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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16750
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Issue Date: 05-Dec-2011
TITLE: Additional Wafer Capacity Expansion at ON Semiconductor (Roznov, Czech Republic)
PROPOSED FIRST SHIP DATE: 05-Mar-2012
AFFECTED CHANGE CATEGORY(S): Wafer Fabrication
AFFECTED PRODUCT DIVISION: PowerFET Business Unit
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Larry DeLuca<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or Brian Goodburn
< [email protected] >
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Donna Scheuch< [email protected] >
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
ON Semiconductor plans to consolidate their manufacturing efforts by closing their Wafer facility in
Aizu, Japan. This Aizu facility has been the source for our High Cell Density (TMOS7 and HD+)
MOSFET Die. These MOSFET Die types are currently being transferred, and will be sourced from
the ON Semiconductor’s Wafer facility in Roznov, Czech Republic.
Reliability Qualification and full electrical characterization over temperature have been performed.
Issue Date: 05-Dec-2011
Rev. 06-Jan-2010
Page 1 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16750
RELIABILITY DATA SUMMARY:
Product built with TMOS7 Silicon Platform Die:
Reliability
Test Results
Test
Test Conditions
Read
points
MMBF170L
NTMD6601
NTD3055
NTD20P06L
1
AC-PC
Ta = 121°C/ 100% RH/
15psig
96hrs
0/80
0/80
0/80
0/80
2
HASTPC
130°C/85% RH for 96 hrs
96hrs
0/80
0/80
0/80
0/80
3
HTGB
1008 Hrs
0/80
0/80
0/160
0/80
4
HTRB
1008 Hrs
0/80
0/80
0/160
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/80
5
IOL
6
TC-PC
TA = Max rated for 1008 hrs
Vgs=100% of max rated
TA = Max rated for 1008 hrs
Vds=80% of max rated
Ta=25'C, delta Tj=100'C, 2min on/off, 15K- cy
-55°C to +150°C
15,000
Cyc
1000
Cycles
Product built with HD+ Silicon Platform Die:
Reliability
Test Results
Test
Test Conditions
Read
points
NTS4001NT
1G
NTJD1155L
NCV8401
NCV8403
1
AC-PC
Ta = 121°C/ 100% RH/
15psig
96hrs
0/80
0/80
0/160
0/80
2
HASTPC
130°C/85% RH for 96 hrs
96hrs
0/80
0/80
0/160
0/80
1008 Hrs
0/80
0/80
1008 Hrs
0/80
0/80
0/160
0/80
0/80
0/80
0/160
0/80
0/80
0/80
0/160
0/80
0/80
0/80
0/160
0/80
TA = Max rated for 1008 hrs
Vgs=100% of max rated
TA = Max rated for 1008 hrs
Vds=80% of max rated
Ta=25'C, delta Tj=100'C, 2min on/off, 15K- cy
3
HTGB
4
HTRB
5
IOL
6
TC-PC
-55°C to +150°
7
HTOL
Tj = 125°C
15,000
Cyc
1000
Cycles
1008 Hrs
ELECTRICAL CHARACTERISTIC SUMMARY:
There is no change in electrical parametric performance. Characterization data is available upon
request.
CHANGED PART IDENTIFICATION:
There will be no physical change to the Devices assembled with ON Semiconductor Die from
Roznov, CR. There will be Wafer Lot traceability from the manufacturing Lot to determine the Die
origin. Product assembled with the Die fabricated from the Roznov wafer facility will have a Finish
Good Date Code no earlier than ‘1210’.
Issue Date: 05-Dec-2011
Rev. 06-Jan-2010
Page 2 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16750
List of affected General Parts:
2N7002LT1H
NTC3055L104WP
NTDV3055L104-1G
2N7002LT3H
NTD18N06LT4G
NTF2955PT1G
2V7002LT1G
NTD18N06T4G
NTF2955T1G
2V7002LT3G
NTD20N06LT4G
NTF3055-100T1G
BS170G
NTD20N06T4G
NTF3055-100T3G
BS170RLRAG
NTD20P06LG
NTF3055L108T1G
BSS138LT1G
NTD20P06LT4G
NTGD1100LT1G
BSS138LT3G
NTD24N06LT4G
NTJD1155LT1G
BSS138LT3H
NTD24N06T4G
NTK3043NT1G
BVSS138LT1G
NTD2955-1G
NTK3043NT1H
MMBF170LT1G
NTD2955G
NTK3043NT5H
MMBFV170LT1G
NTD2955PT4G
NTP2955G
MMBFV170LT3G
NTD2955T4G
NVF2955PT1G
NSTA4001NT1G
NTD2955T4H
NVF2955T1G
NSTJD1155LT1G
NTD3055-094-1G
NVF3055-100T1G
NTA4001NT1G
NTD3055-094T4G
NVF3055L108T1G
NTA4001NT1H
NTD3055-150T4G
NVF3055L108T3G
NTA7002NT1G
NTD3055-150T4H
NVR4003NT3G
NTB25P06T4G
NTD3055L104-1G
NVTA7002NT1G
NTB45N06LT4G
NTD3055L104G
NVTJD4001NT1G
NTB45N06T4G
NTD3055L104T4G
NVTJD4001NT2G
NTB5605PT4G
NTD3055L170T4G
NVTJD4158CT1G
NTB60N06T4G
NTDV18N06LT4G
NVTP2955G
NTBV25P06T4G
NTDV20N06LT4G
SBVS138LT1G
NTBV5605T4G
NTDV20P06LT4G
SMBF1035LT3G
NTBV75N06T4G
NTDV2955-1G
STD20N06T4G
NTC18N06LF
NTDV2955PT4G
STD24N06LT4G
Issue Date: 05-Dec-2011
Rev. 06-Jan-2010
Page 3 of 3