40 V, 100 mA NPN/NPN general-purpose transistor

PUMX1
40 V, 100 mA NPN/NPN general-purpose transistor
Rev. 04 — 20 January 2010
Product data sheet
1. Product profile
1.1 General description
NPN/NPN general-purpose transistor with two independently operating transistors in a
SOT363 (SC-88) very small Surface-Mounted Device (SMD) plastic package.
Table 1.
Product overview
Type number
Package
PUMX1
NXP
JEITA
PNP/PNP
complement
NPN/PNP
complement
SOT363
SC-88
PUMT1
PUMZ1
Simplified outline
Graphic symbol
1.2 Features
„ Double general-purpose transistor
„ Board-space reduction
„ Very small SMD plastic package
1.3 Applications
„ General-purpose switching and amplification
2. Pinning information
Table 2.
Pinning
Pin
Description
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collector TR1
6
5
4
6
5
4
TR2
TR1
1
2
3
1
2
sym020
3
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
3. Ordering information
Table 3.
Ordering information
Type number
PUMX1
Package
Name
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PUMX1
Z*Z
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
40
V
VEBO
emitter-base voltage
open collector
-
5
V
IC
collector current
-
100
mA
ICM
peak collector current
-
200
mA
IBM
peak base current
-
200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
-
200
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
-
300
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
Per device
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PUMX1_4
Product data sheet
[1]
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
2 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
-
-
416
K/W
Per device
Rth(j-a)
[1]
thermal resistance from junction in free air
to ambient
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCB = 30 V;
IE = 0 A
-
-
100
nA
VCB = 30 V;
IE = 0 A;
Tj = 150 °C
-
-
10
μA
nA
Per transistor
ICBO
collector-base cut-off current
IEBO
emitter-base cut-off current
VEB = 4 V;
IC = 0 A
-
-
100
hFE
DC current gain
VCE = 6 V;
IC = 1 mA
120
-
-
VCEsat
collector-emitter saturation
voltage
IC = 50 mA;
IB = 5 mA
-
-
200
mV
fT
transition frequency
IC = 2 mA;
VCE = 12 V;
f = 100 MHz
100
-
-
MHz
Cc
collector capacitance
VCB = 12 V;
IE = ie = 0 A;
f = 1 MHz
-
-
1.5
pF
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PUMX1_4
Product data sheet
[1]
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
3 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
8. Package outline
2.2
1.8
6
2.2 1.35
2.0 1.15
1.1
0.8
5
4
2
3
0.45
0.15
pin 1
index
1
0.3
0.2
0.65
0.25
0.10
1.3
Dimensions in mm
Fig 1.
06-03-16
Package outline PUMX1 (SOT363/SC-88)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type
number
PUMX1
[1]
Package
SOT363
Description
3000
10000
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-165
For further information and the availability of packing methods, see Section 12.
[2]
T1: normal taping
[3]
T2: reverse taping
PUMX1_4
Product data sheet
Packing quantity
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
4 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PUMX1_4
20100120
Product data sheet
-
PUMX1_3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Table 1 “Product overview”: added
Section 1.2 “Features”: updated
Section 1.3 “Applications”: amended
Section 2 “Pinning information”: amended
Figure 1: superseded by minimized package outline drawing
Section 9 “Packing information”: added
Section 11 “Legal information”: updated
PUMX1_3
19990414
Preliminary specification
-
PUMX1_2
PUMX1_2
19970709
Preliminary specification
-
PUMX1_1
PUMX1_4
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
5 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
PUMX1_4
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
6 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PUMX1_4
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 04 — 20 January 2010
7 of 8
PUMX1
NXP Semiconductors
40 V, 100 mA NPN general-purpose double transistor
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
3
3
4
4
5
6
6
6
6
6
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 January 2010
Document identifier: PUMX1_4