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STPS2200
Power Schottky diode
Datasheet  production data
Features
K
A
 Low forward voltage drop
 Very small conduction losses
A
 Negligible switching losses
 Extremely fast switching
 Low thermal resistance
K
 -40°C minimum operating Tj
SMB
STPS2200U
 ECOPACK®2 compliant component
A
Description
This device is a 200 V Schottky rectifier suited for
switch mode power supplies and high frequency
DC to DC converters.
K
SMBflat
STPS2200UF
Table 1. Device summary
Symbol
Value
IF(AV)
2A
VRRM
200 V
Tj(max)
175 °C
VF(typ)
0.58 V
April 2013
This is information on a product in full production.
Packaged in SMB, SMBflat, this device is
especially intended for use in low voltage, high
frequency inverters, freewheeling and polarity
protection. Also ideal for all LED lighting
applications.
DocID024381 Rev 1
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9
Characteristics
1
STPS2200
Characteristics
Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
200
V
IF(RMS)
Forward rms current
10
A
2
A
100
A
SMB
Tl = 145 °C
SMBflat
Tl = 150 °C
IF(AV)
Average forward current  = 0.5, square wave
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
-65 to +175
°C
Operating junction temperature range
-40 to +175
°C
Tj
tp = 10 ms sinusoidal, Tl = 25 °C
Table 3. Thermal parameters
Symbol
Rth(j-l)
Parameter
Value
SMB
20
SMBflat
15
Unit
Junction to lead
°C/W
Table 4. Static electrical characteristics
Symbol
Test conditions
IR(1)
Reverse leakage current
VF(1)
Forward voltage drop
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Min.
VR = VRRM
IF = 2 A
Typ.
Max.
Unit
5
µA
0.7
2.5
mA
0.73
0.80
V
0.58
0.64
V
1. Pulse test: tp = 380 µs,  < 2%
To evaluate the maximum conduction losses use the following equation:
P = 0.58 x IF(AV) + 0.03 IF2(RMS)
Note:
More information is available in the application notes:
AN604 Calculation of conduction losses in a power rectifier
AN4021 Calculation of reverse losses in a power diode
2/9
DocID024381 Rev 1
STPS2200
Characteristics
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Forward voltage drop versus forward
current
PF(AV)(W)
1.6
IF(A)
1.E+01
δ = 0.05
1.4
δ = 0.1
δ = 0.2
δ=1
δ = 0.5
T j = 125 °C
(Maximum values)
1.2
1.E+00
1.0
Tj=125°C
(Typical values)
0.8
Tj=25°C
(Maximum values)
0.6
1.E-01
0.4
Tj=25°C
(Typical values)
T
0.2
IF(AV)(A)
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
δ =tp/T
1.4
1.6
1.8
2.0
VF(V)
tp
1.E-02
2.2
Figure 3. Reverse leakage current versus
reverse voltage applied (typical values)
1.E+01
0.0
2.4
IR(mA)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.9
1.0
1.1
Figure 4. Junction capacitance versus reverse
voltage applied (typical values)
C(pF)
1000
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
Tj = 150 °C
1.E+00
0.8
Tj = 125 °C
1.E-01
Tj = 100 °C
Tj = 75 °C
1.E-02
100
Tj = 50 °C
1.E-03
Tj = 25 °C
1.E-04
VR(V)
VR(V)
1.E-05
10
0
20
40
60
80
100
120
140
160
180
200
1
Figure 5. Relative variation of thermal
impedance junction to lead versus pulse
duration (SMB)
1.0
0.9
Zth(j-l)/Rth(j-l)
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.1
100
1000
Figure 6. Relative variation of thermal
impedance junction to lead versus pulse
duration (SMBflat)
1.0
SMB
10
Zth(j-l)/Rth(j-l)
SMBflat
0.2
Single pulse
0.0
1.E-04
tp(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.1
Single pulse
0.0
1.E-04
DocID024381 Rev 1
tp(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
3/9
Characteristics
STPS2200
Figure 7. Thermal resistance junction to
Figure 8. Thermal resistance junction to
ambient versus copper surface under each lead ambient versus copper surface under each lead
(SMB)
(SMBflat)
Rth(j-a) (°C/W)
200
200
Rth(j-a) (°C/W)
SMB
Epoxy printed circuit board FR4
copper thickness = 35 µm
SMBflat
Epoxy printed circuit board FR4
copper thickness = 35 µm
150
150
100
100
50
50
SCu(cm²)
SCu(cm²)
0
0
0.0
4/9
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
DocID024381 Rev 1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STPS2200
2
Package information
Package information

Epoxy meets UL94, V0

Lead-free package

Cooling method: by conduction (C)

Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9. SMB dimension definitions
E1
D
E
A1
A2
C
L
b
Table 5. SMB dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
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Package information
STPS2200
Figure 10. SMB footprint, dimensions in mm (inches)
1.62
(0.064)
2.60
1.62
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.23)
Figure 11. SMBflat (non exposed pad) dimension definitions
A
c
D
L 2x
L2 2x
E
E1
L
L1 2x
b
Table 6. SMBflat (non exposed pad) dimension values
Dimensions
Ref.
Millimeters
Min.
6/9
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
1.30
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
L1
0.40
0.016
L2
0.60
0.024
DocID024381 Rev 1
STPS2200
Package information
Figure 12. SMBflat (non exposed pad) footprint dimensions
5.84
(0.230)
2.07
(0.082)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
millimeters
(inches)
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Ordering information
3
STPS2200
Ordering information
Table 7. Ordering information
4
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS2200U
G22
SMB
g
2500
Tape and reel
STPS2200UF
FG22
SMBflat
g
5000
Tape and reel
Revision history
Table 8. Document revision history
8/9
Date
Revision
11-Apr-2013
1
Changes
First issue
DocID024381 Rev 1
STPS2200
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