FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 19-MAR-2002 SUBJECT: ON Semiconductor Final Product/Process Change Notification #12384 TITLE: Qualification of DO-41 Package Outline in place of DO-15 Package Outline. EFFECTIVE DATE: 18-May-2002 AFFECTED CHANGE CATEGORY: Package Change AFFECTED PRODUCT DIVISION: Bipolar Discretes Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Mark Wasilewski <[email protected] > SAMPLES: Contact Below Contact your local ON Semiconductor Sales Office or Barbara Matteson <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Kevin Keller <[email protected]> DISCLAIMER: Final Product/Process Change Notification (FPCN) - Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: ON Semiconductor has qualified LiteOn's Seeful facility as an additional assembly/test site for our axial leaded products. In order to further standardize our axial package platform, ON Semiconductor has elected to adopt the DO-41 package outline in place of the DO-15 package outline. This change affects ultrafast, Schottky and SIDAC products. This change also will provide customers of these devices with equivalent performance in a smaller case outline. The LiteOn Seeful facility has been an ON Semiconductor qualified subcontractor since 1999. The two companies have a strong working relationship and past programs have proven very successful. Issue Date: 19 March, 2002 Page 1 of 3 Final Product/Process Change Notification #12384 RELIABILITY DATA SUMMARY: Reliability Data and testing has been completed on three (3) qualification lots of DO-41 package. Qualification vehicles included two (2) lots of the MUR1100E (Highest Voltage, Largest Die Size Ultrafast Rectifier) and one (1) lot of MBR1100 (Highest Voltage, Largest Die Size Schottky Rectifier). Tests performed and results were: HTRB (High Temp Rev Bias) 0/80 0/80 0/80 (Tj=max, 80% bias voltage, 1008 hrs) H3TRB (High Temp Humidity Rev Bias) 0/80 0/80 0/80 (85% RH, 85% bias, 85C, 1008 hrs) TC (Temp Cycle) 0/80 0/80 0/80 (-65C to +150C, 15min dwells, 1000cy) PTH (Pressure Temp Humidity) 0/80 0/80 0/80 (121C, 100%RH, 15PSIG, 96 Hrs) ELECTRICAL CHARACTERISTIC SUMMARY: Characterization data available upon request. CHANGED PART IDENTIFICATION: Differences between the DO-41, DO-15 and original Case 59-04 outlines are noted below. The devices' electrical characteristics will not change and the reliability will continue to meet ON Semiconductor's high quality standards. Case Lead Dia Lead Length Body Dia Min Max Min Max Min Max 59-04 0.76 0.86 27.94 - 2.79 3.05 DO-15 0.71 0.86 25.40 - 2.60 3.60 DO-41 0.71 0.86 25.40 - 2.00 2.70 Body Length Min Max 5.97 6.60 5.80 7.60 4.10 5.20 AFFECTED DEVICE LIST (WITHOUT SPECIALS) PART 1N5817 1N5817RL 1N5818 1N5818RL 1N5819 1N5819RL MBR1100 MBR1100RL MBR130P MBR130PRL MBR140PRL MBR150 MBR150RL MBR160 MBR160RL MKP1V120RL Issue Date: 19 March, 2002 Page 2 of 3 Final Product/Process Change Notification #12384 MKP1V130RL MKP1V160 MKP1V160RL MKP1V240 MKP1V240RL MKP9V160RL MUR105 MUR105RL MUR110 MUR1100E MUR1100ERL MUR110RL MUR115 MUR115RL MUR120 MUR120RL MUR130 MUR130RL MUR140 MUR140RL MUR150 MUR160 MUR160RL MUR180E MUR180ERL MUR190E MUR210 MUR2100E MUR2100ERL MUR210RL MUR220 MUR220RL MUR240 MUR240RL MUR260 MUR260RL Issue Date: 19 March, 2002 Page 3 of 3