LTM4632 25LD LGA 6.25mm X 6.25mm X 1.82mm (TABLE OF MATERIAL DECLARATION) This Package is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+) polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Material Mass No. Part Name Material Name Materials Analysis (element) CAS Number Weight (gram) (gram) 1 Substrate Circuit Board 0.0367 105391-33-1 Bismaleimide/Triazine Resin/Filler Substances (Silica 0.00685 1156-51-0/9003-36-5/21645-51-2 Crystalline) *non-disclosure Continuous Filament Fiber Glass 65997-17-3 0.00608 Copper Metal 7440-50-8 0.01902 Zinc 7440-66-6 0.00000 Chromium(III) oxide 1308-38-9 0.00000 Epoxy Resin *non-disclosure 0.00002 Barium Compounds 7727-43-7 0.00121 Silica amorphous 7631-86-9 0.00004 Calcium caobonate 471-34-1 0.00000 Amine compounds *non-disclosure 0.00002 Leveling agent and others *non-disclosure 0.00005 Acrylic Resin *non-disclosure 0.00231 Copper Compounds 147-14-8 0.00001 Talc;not containing fibers like asbestos 14807-96-6 0.00014 Aromatic carbonyl compounds *non-disclosure 0.00013 Cyanoguanidine 461-58-5 0.00000 Nickel 7440-02-0 0.00068 Phosphorus *non-disclosure 0.00005 Gold 7440-57-5 0.00003 Palladium 7440-05-3 0.00001 7440-38-2 **Ecotoxic substances 0.00001 7439-92-1 2 Solder Paste Alloy 0.0033 Tin (Sn) 7440-31-5 0.00312 Antimony (Sb) 7440-36-0 0.00016 3 Components Passive/Active 0.0760 Iron Powder (Fe) 7439-89-6 0.05293 Copper (Cu) 7440-50-8 0.01570 Nickel (Ni) 7440-02-0 0.00088 Tin (Sn) 7440-31-5 0.00065 Ceramic (Ba) Compounds 12047-27-7 0.00585 4 Active Ics Silicon 0.0024 Silicon (Si) 7440-21-3 0.00240 5 Wire Gold 0.0006 Gold (Au) 7440-57-5 0.00062 7 Encapsulation Epoxy Resin 0.0931 Fused Silica 60676-86-0 0.07184 Epoxy Resin non-disclosure 0.00828 Phenol Resin non-disclosure 0.00828 Crytalline Silica 14808-60-7 0.00279 Carbon Black 1333-86-4 0.00047 Metal Hydroxide non-disclosure 0.00140 Total Package Weight 0.2120 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts Materials Analysis (weight %) 18.69 16.58 51.86 0.00 0.00 0.06 3.30 0.11 0.01 0.05 0.15 6.29 0.03 0.38 0.36 0.01 1.85 0.14 0.09 0.03 0.02 95.00 5.00 69.65 20.65 1.16 0.85 7.69 100.00 99.99 77.20 8.90 8.90 3.00 0.50 1.50