INTEGRATED CIRCUITS DATA SHEET PCA82C250 CAN controller interface Product specification Supersedes data of 1997 Oct 21 File under Integrated Circuits, IC18 2000 Jan 13 Philips Semiconductors Product specification CAN controller interface PCA82C250 FEATURES APPLICATIONS • Fully compatible with the “ISO 11898” standard • High-speed applications (up to 1 Mbaud) in cars. • High speed (up to 1 Mbaud) • Bus lines protected against transients in an automotive environment GENERAL DESCRIPTION The PCA82C250 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. • Slope control to reduce Radio Frequency Interference (RFI) • Differential receiver with wide common-mode range for high immunity against ElectroMagnetic Interference (EMI) • Thermally protected • Short-circuit proof to battery and ground • Low-current standby mode • An unpowered node does not disturb the bus lines • At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage ICC supply current 1/tbit maximum transmission speed VCAN CANH, CANL input/output voltage Vdiff differential bus voltage tPD propagation delay Tamb ambient temperature CONDITIONS MIN. MAX. UNIT 4.5 5.5 V standby mode − 170 µA non-return-to-zero 1 − Mbaud −8 +18 V high-speed mode 1.5 3.0 V − 50 ns −40 +125 °C ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION CODE PCA82C250 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCA82C250T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 PCA82C250U − 2000 Jan 13 bare die; 2790 × 1780 × 380 µm 2 − Philips Semiconductors Product specification CAN controller interface PCA82C250 BLOCK DIAGRAM VCC handbook, full pagewidth 3 TXD Rs PROTECTION 1 8 DRIVER SLOPE/ STANDBY HS 7 RXD 4 6 Vref 5 CANH RECEIVER REFERENCE VOLTAGE CANL PCA82C250 2 GND MKA669 Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input GND 2 ground TXD 1 VCC 3 supply voltage GND 2 RXD 4 receive data output Vref 5 reference voltage output CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input 2000 Jan 13 handbook, halfpage 8 Rs 7 CANH PCA82C250 VCC 3 6 CANL RXD 4 5 Vref MKA670 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification CAN controller interface PCA82C250 FUNCTIONAL DESCRIPTION Pin 8 (Rs) allows three different modes of operation to be selected: high-speed, slope control or standby. The PCA82C250 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high-speed applications (up to 1 Mbaud) in cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO 11898” standard. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The high-speed mode is selected by connecting pin 8 to ground. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If the junction temperature exceeds a value of approximately 160 °C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain in operation. The thermal protection is particularly needed when a bus line is short-circuited. If a HIGH level is applied to pin 8, the circuit enters a low current standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in standby mode, the first message will be lost. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Table 1 Truth table of the CAN transceiver SUPPLY TXD CANH CANL BUS STATE RXD 4.5 to 5.5 V 0 HIGH LOW dominant 0 4.5 to 5.5 V 1 (or floating) floating floating recessive 1 <2 V (not powered) X(1) floating floating recessive X(1) 2 V < VCC < 4.5 V >0.75VCC floating floating recessive X(1) 2 V < VCC < 4.5 V X(1) floating if VRs > 0.75VCC floating if VRs > 0.75VCC recessive X(1) Note 1. X = don’t care. Table 2 Pin Rs summary CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs VRs > 0.75VCC standby IRs < 10 µA −10 µA < IRs < −200 µA slope control 0.4VCC < VRs < 0.6VCC VRs < 0.3VCC high-speed IRs < −500 µA 2000 Jan 13 4 Philips Semiconductors Product specification CAN controller interface PCA82C250 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +9.0 Vn DC voltage at pins 1, 4, 5 and 8 −0.3 VCC + 0.3 V V6, 7 DC voltage at pins 6 and 7 0 V < VCC < 5.5 V; no time limit −8.0 +18.0 V Vtrt transient voltage at pins 6 and 7 see Fig.8 −150 +100 V Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +125 °C Tvj virtual junction temperature note 1 −40 +150 °C Vesd electrostatic discharge voltage note 2 −2000 +2000 V note 3 −200 +200 V V Notes 1. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd × Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 2. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2000 V. 3. Classification B: machine model; C = 200 pF; R = 25 Ω; V = ±200 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT PCA82C250 100 K/W PCA82C250T 160 K/W thermal resistance from junction to ambient QUALITY SPECIFICATION According to “SNW-FQ-611 part E”. 2000 Jan 13 5 in free air Philips Semiconductors Product specification CAN controller interface PCA82C250 CHARACTERISTICS VCC = 4.5 to 5.5 V; Tamb = −40 to +125 °C; RL = 60 Ω; I8 > −10 µA; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 °C. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply I3 supply current dominant; V1 = 1 V − − 70 mA recessive; V1 = 4 V; R8 = 47 kΩ − − 14 mA recessive; V1 = 4 V; V8 = 1 V − − 18 mA standby; Tamb < 90 °C; note 1 − 100 170 µA DC bus transmitter VIH HIGH-level input voltage output recessive 0.7VCC − VCC + 0.3 V VIL LOW-level input voltage output dominant −0.3 − 0.3VCC V IIH HIGH-level input current V1 = 4 V −200 − +30 µA IIL LOW-level input current V1 = 1 V −100 − −600 µA V6,7 recessive bus voltage V1 = 4 V; no load 2.0 − 3.0 V ILO off-state output leakage current −2 V < (V6,V7) < 7 V −2 − +1 mA −5 V < (V6,V7) < 18 V −5 − +12 mA V1 = 1 V 2.75 − 4.5 V V7 CANH output voltage V6 CANL output voltage V1 = 1 V 0.5 − 2.25 V ∆V6, 7 difference between output voltage at pins 6 and 7 V1 = 1 V 1.5 − 3.0 V V1 = 1 V; RL = 45 Ω; VCC ≥ 4.9 V 1.5 − − V Isc7 Isc6 short-circuit CANH current short-circuit CANL current V1 = 4 V; no load −500 − +50 mV V7 = −5 V; VCC ≤ 5 V − − −105 mA V7 = −5 V; VCC = 5.5 V − − −120 mA V6 = 18 V − − 160 mA DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; −2 V < (V6, V7) < 7 V; unless otherwise specified Vdiff(r) Vdiff(d) differential input voltage (recessive) differential input voltage (dominant) −7 V < (V6, V7) < 12 V; not standby mode −7 V < (V6, V7) < 12 V; not standby mode −1.0 − +0.5 V −1.0 − +0.4 V 0.9 − 5.0 V 1.0 − 5.0 V Vdiff(hys) differential input hysteresis see Fig.5 − 150 − mV VOH HIGH-level output voltage (pin 4) I4 = −100 µA 0.8VCC − VCC V VOL LOW-level output voltage (pin 4) I4 = 1 mA 0 − 0.2VCC V 0 − 1.5 V Ri CANH, CANL input resistance 5 − 25 kΩ I4 = 10 mA 2000 Jan 13 6 Philips Semiconductors Product specification CAN controller interface SYMBOL PARAMETER PCA82C250 CONDITIONS MIN. TYP. MAX. UNIT Rdiff differential input resistance 20 − 100 kΩ Ci CANH, CANL input capacitance − − 20 pF Cdiff differential input capacitance − − 10 pF V8 = 1 V; −50 µA < I5 < 50 µA 0.45VCC − 0.55VCC V V8 = 4 V; −5 µA < I5 < 5 µA 0.4VCC − 0.6VCC V Reference output Vref reference output voltage Timing (see Figs 4, 6 and 7) tbit minimum bit time V8 = 1 V − − 1 µs tonTXD delay TXD to bus active V8 = 1 V − − 50 ns toffTXD delay TXD to bus inactive V8 = 1 V − 40 80 ns tonRXD delay TXD to receiver active V8 = 1 V − 55 120 ns toffRXD delay TXD to receiver inactive V8 = 1 V; VCC < 5.1 V; Tamb < +85 °C − 82 150 ns V8 = 1 V; VCC < 5.1 V; Tamb < +125 °C − 82 170 ns V8 = 1 V; VCC < 5.5 V; Tamb < +85 °C − 90 170 ns V8 = 1 V; VCC < 5.5 V; Tamb < +125 °C − 90 190 ns tonRXD delay TXD to receiver active R8 = 47 kΩ − 390 520 ns R8 = 24 kΩ − 260 320 ns 450 ns toffRXD delay TXD to receiver inactive R8 = 47 kΩ − 260 R8 = 24 kΩ − 210 320 ns SR differential output voltage slew rate R8 = 47 kΩ − 14 − V/µs tWAKE wake-up time from standby (via pin 8) − − 20 µs tdRXDL bus dominant to RXD LOW − − 3 µs − − 0.3VCC V V8 = 4 V; standby mode Standby/slope control (pin 8) V8 input voltage for high-speed I8 input current for high-speed − − −500 µA Vstb input voltage for standby mode 0.75VCC − − V Islope slope control mode current −10 − −200 µA Vslope slope control mode voltage 0.4VCC − 0.6VCC V V8 = 0 V Note 1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC. 2000 Jan 13 7 Philips Semiconductors Product specification CAN controller interface PCA82C250 +5 V handbook, halfpage 100 pF VCC TXD CANH PCA82C250 62 Ω Vref 100 pF CANL RXD GND Rs 30 pF Rext MKA671 Fig.3 Test circuit for dynamic characteristics. VCC handbook, full pagewidth VTXD 0V 0.9 V Vdiff 0.5 V 0.7VCC VRXD 0.3VCC tonTXD toffTXD tonRXD toffRXD Fig.4 Timing diagram for dynamic characteristics. 2000 Jan 13 8 MKA672 Philips Semiconductors Product specification CAN controller interface handbook, full pagewidth PCA82C250 VRXD HIGH LOW hysteresis 0.5 V 0.9 V Vdiff MKA673 Fig.5 Hysteresis. VCC handbook, full pagewidth VRs 0V VRXD tWAKE MKA674 V1 = 1 V. Fig.6 Timing diagram for wake-up from standby. 2000 Jan 13 9 Philips Semiconductors Product specification CAN controller interface PCA82C250 1.5 V handbook, full pagewidth Vdiff 0V VRXD tdRXDL MKA675 V1 = 4 V; V8 = 4 V. Fig.7 Timing diagram for bus dominant to RXD LOW. +5 V handbook, full pagewidth VCC 1 nF TXD CANH PCA82C250 62 Ω RXD SCHAFFNER GENERATOR 1 nF CANL Vref GND MKA676 Rs Rext The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig.8 Test circuit for automotive transients. 2000 Jan 13 10 Philips Semiconductors Product specification CAN controller interface PCA82C250 APPLICATION INFORMATION handbook, halfpage P8xC592/P8xCE598 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y Rext +5 V TXD RXD Vref Rs VCC PCA82C250T CAN-TRANSCEIVER 100 nF GND CANH 124 Ω CANL CAN BUS LINE 124 Ω MKA677 Fig.9 Application of the CAN transceiver. 2000 Jan 13 11 Philips Semiconductors Product specification CAN controller interface PCA82C250 handbook, full pagewidth SJA1000 CAN-CONTROLLER TX0 TX1 RX0 6.8 kΩ +5 V 390 Ω 390 Ω VDD RX1 3.6 kΩ 100 nF VSS 6N137 0V 390 Ω 100 nF 6N137 +5 V 390 Ω +5 V TXD RXD Vref Rs +5 V VCC PCA82C250 CAN-TRANSCEIVER 100 nF GND CANH CANL 124 Ω CAN BUS LINE 124 Ω MKA678 Fig.10 Application with galvanic isolation. 2000 Jan 13 12 Rext Philips Semiconductors Product specification CAN controller interface PCA82C250 INTERNAL PIN CONFIGURATION VCC handbook, full pagewidth 3 TXD Rs RXD 1 8 4 7 CANH PCA82C250 Vref 5 6 2 GND Fig.11 Internal pin configuration. 2000 Jan 13 13 MKA679 CANL Philips Semiconductors Product specification CAN controller interface PCA82C250 BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD TXD 1 x y 196 135 GND 2 1280 135 VCC 3 1767 135 RXD 4 2588 135 Vref 5 2594 1640 CANL 6 1689 1640 CANH 7 948 1640 Rs 8 196 1640 Note Rs CANH CANL Vref 1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). 8 7 6 5 handbook, full pagewidth 1.78 mm 3 4 VCC RXD 0 2 GND 0 1 TXD x PCA82C250U y 2.79 mm Fig.12 Bonding pad locations. 2000 Jan 13 14 MGL945 Philips Semiconductors Product specification CAN controller interface PCA82C250 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC EIAJ SOT97-1 050G01 MO-001 SC-504-8 2000 Jan 13 15 EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 Philips Semiconductors Product specification CAN controller interface PCA82C250 SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2000 Jan 13 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 16 o 8 0o Philips Semiconductors Product specification CAN controller interface PCA82C250 Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2000 Jan 13 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 17 Philips Semiconductors Product specification CAN controller interface PCA82C250 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Jan 13 18 Philips Semiconductors Product specification CAN controller interface PCA82C250 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2000 Jan 13 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 285002/05/pp20 Date of release: 2000 Jan 13 Document order number: 9397 750 06609