Product Bulletin Document # : PB21308Z Issue Date: 26 April 2016 Title of Change: NCV7707 Datasheet Update – Revision 3 Effective date: 26 April 2016 Contact information: Contact your local ON Semiconductor Sales Office or Roman Buzas <[email protected]> Type of notification: ON Semiconductor will consider this change accepted. Wafer Fab Change Change category: Assembly Change Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Test Change Other _______________ Material Change Product specific change Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ ON Semiconductor site(s) : External Foundry/Subcon site(s) Sites Affected: All site(s) not applicable Description and Purpose: Features list updated AEC-Q100 Qualified and PPAP Capable” statement added (page 1) New OPN added NCV7707B added to the Marking Diagram (page 1) NCV7707DQBR2G added to the Ordering information table (page 1) Thermal resistance Junction-to-Case added RθJC parameter added to Thermal Characteristics table (page 5) Electrical Characteristics - Current Sense parameters updated Current Sense settling time (tis) values updated (page 14) Current Sense blanking time parameter added (tis_blank) (page 14) Package drawing updated to the latest revision Modified dimension A2 min value Modified dimension b max value Minor text corrections Current Sensing paragraph (page 20) Electrical Characteristics Summary: Current Sense settling time (tis) values updated (page 7) Current Sense blanking time parameter added (tis_blank) (page 7) Original Datasheet Updated Datasheet List of affected Standard Parts: NCV7707DQR2G TEM001094 Rev. E Page 1 of 1