INTEGRATED CIRCUITS DATA SHEET TDA7050 Low voltage mono/stereo power amplifier Product specification File under Integrated Circuits, IC01 June 1989 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050 GENERAL DESCRIPTION The TDA7050 is a low voltage audio amplifier for small radios with headphones (such as watch, pen and pocket radios) in mono (bridge-tied load) or stereo applications. Features • Limited to battery supply application only (typ. 3 and 4 V) • Operates with supply voltage down to 1,6 V • No external components required • Very low quiescent current • Fixed integrated gain of 26 dB, floating differential input • Flexibility in use − mono BTL as well as stereo • Small dimension of encapsulation (see package design example) QUICK REFERENCE DATA 1,6 to 6,0 V Supply voltage range VP Total quiescent current (at VP = 3 V) Itot typ. 3,2 mA Po typ. 140 mW max. 70 mV Vno(rms) typ. 140 µV dtot = 10%; VP = 3 V Po typ. 35 mW dtot = 10%; VP = 4,5 V Po typ. 75 mW α typ. 40 dB Vno(rms) typ. 100 µV Bridge tied load application (BTL) Output power at RL = 32 Ω VP = 3 V; dtot = 10% D.C. output offset voltage between the outputs |∆V| Noise output voltage (r.m.s. value) at f = 1 kHz; RS = 5 kΩ Stereo application Output power at RL = 32 Ω Channel separation at RS = 0 Ω; f = 1 kHz Noise output voltage (r.m.s. value) at f = 1 kHz; RS = 5 kΩ PACKAGE OUTLINE 8-lead DIL; plastic (SOT97); SOT97-1; 1996 July 23. June 1989 2 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage VP max. 6V Peak output current IOM max. 150 mA Total power dissipation see derating curve Fig.1 Storage temperature range Tstg −55 to + 150 °C Crystal temperature Tc max. 100 °C tsc max. 5s A.C. and d.c. short-circuit duration at VP = 3,0 V (during mishandling) Fig.1 Power derating curve. THERMAL RESISTANCE From junction to ambient June 1989 Rthj-a 3 = 110 K/W Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050 CHARACTERISTICS VP = 3 V; f = 1 kHz; RL = 32 Ω; Tamb = 25 °C; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage VP 1,6 − 6,0 V Total quiescent current Itot − 3,2 4 mA VP = 3,0 V; dtot = 10% Po − 140 − mW VP = 4,5 V; dtot = 10% (RL = 64 Ω) Po − 150 − mW Gv − 32 − dB RS = 5 kΩ; f = 1 kHz Vno(rms) − 140 − µV RS = 0 Ω; f = 500 kHz; B = 5 kHz Vno(rms) − tbf − µV Bridge-tied load application (BTL); see Fig.4 Output power; note 1 Voltage gain Noise output voltage (r.m.s. value) D.C. output offset voltage (at RS = 5 kΩ) |∆V| − − 70 mV Input impedance (at RS = ∞) |Zi| 1 − − MΩ Input bias current Ii − 40 − nA Po − 35 − mW Stereo application; see Fig.5 Output power; note 1 VP = 3,0 V; dtot = 10% Po − 75 − mW Gv 24.5 26 27.5 dB RS = 5 kΩ; f = 1 kHz Vno(rms) − 100 − µV RS = 0 Ω; f = 500 kHz; B = 5 kHz Vno(rms) − tbf − µV α 30 40 − dB Input impedance (at RS = ∞) |Zi| 2 − − MΩ Input bias current Ii − 20 − nA VP = 4,5 V; dtot = 10% Voltage gain Noise output voltage (r.m.s. value) Channel separation RS = 0 Ω; f = 1 kHz Note 1. Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2 (BTL application) and Fig.3 (stereo application). June 1989 4 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier Fig.2 Fig.3 June 1989 TDA7050 Output power across the load impedance (RL) as a function of supply voltage (VP) in BTL application. Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25 °C. Output power across the load impedance (RL) as a function of supply voltage (VP) in stereo application. Measurements were made at f = 1 kHz; dtot = 10%; Tamb = 25 °C. 5 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier APPLICATION INFORMATION Fig.4 Application diagram (BTL); also used as test circuit. Fig.5 Application diagram (stereo); also used as test circuit. June 1989 6 TDA7050 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050 PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN June 1989 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 7 Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1989 8