Index

INDEX
SUBJECT INDEX
ANALOG DEVICES' PARTS INDEX
ANALOG-DIGITAL CONVERSION
INDEX
SUBJECT INDEX
A
A-law, 3.26
AA Alkaline Battery Discharge Characteristics,
9.197
Aaron, M.R., 3.37
Aasnaes, Hans Bent, 3.108
Aavid 573300, 7.56
AAVID Thermal Technologies, Inc., general
catalog, 9.139
Aavid TO-220, heat sink, 7.56
Absorption, within shielding material, 9.149
Absorptive switch, 7.79
ACCEL Technologies, Inc., 9.213
Accuracy:
absolute, 2.97
logarithmic DAC, 2.97
relative, 2.97
Acker, David E., 8.104
ACLR, adjacent channel leakage ratio, 2.46,
2.57-58, 2.98
ACPR, adjacent channel power ratio, 2.57-58, 2.98
Acquisition time, 2.98, 7.102
Active lowpass filter, audio DAC, 6.75-76
AD2S90, integrated RDC, 3.103
AD260, digital isolator, 9.114
AD260/AD261:
digital isolator,
circuit, 9.114-115
key specifications, 9.115
AD261, digital isolator, 9.114
AD376, 16-bit 20-µs SAR ADC, 1.53
AD390, quad 12-bit voltage output DAC, 1.50
AD431, XFET, circuit, 7.25
AD480, op amp, 4.12
AD550, 4-bit binary-weighted µDAC quad switch,
1.25, 1.38, 1.41, 3.15-17, 4.6
AD558, 8-bit 1-µs bipolar/IIL DAC, 1.50
AD561, 10-bit 250-ns LWT current-output DAC,
1.38
AD562, 12-bit 1.5-µs DAC, 1.35, 1.38, 1.41,
1.42
AD563, IC DAC, 1.41
AD565:
12-bit 200-ns LWT current-output DAC, 1.38,
1.39-40, 1.41
circuit diagram, 1.36
AD569, 16-bit segmented double-buffered voltage
output BiCMOS DAC, 1.50
AD570, 8-bit 25-µs SAR ADC, 1.39
AD571:
10-bit 25-µs SAR ADC, 1.38, 4.12
diagram, 1.39-40
AD572, 12-bit 25-µs SAR ADC, 1.42-43, 4.6-7
AD574:
12-bit 35-µs SAR ADC, 1.39-40, 1.51,
3.41, 4.12, 6.49
block diagram, 1.40
AD580, precision bandgap reference, with Brokaw
cell, 7.5-6
AD620:
data sheet, 8.26
overvoltage protection,
circuit, 9.106
CM clamping, 9.107
precision in amp, 8.9
AD629, high voltage in-amp, circuit diagram, 9.98
AD670, 8-bit 10-µs ADCPORT, 1.51
AD671, 12-bit 2-MSPS ADC, 1.60
AD673, 8-bit complete ADC, 1.51
AD674, 12-bit 15-µs ADC, 1.51
AD768:
16-bit BiCMOS DAC, 6.73
data sheet, 6.77
single-ended interface, diagram, 6.73
AD770, 8-bit 300-MSPS flash ADC, 1.52
AD797, low-noise buffer, 6.15-16
AD815 high output current differential driver,
data sheet, 9.139
AD830, AD8129, AD8130, data sheets, 6.45
AD850, thin-film resistor network, 1.25, 1.41,
3.16-17
AD872:
12-bit 10-MSPS BiCMOS sampling ADC, 1.63
diagram, 1.61
AD974, SAR ADC, 6.18
AD976, SAR ADC, 6.18
AD977, SAR ADC, 6.18
AD76xx-family, single-supply SAR ADC, 6.18
AD77xx-family:
24-bit sigma-delta ADC, 3.126-127
characteristics, 6.15
equivalent input circuit, 6.16
AD92xx-family, CMOS ADC, 6.29-30
AD185x-family, audio DACs, data directed
scrambling, 3.133
AD746x-family, low voltage single-supply ADC,
6.18
AD771x-series, 24-bit sigma-delta measurement
ADC, 1.63
AD789x-family, 12-, 14-bit 8-channel
single-supply ADC, 6.18-19
AD789x-series, LCCMOS SAR single-supply
ADC, 1.62
AD813x-family:
differential amplifier, 6.75
block diagram, 6.31
configurations, 6.33-34
feedback diagram, 6.31
Index 1
ANALOG-DIGITAL CONVERSION
AD813x-series, data sheets, 6.77
AD922x-family, single-ended DC-coupled level
shifter and driver, circuit, 6.22-23
AD978x-series, 16-bit interpolating TxDAC
family,
key specifications, 8.135
AD985x, high speed DDS synthesizers, table, 8.171
AD1170, modular ADC, VFC architecture, 3.96
AD1175, 22-bit integrating ADC, 1.53-54
AD1332, 12-bit 125-kSPS sampling ADC, 1.53
AD1377, 16-bit 10-µs SAR ADC, 1.53-54
AD1382, 16-bit 500-kSPS sampling hybrid ADC,
1.64
AD1385, 16-bit 500-kSPS sampling
autocalibrated hybrid ADC, 1.64
AD1580:
reference circuit, 7.7
shunt mode IC reference, 7.6-7
AD1582-1585:
bandgap references,
circuit diagram, 7.9
specifications, 7.8
series connection diagram, 7.9
AD1671, 12-bit 1.25-MSPS BiCMOS sampling
ADC, 1.63
AD1674:
12-bit 100-kSPS sampling SAR ADC, 1.63
diagram, 1.59
AD1839A:
24-bit 96-kSPS sigma-delta codec, block
diagram, 8.69
data sheet, 8.74
AD1853:
data sheet, 6.77
sigma-delta audio DAC, 6.75-76
AD1856, 16-bit audio BiCMOS DAC, 1.50
AD1857, 16-bit serial sigma-delta audio DAC,
1.57-58
AD1858, 18-bit serial sigma-delta audio DAC,
1.57-58
AD1859, 20-bit serial sigma-delta audio DAC,
1.57-58
AD1860, 18-bit audio BiCMOS DAC, 1.50
AD1862, 20-bit DAC, diagram, 3.33
AD1865, dual 18-bit stereo DAC, 1.56
AD1871:
24-bit 96-kSPS stereo multi-bit sigma-delta
ADC, 3.124
block diagram, 8.66
digital filter, 3.126
key specifications, 3.125
data sheet, 8.74
AD1879, dual audio ADC, 3.123
AD1896:
192-kHz stereo asynchronous sample rate
converter, block diagram, 8.73
data sheet, 8.74
AD1953:
data sheet, 8.74
Index 2
SigmaDSP 3-channel 26-bit signal processing
DAC,
block diagram, 8.68
evaluation interface, 8.69
AD1955:
16-/18-/20-/24-bit 192-kSPS sigma-delta DAC,
8.66
functional diagram, 8.67
schematic, 3.134
data sheet, 8.74
AD1985, data sheet, 8.74
AD5170:
8-bit two-time programmable digital
potentiometer, block diagram, 8.54
data sheet, 8.58
AD5172:
data sheet, 8.58
three-terminal potentiometer, 8.53
AD5172/AD5173, one-time-programmable digital
potentiometer, block diagram, 8.53
AD5173, rheostat, 8.53
AD5231, 10-bit digital potentiometer, 5.11
AD5235:
10-bit digital potentiometer, 5.11, 8.52-53
block diagram, 8.52
data sheet, 8.58
AD5245:
data sheet, 8.58
digital potentiometer bandwidth model, 8.55
AD5246, data sheet, 8.58
AD5247, data sheet, 8.58
AD5300, 8-bit buffered voltage output DAC, 8.42
AD5310, 10-bit buffered voltage output DAC, 8.42
AD5320:
12-bit buffered voltage output DAC, 8.42-43
diagram, 8.43
data sheet, 8.48
AD5322:
12-bit 100-kSPS dual DAC,
block diagram, 6.63
serial input interface, 6.62-64
data sheet, 6.67
AD5340:
12-bit 100-kSPS DAC,
block diagram, 6.65
parallel data interface, 6.64-65
to ADSP-2189M, 6.65
data sheet, 6.67
AD5379:
14-bit 40-channel parallel/serial input
voltage output DAC, diagram, 8.45
data sheet, 8.48
AD5380, 40-channel multiple DAC, 1.65-66
AD5381, 40-channel multiple DAC, 1.65-66
AD5382, 32-channel multiple DAC, 1.65-66
AD5383, 32-channel multiple DAC, 1.65-66
AD5390, 16-channel multiple DAC, 1.65-66
AD5391, 16-channel multiple DAC, 1.65-66
AD5516:
INDEX
12-bit 16-channel voltage output DAC, diagram,
8.44
data sheet, 8.48
AD5533B:
32-channel precision infinite SHA, 8.45-46
diagram, 8.46
data sheet, 8.48
AD5535, 32-channel 14-bit high voltage DAC,
evaluation board, 9.210, 9.211
AD5541, 16-bit DAC, 8.47
AD5545/AD5555:
16-/14-bit R-2R current-output DAC, 6.74
interface circuit, 6.74
data sheet, 6.77
AD5570, data sheet, 8.48
AD5660, data sheet, 8.48
AD6521:
voiceband/baseband mixed-signal codec, 8.141
block diagram, 8.142
AD6522, DSP-based baseband processor, 8.141
AD6624/24A, 8.136
AD6644, 14-bit 65-MSPS XFCB ADC, 3.85
AD6645:
14-bit 80-/105-MSPS ADC, aperture jitter, 6.83
14-bit 80-/105-MSPS BiCMOS ADC, 6.27-28
input common-mode voltage, 6.38-39
RF transformers, 6.29
transformer coupling, 6.28
14-bit 80-/105-MSPS XFCB ADC, 4.12
thermally enhanced package, 9.137
14-bit 80-MSPS XFCB ADC, 3.77-78, 3.85
characteristics, 2.51-53
NF calculation, 2.64-66
SFDR, 2.52, 2.56-57
SNR versus jitter, 2.73
wideband CDMA channel, 2.58
14-bit 105-MSPS XFCB ADC, 1.65-66, 3.85,
8.146
aperture jitter, 6.97
circuit, 7.107-108
diagram, 3.78
data sheet, 6.45
signal sampling frequency, 8.125
subranging pipelined ADC, 8.128
dithered and undithered DNL, 8.128-129
dithered and undithered SFDR FFT, 8.130
DNL errors, 8.128
two-tone intermodulation performance, 8.123
AD7001, CMOS GSM baseband converter, 1.62,
1.63
AD7008:
10-bit 50-MSPS DDS DAC, 1.57
diagram, 1.58
AD7111:
LOGDAC monolithic multiplying DAC, 2.112,
3.27
diagram, 3.27
AD7226, quad 8-bit double-buffered voltage
output BiCMOS DAC, 1.50
AD7240, 12-bit voltage mode CMOS DAC, 1.50
AD7245, 12-bit double-buffered voltage output
LCCMOS DAC, 1.50
AD7450, 12-bit 1-MSPS ADC, evaluation board,
9.210
AD7450A, 12-bit 1-MSPS 3-V ADC, 6.35
AD7450A/AD7440, data sheet, 6.45
AD7466:
12-bit 200-kSPS SAR ADC, 6.17
input circuit, 6.17
timing diagram, 6.51
AD7466/AD7467/AD7468, data sheet, 6.45, 6.67
AD7467, successive approximation ADC, 6.17
AD7468, successive approximation ADC, 6.17
AD7520:
10-bit 500-ns monolithic multiplying CMOS
DAC, 1.36-37, 1.38, 4.13
current-mode R-2R architecture, 1.36
AD7524:
8-bit 150-ns LWT multiplying DAC,
buffer latch, 1.38
diagram, 1.37-38
AD7528, dual 8-bit buffered CMOS MDAC, 1.50
AD7535, 14-bit double-buffered LCCMOS
MDAC, 1.50
AD7541, 12-bit 1-µs LWT multiplying DAC,
1.36-37, 1.38
AD7545, 12-bit buffered CMOS MDAC, 1.50
AD7546, 16-bit segmented CMOS voltage mode
DAC, 1.50
AD7550, 13-bit quad slope ADC, 1.38, 1.140
AD7568, 12-bit octal CMOS DAC, 1.56-58
AD7570, 10-bit 20-µs CMOS SAR ADC, 1.38,
1.40
AD7572, 12-bit 5-µs SAR LCCMOS ADC, 1.51
AD7575, 8-bit 5-µs SAR LCCMOS sampling
ADC, 1.51
AD7579, 10-bit 50-kSPS LCCMOS SAR sampling
ADC, 1.51
AD7582, 4-channel muxed input 12-bit CMOS
ADC, 1.51
AD7621, 16-bit 3-MSPS PulSAR ADC, 1.65-66,
3.61
AD7664, 16-bit 570-kSPS ADC, 1.65
AD7674, 18-bit 800-kSPS PulSAR ADC, 1.65-66,
3.61, 6.42-43
AD7675, 16-bit 100-kSPS PulSAR ADC, 3.61
AD7676, 16-bit 500-kSPS PulSAR ADC, 3.61
AD7677:
16-bit 1-MSPS PulSAR ADC, 3.61, 6.41-42
diagram, 3.61
data sheet, 6.45
AD7678, 18-bit 100-kSPS PulSAR ADC, 3.61
AD7679, 18-bit 570-kSPS PulSAR ADC, 3.61
AD7730:
24-bit bridge transducer sigma-delta ADC, 1.63
evaluation board, 9.210
24-bit sigma-delta single-supply ADC, block
diagram, 8.3
Index 3
ANALOG-DIGITAL CONVERSION
24-bit single-supply sigma-delta ADC, 6.79
bridge application, 3.131
calibration modes, 3.130-131
design component, 8.10
design evaluation, 8.12
diagram, 1.62, 3.128
digital filter, 3.129, 8.4
external voltage reference, 3.131
high impedance input buffer, 6.15
internal digital filter, 3.128-129
key specifications, 8.5
oversampling, 3.128
ratiometric operation and Kelvin sensing,
8.5
resolution, 8.10-11
settling time, 3.130
weigh scale analysis, 8.6, 8.6-12
AD7730/AD7730L, data sheet, 8.26
AD7739:
24-bit sigma-delta ADC, 8.36-38
block diagram, 8.36
timing, 8.38
data sheet, 8.48
AD7793:
data sheet, 8.26
dual channel 24-bit sigma-delta ADC, 8.12-14
block diagram, 8.13
AD7820, 8-bit 1.36-µs half-flash sampling
ADC, 1.51
AD7821, 8-bit 1-MSPS half-flash sampling ADC,
1.51
AD7840, 14-bit double-buffered voltage output
LCCMOS DAC, 1.50
AD7846, 16-bit segmented voltage output
LCCMOS DAC, 1.50
AD7853/AD7853L:
12-bit 200-/100-kSPS SAR ADC, 6.55
diagram, 6.55
interfacing, 6.56
data sheet, 6.67
AD7853L, serial ADC output timing, 6.56
AD7854/AD7854L:
12-bit 3-V 200-/100-kSPS parallel output ADC,
6.59-61
block diagram, 6.59-60
data sheet, 6.67
AD7865:
14-bit 4-channel SAR ADC, 8.39-40
block diagram, 8.39
data sheet, 8.48
AD7870, 12-bit 100-kSPS LCCMOS SAR
sampling ADC, 1.51
AD7871, 14-bit 83-kSPS LCCMOS SAR
sampling ADC, 1.51
AD7873:
12-bit SAR ADC,
touchscreen digitizer, 8.102-103
application circuit, 8.103
data sheet, 8.105
Index 4
AD7880:
12-bit 66-kSPS LCCMOS sampling SAR ADC,
1.59, 1.63
diagram, 1.60
AD7890, data sheet, 6.45
AD7890-10, 12-bit 8-channel ADC, input circuit,
6.18-19
AD7908/AD7918/AD7928:
8-, 10-, 12-bit 1-MSPS successive
approximation ADC, 8.34-35
block diagram, 8.34
data sheet, 8.48
AD7938/AD7939:
12-, 10-bit 1.5-MSPS successive approximation
ADC, 8.35-36
block diagram, 8.35
data sheet, 8.48
AD7943, multiplying DAC, 3.2
AD8001, high speed current-feedback
amplifier, evaluation board, 9.207-209
AD8016:
20-lead PSOP3 package, heat sink, 9.131
BATWING package, 9.131
PSOP3 package, 9.130
AD8016 low power high output current xDSL line
driver, data sheet, 9.139
AD8017 dual high output current high speed
amplifier, data sheet, 9.139
AD8017AR:
8-pin SOIC op amp,
maximum power dissipation data, 9.127-128
Thermal Coastline IC package, 9.130
thermal rating curves, 9.129
AD8021:
data sheet, 6.45
op amp, 6.41-43
AD8027, data sheet, 6.45
AD8027/8028, op amp family, pin-selectable
crossover threshold, 6.8
AD8031, 6.43
AD8038, differential amplifier, 6.37
AD8055, dual supply op amp, 6.72, 6.74
AD8055/AD8056, data sheet, 6.77
AD8057:
high speed op amp, 6.12
distortion versus frequency, 6.14
distortion versus output voltage, 6.15
key specifications, 6.13
thermal ratings, 9.133-134
AD8057/AD8058, data sheet, 6.45
AD8058:
dual high speed op amp,
ADC driver, 6.29-30
distortion versus frequency, 6.14
distortion versus output voltage, 6.15
key specifications, 6.13
thermal ratings, 9.133-134
AD8061:
data sheet, 6.77
INDEX
op amp, 6.72-73
rail-to-rail output, 6.23
AD8108/AD9109, crosspoint switch, 7.82
AD8110/AD8111, buffered crosspoint switch, 7.82
AD8113, audio/video crosspoint switch, 7.82
AD8114/AD8115, crosspoint switch, 7.82
AD8116:
buffered video crosspoint switch, 7.82-83
diagram, 7.83
AD8130, differential receiver, 6.34
AD8131, AD8132, AD8137, AD8138, AD8139,
data sheets, 6.45
AD8132, differential ADC driver, 6.35
AD8137, differential amplifier, 6.35
AD8138:
differential ADC driver, 6.36-37
noise calculations, 6.37
AD8139:
differential amplifier, 6.38-39, 6.42-44
DC coupled driver for ADC, circuit, 6.39
AD8152:
3.2-Gbps asynchronous digital crosspoint
switch, 7.83-84
circuit, 7.84
AD8170, bipolar video multiplexer, 7.80
AD8174, bipolar video multiplexer, 7.80
AD8180, bipolar video multiplexer, 7.80
AD8182, bipolar video multiplexer, 7.80
AD8183, video multiplexer, 7.80-81
AD8183/AD8185, triple 2:1 video multiplexers,
7.81
AD8185, video multiplexer, 7.80-81
AD8186, single-supply video multiplexer, 7.80-81
AD8187, single-supply video multiplexer, 7.80-81
AD8346, quadrature modulator, 4.25
AD8349, 800-MHz to 2.7-GHz quadrature
modulator, 8.134-136
AD8351:
data sheet, 6.45
single-ended to differential converter, 6.40
key features, 6.39-40
performance, 6.40
AD8370:
data sheet, 6.45
variable-gain-amplifier, 6.41
AD8402, 2-channel 8-bit DAC, 1.58
AD8403, 4-channel 8-bit DAC, 1.58
AD8515, single-supply rail-to-rail op amp, 6.18
AD8517, single-supply rail-to-rail op amp, 6.18
AD8531/8532/8534, CMOS op amp family, 6.7
AD8551, chopper-stabilized amplifier, 9.50
AD8628:
chopper-stabilized op amp, 6.74
data sheet, 6.77
AD8631, single-supply rail-to-rail op amp, 6.18
AD8800, TrimDAC, 1.58
AD9000, 6-bit 75-MSPS flash ADC, 1.52
AD9002, 8-bit 150-MSPS flash ADC, 1.52
AD9003, 12-bit 1-MSPS sampling ADC, 1.53
AD9005, 112-bit 10-MSPS sampling ADC, 1.53-54
AD9006/AD9016, 6-bit 500-MSPS flash ADC,
1.52
AD9008, DDS DAC, 1.58
AD9012, 8-bit 100-MSPS TTL flash ADC, 1.52
AD9014, 14-bit 10-MSPS modular ADC, 1.64
AD9020, 10-bit 60-MSPS flash ADC, 1.52
AD9028/AD9038, 8-bit 300-MSPS flash ADC,
1.52
AD9032, 12-bit 210-MSPS sampling ADC, 1.65-66
AD9042:
12-bit 41-MSPS ADC, 1.63, 1.64, 3.85, 4.12
circuit, 7.106-107
functional diagram, 1.61, 3.75
AD9048, 8-bit 35-MSPS flash ADC, 1.52
AD9054, 8-bit 200-MSPS ADC, 1.62
AD9054A, 8-bit 200-MSPS MagAMP ADC, 3.86
AD9058, dual 8-bit 50-MSPS flash ADC, 1.52
AD9060, 10-bit 75-MSPS flash ADC, 1.52
AD9220, 12-bit 10-MSPS CMOS ADC, 1.61, 1.63
AD9221, 12-bit 1-MSPS CMOS ADC, 1.61, 1.63
AD9223, 12-bit 3-MSPS CMOS ADC, 1.61, 1.63
AD9225:
12-bit 25-MSPS CMOS ADC, 6.20-21, 6.24
diagram, 3.76
single-ended input, 6.21
AD9226, 12-bit 65-MSPS ADC, SINAD and
ENOB, 2.49
AD9229:
quad 12-bit 65-MSPS ADC, 6.52-53
serial outputs, 6.53
AD9235:
12-bit 20-/40-/65-MSPS ADC, 6.36-37
12-bit 65-MSPS CMOS ADC, 3.69
diagram, 3.77
timing diagram, 3.70
data sheet, 6.45
AD9236, 12-bit 80-MSPS ADC, sinewave
histogram
DNL and INL, 5.43-44
AD9245:
14-bit 80-MSPS 3-V CMOS ADC,
packaging and heat sink, 9.135
power dissipation versus frequency,
9.134-135
AD9289:
data sheet, 6.67
quad 12-bit 65-MSPS ADC, 6.52
timing diagram, 6.53-54
AD9410, 10-bit 210-MSPS ADC, 3.51-53
AD9430:
12-bit 170-/210-MSPS BiCMOS ADC, 6.26-27,
6.57-59, 9.136-137
block diagram, 6.57-58
demuxed CMOS output timing, 6.59
diagram, 3.77
FIFO evaluation, FFT output, 5.61-62
LVDS driver, diagram, 9.176
NPR, 2.60, 5.70
Index 5
ANALOG-DIGITAL CONVERSION
packaging and heat sink, 9.136-137
pipelined, 3.69
supply current versus sample rate, 9.136
timing, 6.58
transformer coupling, 6.27
12-bit 210-MSPS ADC, 8.146
evaluation board, 9.211
data sheet, 6.45, 6.67
AD9433, 12-bit 105-/125-MSPS BiCMOS ADC,
6.41
AD9480, 8-bit 250-MSPS ADC, 3.49
AD9700, 8-bit 125-MSPS video ECL DAC, 1.50
AD9712, 12-bit 100-MSPS DAC, 1.57
AD9720, 10-bit 400-MSPS DAC, 1.57
AD9726:
16-bit 600+-MSPS DAC,
block diagram, 6.66
LVDS input, 6.66
data sheet, 6.67
AD9744, 14-bit 165-MSPS TxDAC, spectral
output, 5.22-23
AD9772A, data sheet, 6.77
AD9773, 12-bit TxDAC, oversampling
interpolating, 2.89
AD9775:
14-bit 160-/400-MSPS TxDAC, 3.22
CMOS DAC core, structure, 3.22
oversampling interpolating, 2.89
AD9777:
16-bit 160-MSPS TxDAC,
oversampling interpolating, 2.89
power dissipation, 9.138
SFDR, 2.84-86
smart partitioning, diagram, 4.25
AD9786, 16-bit 160-MSPS TxDAC, block
diagram, 8.134
AD9814, 14-bit 3-channel CCD front-end, 8.99
AD9816, 12-bit 3-channel CCD front-end, 8.99
AD9822, 14-bit 3-channel CCD front-end, 8.99
AD9826, 16-bit 3-channel CCD front-end, 8.99
AD9833, low power 50-MSPS DDS synthesizer,
key features, 8.167
AD9834:
low power 50-MSPS DDS synthesizer,
block diagram, 8.167
key features, 8.167
AD9850, 10-bit 125-MSPS DDS DAC, 1.57
AD9851, 10-bit DDS DAC, spectral outputs, 5.22
AD9857:
14-bit 200-MSPS quadrature digital
upconverter, 8.173
block diagram, 8.173
AD9858:
10-bit 1-GSPS DAC DDS, 1.65-66, 8.168-171
block diagram, 8.169
key specifications, 8.170
single loop upconversion, 8.170
AD9860/AD9862:
mixed-signal front end,
Index 6
broadband communications, 4.29
for broadband wireless OFDM modem, 4.29
AD9877/AD9879, set-top box mixed signal front
end, 4.25
AD9887A:
8-bit 170-MSPS dual flat panel interface,
functional diagram, 8.93
data sheet, 8.105
AD9888:
8-bit 100-/140-/170-/205-MSPS analog flat
panel interface, diagram, 8.92
data sheet, 8.105
AD9898:
CCD signal processor, block diagram, 8.99
data sheet, 8.105
AD9954:
14-bit 400-MSPS 1.8-V DDS, 8.171-172
block diagram, 8.172
key specifications, 8.172
AD10242, dual 12-bit 41-MSPS AD9042 ADCs,
1.64
AD10678, 16-bit 65-/80-/105-MSPS multichip
ADC, 1.65-66
AD12400:
12-bit 400-MSPS ADC, 1.65-66, 8.152-155
Advanced Filter Bank, 8.152-154
block diagram, 8.153
AD74122:
16-/20/24-bit 48-kSPS stereo voiceband codec,
8.65
block diagram, 8.65
data sheet, 8.74
AD20msp430:
chipset, composition, 8.141
SoftFone chipset, 8.140-141
AD1671, 12-bit 1.25-MSPS sampling BiCMOS
ADC,
diagram, 1.60
Adage, 1.21, 1.23-24
Adams, R., 3.137
Adams, Robert, 3.137
Adams, Robert W., 3.36, 3.137
Adams, R.W., 3.137
ADC:
1-bit comparator, 3.42-45
3-bit binary ripple, input and residue
waveforms, 3.80
3-bit folding,
based on Chasek design, 3.83
single-ended waveforms, 3.83
block diagram, 3.82
input and residue waveforms, 3.82
3-bit serial-binary, diagram, 3.80
5-bit counting, 3.88
developed by Reeves, 1.9
Reeves, 3.88
6-bit subranging error corrected,
diagram, 3.68
diagrams, 3.66
INDEX
7-bit 9-MSPS recirculating pipelined, diagram,
3.74
7-bit pipelined, proposed, 3.75
8- to 16-bit, theoretical maximum NPR, 2.60
10-, 11-, 12-bit, theoretical NPR, 2.59
12-bit,
noise floor, 2.43
testing methods, 5.33
16-bit, requires 16-bit driver, 6.42
16-bit sigma-delta, 1.51
50-kSPS vacuum-tube based, 1.21
absolute accuracy, 2.97
analog bandwidth, 2.50
using FFT, 5.75
analog input, high frequency BER test, 2.80
analog signal, BER test, 2.79
analyzer configuration file, inputs, 5.62
aperture delay time, 5.73
aperture jitter, 6.83
locked-histogram test method, 5.70-72
using FFT, 5.73-75
architecture, 3.39-108
counting and integrating, 3.87-103
timeline, 3.87
design issues, 3.78
audio, high performance, 8.66-69
back-to-back static testing, 5.31-33
BER, 2.76-80, 3.45, 5.83-86
testing, 2.77-78, 5.83
BiCMOS, 6.5
binary, single-stage transfer function,
diagram, 3.79
bipolar process, 6.1
bit error rate, 2.76-80
buffered differential input, 6.26
buffering, against logic noise, 9.60-62
charge run-down, 3.89
code center, 5.28, 5.29-30
code density test,
code density test, 5.40
DNL integration, 5.40
linear ramp input, 5.38-44
code transition noise, 5.38
code transition points, test setup, 5.29-30
combined pipelined and multibit, diagram, 3.71
conversion using one stage per bit, 3.78
counting and integrating, 3.87-113
architecture timeline, 1.29
crossplot measurements, linearity, 5.33-35
crossplot test, 5.34
static errors, major code transitions, 5.35
differential amplifier,
driving, 6.29-44
fully integrated driver, 6.31-34
differential gain, 5.78-83
differential input,
driver, 6.23-29
drivers, 6.35-44
integrated differential driver, 6.35-44
single-ended circuits, driving, 6.21-23
switched capacitor, driving, 6.19-23
differential nonlinearity, details, 2.18
differential phase, 5.78-83
digital interface, 6.47-67
digital output, grounding, 9.37-38
digitally corrected subranging, 3.65
drive circuit, 6.2
driver,
differential amplifier, 6.29-44
selection criteria, 6.3
driving, 6.15-44
dual slope,
diagram, 3.96
integrator output waveforms, 3.97
dual slope/multi-slope, 3.96-98
dynamic performance analysis, 2.42
dynamic range, 6.1
dither, 8.126-131
increasing using dither, 8.126-131
dynamic testing, 5.45-86
back-to-back, 5.45-49
setup, 5.45
FFT, basics, 5.51-59
manual, 5.45-49
manual "back-to-back", 5.45-49
ENOB using sinewave curve fitting,
5.49-50
error corrected, 3.61-78
external reference, diagram, 3.39
feedback subtraction, 1.28, 3.54
FFT analysis, 2.41
flash, 1.40, 3.46-53
4-, 6-, 8-bit monolithic, 1.41
8-bit 20-MSPS, SHA, 2.26
monolithic, 1980s, 1.52-53
PCM patent, 1.6
folding, 3.78-87
function, 2.1
gain and ENOB versus frequency, 2.50
generalized bit-per-stage architecture,
diagram, 3.79
grounding, 9.30
high-impedance differential input,
transmission accuracy, 9.52
high-resolution, using VFC and frequency
counter, 3.92
high-speed,
architectures, 3.46-87
timeline, 1.29, 3.87
back-to-back testing, 5.46
CMOS latched buffer, 9.61-62
pipelined, CMOS process, 4.15
histogram test, linear ramp input, 5.38-44
hybrid,
1970s, list, 1.43
1980s, 1.53-54
1990s, 1.64
hybrid and modular,
Index 7
ANALOG-DIGITAL CONVERSION
1980s, 53-54
1990s, 1.64
high performance, 1980s, list, 1.53
ideal bipolar, transfer function, 2.10
input and output, definition, 2.1
input impedance, equal to source resistance,
2.62
input protection, circuit, 9.109
integrating, frequency response, 3.98
integrating and counting, 3.87-113
linearity,
crossplot measurements, 5.33-35
testing methods, 5.46
metastable states, 2.76-80
modular,
1980s, 1.53-54
1990s, 1.64
early 1970s, 1.44
monolithic,
1970s, 1.38-40
summary, 1.40
1980s, 1.51
list, 1.51
1990s, 1.59-64
list, 1.63
multistage subranging, design, 3.78
N-bit two-stage subranging,
diagram, 3.62
residue waveforms, 3.63
noise, 2.43-45
noise and distortion sources, 2.44
noise figure,
model, 2.61
oversampling and process gain effects, 2.65
from SNR, sampling rate, and input power,
2.64
summary, 2.68
non-monotonic, missing code, 2.19
non-monotonicity, 2.18-19
trimming, 2.19
nonlinearity, using beat frequency and
envelope tests, 5.49
Nyquist-type, 8.1
offset and gain error, measurement, 5.31
optical converter, 3.98-99
output, error codes, 2.76
overvoltage recovery time, 5.77-78
parallel output interface, 6.51, 6.57-61
timing, 6.57
pipelined, 2.113, 3.61-78, 6.49-50
1-bit per stage, diagram, 3.72
1.5-bit per stage:
error corrected range, 3.73
residue waveform, 3.73-74
error correction, 3.72
stages, diagram, 3.71
timing diagram, 3.69
power meter, application, 8.22-25
power-saving modes, 3.41
Index 8
practical, noise, 2.43-44
processing gain, FFT output, 5.55
quantization noise, 2.37-45
quantization uncertainty, 5.28
ramp run-up, 3.89-90
recirculating subranging, 3.74
reference input terminal, buffered, 3.40
reference value, 3.39
reference with buffer, diagram, 3.40
relationship to DAC, 2.1
resolver-to-digital converter and synchro,
3.99-103
sampling, 2.112, 7.92
internal SHA, 9.30
sample-and-hold function, 5.45
simultaneous sampling system, 8.39
sampling clock input, 3.41
SAR, 3.91, 6.50
algorithm, 3.57
algorithm analogy, 1.27
development summary, 1.28
diagram, 1.28
fundamental timing, diagram, 3.53-54
switched capacitor DAC, 3.55
timing, 3.54-55
serial bit-per-stage binary and Gray-coded,
3.78-87
serial interface to DSPs, 6.55-56
serial output interface, 6.51-54
servo-loop tester, computer-based, 5.36-38
servo-loop transition test, 5.35-36
settling time, 2.112, 5.76-77
SFDR, 2.41
sigma-delta, 2.112
architecture timeline, 1.30
digital filter, 2.74
high resolution, 3.127-131
driving, 6.15-16
high speed clock, 9.30
performance:
chop mode disabled, 8.183
normal, 8.182
switched capacitor input, circuit, 7.22
synchronization, 8.40
sign-magnitude, 2.15
single-supply,
CMOS, 6.5
driver, fundamental application circuit,
6.4
input protection, circuit, 9.109
scaled input, driving, 6.18-19
SNR, 2.63
sampling clock jitter, 5.60
sparkle codes, 2.76-80
specifications, 5.27-28
static, 5.28-44
back-to-back, testing, 5.32
testing, 5.28-44
static transfer, DC errors, 2.12-21
INDEX
subranging, 1.53-54, 2.19, 2.113, 3.11,
3.61-78
improper trimming, errors, 2.20
missing codes, 3.63
pipeline stage design, 3.67-68
successive approximation, 3.11, 3.53-61, 3.91
5-bit 8-kSPS, 3.58
dynamic transient loads, 7.23-24
single-ended input, driving, 6.17-18
superposition, 5.34
testing, 5.27-91, 5.28
back-to-back static, 5.31-33
dynamic, 5.45-86
FFT, 5.51-59
time-interleaved, block and timing diagrams,
8.147
total effective input noise, from SNR, 2.63
total SNR, equation, 2.72-73
tracking, 3.90-91
transfer function,
endpoint measurement, 5.35
referred noise, 5.37
transient response, 2.73-74, 2.73-75
trimmed, 3.39
unipolar, transfer function;, 2.5
video testing, 5.78-83
voltage-to-frequency converter, 3.91-96
ADC-12QZ:
12-bit 40-µs SAR ADC, 1.44, 1.46
quad-switch ICs, 4.6
ADC-12U, 12-bit 10-µs SAR ADC,
Pastoriza, 1.24-25
ADC analyzer software:
Coherent Sampling Calculator, 5.63
single-tone input, 5.65
two-tone input, 5.65
ADC/DAC, DNL errors, 2.47
ADC FIFO evaluation kit, ADC evaluation boards,
9.211-212
ADC80, 12-bit 25-µs SAR ADC, 1.43
ADC1130, 14-bit 12-µs SAR ADC, 1.46
ADC1140, 16-bit 35-µs SAR ADC, 1.53
ADE775x-series, energy-metering IC, 1.63
ADE7755:
data sheet, 8.26
energy metering IC, 8.23-25
block diagram, 8.23
current and voltage sense connections, 8.25
pulse output, 8.24
ADF4360:
PLL with internal VCO, 6.93
phase noise and jitter, 6.93
ADG200-series, switches and multiplexers, 7.62
ADG201-series, switches and multiplexers, 7.62
ADG439F, trench-isolated multiplexer, 7.89
ADG465:
channel protector IC, circuit diagram, 9.98
single channel protector, 9.110
ADG466, triple channel protector, 9.110-111
ADG467, octal channel protector, 9.110
ADG508F, trench-isolated multiplexer, 7.89
ADG509F, trench-isolated multiplexer, 7.89
ADG528F, trench-isolated multiplexer, 7.89
ADG708:
8-channel multiplexer,
crosstalk versus frequency, 7.72
off-isolation versus frequency, 7.68
ADG801/ADG802, CMOS switch, resistance
versus
input, 7.64
ADG918, absorptive CMOS switch, 7.79
ADG919, reflective CMOS switch, 7.79
ADG32xx-series, bus switches, 7.84
ADG324x-series, unidirectional interfaces, 9.191
ADG3231:
low-voltage bus switch, 9.188-189
low voltage logic level translator, diagram,
9.191
ADG3233:
low voltage logic level translator and bypass
switch, 9.191-192
functional block diagram, 9.192
modes, 9.193
ADG3246:
bus switch,
hot-plug application, 9.194
hot swapping, 9.194
ADG3257:
quad 2:1 Mux/Demux bus switch, 9.186-188
eye diagrams, 9.188
maximum pass voltage versus input voltage,
9.188
resistance versus input voltage, 9.187
Adjacent channel leakage ratio, 2.57-58, 2.98
Adjacent channel power ratio, 2.57-58, 2.98
Adler, Joseph V., 6.98
ADM1023:
data sheet, 8.26
microprocessor temperature monitor, 8.19-22
block diagram, 8.21
input conditioninc circuits, 8.20
key specifications, 8.22
on-chip temperature sensor, 8.21
ADM3311E RS-232 Port Transceiver, data sheet,
9.126
ADP33xx-series, LDO architecture, diagram, 9.70
ADP330x family:
anyCAP topology, 7.40-41, 7.43
merged amplifier-reference design, 7.40-41
ADP333x family:
anyCAP topology, 7.40
merged amplifier-reference design, 7.40-41
ADP3300:
basic 50-mA LDO regulator circuit, 7.46
evaluation board, capacitor size, 7.48
ADP3310:
anyCAP LDO regulator controller,
current limiting, 7.57
Index 9
ANALOG-DIGITAL CONVERSION
features, 7.52
functional diagram, 7.52-53
LDO linear regulator controller, 9.79-80
ADP3310-3.3, fixed-voltage LDO controller,
9.77-78
ADP3310-5, PMOS FET LDO regulator controller,
circuit, 7.53
ADP3331, LDO, adjustable, 9.73
ADP3605, voltage inverter, 9.76
ADP3607:
voltage doubler, 9.76
functional diagram, 9.76
ADP3607-5, charge-pump, application circuit, 9.77
ADR01/ADR02/ADR03, data sheet, 6.77
ADR39x:
bandgap reference specification, 7.10
connection diagram, 7.10
ADR290-ADR293 series:
circuit, 7.12
specifications, 7.13
ADR430-ADR439 series, specifications, 7.13
ADR510, shunt reference, 7.5
ADR512, shunt reference, 7.5
ADSP-2106L, SHARC DSP, 9.170
ADSP-2189, 75-MHz DSP, 6.60-61
ADSP-2189M:
data sheet, 6.67
DSP, 6.55-56
ADSP-21160, SHARC with internal PLL, 9.43
ADT1-1WT, Mini-Circuits RF transformer, 6.26-27
ADT4-1WT, Mini-Circuits RF transformer, 6.24-25
ADT7301:
13-bit digital temperature sensor, 8.17-19
circuit, 8.18
key specifications, 8.18
data sheet, 8.26
ADu7xxx-series, microconverter, based on ARM7
processor, 8.187-190
ADuC-series, MicroConverters, 1.65-66
ADuC70xx-series, development system, 8.189
ADuC702x-series, ARM7-based MicroConverters,
8.188
ADuC812 MicroConverter, precision analog
microcontroller, 1.63
ADuC814, reduced pin-count low cost SAR
MicroConverter, diagram, 8.179
ADuC834, MicroConverter, in bridge transducer,
8.184-185
ADuM1100A:
digital isolator, 9.112-114
characteristics, 9.113
ADuM1100B:
digital isolator, 9.112-114
characteristics, 9.113
ADV453, video RAM-DAC, 1.50
ADV471, video RAM-DAC, 1.50
ADV476, video RAM-DAC, 1.50
ADV478, video RAM-DAC, 1.50
ADV7125:
Index 10
data sheet, 8.105
triple 8-bit 330-MSPS DAC, 8.88-89
functional diagram, 8.89
ADV7160/ADV7162:
220-MSPS video RAM-DAC, diagram, 8.90
data sheet, 8.105
ADV7183A:
10-bit video decoder, 8.82-83
block diagram, 8.83
data sheet, 8.104
ADV7310:
12-bit video encoder, 8.83-84
block diagram, 8.84
data sheet, 8.104
Advanced digital post processing, 8.151
Advanced filter bank, 8.146, 8.151-155, 8.152
block diagram, 8.152
design, 8.152-155
digital post-processing, 8.151-155
Advanced Filter Bank technical description, 8.157
Advanced Micro Devices, 1.25, 1.28, 1.33, 1.40,
1.45, 1.52
Advanced Mobile Phone Service, 8.108
AFE, 1.66
Agilent Labs, 8.146
Agilent press release, 8.157
Aging, resistor, 9.14
Air-gap discharge, ESD testing, 9.121
Akazawa, Yukio, 2.90, 3.105
Alfke, P., 9.197
Aliasing, 2.26, 2.98
in direct digital synthesis, 8.163-165
implications;, 2.27
in time domain, 2.28
All-0s, all bits off, 2.105
All-1s, all bits on, 2.104
All bits off, 2.105
All bits on, 2.104-105
All-parallel ADC, 3-bit converter, 3.46
Aluminum electrolytic capacitor, 9.8
AM685, 1.40
ECL latched comparator, 3.43-44
IC comparator, 1.41
AM685/687, 3.49-50
AM687, 1.40
dual ECL comparator, 1.45
high-speed comparator, 3.63
IC comparator, 1.41
AM6688:
4-bit 100-MSPS flash ADC, 1.40, 1.45, 1.52
4-bit 100-MSPS flash converter, Advanced
Micro Devices Inc., 3.49
Ammann, Stephan K., 3.108
Amplifier:
differential,
fully integrated driver, 6.31-34
voltage levels, 6.32
feedback, patent, 1.14
intercept points, definition, 2.54
INDEX
output stages, 6.8-10
performance, 6.3-15
rail-rail input stages, 6.5-8
Amplifier output:
EMI/RFI, 9.162-163
voltage phase-reversal, 9.101-102
AMPS wideband digital receiver, 8.117
noise, 8.120
sensitivity, 8.119
spurious requirements, 8.118
Analog bandwidth, 2.46, 2.98
ADC, 2.50
data converter, 6.3
using FFTs, 5.75
Analog computing circuitry, 2.2
Analog connector, high-end receiver, 8.81
Analog Devices, 1.33
Analog Devices, Inc., founding, 1.24
Analog Dialogue, 1.47
Analog Dialogue magazine, 1.33-34
Analog-Digital Conversion Handbook, 1.34
Analog-Digital Conversion Notes, 1.34
Analog Front End, 1.66
Analog-front-end integrated devices, 8.99
Analog front ends, 1.55
Analog full scale, 2.14
Analog ground, in mixed-signal IC, 9.35
Analog ground plane, PCB, 9.37
Analog multiplexer, diagram, 8.28-31
Analog power supply, systems, 9.65-91
Analog switch:
application, 7.73-78
dummy switch in feedback, 7.76
dynamic performance, 7.74
minimizing on resistance, 7.75-77
and multiplexer, 7.61-89
unity gain inverter, 7.74
Analog-to-time conversion, using PTM, 1.8
Analog variable, 2.2
Analogic, 1.23
Analogic Corporation, 1.33
Analogic, Inc., 4.2
Anderson, Robin N., 3.108
Andreas, D., 3.137
Andrews, James R., 5.25
Anti-ballistic missile system, 1.22-23
Anti-imaging filter, 8.163
digital audio, 8.64
Antialiasing filter, 2.29, 3.115
design and requirements, 2.30
dynamic range, 2.30
elliptic, TTE Inc., 2.31
position, op amp noise, 6.38
transition band, 2.30
undersampling, 2.33-34
anyCAP:
design features, 7.40-42
functional diagram, basic LDO regulator,
7.45-46
LDO regulator,
functional diagram, 7.45
thermal considerations, 7.46-51
LDO series devices, 7.43-44
low current, 7.44
"paddle-under-lead" packaging, 7.50
thermal coastline packaging, 7.49
thermal performance, 7.48
LDO topology, benefits, 7.43
low dropout regulator family, 7.39-51
pole-splitting topology, 7.42-43
pole splitting topology, 7.42-43
anyCAP LDO regulators, 9.70, 9.72
Aperture delay, 2.69
sample-to-sample variation, 2.70
SHA, 7.96-97
Aperture delay time, 2.68-72, 2.98
ADC, 5.73
measurement, using locked-histogram test, 5.73
SHA, 7.96-97
Aperture jitter, 2.68-72, 2.99, 6.83, 9.39
ADC, locked-histogram test method, 5.70-72
calculation, using locked-histogram test, 5.72
degradation in SNR, 5.74
effects, 2.70
RMS noise, 5.72
sample-to-sample variation, 2.70
SHA, 7.97
test setup, 5.74
using FFTs, 5.73-75
Aperture time, 2.68-72, 2.98
SHA, 7.95
Aperture time jitter, 1.49
Aperture uncertainty, 2.99
SHA, 7.97
ARM7, TDMI microcontroller, 8.141
ARM7TDMI, MCU core, 8.187
Armstrong, Major Edwin H., 8.108
Aspinall, D., 3.106, 7.111
Asynchronous digital subscriber line, 9.194
Asynchronous VFC, 3.91
Audio, digitall, 8.59-74
Audio codec, multichannel, 8.69-70
Audio DAC, multichannel, 8.69-70
Audio DAC family, chart, 8.67
Audio Engineering Society, standards, 8.60
Audio Precision, 5.25
Audio Precision, System Two, analyzer, 5.19
Automatic zero, 2.99
Avalanche diode, 7.3
AWG2020, Tektronix, 5.17
AWG2021, Tektronix, 5.17
B
B4001 and B4003 common-mode chokes, 9.178
Back-to-back testing, ADC, for large-signal
input, 5.48
Baird, Jon, 8.175
Baker, Bonnie, 9.63
Index 11
ANALOG-DIGITAL CONVERSION
Baker, R. Jacob, 2.117, 3.140, 5.89, 5.91
Baldwin, Eugene E., 5.25
Ball-grid array, 1.55
Ball-grid-array, packaging, 4.17
Ball grid array package, 9.200
Ballistic trajectory computation, 1.21
Ball, W.W. Rouse, 1.32, 3.105
Bandgap reference, 6.80, 7.4-10
basic, 7.4
characteristics, 7.14
Bandpass filter, 5.70-72, 6.92
Bandpass sampling, 2.31-32
Bandpass sigma-delta ADC, 3.132-133
Bandwidth:
aliasing, 2.98
analog input small-signal, 2.99
effective resolution, 2.99
full-linear, 2.99
full-power, 2.98, 2.99
full width, 2.98
sampling, rule, 2.32
Bardeen, J., 1.18, 4.9
Bardeen, John, 1.15, 4.3-4
Barnes, Erik, 8.105
Barney, K. Howard, 3.107
Barrow, Jeff, 9.63
Barr, P., 1.31, 5.87
Bartow, Doug, 8.105
Baseband antialiasing filter, 2.29-31
Baudon, J.M.E., 1.4
Baudot code, 1.3
BCD, coding scheme, 2.14
Beat frequency test:
ADC linearity, 5.46-47
test setup, 5.47
Beckman Instruments, 1.24
Bedingfield, Robert C., 1.23
Bell Laboratories, 1.14-16, 1.22-23, 4.3-4
Bell Labs, 7.91
Gray code, 2.6
nonlinear DAC, 3.26
Bell µ-255 standard, 3.26
Bell System, 1.3
Bell Telephone Laboratories, 1.10-11, 1.17, 8.59
Bell Telephone Labs, 3.109
Bell Telephone system, 4.1
Bell, Alexander Graham, 1.3, 1.17
Bell, Barry A., 5.25
Benjamin, O.J., 3.137
Bennett, W.R., 1.18, 2.37, 2.90
BER, 2.76-80, 3.45
ADC, 2.76-80
bit error rate, 2.76-80, 3.45, 5.83
tests, 5.83-86
high-frequency test, analog input, 5.84-85
low-frequency test, analog signal, 5.84
PC-based test, test setup, 5.86
tests, 5.83-86
and time between errors, 2.80
Index 12
Best straight line method, integral linearity
error measurement, 2.16
Best, R.E., 6.98, 8.175
Beyschlag Resistor Products, 9.24
Bias current, 2.99
BiCMOS, 1.49
Bin width, in FFT, 5.54
Binary code:
shadow mask, 1.12
unipolar, 2.4
Binary-coded decimal code, 2.11-12
table, 2.12
Binary-coded shadow mask, 3.47
Binary number, 2.3
Binary ripple ADC, 3.81
Binary-to-Gray code, conversion, 2.8
Binary transfer function, 3.78
Binary-weighted DAC, 3.9-12
Binary-weighted voltage-mode DAC, 3.9
Bipolar code:
4-bit converter, table, 2.9
relationships, table, 2.11
Bipolar converter, 2.14-15
Bipolar mode, 2.100
Bipolar offset, 2.100, 2.110
Bipolar processes, 4.11
Bipolar zero error, DAC, 5.2-4
Bird's nest breadboard, 9.201
Bit error rate, see BER
Bit-per-stage ADC, 3.88
BJT RFI rectification, 9.157-158
sensitivity, 9.159
Black, Harold S., 1.14, 1.18, 4.1, 4.9
Black, H.S., 1.11, 1.18, 2.90, 4.9
Blackman, window function, 5.57-58
Black, W.C., Jr., 8.157
Blair, Jerome, 5.89
Blanking, 1.53
Blattner, Rob, 7.60
Bleaney, B., 9.24, 9.63
Bleaney, B.I., 9.24, 9.63
Block conversion, 8.115
Blood, William R., Jr., 9.179
Bloomingdale, Cindy, 9.179
Bode plot, 7.67
Bogatin, Eric, 9.178, 9.179
Bondzeit, Frederick, 3.108
Bootstrapping, 7.103
Bordeax, Ethan, 9.181
Boser, B., 3.137
Bowers, G.G., 1.31
Boyce, David E., 5.89
BPF, bandpass filter, 3.132
Brahm, C.B., 3.111, 3.136
Brannon, Brad, 2.90, 6.98, 8.156, 8.157
Brattain, Walter, 1.15, 4.3-4
Brattain, W.H., 1.18, 4.9
Breadboarding, 9.199-213
and prototyping, 9.199-213
INDEX
Bridge, ratiometric, 8.9
Bridge output, 2.2
Broadband aperture jitter, 6.83
Brokaw cell, 7.5-6
bandgap reference, 7.33-34
Brokaw, A. Paul, 1.47, 4.19
Brokaw, Adrian Paul, 1.47, 3.36
Brokaw, Paul, 1.35, 1.40, 1.47, 3.18, 4.12, 7.26,
7.60, 9.63, 9.91, 9.179
Bruck, Donald B., 2.116, 3.139, 5.87, 5.90
Bryant, James, 2.1, 2.37, 2.93, 3.1, 3.39, 3.108,
3.109, 4.11, 4.19, 7.1, 9.1, 9.25, 9.30, 9.63, 9.93,
9.125, 9.141, 9.178, 9.199
Bryne, Mike, 9.126
BTL, standards, 9.184
Buchanan, James E., 9.23
Bucklen, Willard K., 3.105, 8.104
Buckley, Kevin, 8.105
Buffer, ADC digital output, 9.37
Buffer amplifier, 3.18-19
Buffer latch, 1.35
Buffering:
AC analog outputs, 6.69-77
ADC reference, 3.40
BiCMOS ADC, 6.25-26
complementary bipolar ADC, 6.25-26
DAC analog output, 6.69-77
internal, 6.1
Bulk metal resistor, 9.16
Buried Zener, 6.80, 7.11, 7.14, 7.16, 7.19
Burkhardt, Andrew, 9.178
Burr Brown, 1.23, 1.33
Burst mode, 6.49-50
Bus, 2.100
Bus switch:
advantages, 9.187
hot swap and hot plug applications, 9.193-194
low voltage, 9.190
NMOS FET, for interfacing, 9.186-190
Buss wire, 9.31
Busy, ADC status, 3.41
Butterworth filter, 2.30
noise bandwidth, 2.62
two-pole, SNR, 2.87
Buxton, Joe, 9.93, 9.125, 9.178
Bypass/decoupling, local high frequency, 9.89-90
Byrne, Mike, 9.30
Byte, 2.100, 2.112
low, 2.100
C
Cable:
electrically long, 9.151
electrically short, 9.151
ground loops, in shielded twisted pair, 9.152
improper use of shielding, 9.151
mutual inductance, 9.19
shielded,
hybrid grounding with passive sensor, 9.153
impedance-balanced drive, 9.154
Cable driving, 9.1
Cables and shields, 9.151-155
Cage jack, 9.31, 9.205
Calibration process, 4.8
Candy, J.C., 2.116, 3.37, 3.112, 3.136, 3.137,
3.139, 5.90
Capacitance, 4.15
parallel plates, diagram, 9.58
Capacitance-coupled noise, reduction, 9.144-145
Capacitive coupling:
EMI path, 9.142
equivalent circuit, 9.59
Capacitive noise, 9.59, 9.59-60
Capacitor, 9.2-8
ceramic, 9.82, 9.84
comparisons, 9.8
decoupling, 9.36, 9.41, 9.43
dielectric absorption, 7.101, 9.3-4
circuit diagram, 9.3
dissipation factor, 9.5-6
electrolytic, 9.7, 9.82, 9.83
equivalent circuit, 9.84
failure mechanisms, 9.7
film, 9.82, 9.83
general purpose aluminum, 9.83
leakage, 9.5
materials, 9.2
noise reduction, 9.82-85
organic semiconductor, 9.83
parasitic waveforms, 9.84
parasitics, 9.2-3, 9.5-6
passive component, 9.1
polarized, 9.7
power supply noise reduction and filtering,
9.82-85
series impedance, 9.5
stacked-film, 9.83
switching, 9.83
tantalum, 9.83
temperature, 9.6
tolerance, 9.6
types, 9.2, 9.4, 9.82
Carbon composition resistor, 9.9, 9.16
Carbrey, R.L., 3.37
Card entry filter, 9.87-88
circuit diagram, 9.87
power supply noise reduction and filtering,
9.87-88
ringing, 9.87
Carrier, and harmonic distortion, 2.48
Cascaded network, two-stage, diagram, 2.67
Cattermole, K.W., 1.2, 1.17, 2.22, 2.90, 2.116,
3.139, 5.90
CAV-1040, 10-bit 40-MSPS sampling ADC,
1.53-54
CAV-1220, 12-bit 20-MSPS sampling ADC,
1.53-54
Caveney, R.D., 3.106
Index 13
ANALOG-DIGITAL CONVERSION
CB, 3.85
CB processes, 4.12
JFET used, 4.12
CCD:
kT/C noise, 8.97
output stage and waveforms, 8.96
thermal noise, calculation, 8.97
CCD array, linear and area, chart, 8.95
CCD image processor, 1.55
CCD imaging electronics, 8.94-99
CDMA, spread-spectrum system, 8.112
CDMA system, signals, chart, 8.123
Çeçen, Kâzim, 1.17
Cecil, Jim, 4.13
Cell phone, handsets, 8.136-139
Cellular radio system, 2.40
Cellular telephone:
ADC and DAC, handsets, 8.139-145
handsets, 8.136-139
ADCs and DACs, 8.139-140
receiver, direct conversion architecture,
8.143
Cellular telephone system, 8.108
Ceramic capacitor, 9.82
Chain code, 1.3
Changeover switch, 3.3
Channel protector, for dual-supply in-amp,
circuit, 9.107
Channel-to-channel isolation, 2.100, 2.102
Channelizer, 8.115
Charge-balance VFC, 3.91
diagram, 3.93
Charge-coupled device, 8.94-99
Charge coupling, 7.71
Charge injection, 2.100
reducing, 7.104
Charge injection model, 7.69
Charge-pump circuit, 9.74
Charge-pump voltage converter, 9.74-75
advantages, 9.74-75
characteristics, 9.75
regulated output, 9.75-77
Charge run-down ADC, 3.89
Charge transfer, 2.100, 2.111
Charged Device Model, ESD model, 9.121
Charpentier, A., 3.137
Chasek, N.E., 3.82, 3.106
Chesnut, Bill, 9.91
Chip area, voltage tolerance/compliance, 9.196
Chip enable, 6.57
Chip-on-Lead packaging, 7.49-50
Chip-scale package, 1.55
Chip-scale-packaging, 4.17
Chip Select, ADC edges, 3.42
Chopper-stabilized amplifier, 8.20
Chroma signal, 8.79, 8.82
Chrominance, 5.78
Circuit, effective input impedance, 6.32-33
Circuit inductance, ground plane, 9.49
Index 14
Clamping diode:
leakage, 9.95-96
reverse bias current, 9.95
Clamping diode leakage, 9.95-96
Clelland, Ian, 9.91
Clock distribution:
end-of-line termination, 9.174
source terminated transmission lines, 9.174
Clock generator, "hybrid", 6.94-95
Cloninger, Chris, 8.156
Closed-loop SHA, circuit, 7.103-104
CM choke, 9.146
CM overvoltage protection:
amplifier output voltage phase reversal,
9.101-102
CMOS channel protectors, 9.98-99
high CM voltage in-amp, 9.99-100
inverting op amp, 9.100-101
CMOS, 9.181
process, 4.13-15
standards, 9.184
CMOS ADC:
differential input, transformer coupling, 6.25
equivalent input circuit, 6.19-23
SHA, 6.19-20
single-ended drive circuit, 6.21-23
CMOS channel protector, 9.98
CMOS IC output driver, configuration, 9.183
CMOS logic, 1.41, 2.2
CMOS process, 3.11
CMOS processes, 4.13-15
CMOS switch, 3.4, 5.35
1-GHz, attributions, 7.78-79
absorptive, 7.79
adjacent, equivalent circuit, 7.65
basics, 7.62-64
charge injection, 7.69
charge injection effects, 7.70
complementary pair technology, 7.63
DC performance, factors, 7.66
diode protection, 7.87
dynamic performance,
charge injection, 7.69
off isolation, 7.68
transfer accuracy versus frequency, 7.67
error sources, 7.65-73
input protection, external Schottky diodes,
7.88
junction-isolation, cross-section, 7.86
latchup prevention, 7.87
MOSFET technology, 7.62-63
off isolation versus frequency, 7.68
on-resistance versus signal voltage, 7.64
overcurrent protection, 7.88
parasitic latch, equivalent circuit, 7.86
parasitic latchup, 7.85-89
reflective, 7.79
settling time, 7.72
single-pole, settling time, table, 7.73
INDEX
transfer function, Bode plot, 7.67
trench-isolation technique, 7.89
CMR, 2.101, 6.74
input transient currents, 6.24
Coaxial cable, 9.154
shielding, 9.155
Code:
binary, unipolar, 2.4
binary-coded decimal, 2.11-12
binary-to-Gray, conversion, 2.8
bipolar, 2.8-12
offset binary, 2.8-9
center, 2.4
complementary, 2.12
fractional binary, 2.3
Gray, 2.4, 2.6-8
Gray-to-binary, conversion, 2.8
integer binary, 2.3
meaning, 2.3
missing, 2.107
MSB, error, 2.7
ones complement, 2.8, 2.11
reflective-binary, 2.6
resolution,
flicker-free, 2.45
noise-free, 2.45
sign-magnitude, 2.8, 2.11
sparkle, ADC, 2.76-80
twos complement, 2.8, 2.9, 2.11
unipolar, 2.3-5
Code center, 5.28
data converter, 2.14
Code-center testing, misleading results, 5.29-30
Code density test:
ADC, 5.38-44
data display, 5.39-40
setup, 5.39
Code-division-multiple-access, see CDMA
Code resolution:
flicker-free, 2.109
noise-free, 2.106, 2.109
Code transition noise, 2.100
DNL, 2.20
Code width, 2.100
Codec, 1.55, 5.27, 5.78, 8.59, 8.61, 8.82
voiceband, 8.65
Coder-decoder, 1.55, 5.27
Coding, quantizing, 2.1-22
Coherent sampling, FFT output signal and
harmonics, 5.63
Cold junction compensation, thermocouple, 8.14
Collins, Niamh, 8.175
Color difference, 8.79
Colton, Evan T., 1.32, 3.106
Comfort noise insertion, 8.138
Common-impedance, EMI path, 9.142
Common-impedance noise:
reducing, 9.143-144
reduction, 9.143-144
solutions, 9.144
Common-mode choke, 9.162
Common-mode error, 2.101
Common-mode overvoltage protection:
CMOS channel protectors, 9.98-99
high CM voltage in-amp, 9.99-100
Common-mode range, 2.101
Common-mode rejection, see CMR
Common-mode voltage, 2.101
Compact PCI Hot Swap Specification R1.0, 9.197
Companding, 3.26
Comparator:
1-bit ADC, 3.42-45
in flash ADC, 3.46
latched, 2.76
metastability, 3.50
metastable output states, error codes, 3.51
metastable state errors, diagram, 3.45
µA711/712, 3.49
in parallel ADC, 3.46
structure, 3.42
diagram, 3.43
Comparator ADC, 1-bit, 3.42-45
Complementary bipolar, see CB
Complementary bipolar processes, 4.12
Complementary code, 2.12
Compliance voltage, 6.71
Compliance-voltage range, 2.101
Complimentary metal oxide semiconductor,
see CMOS
Component analog video standard, 8.79-80
Composite video signal, 8.79
Composite video testing, test setup, 5.78
Compound monolithic, 4.7-8
Computer Labs, 1.23, 1.33
Computer Labs, Inc., 1.24, 1.41, 1.43, 1.44,
4.4-5
Conduction, EMI path, 9.142
Conductive wrist strap, for ESD protection, 9.120
Conductor:
ground plane, skin effect, 9.47
Ohm's law, 9.27
resistance, 9.26-27
skin depth, 9.47
Conductor resistance, in PCB, 9.26-27
Connelly, J.A., 9.63, 9.125
Contact discharge, ESD testing, 9.121
Contact-image sensor, 8.94-99
waveforms, 8.98
Continuous-aperiodic signal, in FFT, 5.52
Continuous-periodic signal, in FFT, 5.52
Continuously available output, ADC, 3.91
Continuously converting, temperature sensor
output mode, 8.15-16
Conversion complete, 2.101, 2.102
Conversion rate, 2.101
Conversion relationship, meaning, 2.3
Conversion time, 2.101, 2.112
Convert command, for ADC, 8.29
Index 15
ANALOG-DIGITAL CONVERSION
Convert-start command, ADC, 3.41
Converter:
optical, 3.98-99
sub-ranging, 2.104
Convolutional coding, 8.137
Conway, Paul, 8.191
Cooley, J.W., 5.89
Copper, resistance, 9.47
Copper conductor, resistance calculation, 9.26
Correlated double sampling, 8.97-98
Cost, 4.23
Counting ADC, 3.88
Counting and integrating ADC architectures,
3.87-113
Counting DAC, monotonic, 3.29
Counting pulse-width modulated DAC, 3.28-29
Counts, Lew, 9.23, 9.125, 9.178
Coupling, within signal cabling, 9.19
Coxeter, H.S.M., 1.32, 3.105
Craven, Bob, 1.35
Craven, Robert B., 1.47
Critical components, assembly, 9.7
Crook, David, 6.98, 8.175
Crosspoint switch:
digital, 7.83-84
video, 7.82-83
Crosstalk, 2.101-102, 7.71-72, 8.28
adjacent switches, equivalent circuit, 7.72
digital, 2.102
noise interference, 9.144
Crystal oscillator, low phase jitter, 9.39
Crystal Oscillators: MF Electronics, 9.63
Crystal Oscillators: Wenzel Associates, Inc.,
9.64
Crystal Semiconductor, 1.51
CSZ5316, monolithic sigma-delta ADC, 1.51
Current limiting, 7.30
Current-mode binary-weighted DAC, 3.10-11
Current output thermometer DAC, 3.7
Current-steering multivibrator VFC, 3.91
Current-steering VFC, diagram, 3.92
Curtin, Mike, 6.98, 8.175
Cushing, Richard, 8.175
Cutler, C.C., 3.109, 3.111, 3.136
Cyclic serial DAC, 3.29-31
D
DAC:
1-bit changeover switch, 3.4
3-bit binary-decoded, linearity error,
superposition, 5.9
3-bit capacitor, 3.55-56
3-bit nonideal,
DNL and INL, superposition, 5.7
transfer function, superposition, 5.6
4-bit, DNL and INL, superposition, 5.7
4-bit binary-decoded, superposition, bit
tests, 5.8
4-bit binary-weighted, R-2R ladder network,
Index 16
diagram, 3.16
4-bit cyclic serial, diagram, 3.30
5-bit binary-weighted, diagram, 3.9
5-bit counting,
developed by Reeves, 1.10
diagram, 3.29
6-bit binary-weighted, diagram, 3.10
6-bit nonlinear segmented, characteristics,
3.27
7-bit segmented, test codes, 5.12
8-bit, 8-kSPS data converter, 3.26
12-bit, sampling clock to output ratio, SFDR,
8.166
12-bit current-output, with cascaded binary
quad switches, diagram, 3.17
12-bit monolithic, with quad switch, problems,
3.18
architecture, 3.1-38
low-distortion, 3.31-33
monotonic, 3.4
audio, high performance, 8.66-69
basic structures, 3.3-4
Kelvin divider, 3.4-6
binary-weighted, 3.9-12
currents switched to load, 3.14-15
electro-mechanical, 3.9
voltage-mode, 3.9
bipolar process IC, 1970s, 1.34-36
bipolar zero error, 5.2-4
buffer, selection criteria, 6.3
buffered reference input terminal, 3.2
buffered reference output terminal, 3.2
buffering analog output, 6.69-77
capacitive binary-weighted, in successive
approximation ADC, 3.12
capacitive coupling, 3.34
CMOS IC, 1970s, 1.36-38
communications, 5.13
compound monolithic, 1.35
counting,
monotonic, 3.29
pulse-width modulated, 3.28-29
current-mode, 3.12
current-mode binary-weighted, 3.10-11
current-mode R-2R ladder network, 3.14
current output, general model, 6.70
cyclic serial, 3.29-31
DDS, distortion, 2.85
deglitching, 7.93
demultiplexed, data distribution, 8.41
differential nonlinearity, 5.2, 5.5
details, 2.18
digital input interface, 6.61-66
digital interface, 6.47-67
digital output interface, 6.61-66
distortion,
measurement, 5.17-18, 5.17-24
test setup, 5.18
DNL, measurement, 2.17
INDEX
DNL and INL,
no superposition, 5.10-13
via superposition, 5.6-10
double-buffered, advantages, 3.33-34, 6.61-62
dynamic performance, 81-89, 2.81-91, 5.13-25
end-point errors, 5.2-5
even harmonics, 5.23
four-quadrant, 3.24
full-scale settling time, measurement, 5.14
fully decoded, 3.6-9
no superposition, 5.10
gain error, 5.1, 5.2-4
glitch, 2.102
glitch impulse area, 2.82-83, 5.15
oscilloscope, 5.15-17
grounding, 9.30
high-speed,
alternative loading, 3.35
buffering using differential amplifier,
6.75
clock rate, 3.34
high speed,
SFDR performance trends, 4.16
update rate trends, 4.16
high speed communication, CMOS process, 4.15
history, hydraulic, 1.1
hybrid,
1970s, list, 1.43
1980s, 1.53-54
1990s, 1.64
hybrid and modular,
1980s, 53-54
1990s, 1.64
high performance, 1980s, list, 1.53
hydraulic, 1.1
ideal bipolar, transfer function, 2.10
input and output, definition, 2.1
integral nonlinearity, 5.1, 5.2, 5.5
intentionally nonlinear, 3.25-26
interpolating, oversampling, 2.87-89
inverted mode, 3.12
linearity error, 5.5
superposition, 5.9
logic, 3.33-35
low distortion, 5.2
mid-scale glitch, 2.83
mid-scale settling time, measurement, 5.14
modular,
1980s, 1.53-54
1990s, 1.64
monolithic,
1970s, summary, 1.38
1980s, 1.49-51
list, 1.50
1990s, 1.56-58
list, 1.58
bipolar process IC, 1.34-36
monotonicity, 5.1
INL and DNL, 5.10
multiple, data distribution, 8.41
multiplying, 3.2, 3.24-25
current-mode R-2R ladder network, 3.25
diagram, 3.25
non-monotonicity, 2.17
nonlinear, 3.25-26, 3.28
normal mode, 3.12
odd harmonics, 5.24
offset coding, bipolar zero error, 5.4-5
offset error, 5.1, 5.2-4
output, 3.3, 3.5
deglitching, 3.32
voltage or current, 3.3
output settling time, 2.81-82
output spectrum, sin(x)/x frequency rolloff,
2.87
oversampling interpolating, 3.23-24
diagram, 3.24
patents, 3.23
parallel input interface to DSP, 6.64-66
R-2R, 3.12-18
R-2R 3-bit binary, 3.26
R-2R ladder,
current mode, 3.14
equal current sources, 3.14-15
voltage mode, 3.13
R-2R thin-film resistor, 3.11
reference input terminal, buffered, 3.2
reference output terminal, buffered, 3.2
reference voltage, 3.2
references, 3.1-2
references and buffer, diagram, 3.3
relationship to ADC, 2.1
resolution, definition, 5.1
segmented, 3.18-23
all-codes testing, 5.11
current-output, structure, 3.21
voltage-output, 3.19
serial input interface, 6.62-64
to DSP, 6.62-64
settling time, 2.81-82, 2.112, 5.13-14, 5.16
oscilloscope, 5.15-17
SFDR, measurement, 2.85, 5.19
SFDR and SNR, 2.83-86
sigma-delta, 3.33, 3.133-134, 5.12
sign-magnitude, rare, 2.14-15
skew glitch, 3.20
SNR, measurement, analog spectrum analyzer,
2.86-87
static error,
basic test method, 5.1-2
measurement methods, 5.1
static linearity, testing, 5.12
static transfer functions, DC errors, 2.12-21
string, 3.4, 3.18
INL trimming, 3.6
no superposition, 5.10
resistors, 3.6
unbuffered, segmented, 3.19-20
Index 17
ANALOG-DIGITAL CONVERSION
superposition, 5.5-6
errors, 5.5
testing, 5.1-25
dynamic performance, 5.13-25
static, 5.1-13
thermometer, 3.4, 3.6-9
two-quadrant, 3.24
unipolar, transfer function;, 2.5
vacuum tube, binary, 3.9
very high speed, 3.20
voiceband and audio, 5.12
voltage-mode, 3.12
voltage-mode binary-weighted resistor, 3.10
voltage-output thermometer, 3.4
DAC-12QZ:
12-bit DAC, 1.46
12-bit modular DAC, 4.8
DAC80, 12-bit DAC, 1.41-43
DAC1138, 18-bit DAC, 1.46
DAC08:
8-bit 80-ns DAC, 1.38
8-bit 85-ns IC DAC, diagram, 1.34
IC DAC, 1.41
Daigle, Paul, 8.26
Daisy chain, temperature sensor output mode, 8.15
Daisy-chaining, 6.62
Dammann, C.L., 3.37
Damping resistors, high-speed DSP
interconnections, 9.172
Dark current, 8.95
Dark signal, 8.95
Darlington connection, 9.68, 9.70
Darlington NPN, pass device, 7.31-33
Data acquisition system:
on a chip, 8.34
on chip, 8.33-36
configurations, 8.27-28
filtering, 8.31-33
diagram, 8.31
multichannel, 8.27-48
design, 8.27
multiplexing, 8.28-31
PGA and SAR ADC, diagram, 8.29
timing diagram, 8.31
Data converter:
8-bit 10-MSPS, 1.23
2000s, list, 1.66
absolute maximum ratings, 2.93
AC errors, 2.37-90
ADC transient response, 2.73-75
analog bandwidth, 2.50
analog full scale, 2.14
aperture time, delay, and jitter, 2.68-72
applications, 8.1-192
architectures, 1.27-30, 3.1-140
feedback subtraction, 1.27
bipolar processes, 4.11
code centers, 2.14
coding schemes, 2.14
Index 18
commercial,
1950s, 1.21-22
history, 1960s, 1.22-26
data sheet importance, 2.93, 2.95
distortion, 2.47-48
DNL error, 2.17
dynamic performance, 2.46-80
quantifying, table, 2.46
dynamic performance specifications, 6.3
early processes, 4.1-10
ENOB, 2.48-50
evaluation board, 9.209-212
gain error, 2.15
general specifications, 2.93-96
high resolution, low noise references, 7.24-25
high speed, CMOS process, 4.14
history, 1.1-66, 5.27-28
1950s, 1.21-22
1950s and 1960s, 1.21-32
1950s to 1960s, 1.21-32
1970s, 1.33-47, 1.33-49
1980s, 1.49-54
1990s, 1.55-64
2000s, 1.65-66
early, 1.1-19
telegraph to telephone, 1.3-5
hybrid, 1.33, 4.3-8
1970s, 1.41-44
hybrid and modular components, 1970s, list,
1.41
ideal N-bit, theoretical quantization
noise, 2.37-43
ideal transfer characteristics, 2.13-14
integral and differential nonlinearity
distortion, 2.46-47
intercept points, 2.54-56
interfacing, 6.1-98
intermodular distortion, 2.53
internal control registers, initialization,
6.48
linearity errors, 2.15
logic, 2.95-96
logic interface issues, 2.94-95
low power, sleep, and standby modes, 6.48-49
measurement and control, 2.13
modern, trends, 6.1-2
modern processes, 4.11-19
modular, 1.33, 4.3-8, 4.6
1970s, 1.44-46
milestones, 1.46
monolithic, 1.33
1970s, 1.34-40
monolithic DAC, 1980s, 1.49-51
multi-tone SFDR, 2.56-57
noise filter and noise figure, 2.61-68
NPR, 2.58-60
offset error, 2.15
overall considerations, 2.93-94
packages, examples, 4.18
INDEX
PCM, 1.5-6
phase noise, 2.71
popular reference options, 6.80
power-on initialization, 6.47-48
process technology, 4.1-30
processes, summary, 4.15
processes and architectures, 4.15-18
summary, 4.18
reconstruction systems, 2.13
sampling frequency,
burst mode, 6.49-50
minimum, 6.49-50
single-shot mode, 6.49-50
sampling systems, 2.13
SFDR, 2.51-53
SINAD, 2.48-50
SNR, 2.48-50
solid state, 4.3-8
specifications, 2.93-96
definitions, 2.97-117
specifications and testing, history, 5.27-28
structure, 2.93
supply current, 2.94
support circuit, 7.1-112
testing, 5.1-91
THD, 2.47-48
THD+N, 2.47-48
theoretical quantization noise, 2.37-45
thermal considerations, 9.134-138
transfer functions, 2.17
vacuum tube, 4.1-3
voltage, 2.93
voltage reference, 7.1-26
voltage reference considerations, 6.81
voltage references, 6.79-81
wideband CDMA, 2.57-58
worst harmonic, 2.47-48
Data distribution system, 8.41-45
with infinite SHA, 8.45-47
multiple programmable voltage sources, 8.41
Data ready, 2.101, 2.102, 6.57
ADC status, 3.41
Data valid, 6.57, 6.59
Datel, 1.33
DATRAC, 3.59-60
11-bit 50-kSPS SAR ADC, picture, 3.60
11-bit 50-kSPS vacuum tube converter, 5.27
11-bit 50-kSPS vacuum tube SAR ADC, 4.2-3
Datrac converter:
11-bit 50-kSPS vacuum tube ADC, 1.22
from Epsco, 1.21
Dattorro, J., 3.137
DCS, digitally corrected subranging, 2.113
DDS, 1.57, 8.159-176
aliasing, 8.163-165
graph, 8.164
anti-imaging filter, 8.163
architecture, signal flow, 8.163
digital dither, 8.166
direct digital synthesis, 2.84
flexible, diagram, 8.161
frequency planning, 8.165-166
for integrated DAC, 4.22
low power 400-MSPS product family, table,
8.173
modern integrated systems, 8.166-174
schematic, 8.160
tuning equation, 8.161
DDS I/Q quadrature modulators, table, 8.174
DDS synthesizers, low-power, chart, 8.168
De Forest, Lee, 1.13, 1.18, 4.1, 4.9
De Jager, F., 3.136
Dead time, DAC, 2.81
Deadbug prototyping, 9.200-202
breadboard, 9.201
power busses, 9.202
short decoupling paths, 9.200
DEC PDP minicomputer, 5.27
Decimation, 3.111, 3.116
GSM channel, 8.112
Decimation filter, on ADC, 4.22
Decoder, digital video, 8.81-84
Decoupling, and grounding, diagram, 9.38
Decoupling capacitor, 9.36, 9.41, 9.43
Deglitcher, 2.102, 2.105
Deglitching, 3.31-32
Del Signore, B.P., 3.137
Delay constant, microstrip, 9.167
Deloraine, E.M., 3.109, 3.136
Delta modulation, 3.109
changes, 3.109
for quantization, 3.110
in sigma-delta ADC., 3.113
versus differential PCM, scheme, 3.110
Delta phase register, 8.160
Delta-sigma architecture, 3.112-113
Demler, Michael J., 2.116, 3.139, 5.88, 5.90
Demodulation, 8.137
analog, 2.32
Dempsey, Dennis, 3.20, 3.37
Demultiplexed data bus, 9.177
Demuxed CMOS output data, 6.58
Derating curves, 9.130
Derjavitch, B., 3.109, 3.136
Designing for EMC, 9.178
Dickinson, Arthur H., 3.107
Dielectric, PCB design, 9.165
Dielectric absorption, 7.100-101, 9.3-4
capacitor, 9.2
PCBs, 9.57
SHA applications, 9.4
surface guarding, 9.57
Dielectric hysteresis, 9.3
Differential analog input capacitance, 2.102
Differential analog input impedance, 2.102
Differential analog input resistance, 2.102
Differential analog input voltage range, 2.102
Differential circuit, 9.28
Index 19
ANALOG-DIGITAL CONVERSION
Differential current-to-differential voltage
conversion, 6.75
Differential gain, 2.102, 5.78-83
ADC, 5.78-83
digital measurement, 5.81
test signal, 5.80, 5.82
Differential input ADC driver, 6.23-29
Differential linearity, 2.107-108
error, 2.15
definition, 2.17
Differential nonlinearity, see DNL
Differential overvoltage, 9.104
Differential PCM, 3.109
versus delta modulation, scheme, 3.110
Differential phase, 2.102, 5.78-83
ADC, 5.78-83
digital measurement, 5.81
test signal, 5.80, 5.82
Differential single-ended conversion, 6.70-73
Differential to single-ended conversion, 6.70-73
Differential transformer coupling, 6.71
DigiPOT, 1.58, 8.56
Digit grounder, 3.57, 3.59
Digital audio, 8.59-74
48-kSPS sampling, 8.62
ADC and DAC, 8.63-65
trends, 8.63-65
anti-imaging filter, 8.64
CD, circuit diagrams, 8.64
key specifications, 8.61
PCM, 8.63
sampling rate and THD+N, 8.60-63
studio quality recording, 8.66
THD+N and sample rate, 8.62
Digital baseband, software radio, 8.109-110
Digital circuit:
cost efficiency, 4.23
standard voltage level, 9.181
Digital converter, Advanced Filter Bank
compensation, 8.154
Digital corrected subranging, 3.64
Digital crosspoint switch, 7.83-84
Digital crosstalk, 2.102
Digital Display Working Group, 8.105
Digital down converter, 8.115
Digital error correction, 3.64
Digital filter, 3.111, 3.116, 3.125-126
GSM channel, 8.113
for sigma-delta ADC, 3.125-126
Digital ground, in mixed-signal IC, 9.35
Digital ground plane, PCB, 9.37
Digital IC, fabrication process geometry, 4.23
Digital interface, ADC and DAC, 6.47-67
Digital isolation, 9.111-116
LED/photodiode optocoupler, circuit, 9.113
LED/phototransistor optocoupler, circuit,
9.112
Digital isolator, overvoltage protection,
9.111-116
Index 20
Digital phase wheel, 8.162
Digital post-processing:
advanced, 8.151
architecture, 8.151
Digital potentiometer, 1.58, 8.49-58
AC considerations, 8.55
advantages and applications, 8.57
applications, 8.55-57
circuit applications, 8.56
CMOS, characteristics, 8.51
modern, small packaging, 8.50-51
nonvolatile memory, 8.51-53
one-time-programmable, 8.53-54
from string DAC, 3.5
tiny packaging, 8.50-51
Digital receiver:
AMPS wideband, 8.117
multicarrier, chart, 8.131
narrowband, 8.110-114
narrowband IF-sampling, 8.110-114
GSM/EDGE, 8.110-114
single carrier, chart, 8.131
software radio, 8.110
wideband, 8.114-126
wideband IF-sampling, 8.114-126
Digital synthesis, direct, 8.159-176
Digital temperature measurement, direct, 8.14-19
Digital video:
ADC and DAC, decoders and encoders, 8.81-84
basics, 8.75-77
black box, 8.78
decoders and encoders, 8.81-84
display electronics, 8.75-105
formats, 8.77-81
serial data interfaces, 8.81
signal generation, model, 8.79
standard broadcast television interlace
format, 8.75
Digital videodisc, 8.63
Digital videotape recorders, development, 8.78
Digital voltmeter, 2.15
Digitally corrected subranging ADC, 2.113
Digitizing, SHA function, 2.26
Diniz, George, 8.105
Diode:
protection network, circuit diagram, 9.97
unbuffered, 7.20
Diode reference circuit, 7.3
DIP package, prototyping, 9.206
DiPilato, Joe, 3.138, 8.157
Direct digital synthesis, 1.58, 2.84, 6.48,
8.159-176
aliasing, 8.163-165
frequency planning, 8.165-166
modern integrated systems, 8.166-174
see also DDS
Direct IF-to-digital conversion, 2.31-32
Discontinuous transmission, 8.137-138
Discrete Fourier transform, 5.51-53
INDEX
applications, 5.51
characteristics, 5.53
outputs, conversion, 5.53
sampled-periodic time domain signal, 5.52
Discrete time Fourier series, 5.51-52
Discrete time sampling, 2.24
Discriminator, 3.43
Displacement current, 9.143
Display electronics, 8.85-90
graphics resolution and pixel rates, table,
8.86
Dissipation factor, 9.5-6
Distortion measurement, 5.17
DAC, 5.17-24
Distortion products, location, 2.48
Dither, 2.42, 8.126-131
out-of-band, to improve SFDR, 8.127
used to randomize ADC transfer function, 8.127
Dither noise, 8.126
generation, 8.129
Dither sinewave, 5.81
Divider buffer, 3.18-19
DNL, 2.72, 3.32, 5.2
DAC, 5.2, 5.5
due to encoding process, 2.46-47
error, 2.17
randomized, 8.129
temperature coefficient, 2.114
DNR, digital audio, 8.60-61
Dobkin, Robert C., 7.60
Doeling, W., 9.23, 9.63
Doernberg, Joey, 5.88
Dominant pole, 7.37
Dooley, Daniel J., 2.116, 3.139
Dorey, Howard A., 3.108
Double-buffered DAC, advantages, 3.33-34
Double throw switch, 3.4
Doublet glitch, DAC, 2.82
Downconversion, 8.142
DPO, digital phosphor scope, 5.15
Drakhlis, Boris, 6.98
DRDY, data ready, 3.41
Drift, 2.102-103, 7.16, 7.18
Droop, 6.50
rate, 2.102-103
SHA, 7.99
Dropout voltage, 7.27-28, 7.31, 9.66
inverting mode pass device, 9.68
DSO, digital storage scope, 5.15
DSP:
grounding, internal PLL, 9.43-44
output rise and fall times, graph, 9.170
serial interface, 6.51
Dual-slope conversion, 2.111
Dual-slope converter, 2.103
Dual-slope integration, in ADC, 3.97
Dual slope/multi-slope ADC, 3.96-98
Dual supply op amp, differential DC coupled
output, 6.72
Duff, David, 2.90
Dummer, G.W.A., 9.24, 9.63
Duracell Inc., 9.197
Duracell MN1500 AA alkaline battery, discharge
characteristics, 9.182
DVD, sampling, 8.63
Dynamic range, digital audio, 8.60-61
Dynamic response, 2.104
Dynamic settling time transient:
from charge coupling, 7.71
during multiplexing, 7.71
Dynamic stability, 2.113
Dynamic testing:
ADC, 5.45-86
low-distortion sinewave inputs, 5.66-68
E
EIA RS-170, monochrome television standard, 8.76
Earnshaw, J.B., 3.104
Eccles-Jordan bistable multivibrator, 3.88
Eckbauer, F., 3.137
ECL, 1.41, 2.2, 9.175
emitter-coupled logic, 3.43
high-speed, invention, 1.24
standards, 9.184
Edge rates, 9.163
Edson, J.O., 1.11, 1.18, 1.31, 2.22, 3.84, 3.104,
3.106, 7.111
Edwards, D.B.G., 3.106, 7.111
EEMEM family, digital potentiometer, 8.52
Effective aperture delay time, 2.69, 2.98
measurement, and ADC input, 2.70
SHA, 7.96-97
Effective input noise, 2.103, 2.106
Effective number of bits, see ENOB
Effective resolution, 2.45, 2.103, 2.109, 8.8
Effective resolution bandwidth, see ERB
Effective series inductance, 9.5
Effective series resistance, 9.5
Efstathiou, Dimitrios, 8.156
EIA RS-343A standard, electronic display, 8.85
EIAJ ED-4701 Test Method C-111, 9.125
8051, 1.63
Electrolytic capacitor, 9.82
ceramic, 9.84
film, 9.83
general purpose aluminum, 9.83
impedance, graph, 9.85
organic semiconductor, 9.83
stacked-film, 9.83
switching, 9.83
tantalum, 9.83
Electromagnetic compatability, see EMC
Electromagnetic interference, see EMI
Electromagnetic radiation, EMI path, 9.142
Electromechanical Compatibility level, European
Community, 9.121
Electromechanical rotating commutator,
Index 21
ANALOG-DIGITAL CONVERSION
multiplexing, 1.4
Electron beam coder:
Bell Labs, 3.48
modes, 2.6
shadow masks, 2.7
Electron beam coding tube, 1.11-12
Electronic Concepts, Inc., 9.91
Electrostatic discharge, 2.94
see also ESD
Elliott, Michael, 3.107, 7.111
Elliott, Michael R., 3.107
Elliptic filter, TTE, 2.30
EMC:
described, 9.141
emissions, 9.141
EMI:
coupling paths, 9.142
noise sources, 9.142
EMI path:
high impedance ground connection, 9.143
summary, 9.143
EMI/RFI, 9.141-179
amplifier outputs, 9.162-163
common-mode choke, for in-amps, 9.162
considerations, 9.141-179
coupling paths, 9.142
damping resistors, fast logic edges, 9.171
flexible common-mode and differential-mode
filter, 9.161
general purpose common-mode/differential mode
filter, 9.161
mechanisms, 9.142, 9.142-179
noise coupling mechanisms, 9.143
noise filter, op amp circuit, diagram, 9.160
noise sources, 9.142
op amp and in-amp outputs, long cable driving,
9.163
and passive components, 9.146-147
rectification sensitivity, op amp and in-amp,
9.155-157
reducing system susceptibility, 9.147-148
shielding, review, 9.148-151
susceptibility, 9.141
system susceptibility reduction, 9.147-148
Emitter-coupled-logic, 2.2, 2.94
design, 6.96
Emitter-coupled logic, see ECL
Encode, sampling clock, 2.103
Encode command, 2.103, 2.112
ADC, 3.41
Encode pulsewidth/duty cycle, 2.103
Encoder, 2.24, 3.41
digital video, 8.81-84
nonsampling, input frequency limitations, 2.24
End-of-conversion, see EOC
End point method, integral linearity error
measurement, 2.16-17
Engelhardt, E., 3.137
ENIAC computer, invention, 1.21
Index 22
ENOB, 1.49, 1.55, 2.103, 5.28
of ADC, using sinewave curve fitting, 5.49-50
calculation using SINAD, 5.50
data converter, 6.3
degradation, in comparators, 3.50
effective number of bits, 2.46, 2.48-50,
2.103, 3.115
FPBW, 2.99
jitter, 6.84
and SINAD, 6.84
Envelope test:
ADC linearity, 5.46
lower input frequency, 5.47
test setup, 5.47
EOC, 2.101, 3.41
ADC status, 3.41
Epsco, 1.33
Epsco Engineering, 1.21, 4.2
Equivalent input referred noise, 2.43-44
Equivalent series inductance, capacitor, 9.2
Equivalent series resistance, capacitor, 9.2
ERB, 2.99, 5.75
Erisman, Brian, 9.91
Error:
gain, 2.97
linearity, 2.97
sources, 2.97
zero, 2.97
Error code, 1.52
Error corrected ADC, 3.61-78
Error correction, quantization levels, 3.64
Error voltage, 8.148
digital current in analog path, 9.32
Esaki diode, 3.48
ESD, 9.116
damage, 9.118
data sheet statement, 9.119
models and testing, 9.121-124
packaging and labeling, 9.118
prime sources, 9.116
protection and prevention, buyer and seller,
9.120
summary, 9.124
testing methods,
differences, 9.122-123
waveforms, 9.123
voltage sources, 9.117
ESD Association Draft Standard DS5.3, 9.125
ESD Association Standard S5.2, 9.125
ESD Prevention Manual, 9.125
ESD protection, 9.195
ESI, 9.5
capacitor, 9.2
ESL:
capacitor loss, 9.83
filter loss, 9.84
ESR, 9.5
capacitor, 9.2
Eubanks, John M., 1.23
INDEX
Euler's equation, 5.53
European Broadcast Union, standards, 8.60
Evaluation board, 9.206-212
data converter, 9.209-212
characteristics, 9.209
dedicated op amp, 9.207-209
general purpose op amp, older, 9.207
Expandor, 3.26
External components, 4.22
F
Fabrication process:
geometry,
and cost, 4.24
for digital IC, 4.23
Fagen, M.D., 1.17, 1.32
Failure, resistor, 9.14
Fair-Rite Linear Ferrites Catalog, Fair-Rite
Products, 9.91
Fair-Rite Products, 9.91
Fairchild, 1.24, 1.33
Fairchild Semiconductor, 1.15, 4.3-4, 4.11
Far-field interference, EMI path, 9.142
Faraday shield, 9.20, 9.58-61, 9.59-60, 9.144
floating, 9.60
impractical location, 9.60
operational model, 9.60
Farmer, M.B., 1.4
Fast Fourier transform, see FFT
FASTRON GmbH, 9.91
FASTStep mode, for AD7730, 3.130
Fault-protected multiplexer, 9.99
FDM, telephone, 1.8
FDMA, frequency division multiple access, 2.58
Feedback amplifier, patent, 1.14
Feedback coder, 1.25, 3.57
Feedback subtraction, 1.27-28, 3.56
Feedback subtraction ADC, 1.28
Feedback subtractor coder, 1.25, 3.57
Feedthrough, 2.103, 7.101
SHA, 2.103
Feedthrough error, 2.103
Felix, Micheal O., 5.89
Ferguson, P.F., Jr., 3.137, 3.138
Ferrite:
characteristics, 9.86
filter inductor, 9.86-87
power supply noise reduction and filtering,
9.86-87
Ferrite bead, 9.38, 9.42-44, 9.86, 9.89, 9.160,
9.164
FET RFI rectification, 9.158-159
Fetterman, Scott, 3.106
FFT, 5.54
accuracy, 5.65-66
ADC analog bandwidth, 5.75
ADC aperture jitter, 5.73-75
analysis, 2.23
basics, 5.51-59
to compute discrete Fourier transform, 5.54
dynamic ADC testing, 5.59-65
FPBW, 2.99
processing gain, 2.42
sinewaves, 5.56
single-tone sinewave testing, 2.42
spectral analysis, ADC, 5.50
test setup, 5.59-65
configuration and measurements, 5.59-65
diagram, 5.60
verifying accuracy, 5.65-66
Fiedler, Udo, 3.107
Film capacitor, 9.82
Filter:
advanced, 8.152
analog, oversampling, 2.88
anti-imaging, 3.23, 8.163
for digital audio, 8.64
antialiasing, 3.115, 8.32
baseband, 2.29-31
position, op amp noise, 6.38
in undersampling, 2.33-34
undersampling, 2.33-34
attenuation, 7.19
bandpass, 5.70-72, 6.92
Butterworth, 2.30
noise bandwidth, 2.62
two-pole, SNR, 2.87
bypass/decoupling, 9.89-90
card entry, 9.87-88
power supply noise reduction and filtering,
9.87-88
custom analog, firms, 2.31
damping, 9.85
data acquisition system, 8.31-33
differential, 6.72
digital, 3.125-126
implications, 3.125-126
sigma-delta ADC, 2.74
elliptic,
11-pole, characteristics, 2.31
TTE, 2.30
Gaussian active, buffering for audio DAC, 6.76
interpolation, 3.23
loss via ESR, 9.82-83
lowpass, audio DAC, 6.75-76
lowpass/bandpass, 2.23
noise, power supply, 9.81-90
notch, 2.59, 2.109
minimizing analyzer overdrive, 5.68
passive components, EMI reduction, 9.147
rail bypass/distribution, 9.88
power supply noise reduction and filtering,
9.88
single-pole, settling time, table, 8.32
type, EMI reduction, 9.147
Finite amplitude resolution, due to quantization,
2.24
Fisher, J., 3.137
Index 23
ANALOG-DIGITAL CONVERSION
Flach, Donald R., 5.88
Flash ADC, 1.40, 2.112, 3.46, 3.88
4-, 6-, 8-bit monolithic, 1.41
5-bit, diagram, 3.47
monolithic, 1980s, 1.52-53
Flash converter, 2.103-104, 3.48
3-bit all-parallel, diagram, 3.46
ADC, 3.46-53
comparator, 2.76
electronic, 1.11
interpolating, 3.52
output latches, 3.70
power dissipation, 3.51
Flash SADC, 3.64
Flat panel display, 8.90-94
analog and digital interfaces, 8.91
electronics, 8.90-94
Flat-pulse generator, 5.76-77
Fleming, Tarlton, 9.23
Flexibility, 4.23
Flicker-free code resolution, 2.45, 2.109
Floating shield, 9.60
Flutter, 5.29
Flyers, 3.45
ADC, 2.76
Flynn, George, 1.31
Folding ADC, 3.42, 3.78-87
Folding converter, 3.81
Folding stage, functional equivalent circuit,
3.81
Folding transfer function, 3.78, 3.84
using rectifier amplifiers, diagram, 3.84
Four-element-varying bridge configuration,
8.6
Four-quadrant, 2.104, 2.108
4000-series, CMOS logic, RCA, 1.24
Fourier analysis, 5.51-59
Fourier series, 5.51-52
Fourier transform, 5.51-52
FPBW, 2.50, 5.75
Fraschilla, J.L., 3.106
Freeman, J., 1.31, 5.87
Freeman, Wes, 9.93, 9.125
Frenzel, Louis E., 8.156
Frequency division multiple access, 2.58
Frequency division multiplexing, see FDM
Frequency synthesis, 8.159
Frequency-to-voltage conversion, see FVC
Friis equation, for noise figure, 2.67
FS-125, modular op amp, Computer Labs, 1.23
FSEA30, Rhode and Schwartz, 5.18
FSR, full-scale range, 2.104
Fu, Dennis, 3.108
Full-power bandwidth, see FPBW
Full-scale, 2.104
positive or negative, 2.104
Full-scale input power, ADC, 2.104
Full-scale range, 2.97, 2.104, 2.107
Fully decoded DAC, 3.6-9
Index 24
diagram, 3.7
Fundamental frequency, 2.50
FVC, 2.104
G
Gailus, Paul H., 3.138
Gain, 2.105
Gain error, 2.15, 2.97
DAC, 5.1, 5.2-4
measurement, 5.31
Gain nonlinearity, 2.110
Gain tempco, 2.114
Gaines, W.M., 1.31, 5.87
Gallium arsenide, data converter role, 4.17
Gallium arsenide process, 3.50
Gamma unit, 8.79
Ganesan, A., 3.137
Garcia, Adolfo, 9.125, 9.178, 9.213
Gardner, F.M., 6.98, 8.175
Gate-drain capacitance, 7.70
Gaussian active filter, buffering for audio DAC,
6.76
Gaussian-filtered minimum-shift keying, 8.145
Gaussian frequency distribution, 6.83
Gaussian noise, 2.38, 2.58, 2.109, 5.44, 8.8,
8.124
General Electric, 1.23
General Instrument Corp., 1.23
Gentile, Ken, 8.175
George A. Philbrick Researches, Inc., 1.34, 4.2, 4.9
Gerber file, 9.46, 9.204, 9.209
Gerke, Daryl, 9.178
Germanium transistor, invention, 1.14
Gilbert, Roswell W., 3.108
Giles, James N., 3.44, 3.104
Giles, Jim, 1.40
Glitch, 2.102, 2.105, 2.109
DAC, 2.102
net impulse area, calculation, 2.83
Glitch charge, 2.106
Glitch energy, 2.102, 2.106, 5.15
DAC, 2.82
Glitch impulse, 2.106
Glitch impulse area, 1.49, 2.102, 2.105-106
DAC, 2.82-83, 5.15
measurement, 5.15-17
net impulse area, calculation, 2.83
Gold, B., 5.89
Goldberg, A., 8.104
Goldberg, A.A., 8.77
Goldberg, Bar-Giora, 6.98
Goodall, W.M., 1.11, 1.18, 3.105
Goodenough, Frank, 7.60, 9.91
Goodman, D.J., 3.112, 3.136
Gorbatenko, G.G., 3.106
Gordon Engineering, 1.33
Gordon, Bernard M., 1.21, 1.22, 1.25, 1.28, 1.31,
1.32, 2.116, 3.36, 3.59, 3.105, 3.106, 3.107,
3.139, 4.2, 5.27, 5.87, 5.88, 5.90
INDEX
Gorman, Christopher, 3.20, 3.37
Gosser, Roy, 3.106, 4.12, 7.111
Goto, 3.104
Graham, M., 9.197
Grame, Jerald, 9.63
Grant, Doug, 8.139, 9.23
Graphics control system, signal generation, 8.87
Graphics display, RGB video levels, 8.89
Gratzek, Tom, 8.156
Gray bit, 3.81
Gray bit output, 3.81
Gray code, 1.3, 1.12-13, 2.4-8, 3.47-48, 3.51,
3.81, 3.99
ADC architecture, 3.42
in ADC architecture, 3.84
coding scheme, 2.14
decoding, errors, 3.52
latched, 3.51
LSB error, 1.13
Gray code MagAMP design, 3.85
Gray code shadow mask, 3.47
Gray-coded ADC, 3.78-87
Gray-to-binary code, conversion, 2.8, 3.51
Gray transfer function, 3.78
Gray, Elisha, 1.13, 2.6, 3.47
Gray, Frank, 1.13, 1.18, 2.6, 2.22, 3.47, 3.104
Gray, G.A., 2.90
Gray, J.R., 3.106, 7.111
Gregg, Christopher, 9.178
Grift, Rob E.J. van de, 3.107
Groshong, Richard, 8.156
Gross, George F., Jr., 3.106
Ground, 2.2
analog and digital,
separation, 9.34-35
diagram, 9.35
isolation techniques, 9.50-52
PCB, layers, 9.32-33
return current, 9.28
Ground current, amplifier degradation, 9.50
Ground isolation amplifier, 9.51
differential input, 9.51
Ground isolation techniques, 9.50-52
Ground loop, digital isolator, 9.111
Ground noise, 9.39
Ground plane, 9.30-32
breaks, 9.49-50
circuit inductance, 9.49
current flow, 9.49
in mixed-signal multicard system, 9.33-34
summary, 9.33
Grounded-input histogram, 2.44
for input-referred noise, 5.44
Grounding, 9.30-45
ADC digital output, 9.37-38
decoupling, 9.35-36
and decoupling, diagram, 9.38
double-sided versus multilayer PCBs, 9.32-33
ground plane multiple connections, 9.81
linear and switching regulators, 9.78-81
mixed-signal, 9.40-41
mixed signal system, 9.30-46
multicard mixed-signal systems, 9.33-34
multicard systems,
high digital currents, summary, 9.42-43
low digital currents, summary, 9.41-42
PCB, 9.25
sampling clock, 9.38-41
separating analog and digital, 9.34-35
signal routing, for LDO, diagrams, 9.80
single-card, for multicard system, 9.40-41
summary, 9.44-45
Grown-junction silicon transistor, 4.3
GSM-900MHz system:
sensitivity requirements, 8.121
spurious requirements, 8.120-121
GSM/DCS cellular telephone handset, functional
diagram, 8.140
GSM digital cellular telephone system, block
diagram, 8.137
GSM/EDGE, European multicarrier time-division
multiplexed-access system, 8.111-112
GTL, standards, 9.184
Guard rings, 7.99
Guard shield, in PCB, 7.100
Guarding:
basic principles, 9.54
inverting mode, diagram, 9.53, 9.56
MINIDIP layout, 9.55-56
non-inverting mode, diagram, 9.54, 9.56
PCB, 9.53
Gustavsson, M., 8.157
Gustavsson, Mikael, 2.117, 3.140, 5.91
H
Hageman, Steve, 9.91
Hamming, window function, 5.57-58
Hanning, window function, 5.57, 5.63-64
Hardware:
design,
cable driving, 9.1
overvoltage protection, 9.1
passive components, 9.1-24
receiving, 9.1
shielding, 9.1
Hardware design, 1-213
Harmonic distortion, 2.46-48, 5.17
2nd, 2.106
3rd, 2.106
data converter, 6.3
total, 2.106
plus noise, 2.106
Harmonic sampling, 2.31-32
Harmonic telegraph, 1.3
Harmonics, 2.48
Harris, Fredrick J., 5.89
Harrison, R.M., 3.106
Hartley, R.V.L., 1.17, 2.27, 2.35
Index 25
ANALOG-DIGITAL CONVERSION
Harvey, Barry, 5.25
HAS-1201, 12-bit 1-MSPS sampling ADC, 1.53
HAS-1202, 12-bit 2.2-µs SAR ADC, 1.43
HAS-1409, 14-bit 1.25-MSPS sampling ADC, 1.53
Hauser, Max, 3.109
Hauser, Max W., 3.136
HDG-series, 4-, 6-, 8-bit 5-ns video ECL DACs,
1.53
HDS-1240E, 12-bit 40-ns ECL DAC, 1.53
HDS-1250, 12-bit 35-ns DAC, 1.43
Heat sinking, 9.128, 9.129
Heinzer, Walt, 8.49, 8.58
Heise, B., 3.137
Hendrickson, Gary, 9.179
Hendriks, Paul, 3.138
Henning, H.H., 1.18, 1.31, 2.22, 3.84, 3.104,
3.106
Henning, H.O., 7.111
Henry, J.L., 3.137
Hensley, Mike, 3.107, 7.111
Herring, G.J., 1.31
Higgins, Richard J., 5.89
High K capacitor, 9.8
High megohm resistor, 9.16
High performance hybrid and modular DACs and
ADCs, 1980s, list, 1.53
High-performance mixed-signal circuit,
specialized processes, 4.27
High resolution measurement sigma-delta ADC,
3.127-131
High-speed ADC:
architecture, 3.46
FIFO Evaluation Kit, 5.60-61
High-speed logic, 9.169-177
EMI/RFI, 9.169-177
High-speed thermometer DAC, current outputs, 3.8
Higher order loop, 3.123
sigma-delta converter, 3.123
Histogram, grounded-input, 2.44
Histogram test:
ADC, 5.38-44
buffer memory constraints, 5.41
data display, 5.39-40
sampling protocols, 5.41
setup, 5.39
sinewave, 5.42
A History of Engineering and Science in the Bell
System, 1.3
Hnatek, Eugene R., 2.116, 3.36, 3.139, 5.90
Hodges, D.A., 8.157
Hodges, David A., 5.88
Hoerni, Jean, 1.15, 1.19, 4.3-4, 4.9
Hoerni, Jean A., 1.19, 4.9
Hoeschele, David F., Jr., 2.116, 3.139, 5.90
Hold mode, 2.100
Hold mode distortion, 7.101
measurement, 7.102
Hold mode droop, 7.99
Hold mode noise, 7.102
Index 26
Hold mode settling time, SHA, 7.95
Hold-to-track transition, specifications, 7.102
Holloway, Peter, 1.35, 1.47
Homodyne, 8.108
Horizontal sync, 8.76
Horna, O.A., 3.106, 7.111
Horvath, Johannes, 9.181
HS-810:
8-bit 10-MSPS ADC, 4.4-5
Computer Labs, Inc., 1.24
using Gray code, 3.84
HTC-0300, 300-ns SHA, 1.43-44
HTS-0025, 25-ns SHA, 1.43-44
Human Body Model, ESD model, 9.121, 9.123
Hybrid clock generator, 6.94-95
Hybrid data converter, 4.6
Hybrid ground, cable shielding, 9.153
Hybrid regulation, 9.77
Hybrid SHA, 7.92
Hybrid Systems, 1.33
Hygroscopicity, PCB, 9.25
Hysteresis, 2.104, 3.43-44
I
IC, 4.4
ESD-sensitive, workstation environment, 9.119
invention, 1.14
Ichiki, H., 3.104
iCoupler technology, 9.112
Idle tone:
in sigma-delta ADC, 3.121-123
sigma-delta converter, 3.121-123
IEC-1000-4, ESD standard, 9.122
IEC-1000-4-1, ESD standard, 9.122
IEC-1000-4-2:
compliance testing methods, 9.121
ESD standard, 9.122-123
IEC-1000-4-3, ESD standard, 9.122
IEC-1000-4-4, ESD standard, 9.122
IEC-1000-4-5, ESD standard, 9.122
IEC-1000-4-6, ESD standard, 9.122
IEC-1000-4-x, 9.121
IEEE-488 bus, 5.27
IEEE Standard 746-1984, 5.81, 5.88, 8.104
IEEE Standard 1057-1994 (R2001), 5.88
IEEE Standard 1241-2000, 5.21, 5.25, 5.81, 5.88
IEEE Standard 1596.3-1996, 9.179
IF sampling, 146-155, 2.31-32, 8.107
software radio receiver and transmitter,
diagram, 8.107
time-interleaved, 8.146-155
IF sampling receiver, 1.55
IF-to-digital conversion, direct, 2.31-32
Ikeda, K., 3.104
ILC/Data Device Corporation, 1.33
Image spurs, 8.147, 8.150, 8.153
Images, aliases, 2.28
Imaging system, diagram, 8.94
IMD:
INDEX
intermodulation distortion, 2.53, 2.106, 2.108
third-order products, 2.54-56
slope, 2.54
Impedance:
in grounding system, 9.29
input, 2.106
Impedance mismatch, 9.149
Impulse, 2.105
In-amp:
input, 9.160-162
rectification, 9.160-162
overvoltage protection, 9.105-109
RFI rectification sensitivity, tests,
9.155-157
single supply, protection, circuit, 9.108
In-circuit overvoltage:
general input common-mode, 9.93-95
protection, 9.93-116
summary, 9.116
In-circuit voltage protection, 9.93-116
general input common-mode limitations, 9.93-95
In-phase signal processing, 8.38
Incremental optical encoder, 3.98
Inductance, 4.15, 9.17-21
mutual, 9.17-20, 9.17-21
ringing, 9.17-20
stray, 9.17
wire and strip, calculations, 9.17
Induction, skin effects, 9.46-48
Inductive coupling:
basic principles, 9.18
EMI path, 9.142
Inductor:
parasitic effects, 9.21
Q (quality factor), 9.21-22
quality factor, 9.21-22
ringing, 9.20
Infinite ground conductivity, 9.29
Infinite SHA, 8.45-47
INL, integral nonlinearity, 5.2
Inose, H., 3.136
Input differential protection, 9.104-105
Input impedance, 2.106
Input multiplexer, 1.55
Input noise, 2.72
Input-referred noise, 2.103, 2.106, 5.71, 5.76
grounded input histogram, 5.44
Instantaneous power, 8.22
Instantaneous real power, 8.22
Insulation resistance, capacitor, 9.2
Integral linearity, 2.107-108
error measurement, 2.15-16
Integral nonlinearity, 2.107-108
DAC, 5.1, 5.5
Integrated circuit, see IC
Integrated circuit ground pin, 9.31
Integrated Device Technology (IDT), Inc., 9.197
Integrated function, 1990s, table, 1.64
Integrated-injection logic, 1.38
Integrated-injection-logic process, 4.12
Integrating and counting ADC architectures,
3.87-113
Integrating servo-loop ADC tester, diagram, 5.36
Integration, 4.21-26
levels, trends, 4.26
Intel, 4.26
Intentionally nonlinear DAC, 3.25-26
Intercept points, amplifier, definition, 2.54-55
Interconnection stability, resistor, 9.11
Interface bandwidth, 4.22
Interfacing:
2.5V/1.8V, 9.190-193
3.3V/1.8V, 9.190-193
3.3V/2.5V, 9.188-190, 9.190-193
analysis, 9.190
5V systems to 3.3V systems, using NMOS FET
bus switches, 9.186-190
bidirectional, NMOS FET, 9.186
Interference, associated impedance, 9.148
Interlacing, television, 8.75
Intermodulation distortion, 2.106, 2.108
data converter, 6.3
Internal compliance and tolerance, CMOS IC,
diagram, 9.195
Internal high voltage generation, 9.196
International Telephone and Telegraph
Corporation, 1.8, 1.10, 8.59
Interpolation, 3.51
Interpolation filter, on DAC, 4.22
Intersil, 1.33
Intersymbol interference, 3.8
Inverse Fourier transform, 5.51
Inverting-mode op amp protection, 9.100-101
Irons, Fred H., 2.91
IS-136, US multicarrier time-division
multiplexed-access system, 8.112
ISI, intersymbol interference, 3.8
ITT Laboratories, 3.109
ITU-Recommendation BT.601, 8.104
ITU-Recommendation BT.656-4, 8.104
ITU-Recommendation BT.709-5, 8.104
ITU Recommendation ITU-R BT.1204, 5.89
J
Jager, F. de, 3.136
Jantzi, S.A., 3.138
Jayant, Nuggehally S., 2.116, 3.139, 5.90
J.B. Rea, 1.21
JEDEC, 9.197
JEDEC standards, 9.184-185
JFET RFI rectification, sensitivity, 9.159
Jitter:
aperture, 9.39
calculation, from phase noise, 6.88
oscillator, 6.86-94
Johns, David A., 2.116, 3.139, 5.90
Johnson noise, 9.14-15, 9.100
Johnson, H., 9.197
Index 27
ANALOG-DIGITAL CONVERSION
Johnson, Howard W., 9.63
Joint Electron Device Engineering Council
(JEDEC), 9.197
Jump size, 8.163
Junction field effect transistor, extra
implantation, 7.11-14
Junction-to-ambient, thermal resistance, 9.127
Jung, Walt, 1.1, 3.108, 4.2, 4.19, 6.79, 7.1,
7.26-27, 8.157, 9.1, 9.25, 9.65, 9.91, 9.93,
9.127, 9.139, 9.141, 9.178, 9.199
Jung, Walter G., 1.17, 2.90, 2.117, 3.140, 4.9,
4.19, 5.91, 6.77, 8.26, 9.23
K
K2-W op amp, 4.2
K2-W Operational Amplifier, data sheet, 4.9
Kaiser, Harold R., 3.105
Kaiser, H.R., 3.59
Kaneko, H., 3.37
Kearney, Paul, 8.105
Kelvin divider, 3.8
DAC, 3.4, 3.4-6
DNL, 5.10
no superposition, 5.10
Kelvin feedback:
in PCB, 9.27-28
signal leads, 9.27-28
Kelvin sensing, 7.8, 7.17, 7.20, 7.58, 8.5, 8.9
Kelvin-Varley divider, 3.18
Kelvin, Lord, 3.4
Kemet Electronics, 9.91
Kemet T491C-series, tantalum capacitor, 7.48
Kerr, Richard J., 8.175
Kessler, Martin, 4.21
Kester, W.A., 5.88, 8.104
Kester, Walt, 1.1, 1.49, 2.1, 2.23, 2.37, 2.90,
2.97, 2.117, 3.1, 3.39, 3.109, 3.140, 5.1, 5.88,
5.89, 5.91, 6.1, 6.45, 6.47, 6.67, 6.69, 6.77,
6.83, 7.1, 7.61, 7.91, 8.26, 8.27, 8.49, 8.59,
8.75, 8.107, 8.157, 8.159, 9.1, 9.25, 9.30,
9.63, 9.65, 9.91, 9.93, 9.125, 9.139, 9.141,
9.178, 9.181, 1.55, 1.65, 4.1, 4.11, 9.199
Kester, Walter, 5.88
Kester, Walter A., 5.87, 8.104
Khairolomour, Peter, 8.58
Kilby, Jack, 1.15, 4.3-4
Kilby, J.S., 1.19, 4.9
Kimmel, William, 9.178
King, Grayson, 8.177
Kinniment, D.J., 3.106, 7.111
Kirchoff's law, 9.17, 9.28
Kitchen, Charles, 9.125, 9.178
Kitchen, Chuck, 9.178
Kitsopoulos, S.C., 3.106, 7.111
Kiyomo, T., 3.104
Klonowski, Paul, 3.108
Koch, R., 3.137
Kovacs, Gregory T.A., 7.60
Kovar lid, 9.60
Index 28
Krabbe, Hank, 4.13
kT/C noise, 2.43, 2.109
CCD, 8.97
Kurosawa, N., 8.157
Kurth, C.F., 2.116, 3.139, 5.90
Kurz, Dov, 9.125
Kwan, Tom W., 3.36, 3.137
L
LabVIEW, 5.89
Lackey, 8.156
Lane, Chuck, 3.105
Lapham, Jerome F., 4.19
Laser wafer trimming, 4.12
Latch:
in double-buffered DAC, 3.33
output, 3.70
Latched comparator, 2.76, 3.43
Latchup, 9.35
Latency, 2.106
Lateral PNP, 4.11
LCCMOS, 1.49, 4.13
LDO, 7.27
adjustable voltage, 9.72-74
advantages, 9.66
architectures, 7.35-39, 9.70-74
DC and AC design issues, 7.38
zoned load capacitor, effects, 7.39
device selection, voltages, table, 9.72
fixed-voltage, 9.71-72
grounding, 9.78-79
signal routing, diagram, 9.78-79
regulator controller, 9.73
LDO regulator:
board layout guidelines, 7.47
thermal considerations, 7.46-51
LDO regulator controller, 7.51-59, 7.51-60
2.8-V/8-A, 7.59
diagram, 7.59
basic, 7.53-54
copper resistance design, table, 7.58
pass device, 7.54-55
PCB layout issues, 7.58
PMOS FET pass device, 7.51
sensing resistor, 7.57-58
sensing resistors, 7.57-58
thermal design, 7.55-57
LE1182-series elliptic filter, TTE Inc., 2.31
Leaded ferrite bead, 9.86
Leakage current, output, 2.106
Leakage resistance, static effect, 9.52
Least-significant bit, see LSB
Lee, Hae-Seung, 5.88
Lee, Seri, 9.139
Lee, Wai Laing, 3.137
Lee, W.L., 3.137
Left-justified data, 2.107
Lewis, Stephen H., 3.106
Li, Alan, 7.60, 8.58
INDEX
Li, Harry W., 5.89
Lindesmith, John L., 3.108
Line sensitivity, 7.17-18
Linear compatible CMOS, 4.13
Linear IC regulation, 9.66
Linear mode regulation, 9.65
Linear post regulator:
low noise, 9.78
switching supplies, 9.77-78
Linear predictive coding, 8.137
Linear ramp input, 3.79
limitations, 5.41
Linear regulator:
low dropout, 7.27-60
architectures, 7.35-39
Linear resistance, calculation, 9.26
Linear settling time, DAC, 2.81
Linear voltage regulator:
basics, 7.27-31, 9.66-68
block diagram, 9.68
negative leg series, 9.66
pass device, 9.68
positive leg series, 9.66
three-terminal circuit, 9.67
Linearity, 2.107
differential, 2.107-108
error, 2.15, 2.97
integral, 2.107
Linearity tempco, 2.114
LM309, fixed-voltage regulator, 9.68
LM317, adjustable-voltage regulator, 9.69
LM109, basic bandgap reference, 7.4
LM109/309, bandgap voltage reference, 7.33
LM309:
voltage regulator, 7.33-35, 7.37
schematic diagram, 7.34
LM311:
comparator, 1.38
IC comparator, 1.41
LM317:
adjustable voltage regulator,
schematic diagram, 7.34
topology, 7.35
LM361, IC comparator, 1.41
LO-PADS, 9.202
Load sensitivity, 7.17-18
Local high frequency bypass/decoupling, 9.89-90
layouts, 9.89
Locked-histogram test, 5.70-72
ADC aperture jitter, test setup, 5.71
Logarithmic transfer function, 3.26
LOGDAC, functions, 3.27-28
Logic:
interface, 2.94-95
standards, summary, 9.184
types, 2.2
Logic circuit, low voltage, interfacing, 2.95
Logic device:
choice and noise problems, 9.164
EMI/RFI protection, 9.164
Logic gate, 6.85
RMS jitter, 6.86
Logic IC, characteristics, 9.183
Logic interfacing, low voltage, 9.181-197
Logic noise:
ADC buffering, 9.60-62
buffering ADC, 9.60-62
CMOS latched buffer, 9.61
Lohman, R.D., 3.104
Lohman, Robert D., 3.48
Long term prediction, 8.138
Looney, Mark, 8.146, 8.157
Lorber, Matt, 4.11
Low byte, 2.100
Low-distortion DAC, 3.31-33
Low-distortion sinewave, generation, test setups,
5.66-67
Low dropout linear regulator, 7.27-60
Low dropout regulator:
architectures, 7.35-39
definition, 7.27
see also LDO
Low-glitch architecture, DAC, 3.5
Low-glitch segmented DAC, 3.31-32
Low noise, 7.24-25
Low power mode, 6.48
Low-voltage-differential-signaling, see LVDS
Low-voltage logic, interfaces, 9.181-197
Lowpass filter, audio DAC, 6.75-76
LPKF Laser & Electronics, 9.213
LSB, 2.13, 2.100, 2.107
peak-to-peak, 2.109
rms, 2.109
Luma signal, 8.79, 8.82
Luminance, 5.78, 8.79
LVDS, 3.76, 6.52, 6.54
for high speed interfaces, 4.22
logic, 2.2
output driver, 6.54
standards, 9.184
LVDS logic, 9.175-176
LVTTL, standards, 9.184
Lyne, Niall, 9.125
M
Machine Model, ESD model, 9.121
MacKenzie, I. Scott, 8.191
Maddox, C.L., 3.37
MagAMP, 3.81
3-bit, folding ADC, 3.81-82
architecture, advantages, -86
current-steering, differential gain-of-two,
diagram, 3.85
Gray code, 3.86
Magnetic field, reflection loss, 9.149
Magnetically-coupled noise, reduction, 9.145-146
Magnetically coupled noise, reduction, 9.145-146
Mahoney, Matthew, 2.116, 3.139, 5.88, 5.90
Index 29
ANALOG-DIGITAL CONVERSION
Malaeb, Mark, 8.58, 8.191
Mangelsdorf, Christopher W., 2.90, 3.104
Mannion, Patrick, 8.156
Manolakis, Dimitris G., 5.89
Mark/Space ratio, ADC, 3.91
Markow, John, 8.26
Mark, W., 9.23
Mark, W, 9.63
Martin, Ken, 2.116, 3.139, 5.90
Martin, Steve, 3.108
MAS-1202, 12-bit 2-µs SAR ADC, 1.44, 1.46
MASH:
multistage noise shaping, 3.126
sigma-delta ADC, block diagram, 3.127
Mathcad, 5.89
MATLAB, 5.89
Matsuya, Y., 3.137
Matsuzawa, A., 2.90, 3.105
Matsuzoe, Nobuhiro, 8.191
Maximum conversion rate, 2.108
Maxwell, Darragh, 8.191
MC1650, IC comparator, 1.41
McCarthy, Mary, 8.58
McClaning, Kevin, 2.90
McDaniel, L.D., 3.37
McDaniel, Wharton, 7.60
MCM, 4.7
MDAC, 3.2
current-mode R-2R ladder network, 3.25
diagram, 3.25
external voltage reference, 3.24
MDS-1250, 12-bit 50-ns DAC, 1.46
Meacham, L.A., 1.18, 3.37, 3.105, 7.111, 8.59,
8.74
Melliar-Smith, C. Mark, 1.18, 4.9
Memory, non-volatile, 4.14
Mendelsohn, Alex, 8.191
Mercer, Doug, 4.19, 8.157
MESC series RFI suppression chokes, 9.91
Metal film resistor, 9.16
Metal foil resistor, 9.16
Metal migration, 9.94
Metal-on-silicon device, 4.13
Metastability, 2.76, 3.44-45
Metastable comparator output, errors, 2.77
Metastable state, 2.76-80
ADC, 2.76-80
Meyer, F.C., 5.87
MF Electronics, 9.39
Miao, Kai, 8.191
Mica capacitor, 9.8
Micro Power, 1.52
Micro Power Systems, 1.33
Microcontroller, 8.16
precision analog, 8.177-191
MicroConverter:
applications, 8.184-186
based on ARM7 processor core, 8.187-190
characteristics, 8.178-183
Index 30
definition, 8.177
development tools, chart, 8.186
family, characteristics, 8.178-183
RTD interfacint, 8.185
sigma-delta ADC architecture, 8.182
summary, 8.183
MicroConverter 12-bit SAR-based, summary, 8.180
MicroConverter SAR ADC performance, 8.179
MicroConverter sigma-delta ADC architecture,
8.180-182
Micronetworks, 1.33
Microprocessor supervisory products, 8.19
Microstrip:
delay constant, 9.167
guidelines, 9.167
Microstrip PCB layout, two pairs of LVDS signals,
9.177
Microstrip transmission line:
characteristic impedance, 9.166
controlled impedance, termination techniques,
9.173
general parameters, 9.48
on PCB, 9.166-167
MICROWIRE, serial interface, 6.51
Mid-scale settling time, 5.14
Mierlo, S. Van, 3.109, 3.136
MIL-883B, 4.6
MIL-M-38510, standard for 12-bit DAC, 1.35
MIL-STD-883 Method 3015, 9.121, 9.125
MIL-STD-883B, 1.42
MIL-STD-883B Method 3015.7, ESD test method,
9.122-123
Milled PCB prototyping, 9.203-205
board, 9.204-205
Millman, S., 1.17
Miner, Willard M., 1.4, 1.17
Mini-Circuits, 6.45
Mini-Circuits RF transformer, 6.24-27
Mini-Mount, breadboarding system, 9.202
Minidac, 1.24-25
12-bit, with op amp, quad switches, thin film
resistor network, diagram, 1.26
MINIDIP guard layout, 9.55-56
Minimum 4-term Blackman-Harris, window
function,
5.57, 5.63-64
Minimum conversion rate, sampling, 2.108
Minimum sampling frequency, 6.49-50
Missing code, 2.107, 2.108
errors, 2.20-21
MIT Lincoln Labs, 1.23
Mitola, Jim, 8.156
Mixed-signal front ends, 1.55
Mixed-signal grounding, problems, 9.40-41
Mixed-signal IC:
grounding, 9.30
internal digital currents, diagram, 9.36
low internal digital currents, diagram,
9.41
INDEX
grounding and decoupling, 9.35-36
low voltage, summary, 9.182
Mixed-signal system:
grounding, 9.45
multicard, 9.33-34
partitioning analog and digital circuits, 9.46
PCB layout guidelines, 9.45-46
MOD-815:
8-bit 15-MSPS ADC, 1.44-45
8-bit 15-MSPS subranging ADC, Computer Labs
Inc., 3.64
8-bit 15-MSPS video sampling ADC, 1.46
MOD-1020, 10-bit 20-MSPS sampling ADC,
photograph, 1.45-46
MOD-1205, 12-bit 5-MSPS sampling ADC,
1.45-46
MOD-4100, 4-bit 100-MSPS flash ADC, using
AM685
comparator, 3.49-50
Modern data converter processes, 4.11-19
Modular data converter, 4.6
Modulation, 8.137
Moghimi, Reza, 3.104, 8.58
Monochrome, television, 8.76
Monolithic ceramic capacitor, 9.8
Monolithic dual FET, matched, 1.41
Monolithic transistor array, 1.41
Monotonic, DAC, 3.5, 5.1
Monotonicity, 2.107, 2.108, 3.89
Montrose, Mark, 9.64, 9.178
Moore, Gordon, 4.26
Moore's Law, 4.26, 4.30
Moreland, Carl, 3.85, 3.107, 7.111
Moreland, Carl W., 3.107
Morrison, Ralph, 9.63, 9.178
MOS, 4.13
MOSFET, switch, on-resistance versus signal
voltage, 7.63
Moss, Brian, 8.191
Most significant bit, see MSB
Motchenbacher, C.D., 9.63, 9.125
Motherboard, PCB, in mixed-signal system,
9.33-34
Motorola, 1.33
Motorola MC1650, 3.49
Motorola MC1650 dual ECL comparators, 3.65
MP7684, 8-bit 20-MSPS flash ADC, 1.52
MSB, 2.2, 2.108
error, electron beam coder, 1.12
µ-law, 3.26
Mu-metal:
shielding, 9.20
shields, 9.146
µA702, monolithic op amp, 4.11
µA709:
IC op amp, Fairchild, 3.49
op amp, Fairchild, 1.24
µA710, IC comparator, 1.41
µA710/711:
comparator, Fairchild, 1.24
comparators, Fairchild, 1.23
µA710 comparator, 1.25
µA710/µA711, comparator, 4.11
µA711, IC comparator, 1.41
µA711/712, comparator, Fairchild, 3.49
µA741, op amp, 4.11
Multi-bit sigma-delta ADC, 3.123-125
block diagram, 3.123
Multi-tone intermodulation distortion, 2.46
Multi-tone SFDR, 2.56-57
Multibit sigma-delta converter, 3.123-125
Multicard, mixed-signal systems, 9.33-34
Multicard system:
grounding, high digital currents, diagram,
9.43
grounding mixed-signal devices, 9.41-42
Multicarrier CDMA2000 receiver, RF spectrum,
8.117
Multicarrier receiver, chart, 8.131
Multicarrier transceiver, summary, 8.136
Multicarrier transmitter, chart, 8.135
Multichannel audio codecs and DACs, chart, 8.70
Multichannel data acquisition system, 8.27-48
Multichannel data distribution, 8.42
Multichannel system, two-tone intermodulation
distortion, 8.122
Multichip module, 4.7, 4.17
Multimode cellular chipset, l, 4.22
Multiplexed Front End, 1.66
Multiplexer, 7.80-82, 8.37
analog, diagram, 8.28
from Analog Devices, 7.84-85
dual source RGB,
using AD8183/AD8185/AD8186/AD8187, 7.81
using three AD8170, 7.81
fault-protected, 9.99
for dual-supply in-amp, circuit, 9.107
key specifications, 8.28
MOSES-8 MOSFET Multiplexer, 7.61
output, 2.73, 3.125
settling time, 2.74, 7.73
SHA, dynamic signal input processing, 8.30
triple dual input, 7.82
Multiplexers and analog switches, 7.61-89
Multiplexing, 1.4, 8.28-31
inputs to sigma-delta ADC, 8.36-38
Multiplying DAC, 2.108, 3.24-25
current-mode R-2R ladder network, 3.25
diagram, 3.25
external voltage reference, 3.24
feedthrough, 2.103
Multipoint ground, diagram, 9.34
Multistage noise shaping:
sigma-delta ADC, 3.126-127
sigma-delta converter, 3.126-127
Multisync, 8.86
Multitone spurious free dynamic range, 2.108
Murakami, J., 3.136
Index 31
ANALOG-DIGITAL CONVERSION
Murden, Frank, 3.85, 3.106, 3.107, 4.12, 7.111
Murphy, Eva, 9.181, 9.197
Musmann, H.G., 3.37
Muto, Art, 5.88
Muto, Arthur S., 5.88
Mutual inductance, 9.17-20, 9.17-21, 9.143
within signal cabling, 9.19
MxFE, 1.66, 4.25
N
N1 SADC gain error, 3.67
N1 SADC linearity error, 3.67
N1 SADC offset error, 3.67
N1 SDAC offset error, 3.67
Nahman, Norris S., 5.25
Narrowband, definition, 8.114
Narrowband digital receiver, 8.110-114
Narrowband GSM receiver bandpass sampling,
diagram, 8.112
National LM361, 3.49
National Semiconductor, 1.25, 1.28, 1.33
Naylor, Jim R., 5.25, 5.87
NDB6020P, 7.53, 7.56, 7.59
NDP6020P, 7.53-56, 7.59
NDP6020P/NDB6020P, data sheet, 7.60
NE521, IC comparator, 1.41
Near-field interference, EMI path, 9.142
Neary, Eamon, 8.191
Neelands, Lewis J., 3.108
Negative full-scale, 2.104
Neil, Martin, 5.88
Net glitch area, 5.15
New TxDAC Generation, 8.157
NF, noise figure, 2.61
Nguyen, Khiem, 3.36, 3.137
Nicholas, Henry T., III, 8.175-176
Ninke, W.H., 3.37
NMR, 2.110
No missing codes resolution, 2.109, 2.112
Noise, 2.97
capacitance-coupled, reduction, 9.144-145
common-impedance, reduction, 9.143-144
conducted type, 9.82
equivalent input referred, 2.43-44
excess, 9.14-15
Gaussian, 2.109
input-referred, 2.44
input referred, grounded input histogram, 5.44
Johnson, 9.14-15
KT/C, 2.109
magnetically-coupled, reduction, 9.145-146
magnetically coupled, reduction, 9.145-146
from near-field interference, 9.144
peak, 2.109
random, 2.109
RMS, 2.109
signal-to-quantization ratio, 2.39
thermal, 9.14-15
voltage reference, 7.18-20
Index 32
Noise bandwidth, definition, 2.62
Noise coupling, mechanisms, 9.143
Noise factor, 2.61-68
Noise figure, 2.46, 2.61-68
cascaded, using Friis equation, 2.67
Noise-free code resolution, 2.45, 2.103, 2.106,
2.109, 8.8, 8.11
Noise immunity, 3.103
Noise power ratio testing, 5.69-70
Noise reduction, power supply, 9.81-90
Noise reduction pin, 7.19
Noise Shaped Video techniques, 8.83
Noise shaping, 3.111, 3.112, 3.116
Non-coherent sampling:
FFT output signal and harmonic leakage, 5.64
leakage, 5.63
Non-Linear Systems, Inc., 1.21
Non-monotonic ADC, errors, 2.20
Non-monotonicity, 3.19
Nonlinear DAC, 3.25-26
Nonlinearity, 2.107, 2.110
offset, 2.111
Nonlinearity error, resistor, 9.10
Nordenberg, H., 9.63
Normal mode, 2.110
Normal mode rejection, see NMR
Normalization, 2.2
Norton, Mark, 1.47
Notch filter, 2.59, 2.109
minimizing analyzer overdrive, 5.68
Nova Devices, 4.11
Noyce, Robert N., 1.15, 1.19, 4.3-4, 4.9
NP0 ceramic capacitor, 9.8
NPR, 1.49, 2.58-60
ADC testing, 5.69-70
measurements, 2.58
noise power ratio, 2.46, 2.109, 5.69-70
test setup, 5.69
NTSC, 5.78-79, 5.81
composite color video line, 8.76-77
signal characteristics, 8.77
videotape recorders, 8.62
Numerically controlled oscillator, 8.115,
8.160-161
Nyquist ADC, 3.111
high resolution, 3.112
Nyquist band, 3.116
sigma-delta ADC, 3.115
Nyquist bandwidth, 1.61, 1.64, 2.28-29, 2.38-39,
2.41, 2.63, 2.86-87, 2.98, 3.76, 5.19, 8.32,
8.113, 8.120, 8.122, 8.133, 8.160, 8.165
Nyquist conditions, 2.64
Nyquist criteria, 2.27, 2.27-29, 8.163
Nyquist frequency, 2.30, 2.49, 5.48, 6.37,
8.148-149, 8.164
Nyquist operation, 3.133
Nyquist range, 3.23
Nyquist rate, 3.110
Nyquist sigma-delta ADC, 3.112
INDEX
Nyquist theorem, PCM, 1.7
Nyquist-type ADC, 8.1
Nyquist zone, 2.28-29, 2.33-34, 2.58, 8.112,
8.118, 8.153
first, 2.31-32
frequency translation, 2.32
undersampling, 2.31-32
Nyquist, Harry, 1.6, 1.17, 2.27, 2.35
O
OA-125, modular op amp, Computer Labs, 1.23
O'Brien, Paul, 6.98, 8.175
Octal DAC, 1.56
Off-channel isolation, 8.28
Offset, bipolar, 2.110
Offset binary code, 2.8-9, 2.14
bipolar 3-bit ADC, 2.9-10
bipolar 3-bit DAC, 2.9-10
Offset error, 2.15
DAC, 5.1, 5.2-4
measurement, 5.31
Offset nonlinearity, 2.111
Offset spurs, 8.147
Offset step, 2.100, 2.110, 2.111
Offset tempco, 2.115
Ohmite Victoreen MAXI-MOX Resistors, 9.23
Ohm's law, 9.27
Oliver, Bernard M., 3.107
Oliver, B.M., 1.18, 2.90
Olshausen, Richard, 3.108
O'Mara, Brian, 8.191
On-Chip tools, resources, 8.189
On-resistance, 8.28
On-resistance modulation, 8.28
ON Semiconductor, 6.98
One shot, temperature sensor output mode, 8.15-16
1-dB compression point, 2.54
1N821-1N829 series, Zener references, 7.3
1148, IC switcher, 9.77-78
1408:
8-bit bipolar process IC DAC, 1.34
IC DAC, 1.41
O'Neill, E.F., 1.17
Ones complement, code, 2.11, 2.14
Ones-density, 3.117
Op amp:
applied feedback, 6.9
bipolar input, output phase-reversal, 9.103
for buffering DAC output, 6.69
dual,
driver, 6.29-30
driving, 6.29-30
dual supply, differential DC coupled output,
6.72-73
evaluation board,
1990s, 9.207
dedicated, 9.207-209
FET, output phase-reversal, 9.103
gain and level-shifting circuits, 6.10-13
diagram, 6.11
gain-of-two, 3.84
input, 9.159-160
rectification, 9.159-160
input bias current, 6.7
input common-mode voltage, 6.5
input differential overvoltage protection
network, 9.104
inverting-mode protection, 9.100-101
low bias current FET input I/V converter,
block diagram, 9.100
in low voltage rail-rail references, table,
7.21
noise, antialiasing filter, 6.38
noise figure, 2.61
open-loop gain, 6.9
output stages, diagram, 6.9
overvoltage, CM protection circuit, 9.94
performance factors, 6.2
PNP, PMOS, or N-channel JFET stages, 6.5-6
push-pull output, 6.8
rail-rail input, 6.5-8
diagram, 6.6
rail-to-rail,
"almost" output, 6.10
for single-ended level shifter with gain,
6.13
and regenerative repeaters, 1.13-16
RFI rectification sensitivity, tests,
9.155-157
single-supply, grounding, 9.56
slew rates, 6.8
specifications, key specifications, 6.4
specifications and requirements, 6.13-15
thermal resistance considerations, 9.131
video driver, power dissipation, 9.133
Op Amp Applications, 1.1, 4.2, 4.19
Op Amps Combine Superb DC Precision and Fast
Settling, 4.19
OP177, low-noise buffer, 6.15-16
OP184/284/484:
bias input currents, 6.7
rail-rail input stage, 6.7
OP191/291/491, common-mode voltage, 6.7
OP275, data sheet, 6.77
OP1177, low-noise buffer, 6.15
Open-loop SHA, 7.102-104
circuit, 7.103
using diode bridge switch, 7.103
Oppenheim, V., 5.89
Optical converter, 3.98-99
ADC, 3.98-99
Optical encoder:
incremental, 3.98
incremental and absolute, illustration, 3.99
Opto-isolator, 8.14
Optocoupler, 9.112
architecture, 9.112-113
Optoisolator, 9.112
Index 33
ANALOG-DIGITAL CONVERSION
OS-CON, organic semiconductor capacitor, 9.83
OS-CON Aluminum Electrolytic Capacitor
Technical
Book, Sanyo, 9.91
Oscillation, 3.43
Oscillator, 3.89
broadband phase noise comparison, 6.90
phase noise and jitter, 6.86-94
phase noise versus frequency, 6.88
power spectrum, phase noise, 6.86
quartz crystal, 2.71
resolution and input frequency, 6.94
Wenzel, 6.90-91
jitter calculations, 6.91
Oscilloscope, sensitivity, 5.16
Oscilloscope measurement, settling time and
glitch impulse area, 5.15-17
Othello direct conversion radio, 4.22
Othello radio, dual band GSM architecture, 8.144
Othello radio chipset, 8.140-145
Virtual-IF transmitter, 8.142
Othello radio chipsets, 8.140-145
Ott, Henry, 9.178
Ott, Henry W., 9.24, 9.63, 9.91
Out-of-circuit overvoltage, protection, 9.116-124
Out-of-circuit voltage protection, 9.116-124
Output, digital, signal quantization, 2.12
Output amplifier, 1.35
Output glitch, 3.21
Output latches, flash converters, 3.70
Output leakage current, 2.106
Output phase-reversal, fixes, 9.103-104
Output phase-reversal test, 9.102-103
Output propagation delay, 2.110
Output ripple, 2.104
Output ripple voltage, voltage regulator, 9.76
Output settling time, 2.112
Output spectrum, DAC, sin(x)/x frequency rollout,
2.87
Output voltage phase-reversal, 9.101-102
illustration, 9.102
key points, 9.103
prevention, 9.103-104
testing, 9.102-103
Output voltage tolerance, 2.110
Overdrive, settling time, 5.15
Overlap bits, 3.64
Overload, 2.110
Overrange, overvoltage, 2.110
Oversampling, 2.40, 3.111, 3.112, 3.115-116,
3.116
audio DAC, 6.75-76
baseband antialiasing filter, 2.29
for digital audio, 8.64
interpolating DAC, 2.87-89, 3.23-24
sigma-delta ADC, 3.115
and undersampling, process gain, 2.40-41
Overvoltage:
in-circuit, 9.93
Index 34
out-of-circuit, 9.93
power supply sequencing, protection, circuit,
9.111
protection, 9.93-126
CMOS channel protectors, 9.98-99
recovery time, 2.46, 2.75, 2.110, 5.77-78
test waveform, 5.77
Overvoltage overrange, 2.110
Overvoltage protection, 9.1, 9.93-126
CMOS channel protector, 9.110-111
CMOS channel protectors, 9.110-111
digital isolators, 9.111-116
ESD models and testing, 9.121-124
in-amps, 9.105-109
in-circuit, 9.93-116
out-of-circuit, 9.116-124
Owen, Frank F.E., 2.116, 3.139, 5.90
P
p-epi CB process, 4.12
Packaging, data converter, 4.17
PADS Software, Advanced CAM Technologies,
Inc.,
9.213
PAL, 5.78-79, 5.81
signal characteristics, 8.77
videotape recorders, 8.62
Panasonic, 9.91
Parallel ADC, 3.46-53
Parallel latch, 3.21
Parallel plate capacitor, 9.58
Parasitic capacitance, 9.11
Parasitic coupling, 9.57
Parasitic diode, 2.94
Parasitic effect, 7.37-38
pin socket, 9.205
Parasitic inductance, 9.11
Parasitic resistance, 4.15
Parasitic thermocouple, 9.12
Parasitics, 1.56, 9.200
capacitor, 9.2
copper wire, 9.12
Partitioning, 4.21-30
chip set, progress, 4.28
developments, 4.27-30
necessity, 4.26-27
smart, 4.21-30
diagram, 4.24
purposes, 4.26-27
versus complete integration, 4.21
Parzefall, F., 3.137
Pass device, 9.68
associated tradeoffs, 7.31-35
pros and cons, 7.32
for voltage regulator, types, 7.31
Passive component, 9.1-24
capacitor, 9.1, 9.2-8
EMI path, 9.146-147
error analysis, 9.22
INDEX
inductance, 9.17-21
PCB, 9.1
potentiometer, 9.1, 9.15
resistor, 9.1, 9.9-16
versus EMI/RFI, 9.146-147
Pastoriza division of Analog Devices, 7.92
Pastoriza Electronics, 1.23, 1.24, 1.44, 4.11
Pastoriza, James, 1.23, 1.25
Pastoriza, James J., 1.31, 3.16-17, 3.36
Pattavina, Jeffrey S., 9.63
PCB:
capacitive noise, 9.59-60
conductor resistance, 9.26-27
continuous ground plane, 9.50
design, 9.25-64, 9.163-164
controlled impedance traces, 9.164-166
EMI/RFI protection, 9.163, 9.163-164
double-sided,
from HS-81, 4.5
versus multilayer, 9.32-33
double-sided versus multilayer, 9.32-33
dynamic effects, 9.57-62
Faraday shield, 9.59-60
floating shield, 9.60
grounding, in mixed systems, 9.30-45
guard pattern, MINIDIP package, 9.55
Kelvin feedback, 9.27-28
layout, 7.58-59
mixed-signal system, 9.45-46
layout guidelines, for mixed-signal
systems, 9.45-46
microstrip transmission line, as controlled
impedance conductor, 9.48
microstrip transmission lines, 9.166-167
moisture sensitivity, 9.53
multilayer, versus double-sided, 9.32-33
passive component, 9.1
precision circuit performance, 9.25
signal leads, voltage drop, 9.27-28
signal return currents, 9.28-30
skin effect, 9.46-48, 9.48
SOIC guard layout, 9.56
static effects, 9.52-56
guard layouts, 9.55-56
stray capacitance, 9.58-59
symmetric stripline transmission lines,
9.167-168
trace resistance, 9.27
transmission lines, 9.48-49
PCB design:
controlled impedance traces, 9.164-166
embedded traces, 9.169
for EMI/RFI protection, 9.163-164, 9.164
low impedance reference plane, 9.165
PCM, 3.109
from Bell Labs, 1.11
and Bell System, history, 1.10-13
Bell System work, 1.21
invention, 1.5-6, 4.2
Western Electric, 1.5
mathematical foundations, 1.6-8
mathematics, 1.6
historical summary, 1.8
nonlinear DAC, 3.26
Nyquist theorem, 1.7
patent, 1.6
patents, 1.8-10
reinvention by Reeves, 1.8
solid state repeater, Wrathall, 1.15
theory, 1.5-6
voice channels, copper cable pairs, 1.15
PCM DAC, architecture, 3.30
PCM facsimile system, patent, 3.47
Peak glitch area, DAC, 2.82
Peak spurious component, 2.115
Pease, Bob, 9.125
Pease, Robert A., 9.23, 9.213
PECL, 2.2, 6.96
standards, 9.184
PECL low-jitter receiver/driver, 6.96
Pedestal, 2.110, 2.111, 2.112
Pedestal error, SHA, 7.95
Pedestall, 2.100
Peetz, Bruce E., 5.88
Pericom Semiconductor Corporation, 9.197
Personal digital assistants, 8.100
Peterson, E., 1.18, 3.37, 3.105, 7.111, 8.59
Peterson, J., 1.47, 3.105
Phase accumulator, 8.160
Phase-frequency detector, 8.144
Phase jitter, in sampling clock, 9.39
Phase-locked loop, 6.92-94, 8.145, 8.159
design, 6.94
Phase noise, 2.71
definition, 6.86
jitter, calculation, 6.88, 6.90
oscillator, 6.86-94
sampling clock, sinewave, 6.87
Phased array radar receiver, 1.23
Phillips Laboratories, 3.109
Pierce, J.R., 1.18, 2.90
Pin count, 4.21
Pin socket, 9.31, 9.205, 9.207
parasitic effects, 9.205
Ping-pong high-speed DAC, 3.35
Pipelined ADC, 2.113, 3.61-78, 3.88
Pipelined architecture, 3.68
Pipelining, 2.106, 2.111
Pixel, 8.85
Planar process, 1.14-15, 4.4
Plassche, R.J. van de, 3.136
Plassche, Rudy J. van de, 3.107
Plassche, Rudy van de, 2.116-117, 3.139, 3.140,
5.90-91
PLL, grounding DSP, 9.43-44
PMOS:
pass device, 7.31-32
transistor current switch, 3.22-23
Index 35
ANALOG-DIGITAL CONVERSION
PN4117, JFET diode, 9.95
PNP/NPN, pass device, 7.31-32
Pohlmann, Ken C., 8.74
Pole-splitting, 7.42
Pole splitting, 9.71
anyCAP topology, 7.42-43
basic topology, 7.42
Polycarbonate capacitor, 9.8
Polyester capacitor, 9.8
Polypropylene capacitor, 9.8
Polystyrene capacitor, 9.8
Positive emitter coupled logic, see PECL
Positive full-scale, 2.104
Positive-true, 2.104-105
Potentiometer, 2.2, 9.15
digital, 6.48, 8.49-58
3-bit CMOS string DAC, diagram, 8.50
passive component, 9.1
trimming, 9.15
Poulin, Michael, 8.74, 8.104
Poulton, K., 8.157
Power Consideration Discussions, 9.139
Power conversion efficiency, 9.65
Power-down, ADC status, 3.41
Power line decoupling, resonant circuit, 9.20
Power measurement, basics, 8.22-23
Power meter, ADC application, 8.22-25
Power-on circuitry, 6.47
Power plane, 9.30-32
Power supply:
analog, 9.65-91
regulation priorities, 9.65
analog ready, 9.87
analog systems, 9.65-91
conditioning, summary, 9.90
filter, ferrite, 9.86-87
linear IC regulation, 9.66
low dropout regulator, 9.70-74
noise, 9.65
reduction and filtering, 9.81-90
noise reduction and filtering, 9.81-90
bypass/decoupling, 9.89-90
capacitor, 9.82-85
card entry filter, 9.87-88
ferrite, 9.86-87
rail bypass/distribution filter, 9.88
pass device, 9.66-68
regulator with adjustable voltage ICs, 9.68-69
switching, noise, 9.81-90
voltage regulator, 9.66-68
Power-supply rejection ratio, see PSRR
Power-up sequencing, 9.195
Poynton, Charles, 8.104
Pratt, Bill, 5.87
Preamplifier, 3.52-53
Precision analog microcontroller, 1.63, 8.177-191
Precision measurement:
sensor conditioning, 8.1-26
sigma-delta ADC, applications, 8.2-6
Index 36
Precision Monolithics, 1.33
Precision Resistor Co., Inc., 9.23
Preston Scientific, 1.24
Principles of Pulse Code Modulation, 1.2
Printed circuit board, see PCB
Proakis, John G., 5.89
Process gain, 2.40, 8.113, 8.118
ADC, FFT output, 5.55
DAC, 5.20
Process support protection, 9.195
Programmable gain amplifier, 1.55
alternate configuration, 7.78
poor design, 7.77
Prototyping, 9.199-213
analog, key points, 9.199
and breadboarding, 9.199-213
deadbug, 9.200-202
milled PCB, 9.203-205
PCB design, 9.206
solder-mount, 9.202-203
summary, 9.212
Pseudo-color, 8-bit RGB graphics system, 8.87-88
Pseudo-Gray code, 1.13, 2.7, 3.48
PSpice diode models, 9.95-96
PSRR, 2.111
PTM, constant pulse amplitude, 1.8
Pulldown resistor, 6.8
PulSAR family, SAR ADCs, 3.53
PulSAR series, 3.60
Pulse code modulation:
digital audio, 8.63
see also PCM
Pulse current response, 7.22-24
Pulse Engineering B4001 choke, 9.162
Pulse Engineering, Inc., 9.178
Pulse time modulation, see PTM
Pulse-width-modulated, pulse control, 3.88
Pulse width modulated, see PWM
PWM, pulse-width-modulated, 3.28-29, 3.88
PWM DAC, 3.28-29
PWM pulse, in Reeves' ADC and DAC, 1.10
Q
QS3384 data sheet, Integrated Device Technology
(IDT), Inc., 9.197
QSPI, serial interface, 6.51
Quad-slope architecture, in ADC, 3.97
Quad-slope converter, 2.111
Quad switch, 3.16-17
DAC with thin film resistor network, diagram,
1.26
Quadrature modulation, 8.145
Quadrature signal processing, 8.38
Quality factor, inductor, 9.21-22
Quantization:
error, 2.14, 2.38, 2.111
root-mean-square, 2.38
sigma-delta ADC, 3.115
table, 2.13
INDEX
uncertainty, 2.4, 2.14, 5.28
using delta modulation, 3.110
Quantization noise, 2.37-45, 2.59-60, 2.72,
3.119, 8.126, 8.165-166
frequency content, 2.41
function of time, 2.38
sigma-delta ADC, 3.115
Quantizing uncertainty, 2.97, 2.111
Quartz crystal oscillator, 2.71
QuickStart, MicroConverter development tool,
8.186
QXGA, electronic display standard, 8.86
R
R-2R DAC, 3.12-18
3-bit binary, 3.26
resistor ladder network, diagram, 3.12
R-2R ladder network, trimming, 3.19
Rabbits, 3.45
ADC, 2.76
Rabiner, L.R., 5.89
Rack, A.J., 3.30
Radiation, Inc., 1.23
Radio frequency interference, see RFI
Radix-2 algorithm, 5.54
Rail bypass/distribution filter, 9.88
diagram, 9.88
power supply noise reduction and filtering,
9.88
Rainey, Paul M., 1.5, 1.17, 3.9, 3.36,
3.47, 3.104
Raltron Electronics Corporation, 6.98
RAM-DAC, high-speed video, 1.49
RAM-DAC family, 1.57
Ramachandran, R., 3.106
Ramirez, R.W., 5.89
Ramp run-up ADC, 3.89-90
diagram, 3.90
Ramp voltage, 3.88
Random noise, 2.109
Rappaport, Andy, 9.23
Raster scan, 8.86
Ratiometric, 2.111
Ratiometric converter, 2.111
Raytheon Computer, 1.23-24
RCD Components, Inc., 9.23
RDACs, 9.15
RDC:
resolver-to-digital converter, 3.91, 3.99,
3.101-102
diagram, 3.102
tracking, 3.103
type-2 servo loop, 3.103
Reay, Richard J., 7.60
Receive signal processing, in wideband receiver,
diagram, 8.115
Receive signal processor, 8.107
Receiver design, 8.109
digital processing at baseband, 8.109-110
Recirculating subranging ADC, 3.74
Recovery time, DAC, 2.81
Rectangular, window function, 5.58
Redcor Corporation, 1.23-24
Redmond, Catherine, 9.181, 9.197
Redundant bits, 3.64
Reeves Instruments, 1.24
Reeves, A.H., 3.28, 3.37, 7.91, 8.59
5-bit counting ADC, 3.88
Reeves, Alec Harley, 1.8-10, 1.18, 3.105, 4.9,
7.111, 8.74
Reeves, Alec Hartley, 4.2
Reference noise:
bandwidth, 7.18
performance, circuit, 7.20
requirements, table, 7.19
Reference white, 1.53
Reflected binary code, 1.13, 3.47
Reflection, off shielding material, 9.149
Reflective switch, 7.79
Regeneration time constant, 3.45
Regular pulse excitation, 8.138
Regulated output charge-pump voltage converter,
9.75-77
Regulator controller, differences, 7.52-53
Reichenbacher, P., 9.23, 9.63
Rempfer, William C., 9.63
Repetitive code patterns, ADC testing, 5.41
Residue amplifier offset error, 3.67
Residue output, 3.78
Resistor:
aging, 9.14
comparison, chart, 9.16
comparisons, 9.16
discrete, 9.16
excess noise, 9.14-15
failure mechanisms, 9.14
mismatched, error source, 9.9
network, 9.16
parasitics, 9.11-12
passive component, 9.1
power dissipation, error source, 9.10
ratiometrical precision, 4.11
temperature-related errors, 9.11
thermoelectric effects, 9.12-14
types, 9.9
voltage sensitivity, 9.14
Resistor noise, 2.43
Resistor-transistor-logic, see RTL
Resolution, 2.112
DAC, 5.1
no missing codes, 2.109, 2.112
Resolver, 2.2
diagram, 3.100
Resolver-to-digital converter, 3.91, 3.99-103
ADC, 3.99-103
Resonant circuit, power line decoupling, 9.20
Resonator, replacing integrator, for bandpass
sigma-delta ADC, 3.132
Index 37
ANALOG-DIGITAL CONVERSION
Retrace factor, 8.86
Reverse junction breakdown, 9.104
RF transformers, noise figure improvement, 2.66
RFI, rectification, sensitivity, 9.155
RFI rectification, 9.155
device susceptibility, 9.156
op amp and in-amp,
sensitivity, summary, 9.157
sensitivity testing, 9.155-157
proportional to interfering signal amplitude,
9.158
reduction, using op amp and in-amp circuits,
9.158
RFI Rectification Test Configuration, 9.156
Rheostat, 8.50
Rich, Alan, 9.63, 9.178
Right-justified data, 2.112
Ringing, 9.17-20, 9.20
voltage reference, 7.23
Risetime, DAC, 5.16
Ritchie, G.R., 3.37
RMS input noise, 2.45
RMS jitter:
calculation, 6.89
versis analog input frequency, ENOB, 6.85
RMS noise:
aperture jitter, 5.72
measurement, 5.75
RMS quantization error, 2.38
RMS quantization noise, 3.115
Roberts, Neil, 6.98
Robertson, Dave, 4.19, 4.21, 8.156
Robin, Michael, 8.74, 8.104
Rohde & Schwarz, Inc., 5.25
Rohde, Ulrich L., 6.98, 8.175
Rollenhagen, D.C., 5.87
Root-mean-square, see RMS
Rorabaugh, C. Britton, 5.89
Ross, Ian M., 4.9
Rotating transformer, 3.100
RS-232, 9.121
RTL, in anti-ballistic missile system
electronics, 1.23
Ruscak, Stephen, 8.156
Ruscak, Steve, 2.90
Rutten, Ivo W.J.M., 3.107
S
S/N+D, see SINAD
"S" series surface mount current sensing
resistors, 7.60
SADC, subranging ADC, 3.64-65, 3.67
Sallen, R.P., 3.78
Sample-and-hold, see SHA
Sample-and-hold amplifier, see SHA
Sample rate converter, 8.70-73
concepts, 8.71
Sample-to-hold offset, 2.100, 2.111, 2.112
Sample-to-sample variation, in CCD, 8.97
Index 38
Sampled-aperiodic signal, in FFT, 5.52
Sampled data system:
block diagram, 2.23
fundamentals, 2.1-117
Sampled-periodic signal, in FFT, 5.52
Sampling:
bandpass, 2.31-32
harmonic, 2.31-32
IF, 2.31-32
Nyquist criteria, 2.27-29
SHA need, 2.24-26
theory, 2.23-25
Sampling ADC, 2.112
Sampling clock, 2.112, 6.83-98
ADC input, 3.41
circuitry, grounding, 9.38
differential,
driving input, 6.995-997
input driving, 6.95-97
distribution, digital to analog ground planes,
diagram, 9.40
encode, 2.103
generation, 6.83-98
grounding, 9.38-40, 9.38-41
"hybrid" generator, 6.94-95
jitter, 2.72, 6.83
effect on ADC SNR, 9.39
effects, 2.70
low jitter single-ended to differential,
diagram, 6.96
phase jitter, 9.39
phase noise, sinewave, 6.87
pulsewidth/duty cycle, 2.103
ratio to input frequency, SFDR, 2.42
ratio to output frequency on 12-bit DAC SFDR,
8.166
summary, 6.97
Sampling frequency, 2.112
Sampling rate, 2.108
criteria, 1.5
Sampling system, simultaneous, 8.38-40
Sampling theory:
basics, 2.23
discrete time sampling, 2.24
finite amplitude resolution due to
quantization, 2.24
Samueli, Henry, 8.175-176
Sanyo, 9.91
SAR, 2.114
logic function, implementation, 3.59
SAR ADC, 3.11, 3.53-61, 3.91, 6.50
algorithm, 3.57
algorithm analogy, 1.27
with capacitive binary-weighted DAC, 3.12
development summary, 1.28
diagram, 1.28
dynamic transient loads, 7.23-24
fundamental timing, diagram, 3.53-54
by Schelleng, 3.58
INDEX
single-supply, resolution/conversion times,
table, 3.60
superposition, 5.34
switched capacitor DAC, 3.55
terminology, 3.57
timing, 3.54-55
SAR logic IC, invention, 1.25
SAR MicroConverter products, 8.178
SAR register logic IC, invention, 1.25
Sauerwald, Mark, 9.63
Sawtooth error waveform, 5.32-33
Scaled reference, 7.20-22
Schafer, R.W., 5.89
Scharf, Brad W., 4.19
Schelleng, J.C., 3.57-59
Schelleng, John, 3.9-10
Schelleng, John C., 3.36, 3.105
Schindler, H.R., 3.104
Schmid, Hermann, 2.116, 3.139, 5.90
Schmitt trigger, 8.37
Schoeff, John A., 3.37
Schoenwetter, Howard K., 5.25
Schottky diode, 1.24, 1.41, 2.94, 5.16, 5.76,
6.96-97, 7.88, 7.103, 9.34, 9.42-44, 9.94-96,
9.103, 9.108-109
Schownwetter, H.K., 5.87
Schreier, Richard, 3.138
Schultz, Thomas W., 8.191
Scott-T transformer, 3.101
SDA6020, 6-bit 50-MSPS flash ADC, 1.52
SDC, synchro-to-digital converter, 3.91
SDC1700, synchro-to-digital converter, 1.46
Sears, R.W., 1.11, 1.18, 2.22, 3.47, 3.104
SECAM, 8.77
Segmentation, 3.18-23
Segmented ADC, 8.59
Segmented current-output DAC, diagrams, 3.21
Segmented DAC, 3.18-23, 8.59
Segmented unbuffered string DAC, 3.20
Seitzer, Dieter, 3.107
Selector, 3.57, 3.59
Semiconductor, junction temperature, 9.127
Semiconductor process, range, diagram, 4.28
Sensitivity, 8.119
Sensor, conditioning, 8.9
Sequential coder, 1.25, 3.57
Serial bit-per-stage binary ADC, 3.78-87
Serial data interface, 8.81
Serial-Gray converter, 3.81
Serial output, 2.112
Servo-loop tester, 5.36
computer-based, 5.36-38
diagram, 5.37
Servo-loop transition test, ADC, 5.35-36
Settling time, 2.46, 2.115, 3.80, 5.16-17,
5.76-77
ADC, 2.112, 5.76-77
DAC, 2.81, 2.81-82, 2.112, 5.13, 5.13-14
full-scale, definitions, 5.13-14
function of time constant, 2.75
measurement, 5.76
oscilloscope, 5.15
multiplexer, 2.74
output, 2.112
overdrive, 5.15
Settling time error, SHA, 7.95
74ACTQ240, Fairchild driver, 9.172
74FCT3807/A, IDT driver, 9.172
7400-series TTL logic, 4.11
7400TTL:
transistor-transistor-logic, 1.23
RCA, 1.24
SFDR, 1.49, 1.55, 2.46, 2.51-53, 2.84, 2.113,
3.32, 5.17
12-bit DAC, sampling clock and output
frequency, 5.22
ADC, 2.41
clock frequency, worst harmonic, 5.24
DAC, 2.83-86
measurement, 2.85
data converter, 6.3
measurement in DAC, 5.19
measurement with analog spectrum analyzer,
2.86-87
multi-tone, 2.56-57, 2.108
two tone, 2.115
SHA, 1.55, 2.24-26, 7.91
acquisition time, 8.33
in ADC, FFT processing gain, 2.43
amplifier, function, 2.24-26
aperture delay, 7.96
aperture delay time, 7.96
aperture jitter, 7.97
aperture uncertainty, 7.97
applications, 7.108-110
architectures, 7.102-105
open-loop, 7.102-103
basic operation, 7.93-94
circuit, 7.91-111
DAC deglitcher, 7.109
dielectric absorption, 7.100, 9.4
differential switching, 7.104
driving ADCs, 7.108
droop error, 3.67
effective aperture delay time, 7.96
error sources, 7.94
function, 2.25
hold mode, 2.25
hold mode specifications, 7.99-102
internal circuit, for IC ADCs, 7.104-108
minimizing DAC glitches, 7.108
multiple,
data distribution system, 7.110
for simultaneous sampling, 7.109
output, jitter effects, 7.98
in pipelined delay, 7.110
sample mode, 2.25
in sampling, 2.24-26
Index 39
ANALOG-DIGITAL CONVERSION
in SAR ADC, 3.53
settling time error, 3.67
specifications, 7.94
stray capacitance, 7.101
switched capacitor CMOS, circuit, 7.106
synchronous sampling clock delay, 7.97
track mode specifications, 7.94-95
bandwidth, 7.94
distortion, 7.95
gain, 7.94
noise, 7.95
nonlinearity, 7.94
offset, 7.94
settling time, 7.95
slew rate, 7.95
track-to-hold mode specifications, 7.95-99
versus THA, 2.25
virtual ground design, guard shield, 7.100
waveforms, 7.96
definitions, 2.69
SHA circuit, 7.91-111, 7.93
applications, 7.108-111
architectures, 7.102-105
basic operation, 7.93-94
history, 7.91-93
hold mode specification, 7.99-102
hold-to-track transition specifications, 7.102
internal circuits, 7.105-108
internal timing, 7.96
track mode specifications, 7.94-95
track-to-hold mode specifications, 7.95-99
Shadow mask:
binary-coded, 1.12-13, 2.7
electron beam coder, for binary and Gray code,
1.12
Shannon decoder, 3.31
Shannon-Rack decoder, 1.11, 3.31
Shannon, C.E., 1.17, 1.18, 2.35, 2.90, 3.30
Shannon, Claude, 2.27
Shannon, Claude E., 3.107
SHARC DSP, 9.170, 9.174-175
bi-directional transmission, source
termination, 9.175
Sheet resistance, calculation, 9.26
Sheingold, Dan, 1.33-34, 1.47, 2.1, 2.22, 2.91,
2.97, 2.116, 3.108, 3.112-113, 3.139, 4.2, 5.1,
5.25, 5.87, 5.88, 5.90, 7.26
Shielding, 9.1
absorption loss, 9.149
effectiveness, calculation, 9.150
magnetic field, 9.20
review, 9.148-151
Shockley, W., 1.19, 4.9
Shockley, William, 1.15, 4.3-4
Shunt, voltage reference, 7.2
Siemens, 1.52
Sigma-delta ADC, 2.112
advantages, 3.112
architecture, 3.112
Index 40
benefits, 8.1
timeline, 3.112
architecture timeline, 1.30
bandpass, 3.132-133
basics, 3.114-120
characteristics, 3.115
on chip features, 8.2
choice of name, 3.113-114
CMOS process, 4.15
decimation, 3.114
for digital audio, 8.64
digital filter, 2.74, 3.114, 3.125-126
in digital temperature sensor, 8.14
first-order,
diagram, 3.117
modulator, idling patterns, 3.122
high-density digital VLSI, 3.114
high resolution, 3.127-131, 8.1
applications, 8.3
driving, 6.15-16
high speed clock, 9.30
linear, 8.59
modulator, 3.117
ENOB, 3.120
frequency domain linearized model, 3.119
quantization noise shaping, 3.120
repetitive bit pattern, 3.122
waveforms, 3.118
modulator loop, higher order, 3.123
multi-bit, 3.123-125
multiplexing inputs, 8.36-38
oversampling, 3.114
performance,
chop mode disabled, 8.183
normal, 8.182
precision measurement, 8.2-6
quantization noise shaping, 3.114
second-order,
modulator:
block diagram, 3.120
idling patterns, 3.122
single and multibit, 3.111
SNR versus oversampling, loops, 3.121
switched capacitor input, circuit, 7.22
synchronous voltage-to-frequency converter,
3.118
Sigma-delta architecture, summary, 3.134-135
Sigma-delta converter, 3.109-140
ADC basics, 3.114-120
bandpass, 3.132-133
DAC, 3.133-134
high resolution measurement ADC, 3.127-131
higher order loop, 3.123
history, 3.109-114
idle tone, 3.121-123
multibit, 3.123-125
multistage noise shaping, 3.126-127
Sigma-delta DAC, 3.133-134
CMOS process, 4.15
INDEX
for digital audio, 8.64
interpolation filter, 3.23
linear, 8.59
schematic, 3.133
Sigma-delta MicroConverters, 16-/24-bit, 1.65-66
SigmaDSP family, audio DACs, 8.68
Sign-magnitude code, 2.11, 2.14
Sign-magnitude converter, 2.14
Signal:
aliasing, 2.27
in FFT, 5.52
undersampled, Nyquist zone, 2.34
Signal return current, 9.28-30
in PCB, 9.28-30
Signal-to-noise-and-distortion ratio, see SINAD
Signal-to-noise ratio, see SNR
Signal trace routing, 9.18
correct, 9.19
Signetics, 1.33
Signetics 521, 3.49
Sikimoto, T., 3.37
Silence descriptor, 8.138
Silicon germanium, data converter role, 4.17
Silicon transistor, 4.4
Siliconix PAD/JPAD/SSTPAD series low leakage
Pico-amp diodes, Vishay/Siliconix, 9.125
Simpson, Chester, 7.60
Simultaneous sampling system, 8.38-40
SINAD, 1.49, 1.55, 2.46, 2.103, 2.113, 5.28
calculation from SNR and THD, for DAC, 5.21
data converter, 6.3
FFT, noise and distortion, calculation,
5.64
FPBW, 2.99
signal-to-noise-and-distortion, 2.46, 2.48-50,
2.103, 2.113
Sinewave, probability density function, 5.42
Sinewave converter, 8.72
Sinewave curve fitting:
for ADC ENOB, 5.49-50
test setup, 5.50
Sinewave generator, 5.82
Sinewave histogram DNL and INL, for ADC,
5.43-44
Sinewave input, low-distortion, 5.66-68
Singer, Larry, 2.90
Single-carrier narrowband system, 8.122
Single-carrier receiver, chart, 8.131
Single-ended current-to-voltage conversion,
6.73-75
Single-ended single-supply DC-coupled level
shifter, diagram, 6.12
Single-ended to differential conversion, using
RF transformer, 6.97
Single loop upconversion, 8.170
Single NPN, pass device, 7.31-32
Single PNP, pass device, 7.31-32
Single-pole switch, 3.4
Single-shot mode, 6.49-50
Single-slope conversion, 2.113
Skew glitch, 3.20
Skin effect, 9.46-48, 9.49
PCB, 9.46-48
Skinny connection, 9.32
Slattery, Colm, 8.175
Sleep, 6.48-50
ADC status, 3.41
Slew rate, 2.113
Slewing time, DAC, 2.81
Slope clipping, 3.110
Small signal bandwidth, 2.50
Smith, B., 3.37
Smith, B.D., 1.28, 3.9-10, 3.13, 3.26, 3.36,
3.59, 3.81, 3.105, 3.106
Smith, B.K., 3.9
Smith, Bruce K., 3.36
Smith, D.B., 3.78
Smith, Steven W., 5.89
SMPTE 125M, 8.104
SMPTE 170M, monochrome television standard,
8.76
SMPTE 244M, 8.104
standard for NTSC signals, 8.78
SMPTE 259M, 8.104
standard for NTSC signals, 8.78, 8.81
SMPTE 292M, 8.104
Snelgrove, M., 3.138
SNR, 1.49, 1.55, 2.72, 5.17, 5.28
ADC,
aperture and sampling clock jitter effects,
2.71
sampling clock jitter effect, 9.39
and broadband aperture jitter, 6.83
DAC, 2.83-86
spectrum analyzer, 5.20
data converter, 6.3
degradation from jitter, 9.39
digital audio, 8.60-61
FFT, values, 5.66
measurement with analog spectrum analyzer,
2.86-87
sampling clock jitter effects, 7.98
signal-to-noise ratio, 2.39, 2.46, 2.48-50,
5.17
theoretical, 2.39
total, equation, 2.72-73
without harmonics, 2.113
Soakage, 9.3
Socket, 9.200, 9.205-206
low-profile, 9.205
problems, 9.205-206
Sockolov, Steve, 9.23
Sodini, C.G., 3.137
Softcell family, 8.134, 8.136
SoftFone chipset, 8.140-145
SoftFone radio chipsets, 8.140-145
Software radio, 8.107-145
ADC dynamic range, dither, 8.126-131
Index 41
ANALOG-DIGITAL CONVERSION
evolution, 8.108
IF sampling, 8.107-157
receiver, digital baseband processing,
8.109-110
SOIC guard layout, 9.56
Solder-Mount:
breadboarding system, 9.202
prototyping, 9.202-203
board, 9.203
Solid-state:
key developments, 1.15, 4.4
and op amp, history, 1.13-16
Solomon, Jim, 7.60
Sonet/SDH OC-48, using AD8152, 7.83-84
SOT-223 packaging, reduction, 7.51
Souders, T. Michael, 5.88
Souders, Thomas, 5.87
Southern and F-Dyne film capacitors, 9.23
Span, 2.104
Sparkle code, 1.52, 2.76-80, 3.45
ADC, 2.76-80
SPDT switch, 3.3
Specification MIL-PRF-123B, 9.23
Specification MIL-PRF-19978G, 9.23
Specifications, definitions, 2.97-117
Spectral leakage, ADC testing, 5.55
Spectral output, code-dependent glitches, effect,
2.84
Spectrum:
in-band SFDR, 2.51
out-of-band SFDR, 2.51
Spectrum analyzer:
DAC distortion and SNR measurement, 5.20
sensitivity to input overdrive, 5.68
Speech decoder, 8.136
Speech encoder, 8.136
SPI, serial interface, 6.51
Sprague, Clarence A., 3.36
Spread-spectrum, 8.116
Spurious free dynamic range, 2.113, 5.17
Stability, 2.113
Staffin, R., 3.104
Staffin, Robert, 3.48
Staircase, 2.113
Staircase generator, 5.82
Standard IPC-2141, 9.178
Standby mode, 6.48, 6.50
ADC status, 3.41
Staniforth, Alan, 9.178
Star ground, 9.31, 9.34
Stata, Ray, 1.24, 1.33, 1.47, 4.11
Static error, DAC, measurement methods, 5.1
Status, 2.101
Stewart, James W., 8.191
Stop, Russell, 3.107, 7.111
Straight binary, coding scheme, 2.14
Strain gage, 2.2
Stray capacitance, 9.58-59
PCBs, 9.57-59
Index 42
SHA, 7.101
Stray inductance, 9.17
String DAC, 3.4, 3.18
architecture for digital potentiometer, 8.49
INL, 5.11
INL trimming, 3.6
no superposition, 5.10
resistors, 3.6
unbuffered, segmented, 3.19-20
Strip inductance, 9.17
Stroud, Tim, 8.105
Submicron CMOS, 4.14
Subranging ADC, 2.113, 3.11, 3.61-78, 3.88
Subranging converter, 2.104
Substrate PNP, 4.11
Successive approximation, see SAR
Superheterodyne, 8.108, 8.142-143
Superhomodyne, 8.142-144
Superposition:
DAC,
bit errors, 5.5
DNL and INL, 5.6
Supply range, 7.17-18
Supply voltage, 4.21
shrinking, effects, 4.27
Susskind, Alfred K., 2.116, 3.139, 5.90
SVFC:
clock frequency, 3.94
nonlinearity, 3.95
problems, 3.94
quantization, 3.95
synchronous VFC, 3.93-94
temperature stability, 3.94
waveforms, 3.95
SVGA, electronic display standard, 8.86
Swanson, E.J., 3.137
Swart, Leland K., 3.36
Sweetland, Karl, 3.36, 3.137
Switch:
from Analog Devices, 7.84-85
CMOS,
1-GHz, 7.78-79
application, 7.73-78
basics, 7.62-64
error sources, 7.65-73
CMOS and DMOS, 1.41
digital crosspoint, 7.83-84
hold mode, 6.19-20
track mode, 6.19-20
video, and multiplexers, 7.80-82
video crosspoint, 7.82-83
Switch capacitance, 7.70
Switches and multiplexer, CMOS process, 7.62
Switching regulator, 9.79-80
analog ready, 9.82
capacitor, 9.82-85
peak amplitudes, 9.82
power supply noise, reducing, 9.82
Switching time, 2.114, 8.28
INDEX
DAC, 2.81
Switching transients, charge-balance VFC, 3.93
SXGA, electronic display standard, 8.86
Symmetric stripline, 9.167
capacitance, 9.168
transmission line, 9.167-168
formation, 9.168
Sync, 1.53
Synchro, 2.2, 3.99-103
diagram, 3.100
Synchro ADC, 3.99-103
Synchro-to-digital converter, 3.91
Synchronous sampling clock delay, SHA, 7.97
Synchronous VFC, 3.91, 3.93
System Management Bus, 8.21
T
T-1 carrier system, Bell Labs, 1.16
T-Carrier digital transmission system, 8.137
T-Tech, Inc., 9.213
Tadewald, T., 9.23, 9.63
Talambiras, Robert P., 1.31, 3.36, 3.105, 3.107
Tan, Nianxiong Nick, 2.117, 3.140, 5.91
Tan, N.N., 8.157
Tantalum and Ceramic Surface Mount Capacitor
Catalog, 9.23
Tantalum capacitor, 9.8
Tantalum Electrolytic and Ceramic Capacitor
Families, 9.91
Tant, M.J., 2.90
Tartaglia, mathematician, 3.56
TDC-1007J:
8-bit 30-MSPS video-speed flash ADC, 1.40,
1.45, 1.52
TRW LSI Division, 3.49
TDC-1014J:
6-bit 30-MSPS video-speed flash ADC, 1.40,
1.45
TRW LSI Division, 3.49
TDC-1016J, 6-bit 30-MSPS flash ADC, 1.40, 1.52
TDC-1048, 8-bit 30-MSPS flash ADC, 1.52
TDM, telegraph, 1.4
Teal, Gordon, 4.3-4
Teflon capacitor, 9.8
Tektronix, Inc., 5.25
Teledyne Philbrick, 1.33
Telegraph, electric, history, 1.3
Telegraph multiplexing system, 1.3
Telephone:
cellular, handsets, 8.136-139
most significant communication event, 1.3
NPR, 5.69
patent, 1.4
Television, standard interlace format, 8.75
Telmos, 1.52
Temes, Gabor C., 2.116, 3.137, 3.139, 5.90
Tempco:
gain, 2.114
linearity, 2.114
offset, 2.115
Temperature, capacitor, 9.6
Temperature coefficient, 2.113, 2.114
Temperature measurement, digital, direct, 8.14-19
Temperature retrace, resistor, 9.11
Temperature sensor, microprocessor substrate,
8.19-22
10 percent white, 1.53
Testability, 4.22
Tewksbury, Stuart K., 5.87
Texas Instruments, 1.15, 1.24, 4.3-4
THA, 2.25
for deglitching DAC, 3.32
Thandi, Gurgit, 9.91
THD, 2.46-48, 2.106, 3.32, 5.17, 5.28
data converter, 6.3
THD+N, 2.46-48, 2.106, 5.17
data converter, 6.3
digital audio, 8.60-61
Theoretical SNR, jitter, 6.84
Thermal basics, 9.127-128
Thermal Coastline packaging, 7.39, 7.48-49
Thermal EMF, 9.12
Thermal management, 9.127-139
basics, 9.127-128
Thermal noise, 8.124, 9.14-15
Thermal rating curves:
for BATWING and PSOP3 packages, 9.131
for standard and ADI Thermal Coastline 8-pin
SOIC pppackages, 9.130
Thermal relationships, table, 9.128
Thermal resistance, 9.127
considerations, 9.131
junction and ambient air, 9.128
Thermal tail, 2.115
Thermal turbulence, 9.14
Thermocouple, 2.2
conditioning, 8.12-14
effect, 9.12
EMF, effects, diagram, 9.13
measurement design, 8.13-14
resistor, diagram, 9.13
type K, conditioning, 8.12-14
Thermoelectric effect, 9.12-14
Thermometer DAC, 3.6-9
3-bit, in current-output segmented DAC, 3.21
current output, diagram, 3.7
high speed, current outputs, 3.8
Thevenin impedance, 9.172
Thick film resistor, 9.16
Thin film laser trimming, sigma-delta ADC, 3.124
Thin-film resistor, 9.16
in in-amp, 9.105
process, 4.11-12
Thin-film wafer trimmed resistor, 4.12
Threshold, 2.104
THS-0025, 25-ns SHA, 1.46
THS-0300, 300-ns SHA, 1.46
TIA/EIA-644-A Standard, 9.179
Index 43
ANALOG-DIGITAL CONVERSION
Time division multiplexing, see TDM
Time-interleaved ADC:
digital post-processor, 8.146-155
matching requirements, 8.150
Time interleaving, 8.146, 8.154
Time-skew, 2.102
Timing, data converter, 2.95-96
TLM1070, 7-bit 20-MSPS flash ADC, 1.52
TMP05/TMP06:
data sheet, 8.26
digital output sensor, 8.14-17
circuit, 8.15
output format, 8.15
TMP06, digital output sensor, interfaced to
microcontroller, 8.16
Tolerance, 7.15, 7.18
capacitor, 9.6
Total harmonic distortion, see THD
Total harmonic distortion plus noise, see THD+N
Total unadjusted error, 2.115
Touchscreen:
construction, 8.100
digitizer, 8.100-103
voltages, absolute and ratiometric
measurements, 8.101
Touchscreen digitizer, 8.100-103
Trace, embedding, 9.169
Track-and-hold, see THA
Track-and-hold circuit, 7.91
Track mode distortion, 7.101
Tracking ADC, 3.90-91
Transfer function:
data converter, graphs, 2.14
folding stage, 3.81
Transformer coupling, 6.24
Transient error, SHA, 7.95
Transient response, 2.73, 2.73-75, 2.115, 8.33
Transient voltage suppressor, 9.109, 9.124
Transistor, germanium, invention, 1.14
Transistor-transistor logic, 2.2
Transmission line, 9.48-49, 9.165
clock distribution, 9.174
PCB, as controlled impedance conductor, 9.48
single, end termination, 9.175
symmetric stripline, PCB, 9.167-168
termination guidelines, 9.169-170
Transmission Systems for Communications, 1.17
Transmit DAC, 1.58
TransZorb, 9.124
clamp, 9.106
General Semiconductor, Inc., 9.126
Travis, Bill, 8.191
Trench-isolation, 9.111
CMOS switch, 7.89
Triboelectric effect, 9.117
TrimDAC, 1.58, 9.15
Trimming, 4.8, 4.11
ADC, 3.39
laser wafer, 4.12
Index 44
Trimpot, 9.15
Triple-slope architecture, in ADC, 3.97
TRW LSI Division, 1.33, 1.40, 1.45, 1.52
TTE, elliptic filters, 2.30
TTE, Inc., 2.35
TTL, 1.41, 2.2
standards, 9.184
Tukey, J.W., 5.89
Tunnel diode, 3.48
Turney, William J., 3.138
Two-converter interleaved FFT plot, 8.149
Two-converter time-interleaved 12-bit 400-MSPS
ADC, 8.148
Two-tone intermodulation distortion, 2.46, 2.53
Two-tone SFDR, 2.115
2N5457, JFET diode, 9.95-96
2502:
8-bit serial SAR IC, 1.41
Advanced Micro Devices and National
Semiconductor, 1.25
2503:
8-bit serial expandable SAR IC, 1.41
Advanced Micro Devices and National
Semiconductor, 1.25
2504:
12-bit serial expandable SAR IC, 1.41-42
Advanced Micro Devices and National
Semiconductor, 1.25
Twos complement code, 2.9, 2.11, 2.14
TxDAC, 1.57, 1.58, 4.25, 6.66, 6.70
clock-rate dependent power dissipation, 9.138
CMOS process, 4.15
communications, 5.13, 5.18
current switching, 3.22
interpolating, oversampling, block diagram,
2.89
testing, 5.46
in wideband radio, 8.132
Type 5MC Metallized Polycarbonate Capacitor,
Electronic Concepts, Inc., 9.91
Type EXC L leadless ferrite bead, 9.91
Type EXCEL leaded ferrite bead, 9.91
Type HFQ Alumninum Elecrolytic Capacitor,
Panasonic, 9.91
Type K thermocouple, 8.12-14
U
U-matic, videotape recorders, 8.62
Undersampling, 2.31-32
antialiasing filter, 2.33-34
and oversampling, process gain, 2.40-41
Understanding Common Mode Noise, 9.178
Unipolar converter, 2.14-15
zero TC, 2.114
UNIVAC computer, invention, 1.21
Upmall, 8.156
UXGA, electronic display standard, 8.86
INDEX
V
Vacuum tube:
data converter, 4.1-3
invention, 4.1
patent, 1.13
and op amp, history, 1.13-16
Vacuum tube binary DAC, 3.9
Van de Grift, Rob E.J., 3.107
Van de Plassche, R.J., 3.136
Van de Plassche, Rudy, 2.116-117, 3.139, 3.140,
5.90-91
Van de Plassche, Rudy J., 3.107
Van de Weg, H., 3.136
Van der Veen, Martien, 3.107
Van Doren, A., 1.31, 5.87
Van Mierlo, S., 3.109, 3.136
Variable frequency oscillator, see VFO
Variable phase shifter, in locked-histogram ADC
test setup, 5.71
Vassalli, Luca, 8.191
VCXO, voltage-controlled crystal oscillator, 6.91
Vector Electronic Company, 9.213
Vectorscope, 5.80
Veen, Martien van der, 3.107
Velazquez, S., 8.157
Verster, T.C., 3.64, 3.106
Vertical sync, 8.76
VFC, 2.104, 3.91-96, 8.14
applications, 3.96
charge-balance, 3.91
current-steering multivibrator, 3.91
waveforms, 3.95
VFO, 3.91
VGA, electronic display standard, 8.86
VHS-630, 6-bit 30-MSPS flash converter,
Computer
Labs Inc., 3.49
VHS-675, 6-bit 75-MSPS flash converter,
Computer
Labs Inc., 3.49
Video, analog and digital standards, 8.80
Video crosspoint switch, 7.82-83
Video DAC, properties, 8.88
Video decoder, specifications, 8.85
Video encoder, specifications, 8.85
Video RAM-DAC, 8.87, 8.90-91
Video switch, 7.80-82
Video testing, 5.78-83
ADC, 5.78-83
Vishay/Dale Resistors, 9.24
Vishay/Siliconix, 9.125
Viswanathan, T.R., 3.106
Viterbi coding, 8.137
Viterbi decoding, 8.137
Vito, Tom, 2.90
VLSI mixed-signal CMOS processing, 8.33
VM-700, Tektronix, 5.19
VM-5000, Tektronix, 5.19
Vocoder, 1.10
Voice activity detector, 8.138
Voiceband ADC, sigma-delta, 8.139
Voiceband codec, 8.65, 8.139
Voiceband digital audio, beginnings, 8.59
Voiceband telcom digital audio:
diagram, 8.60
standards, 8.60
Voldicon VF7, 8-bit 1-MSPS sampling ADC,
Adage,
1.24
Voltage-adjustable regulator, 9.68-69
Voltage compliance, 9.185
voltage tolerance, 9.185
internal, 9.195-196
Voltage-controlled crystal oscillator, 6.91
phase noise, 6.92
Voltage converter:
charge-pump, 9.74-75
regulated output, 9.75-77
Voltage doubler, 9.74
Voltage drop:
analysis, 9.28
signal leads, 9.27-28
Voltage follower protection circuit, 9.96-98
Voltage inverter, 9.74
Voltage-mode binary-weighted resistor DAC, 3.10
Voltage reference, 1.35
architectures, characteristics, 7.14
capacitive decoupling, 6.81
data converter, 6.79-81, 7.1-26
DC specifications, table, 7.18
design specifics, 6.81
drift, 7.16, 7.18
large capacitive load, 7.23
line sensitivity, 7.17-18
load sensitivity, 7.17-18
low noise, 7.24-25
noise, 7.18-20
precision, 7.1-2
issues, 7.1-2
pulse current response, 7.22-24
scaled reference, 7.20-22
shunt, 7.2
specifications, 7.15-25
standard hookup, diagram, 7.15
supply range, 7.17-18
temperature drift, accuracy, table, 7.16
three-terminal, 7.2
tolerance, 7.15, 7.18
transient loads, 7.23
trim, 7.14
two-terminal, 7.2
types, 7.2-4
Voltage regulator:
block diagram, 7.30
current underload, 7.29
grounding, 9.78-81
linear,
Index 45
ANALOG-DIGITAL CONVERSION
basics, 7.27-31, 9.66-68
low dropout, 7.27-60
low dropout, 9.70-74
adjustable voltage, 9.72-74
fixed voltage, 9.71-72
pass device, types, 7.31
pole-splitting topology, 7.42
positive leg series style, 7.27
thre terminal, circuit, 7.28
Voltage sensing, feedback, 9.27-28
Voltage sensitivity, resistor, 9.14
Voltage-to-frequency converter, see VFC
Voltage tolerance, 9.185
voltage compliance, 9.185
internal, 9.195-196
W
Wadell, Brian C., 9.179
Wainwright Instruments, 9.202
Wainwright Instruments GmbH, 9.213
Wainwright Instruments Inc., 9.213
Waldhauer, F.D., 3.106
Waldhaur, W.D., 3.84
Waltman, Ron, 2.90
Water metering system, binary weighted, 1.2
Waveform generator, 5.17
WCDMA, 2.57-58
Weaver, Lindsay A., 8.175
Weg, H. Van de, 3.136
Weigh scale:
analysis, using AD7730, 8.6-7
design analysis, 8.6-12
load cell characteristics, 8.7
fullscale output, 8.7
Welland, D.R., 3.137
Wenzel Associates, Inc., 6.98, 9.39
Wesco film capacitors, 9.23
Western Electric, 1.14
Wheable, Desmond, 3.108
Wide code, errors, 2.20
Wideband, definition, 8.114
Wideband DCMA, 2.57-58
Wideband digital receiver, 8.114-126
Wideband radio:
transmission, 8.132-136
transmitter, 8.132
architectures, 8.132
Widlar, Bob, 1.24, 4.11, 7.26, 7.60
Wikner, J. Jacob, 2.117, 3.140, 5.91
Wikner, J.J., 8.157
Wilhelm, Tim, 5.88
Williams, Jim, 9.213
Williamson, Russell, 8.191
Williams, Tim, 9.178
Window function, 5.57-58
Index 46
characteristics, 5.58
comparison, 5.59
frequency response, 5.58
Windowing, to reduce spectral leakage, 5.57
Wire inductance, 9.17
Wire microstrip, 9.165
Wireless air interface standards, wideband ADC
requirements, table, 8.126
Wireless communication:
evolution, chart, 8.116
standards, 8.116
Wirewound resistor, 9.16
Witte, Robert A., 2.90
Wold, Ivar, 1.47, 3.108
Wold, Peter I., 3.36
Wong, James, 9.23, 9.178
Wong, Thick C., 5.88
Woodward, Charles E., 2.90, 3.104
Wooley, B.A., 3.137
Wooley, Bruce, 3.137
Word, 2.2
Worst harmonic, 2.46-48
data converter, 6.3
Worst other spur, 2.115
Wrathall repeater, germanium transistors, 1.14-15
Wrathall, L.R., 1.14-15, 1.19
Wurcer, Scott, 9.23
X
XFCB:
high-speed complementary bipolar process, 1.61
for producing converters, 4.12
XFET, 6.80
reference, 7.11-15, 7.16
characteristics, 7.14
XGA, electronic display standard, 8.86
Y
Yasuda, Y., 3.136
Yester, Francis R., Jr., 3.138
Yield, 4.22
Young, F.M., 1.31
Young, Joe, 3.107, 7.111
Z
Zeltex, Inc., 1.24, 1.33
Zener diode, 1.24, 1.35, 1.39, 1.41, 1.42, 3.17,
7.3-4, 7.11, 7.19, 9.96-97, 9.106, 9.109, 9.124
monolithic, 7.3
Zeoli, G.W., 2.90
Zero error, 2.97
Zero TC, 2.114
Zuch, Eugene L., 2.116, 3.139, 5.87, 5.90
Zumbahlen, Hank, 8.58
INDEX
ANALOG DEVICES' PARTS INDEX
AD2S90, 3.103
AD29x, 7.20
AD38x, 7.15
AD39x, 7.15
AD42x, 7.20
AD43x, 7.20
AD52xx-series, 1.58
AD260, 9.114
AD261, 9.114
AD376, 1.53
AD386, 7.92
AD390, 1.50
AD431, 7.25
AD480, 4.12
AD510, 7.21
AD512, 7.21
AD550, 1.25-26, 1.38, 1.41, 3.15-17, 4.6
AD558, 1.50
AD561, 1.35, 1.38
AD562, 1.35, 1.38, 1.41, 1.42, 4.8
AD563, 1.35, 1.41
AD565, 1.35, 1.38, 1.39-40, 1.41, 4.8
AD565A, 1.35
AD569, 1.50
AD570, 1.39
AD571, 1.38, 1.40, 4.12
AD572, 1.42, 4.6-7
AD574, 1.39-40, 1.51, 1.59, 2.24, 3.41, 4.12,
6.49, 7.24, 7.92, 8.29
AD574A, 1.63
AD580, 7.5-6
AD582, 7.92
AD583, 7.92
AD584, 7.6
AD585, 7.92
AD586, 7.16, 7.18, 7.20
AD587, 7.19, 7.20
AD588, 7.15-16, 7.17-18
AD589, 7.5, 7.6, 7.20-21
AD592, 8.184-185
AD620, 8.9, 9.105-107, 9.161-162
AD621, 9.161-162
AD622, 9.161-162
AD623, 9.52, 9.108, 9.161
AD627, 9.108, 9.161
AD629, 9.51, 9.98-99
AD670, 1.51
AD671, 1.60
AD673, 1.51
AD674, 1.51
AD680, 7.5, 7.17
AD684, 7.91, 7.92
AD688, 7.17
AD768, 6.73
AD770, 1.52
AD780, 6.23, 7.5, 7.15, 7.17-18, 7.18, 7.24,
8.47, 8.184-185
AD781, 7.91
AD783, 7.91, 7.92
AD795, 9.100-101
AD797, 6.15, 7.20, 9.105, 9.156
AD817, 9.133
AD820, 8.47, 9.97
AD820/822, 7.21
AD827, 9.156
AD845, 9.156
AD850, 1.25-26, 1.41, 3.16-17
AD872, 1.61, 1.63
AD974, 3.60, 6.18
AD976, 6.18
AD977, 6.18
AD51xx-series, 1.58
AD76xx-series, 6.18
AD77xx-series, 6.15-16, 7.24-25, 9.30
AD92xx-series, 6.21, 6.29-30
AD158x-series, 7.18
AD185x-series, 3.133
AD746x-series, 6.18
AD771x-series, 1.62, 1.63
AD789x-series, 1.62, 6.18, 6.19
AD813x-series, 6.31, 6.33-34, 6.75
AD922x-series, 6.22
AD974x, 8.136
AD976x, 1.57
AD976x-series, 6.70
AD977x, 1.57
AD977x-series, 3.22, 6.70
AD978x, 8.136
AD978x-series, 8.135
AD985x, 8.171
AD985x-series, 3.22, 9.138
AD987x, 1.57
AD1170, 3.96
AD1175, 1.53, 1.54
AD1332, 1.53
AD1377, 1.53, 1.54
AD1382, 1.64
AD1385, 1.64
AD1580, 7.5, 7.6-7, 7.20-21
AD1582, 7.7
AD1582-1585 series, 7.5, 7.7, 7.15, 7.17, 7.23
AD1671, 1.60, 1.63
AD1674, 1.59, 1.63
AD1833, 8.70
AD1833C, 8.70
AD1834, 8.70
AD1835A, 8.70
AD1836A, 8.70
AD1836AC, 8.70
AD1837A, 8.70
Index 47
ANALOG-DIGITAL CONVERSION
AD1838A, 8.70
AD1839A, 8.69-70, 8.70
AD1852, 8.67
AD1853, 3.134, 6.75-76, 8.67
AD1854J, 8.67
AD1854K, 8.67
AD1855, 8.67
AD1856, 1.50
AD1857, 1.57, 1.58
AD1858, 1.57, 1.58
AD1859, 1.57, 1.58
AD1860, 1.50
AD1862, 3.32-33
AD1865, 1.56
AD1871, 3.124, 8.66
AD1879, 3.123
AD1890, 8.72
AD1896, 8.72
AD1938, 8.70
AD1953, 8.68
AD1955, 3.134, 8.66, 8.67
AD5170, 8.54
AD5172, 8.53-54
AD5173, 8.53-54, 8.56
AD5227, 8.56
AD5231, 5.11
AD5235, 5.11, 8.52-53
AD5245, 8.50-51, 8.55
AD5246, 8.50-51
AD5247, 8.50-51
AD5251, 8.52
AD5252, 8.52
AD5253, 8.52
AD5254, 8.52
AD5300, 8.42
AD5310, 8.42
AD5320, 8.42-43
AD5322, 6.62-64
AD5340, 6.64-65
AD5379, 8.44-45
AD5380, 1.65-66
AD5381, 1.65-66
AD5382, 1.65-66
AD5383, 1.65-66
AD5390, 1.65
AD5391, 1.65
AD5516, 8.44
AD5533B, 8.45-46
AD5535, 9.210, 9.211
AD5541, 8.47
AD5545/AD5555, 6.74
AD5570, 8.43
AD5660, 8.43
AD6521, 8.141
AD6522, 8.141
AD6600, 8.111, 8.131
AD6620, 8.111, 8.131, 8.136
AD6622, 8.135, 8.136
AD6623, 8.135, 8.136
Index 48
AD6624, 8.111, 8.131
AD6630, 8.131
AD6633, 8.135, 8.136
AD6634, 8.111, 8.131, 8.136
AD6635, 8.131, 8.136
AD6636, 8.131, 8.136
AD6640, 8.131
AD6640/44/45, 8.136
AD6644, 3.85, 8.131
AD6645, 1.65-66, 2.51-53, 2.56-57, 2.58,
2.64-66, 2.73, 3.77-78, 3.85, 4.12, 6.27-28,
6.38-40, 6.83, 6.97, 7.107, 8.117-120,
8.122-125, 8.128-129, 8.131, 8.146, 9.137-138
AD6650, 8.111, 8.131
AD6652, 8.111, 8.131
AD6654, 8.131
AD7001, 1.62, 1.63
AD7008, 1.57-58
AD7111, 2.112, 3.27-28
AD7226, 1.50
AD7240, 1.50
AD7245, 1.50
AD7311, 8.84
AD7450, 9.210
AD7450A, 6.35
AD7466, 6.17, 6.51-52
AD7467, 6.17, 6.51
AD7468, 6.17, 6.51
AD7482, 3.60
AD7484, 3.60
AD7490, 3.60
AD7500-series, 7.62
AD7520, 1.36, 1.38, 4.13
AD7524, 1.37-38, 1.38
AD7528, 1.50
AD7535, 1.50
AD7541, 1.36, 1.38
AD7545, 1.50
AD7546, 1.50
AD7550, 1.38, 1.40
AD7568, 1.56-57, 1.58
AD7570, 1.38, 1.40
AD7572, 1.51
AD7575, 1.51
AD7579, 1.51
AD7582, 1.51
AD7621, 1.65-66, 3.60, 3.61
AD7664, 1.65
AD7674, 1.65-66, 3.60-61, 6.42-43
AD7675, 3.61
AD7676, 3.61
AD7677, 3.60, 6.41-42
AD7678, 3.61
AD7679, 3.61
AD7710, 7.24-25
AD7730, 1.62, 1.63, 3.127-130, 6.15, 6.79,
8.2-6, 8.6-12, 8.9, 9.210
AD7732, 8.37
AD7734, 8.37
INDEX
AD7738, 8.37
AD7739, 8.36-38
AD7793, 8.12-14
AD7820, 1.51
AD7821, 1.51
AD7840, 1.50
AD7846, 1.50
AD7853/AD7853L, 6.55
AD7853L, 6.55-56
AD7854/AD7854L, 6.59-61
AD7865, 8.39-40
AD7870, 1.51
AD7871, 1.51
AD7873, 8.102
AD7880, 1.59, 1.63
AD7890-10, 6.18-19, 9.109
AD7908/AD7918/AD7928, 8.34-35
AD7928, 3.60
AD7938/AD7939, 8.35-36
AD7943, 3.2
AD8001, 9.207-209
AD8016, 9.130-133
AD8017, 9.133
AD8017AR, 9.127-130
AD8018, 7.82
AD8021, 6.41-43
AD8027, 6.8, 6.23
AD8028, 6.8, 6.30
AD8031, 6.23, 6.43
AD8032, 6.30
AD8038, 6.37
AD8055, 6.72, 6.74
AD8057, 6.12, 6.13-15, 6.23, 9.133
AD8058, 6.13-15, 6.29-30, 9.133
AD8061, 6.23, 6.72-73
AD8062, 6.30
AD8074, 7.85
AD8075, 7.85
AD8091, 6.23
AD8092, 6.30
AD8108, 7.85
AD8109, 7.85
AD8110, 7.82, 7.85
AD8111, 7.82, 7.85
AD8113, 7.82, 7.85
AD8114, 7.82, 7.85
AD8115, 7.82, 7.85
AD8116, 7.82-83, 7.85
AD8130, 6.34
AD8131, 6.35
AD8132, 6.34, 6.35
AD8137, 6.35-36
AD8138, 6.35-37
AD8139, 6.35, 6.38, 6.38-39, 6.42-44
AD8150, 7.85
AD8151, 7.85
AD8152, 7.83-84, 7.85
AD8170, 7.80, 7.85
AD8174, 7.80, 7.82, 7.85
AD8180, 7.80, 7.85
AD8182, 7.80, 7.85
AD8183, 7.80-81, 7.82
AD8184, 7.82, 7.85
AD8185, 7.80-81, 7.82, 7.85
AD8186, 7.80-81, 7.82, 7.85
AD8187, 7.80-81, 7.82, 7.85
AD8346, 4.25-26
AD8349, 8.134-135, 8.136
AD8350, 8.131
AD8351, 6.38-40
AD8370, 6.41
AD8402, 1.58
AD8403, 1.58
AD8515, 6.18
AD8517, 6.18
AD8531, 6.7
AD8531/32/34, 7.21
AD8532, 6.7
AD8534, 6.7
AD8541/42/44, 7.21
AD8551, 9.50, 9.56
AD8610, 9.103
AD8628, 6.74
AD8631, 6.18
AD8800, 1.58
AD9000, 1.52
AD9002, 1.52
AD9003, 1.53
AD9005, 1.53, 1.54
AD9006/AD9016, 1.52
AD9008, 1.58
AD9012, 1.52
AD9014, 1.64
AD9020, 1.52
AD9028/AD9038, 1.52
AD9032, 1.65-66
AD9042, 1.61, 1.63, 1.64, 3.75-76, 3.85, 4.12,
7.106-107
AD9048, 1.52
AD9054, 1.62
AD9054A, 3.86
AD9058, 1.52
AD9060, 1.52
AD9100, 7.92
AD9101, 7.92
AD9109, 7.82
AD9220, 1.61, 1.63
AD9221, 1.61, 1.63
AD9223, 1.61, 1.63
AD9225, 3.76, 6.20-21, 6.24
AD9226, 2.49, 8.131, 8.136
AD9229, 6.52-54
AD9235, 3.69, 3.76-77, 6.36-37
AD9235/38, 8.131
AD9236, 5.43-44
AD9244, 8.136
AD9245, 9.134-135
AD9245/AD9444, 8.131
Index 49
ANALOG-DIGITAL CONVERSION
AD9289, 6.52-54
AD9410, 3.51-53
AD9430, 2.60, 3.69, 3.76-77, 5.61-62, 5.70,
6.26-27, 6.57-59, 8.146, 9.136-137, 9.176, 9.211
AD9432, 8.131
AD9432/33, 8.136
AD9433, 6.41
AD9444, 8.136
AD9444/45, 8.131
AD9480, 3.49
AD9700, 1.50
AD9712, 1.57
AD9720, 1.57
AD9726, 6.66
AD9744, 5.22-23, 8.135
AD9754, 8.136
AD9772, 8.135
AD9772A, 8.135, 8.136
AD9773, 2.89
AD9775, 2.89, 3.22
AD9777, 2.84-86, 2.89, 4.25-26, 8.135, 9.138
AD9784/86, 8.135
AD9786, 8.133-134
AD9814, 8.99
AD9816, 8.99
AD9822, 8.99
AD9826, 8.99
AD9830, 8.168
AD9831, 8.168
AD9832, 8.168
AD9833, 8.167, 8.168
AD9834, 8.166-168, 8.168
AD9835, 8.168
AD9850, 1.57, 8.171
AD9851, 5.22, 8.171
AD9852, 8.171
AD9853, 8.174
AD9854, 8.171
AD9856, 8.174
AD9857, 8.171, 8.173, 8.174
AD9858, 1.65-66, 8.168-171, 8.171
AD9859, 8.173
AD9860/AD9862, 4.29
AD9877, 4.23, 4.25
AD9879, 4.23, 4.25
AD9887A, 8.93-94
AD9888, 8.91-92
AD9898, 8.99
AD9951, 8.173
AD9952, 8.173
AD9953, 8.173
AD9954, 8.171-172, 8.173
AD10242, 1.64
AD10678, 1.65-66
AD12400, 1.65-66, 8.152-154, 8.152-155
AD74122, 8.65
AD20msp430, 8.140-141
ADC-12QZ, 1.44, 1.46, 4.6
ADC-12U, 1.24, 1.25
Index 50
ADC80, 1.43
ADC1130, 1.46
ADC1140, 1.53
ADE775x-series, 1.63, 8.22
ADE7755, 8.23-25
ADF41xx-series, 6.92
ADF4001, 6.92
ADF4360, 6.93
ADG2xx-series, 7.85
ADG4xx-series, 7.85
ADG5xx-series, 7.85
ADG6xx-series, 7.85
ADG7xx-series, 7.85
ADG8xx-series, 7.85
ADG9xx-series, 7.85
ADG200-series, 7.62
ADG201-series, 7.62
ADG412, 7.71
ADG438F, 7.85, 9.99
ADG439F, 7.85, 7.89, 9.99
ADG465, 9.98, 9.107, 9.110
ADG466, 9.98, 9.110-111
ADG467, 9.98, 9.110
ADG508F, 7.85, 7.89, 9.99
ADG509F, 7.85, 7.89, 9.99
ADG528F, 7.85, 7.89
ADG708, 7.68, 7.72
ADG725, 7.61
ADG726, 7.61
ADG731, 7.61
ADG732, 7.61
ADG801/ADG802, 7.64
ADG918, 7.78-79
ADG919, 7.78-79
ADG3xxx-series, 7.85
ADG12xx-series, 7.85
ADG14xx-series, 7.85
ADG32xx-series, 7.84
ADG314x-series, 9.189
ADG324x-series, 9.191
ADG3231, 9.188-189, 9.191
ADG3233, 9.191
ADG3241, 9.190
ADG3242, 9.190
ADG3243, 9.190
ADG3245, 9.190
ADG3246, 9.190, 9.194
ADG3247, 9.190
ADG3248, 9.190
ADG3249, 9.190
ADG3257, 9.186-189
ADMxxx-E series, 9.124
ADM1023, 8.19-22
ADM8830, 9.75
ADM8839, 9.75
ADM8840, 9.75
ADP33xx-series, 9.70-71
ADP330x-series, 7.39-40
ADP333x-series, 7.39-40
INDEX
ADP3300, 7.43-46, 7.48, 9.71-72
ADP3300-5, 7.46
ADP3301, 7.43-44, 9.71-72
ADP3302, 7.43-44
ADP3303, 7.43-44, 9.72
ADP3303A, 9.72
ADP3307, 7.43-44, 9.72
ADP3308, 7.44, 9.72
ADP3309, 7.44, 9.72
ADP3310, 7.51-52, 7.54, 7.57, 7.58-59, 9.78-80
ADP3310-3.3, 9.77-78
ADP3310-5, 7.53
ADP3330, 7.44, 7.49, 9.72
ADP3331, 7.44, 7.49, 9.72-73
ADP3333, 7.44, 7.50, 9.72
ADP3334, 7.44, 9.72
ADP3335, 7.44, 7.50, 9.72
ADP3336, 7.44, 7.50, 8.56, 9.72
ADP3338, 7.44, 7.50-51, 9.72
ADP3339, 7.44, 7.50, 9.72
ADP3605, 9.76
ADP3607, 9.76
ADP3607-5, 9.77
ADR01, 7.5, 7.15, 7.18, 7.20
ADR02, 7.5, 7.15, 7.18, 7.20
ADR03, 6.74, 7.5, 7.15, 7.18, 7.20
ADR29x, 7.15, 7.17-18
ADR29x-series, 7.23
ADR38x, 7.17-18
ADR38x-series, 7.5, 7.8
ADR39x, 7.17-18
ADR39x-series, 7.5, 7.8
ADR42x, 7.18
ADR43x, 7.15, 7.17-18
ADR43x-series, 7.23
ADR290, 7.12
ADR290-ADR293 series, 7.12
ADR291, 7.12
ADR292, 7.12
ADR292E, 7.20
ADR293, 7.12
ADR380, 7.9
ADR381, 7.9
ADR390, 6.35, 7.10
ADR391, 7.10
ADR392, 7.10
ADR395, 7.10
ADR430-ADR439 series, 7.13
ADR431, 6.23, 6.42, 7.24-25
ADR433, 7.24
ADR510, 7.5, 7.7, 7.21
ADR512, 7.5, 7.7, 7.20-21
ADR520, 7.7
ADR525, 7.7
ADR530, 7.7
ADR540, 7.7
ADR545, 7.7
ADR550, 7.7
ADSP-21xx-series, 6.62
ADSP-218x, 8.141
ADSP-2106L, 9.170
ADSP-2189, 6.60-61
ADSP-2189M, 6.55-56, 6.63-65
ADSP-21160, 9.43-44
ADSX34, 7.85
ADT7301, 8.17-19
ADu7xxx-series, 8.187-190
ADuC7xxx-series, 8.187-190
ADuC8xxx-series, 8.187-190
ADuC70xx-series, 8.189
ADuC702x-series, 8.188
ADuC812, 8.178, 8.180, 8.186
ADuC812 MicroConverter, 1.63
ADuC814, 8.179-180, 8.186
ADuC816, 8.183, 8.186
ADuC824, 8.183, 8.186
ADuC831, 8.178, 8.180, 8.186
ADuC832, 8.178, 8.180, 8.186
ADuC834, 8.180-182, 8.183, 8.186
ADuC836, 8.183, 8.186
ADuC841, 8.178, 8.180, 8.186
ADuC842, 8.178, 8.180, 8.186
ADuC843, 8.178, 8.180, 8.186
ADuC845, 8.180-182, 8.183, 8.186
ADuC847, 8.181, 8.183, 8.186
ADuC848, 8.181, 8.183, 8.186
ADuC7020, 8.188
ADuC7021, 8.188
ADuC7022, 8.188
ADuC7024, 8.188
ADuC7026, 8.188
ADuM1100A, 9.112-114
ADuM1100B, 9.112-114
ADuM1300, 9.113
ADuM1301, 9.114
ADuM1400, 9.113
ADuM1401, 9.114
ADV453, 1.50
ADV471, 1.50
ADV476, 1.50
ADV478, 1.50
ADV7125, 8.88-89
ADV7160/ADV7162, 8.90
ADV7183A, 8.82-83
ADV7310, 8.83-84
AMP03, 9.51, 9.100
CAV-1040, 1.53, 1.54
CAV-1220, 1.53, 1.54
DAC-12QZ, 1.46, 4.8
DAC08, 1.38, 1.41
DAC80, 1.41-43
DAC1138, 1.46
HAS-1201, 1.53
HAS-1202, 1.43
HAS-1409, 1.53
HDG-series, 1.53
HDS-1240E, 1.53
HDS-1250, 1.43
Index 51
ANALOG-DIGITAL CONVERSION
HTC-0300, 1.43, 7.92
HTS-0025, 1.43, 7.92
LOGDAC, 2.112
MAS-1202, 1.44
MOD-815, 1.44, 1.45, 3.63, 3.64
MOD-1020, 1.45
MOD-1205, 1.45
MOD-4100, 3.50
MOSES-8, 7.61
OP27, 7.20, 9.104
OP42, 9.156
OP80, 9.156
OP113, 7.20
OP113EP, 7.20
OP177, 6.15, 9.13
OP181/281/481, 7.22
OP184, 6.7, 7.20
OP184/284/484, 7.21
OP191, 6.7
OP193/293, 7.21
OP193/293/493, 7.22
OP196/296/496, 7.21
OP200, 9.156
OP213, 7.71
OP249, 9.156
Index 52
OP275, 6.76
OP279, 6.7, 7.21, 7.22
OP281/481, 7.21
OP284, 6.7, 7.21
OP291, 6.7
OP297, 9.156
OP484, 6.7
OP491, 6.7
OP777, 7.21, 9.98
OP1177, 6.15-16
REF01, 7.5
REF02, 7.5
REF03, 7.5
REF43, 7.15, 7.17
REF19x, 7.15, 7.17, 7.18, 7.23
REF19x-series, 7.5
REF195, 7.15, 7.17, 7.18
SHA1, 7.92
SHA2, 7.92
TMP05/TMP06, 8.14-17
TMP06, 8.16
Transmit TxDAC family, 2.85
TxDAC family, 1.55
VHS-630, 3.49
VHS-675, 3.49