FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 09-JUL-2001 SUBJECT: Product/Process Change Notification #11504 TITLE: Final Notification – Phase#1 - Bipolar Power Wafer Fab Transfer TLS-BP6 to PHXBP/ZR Fab EFFECTIVE DATE: 21-Aug-2001 AFFECTED CHANGE CATEGORY: On Semiconductor Fab Site, Subcontractor Fab Site, and Wafer Process AFFECTED PRODUCT DIVISION: Bipolar Discrete Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or LAURA RIVERS <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Jose Ramirez <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Jose Ramirez <[email protected]> DISCLAIMER: Initial Product/Process Change Notification (IPCN) - First Notification distributed to customers. Distributed at least 120 days from the effective date of the change. Final Product/Process Change Notification (FPCN) - Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: ON Semiconductor wishes to notify its Customers that the 1st Phase of the Bipolar Power Wafer Manufacturing Operation Transfer from Toulouse-France to Phoenix-Arizona is taking place as announced in IPCN # 10863, and Product Lines using the Epi Base Technology will be transferred as indicated. ON Semiconductor continues to make substantial investments in both newtechnologies and improved manufacturing capabilities to provide you the highest quality and reliability in the Semiconductor industry. We believe these actions will also improve our ability to serve you better in the future. Issue Date: 09 July, 2001 Page 1 of 8 Product/Process Change Notification #11504 QUALIFICATION PLAN: *Per AEC-Q101 guidelines. Test* Conditions Exceptions Parametric verification Per device specification @ 25DegC HTRB 1000 hrs Vcb=80% T=150 deg C Temp Cycle 1K cycles - 65 to 150 deg C Autoclave 96 hrs RH=100% P=15psi Ta=121 deg C H3TRB 1000 hrs Vcb=80% RH=85% IOL 15K cycles Delta tj=100 deg C D.P.A. Random H3TRB and IOL samples Thermal Resistance Delta VBE Die Shear Pre and Post process change comp. Wire Bond Strength Pre and Post process change comp. Wire Bond Shear Method 3 (Parametric measurements are per device specification @ 25 deg C) Qualification Vehicle Justification: Family PNP NPN Qualification Device TIP42C TIP122 Reason Chosen Large Die size, highest voltage Highest Voltage RELIABILITY DATA SUMMARY: Interim Reliability Tests results after completion of 500 hrs. Final Reliability Report available after completion of 1000 hours. Test Desc. HTRB H3TRB Autoclave IOL Temp Cycle Interval 500 hrs 500 hrs 96 hrs 4286 cyc 500 cyc Lot#1 0/77 0/77 0/77 0/77 0/77 TIP42C Lot#2 Lot#3 Control Lot#1 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 TIP122 Lot#2 0/77 0/77 0/77 0/77 0/77 Lot#3 0/77 0/77 0/77 0/77 0/77 Control 0/77 0/77 0/77 0/77 0/77 ELECTRICAL CHARACTERISTIC SUMMARY: TIP42C Test IEBO ICEO ICES BVCEO HFE Cond1 Ic=0.3A Group Cond2 Vbe=5V Vce=60V Vce=100V Ic=30mA Vce=4V Limit= <1mA <700uA <400uA >100V >30 Mean 1.0 E-6 1.1 E-7 9.8 E-8 129.7 235.3 Lot#1 StDev 5.5 E-14 3.8 E-15 1.4 E-8 1.3 8.7 Cpk 6.1 E+9 6.1 E+10 9.4 E+3 7.8 9.0 HFE VBE(on) VCE(sat) Ic=3A Ic=6A Ic=6A Vce=4V Vce=4V Ib=0.6A 15-75 <2.0V <1.5V 53.8 1.319 1.054 2.0 0.013 0.042 8.9 17.7 3.52 Mean 1.0 E-06 9.8 E-8 9.8 E-8 Lot#2 StDev 5.5 E-14 2.5 E-8 1.4 E-8 Cpk 6.1 E+9 9.5 E+3 9.4 E+3 119.9 2.4 2.8 207.4 21.1 3.28 50.2 3.4 4.9 1.326 0.015 14.7 1.062 0.066 2.22 Mean 1.0 E-6 Lot#3 StDev 2.0 E-7 Cpk 1.7 E+3 120.4 1.8 3.7 232.7 15.2 5.1 57.4 2.6 7.3 1.290 0.012 20.5 1.024 0.040 3.94 Mean 1.0 E-6 1.1 E-6 1.0 E-7 106.1 Control StDev 5.5 E-14 4.8 E-7 3.8 E-15 6.3 Cpk 6.1 E+9 4.9 E+2 3.5 E+10 0.3 322.9 30.2 3.6 58.7 4.2 4.6 1.309 0.018 12.5 0.933 0.087 2.2 Issue Date: 09 July, 2001 1.0 E-7 9.8 E-8 2.0 E-8 1.4 E-8 1.2 E+4 9.4 E+3 Page 2 of 8 Product/Process Change Notification #11504 TIP122 Test ICBO IEBO ICEO BVCEO HFE HFE VCE(sat) VCE(sat)VBE(on) Cond1 Ic=0.5A Ic=3A Ic=3A Ic=5A Ic=3A Group Cond2 Vcb=100V Veb=5V Vce=50V Ic=0.1A Vce=3V Vce=3V Ib=12mA Ib=20m Vce=3V Limit 1uA 2mA 1uA 100V >1000 >1000 <2.0V <4.0V <2.5V Mean 1.0 E-8 8.6 E-4 5.7 E-9 114.9 4395.4 10104 1.041 1.269 1.625 Lot#1 StDev 2.5 E-9 3.3 E-5 2.6 E-9 2.23 162.0 240 0.004 0.007 0.005 Cpk 132.2 11.7 127.3 2.22 7.0 12.6 79.9 132.9 52.5 Mean 1.3 E-8 8.2 E-4 7.3 E-9 117.9 4298.7 8800 1.045 1.275 1.634 Lot#2 StDev 2.7 E-9 7.1 E-5 2.7 E-9 2.79 307.8 734 0.007 0.010 0.006 Cpk 124.2 5.6 123.7 2.14 3.6 3.5 49.3 88.4 41.7 Mean 1.2 E-8 7.9 E-4 6.5 E-9 114.5 4788.4 10841 1.038 1.266 1.622 Lot#3 StDev 2.3 E-9 1.4 E-5 2.3 E-9 3.07 92.5 326 0.002 0.004 0.003 Cpk 146.1 29.1 13.3 1.57 13.6 10.1 132.7 242.5 75.6 Mean 1.2 E-8 1.0 E-3 4.6 E-9 126.1 3883.7 7308 1.164 1.456 1.703 Control StDev 1.4 E-8 3.4 E-5 2.2 E-9 0.67 146.1 258 0.006 0.010 0.005 Cpk 24.2 9.5 14.2 13.0 8.9 8.2 46.2 83.6 49.4 CHANGED PART IDENTIFICATION: Customers may receive Bipolar Power Epi Base Products with the silicon Chip manufactured at the Phoenix BP/ZR Fab starting with product marked with Date Code 0135. ADDITIONAL INFORMATION: Contact(s) at ON Semiconductor : Americas Europe Name Jose Ramirez Daniel Zurawski Email [email protected] [email protected] Phone (602) 244 - 4819 33534611194 Country USA France AFFECTED DEVICE LIST(WITHOUT SPECIALS): PART 2C3773WP 2N3055 2N3055A 2N3055H 2N3442 2N3771 2N3772 2N3773 2N4918 2N4919 2N4920 2N4921 2N4922 2N4923 2N5190 2N5191 2N5192 2N5194 2N5195 2N5302 2N5631 Issue Date: 09 July, 2001 Page 3 of 8 Product/Process Change Notification #11504 2N5684 2N5686 2N5883 2N5884 2N5885 2N5886 2N6031 2N6034 2N6035 2N6036 2N6038 2N6039 2N6040 2N6042 2N6043 2N6045 2N6052 2N6058 2N6107 2N6109 2N6111 2N6282 2N6284 2N6286 2N6287 2N6288 2N6292 2N6387 2N6388 2N6487 2N6488 2N6490 2N6491 2N6667 2N6668 BD179 BD180 BD234 BD237 BD238 BD241C BD242B BD242C BD243B BD243C BD244B BD244C BD249C BD435 BD435T BD436 BD436T BD437 BD437T BD438 BD438T Issue Date: 09 July, 2001 Page 4 of 8 Product/Process Change Notification #11504 BD439 BD440 BD441 BD442 BD675 BD675A BD676 BD676A BD677 BD677A BD678 BD678A BD679 BD679A BD680 BD680A BD680T BD681 BD682 BD682T BD809 BD810 BDV64B BDV65B BDW42 BDW46 BDW47 BDX33B BDX33C BDX34B BDX34C BDX53B BDX53C BDX54B BDX54C MJ11012 MJ11015 MJ11016 MJ11028 MJ11029 MJ11030 MJ11032 MJ11033 MJ14001 MJ14002 MJ14003 MJ15001 MJ15002 MJ15015 MJ15016 MJ2955 MJ4502 MJ802 MJB42C MJB42CT4 MJC11015WP Issue Date: 09 July, 2001 Page 5 of 8 Product/Process Change Notification #11504 MJC11016WP MJC122WP MJC15015WP MJC2955WP MJD112 MJD112-001 MJD112RL MJD112T4 MJD117 MJD117-001 MJD117T4 MJD122 MJD122T4 MJD127 MJD127T4 MJD128T4 MJD148T4 MJD2955 MJD2955-001 MJD2955T4 MJD3055 MJD3055T4 MJD31C MJD31C1 MJD31CRL MJD31CT4 MJD31T4 MJD32C MJD32C1 MJD32CRL MJD32CT4 MJD32RL MJD32T4 MJD41C1 MJD41CRL MJD41CT4 MJD42C MJD42C1 MJD42CRL MJD42CT4 MJD6039T4 MJE2955T MJE3055T MJE371 MJE4353 MJE521 MJE700 MJE702 MJE703 MJE800 MJE802 MJE803 MJF122 MJF127 MJF2955 MJF3055 Issue Date: 09 July, 2001 Page 6 of 8 Product/Process Change Notification #11504 MJF31C MJF32C MJF6388 MJF6668 MJH6284 MJH6287 SJB42C SJB42CT4 SJD31CT4 TE02514LFVK TEAC3055WP TIP100 TIP101 TIP102 TIP105 TIP106 TIP107 TIP110 TIP111 TIP112 TIP115 TIP116 TIP117 TIP120 TIP121 TIP122 TIP125 TIP126 TIP127 TIP131 TIP132 TIP137 TIP140 TIP141 TIP142 TIP145 TIP146 TIP147 TIP29 TIP2955 TIP29A TIP29B TIP29C TIP30 TIP3055 TIP30A TIP30B TIP30C TIP31 TIP31A TIP31B TIP31C TIP32 TIP32A TIP32B Issue Date: 09 July, 2001 Page 7 of 8 Product/Process Change Notification #11504 TIP32C TIP33A TIP33C TIP35A TIP35C TIP36A TIP36C TIP41 TIP41A TIP41B TIP41C TIP42 TIP42A TIP42B TIP42C TIPC122WP TIPC127WP Issue Date: 09 July, 2001 Page 8 of 8