INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 06-OCT-2004 SUBJECT: ON Semiconductor Initial Product/Process Change Notification #13699 TITLE: SOT-723 Assembly/Test Qualification at Leshan EFFECTIVE DATE: 06-Feb-2005 AFFECTED CHANGE CATEGORY: ON Semiconductor Assembly/Test Site AFFECTED PRODUCT DIVISION: Discretes Products FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Mark Dewitt <[email protected]> NOTIFICATION TYPE: Initial Product/Process Change Notification (IPCN) First change notification sent to customers. IPCNs are issued at least 120 days prior to implementation of the change. An IPCN is advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan. The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 60 days prior to implementation of the change. DESCRIPTION AND PURPOSE: ON Semiconductor is pleased to announce additional Assembly/Test capacity of SOT-723 manufacturing in our factory located in Leshan China. This notification affects NPN/PNP General Purpose Transistors and Digital Transistors. Our Leshan factory is both QS9000 certified and AEC qualified and has been producing all the technologies in SOT-23 for customers worldwide for many years. This expansion will provide additional flexibility and capacity needed to improve responsiveness and on time delivery to our valuable customers. There will be no change to the form, fit, and function of the devices. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductors standards. Issue Date: 06 Oct, 2004 Page 1 of 3 Initial Product/Process Change Notification #13699 QUALIFICATION PLAN: Package = SOT723, Devices, BAS16, BC846, MMBT2907A, DAN222 Test Conditions Interval Sample Size (Lots x Units) A/clave +PC Ta=121 degC, P=15 psig, RH=100% 96 hrs 3x77 H3TRB+PC Ta=85 degC, RH = 85%, Bias = 80% rated voltage 1008 hrs 3x77 HTB Ta = 150 deg C 1008 hrs 3x77 HTRB Ta=150 degC, bias = 80% rated voltage 1008 hrs 3x77 Temp Cycle +PC Ta = -65 to +150 deg C 1000 cyc 3x77 IOL+PC Ta=25 deg C, Ton=Toff=2min, delta Tj=100 deg C max 15000 cyc 3x77 MSL1 (PC) 24 hr bake @125deg C + 168 hr 85/85 Readout 3x252 + 3 IR @ 260 deg C + 1x Flux immersion + Alcohol + DI rinse + Visual AFFECTED DEVICE LIST (WITHOUT SPECIALS): PART 2SA2029M3T5G 2SC5658M3T5G BC846BM3T5G BC856BM3T5G DTA114EM3T5G DTA114TM3T5G DTA114YM3T5G DTA115EM3T5G DTA123EM3T5G DTA123JM3T5G DTA124EM3T5G DTA124XM3T5G DTA143EM3T5G DTA143TM3T5G DTA143ZM3T5G DTA144EM3T5G DTA144TM3T5G DTA144WM3T5G DTC114EM3T5G DTC114TM3T5G DTC114YM3T5G DTC115EM3T5G DTC123EM3T5G DTC123JM3T5G DTC124EM3T5G DTC124XM3T5G Issue Date: 06 Oct, 2004 Page 2 of 3 Initial Product/Process Change Notification #13699 DTC143EM3T5G DTC143TM3T5G DTC143ZM3T5G DTC144EM3T5G DTC144TM3T5G DTC144WM3T5G Issue Date: 06 Oct, 2004 Page 3 of 3