full pagewidth SC sandcastle n.c. ADEXT1 ADEXT1 100 kΩ ADEXT2 ADEXT2 100 kΩ ADEXT3 100 kΩ YIN ADEXT3 1 YIN ADR 1 24 2 23 3 22 4 21 5 20 6 19 TDA9178 7 18 8 17 9 16 10 15 n.c. n.c. CF CF SOUT SOUT VCC YOUT 8V 100 nF 10 µF YOUT VEE 0V 0 UIN UIN VIN VIN TP 100 Ω SCL UOUT UOUT VOUT VOUT DECDIG 100 nF SCL n.c. 11 14 12 13 SDA n.c. 100 Ω SDA MGR913 Fig.19 YUV application. 1999 Sep 24 30 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 ME seating plane D A2 A A1 L c e Z b1 (e 1) w M MH b 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 22.3 21.4 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT234-1 1999 Sep 24 EUROPEAN PROJECTION 31 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1999 Sep 24 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 32 o 8 0o Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Sep 24 TDA9178 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 33 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Sep 24 34 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1999 Sep 24 35 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. 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Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 68 © Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545004/01/pp36 Date of release: 1999 Sep 24 Document order number: 9397 750 04621