7 A H-Bridge for DC-Motor Applications 1 Overview 1.1 Features TLE 7209-2R • Operating supply voltage 5 V to 28 V • Typical RDSon = 150 mΩ for each output transistor (at 25 °C) • Continuous DC load current 5 A (TC < 100 °C) • Output current limitation at typ. 6.6 A ± 1.1 A • Short circuit shut-down for output currents over 8 A • Logic- inputs TTL/CMOS-compatible • Output switching frequency up to 30 kHz • Rise and fall times optimized for 0.5-2 kHz • Over-temperature protection • Short circuit protection • Undervoltage disable function • Diagnostic by SPI or Status-Flag (configurable) • Enable and Disable inputs • PG-DSO-20-37, -65 power package • Green Product (RoHS compliant) Functional Description The TLE 7209-2R is an intelligent full H-Bridge, designed for the control of DC and stepper motors in safety critical applications and under extreme environmental conditions. The H-Bridge is protected against over-temperature and short circuits and has an under voltage lockout for all the supply voltages “VS” (main DC power supply). All malfunctions cause the output stages to go tristate. The device is configurable by the DMS pin. When grounded, the device gives diagnostic information via a simple error flag. When supplied with VCC = 5 V, the device works in SPI mode. In this mode, detailed failure diagnosis is available via the serial interface. Type Package TLE 7209-2R PG-DSO-20-37, -65 Data Sheet 1 Rev. 1.5, 2010-11-05 TLE 7209-2R Overview 1.2 Pin Configuration GND SCK/SF IN1 V S CP VS OUT1 OUT1 SDO SDI GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 GND IN2 DIS CSN VS OUT2 OUT2 EN DMS GND Metal slug is connected to GND pins internally Figure 1 Table 1 Pinout TLE 7209-2R Pin Definitions and Functions Pin. No. Symbol Function 1 GND Ground 2 SCK/SF SPI-Clock/Status-flag 3 IN1 Input 1 4 5, 16 VSCP VS Supply voltage; connect pins externally 6, 7 OUT1 Output 1; connect pins externally 8 SDO Serial data out 9 SDI Serial data in 10 GND Ground 11 GND Ground Data Sheet Supply voltage for internal charge pump 2 Rev. 1.5, 2010-11-05 TLE 7209-2R Overview Table 1 Pin Definitions and Functions (cont’d) Pin. No. Symbol Function 12 DMS Diagnostic-Mode selection (+ Supply voltage for SPI-Interface) 13 EN Enable 14, 15 OUT2 Output 2; connect pins externally 17 CSN Chip Select (low active) 18 DIS Disable 19 IN2 Input 2 20 GND Ground Data Sheet 3 Rev. 1.5, 2010-11-05 TLE 7209-2R Overview 1.3 Block Diagram DMS Bias V SCP VS Charge Pump FaultDetect EN DIS Driver CSN SDI SDO SCK/SF IN1 IN2 SPI 8 Bit Logic and Latch OUT 1 & GateControl OUT 2 Direct Input Under Voltage Over Temperature GND Figure 2 Data Sheet Block Diagram TLE 7209-2R 4 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 2 Circuit Description 2.1 Control Inputs The bridge is controlled by the Inputs IN1, IN2, DIS and EN as shown in Table 2. The outputs OUT1 and OUT2 are set to High or Low by the parallel inputs IN1 and IN2, respectively. In addition, the outputs can be disabled (set to tristate) by the Disable and Enable inputs DIS and EN. Inputs IN1, IN2 and DIS have an internal pull-up. Input EN has an internal pull-down. Table 2 Functional Truth Table Pos. DIS EN IN1 IN2 OUT1 OUT2 SF1) SPI2) DIA_REG 1. Forward L H H L H L H 2. Reverse L H L H L H H 3. Free-wheeling low L H L L L L H 4. Free-wheeling high L H H H H H H 5. Disable H X X X Z Z L 6. Enable X L X X Z Z L 7. IN1 disconnected L H Z X H X H 8. IN2 disconnected L H X Z X H H 9. DIS disconnected Z X X X Z Z L 10. EN disconnected X Z X X Z Z L 11. Current limit. active L H X X Z Z H 12. Under Voltage X X X X Z Z L 13. Over-temperature X X X X Z Z L 14. Over-current X X X X Z Z L 1) If Mode “Status-Flag” is selected (see Chapter 2.4) 2) If Mode “SPI-Diagnosis” is selected (see Chapter 2.4) Data Sheet 5 see Chapter 2.4.2 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 2.2 Power Stages Four n-channel power-DMOS transistors build up the output H-bridge. Integrated circuits protect the outputs against over current and over-temperature if there is a short-circuit to ground, to the supply voltage or across the load. Positive and negative voltage spikes, which occur when switching inductive loads, are limited by integrated freewheeling diodes. To drive the gates of the high-side DMOS, an internal charge pump is integrated to generate a voltage higher than the supply voltage. 2.2.1 Chopper Current Limitation To limit the output current at low power loss, a chopper current limitation is integrated as shown in Figure 3. The current is measured by sense cells integrated in the low-side switches. When the current limit IL has been exceeded for a time tb, all output stages are switched off for a fixed time ta. Blanking time tb IOUT Current limit IL Switch-off time ta time Figure 3 Data Sheet Chopper current limitation 6 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 2.2.2 Temperature-depending Current Reduction For TILR < Tj < TSD the current limit IL = 2.5 A ± 1.1 A as shown in Figure 4 decreases from IL = 6.6 A ± 1.1 A to A 6.6A range of overtemperature shut-down tolerance of temperature dependent current reduction IL 2.5A Tj Figure 4 2.3 TILR TSD °C Temperature dependent current reduction Protection The TLE 7209-2R is protected against short circuits, overload and invalid supply voltage by the following measures: 2.3.1 Short circuit to Ground The high-side switches are protected against a short of the output to ground by an over current shut-down. If a high-side switch is turned on and the current rises above the short circuit detection current IOUK all output transistors are turned off after a typical filter time of 2 μs, and the error bit “Short Circuit to Ground on output 1 (2)”, SCG1 (SCG2) is stored in the internal status register. 2.3.2 Short circuit to VS Due to the chopper current regulation, the low-side switches are already protected against a short to the supply voltage. To be able to distinguish a short circuit from normal current limit operation, the current limitation is deactivated for the blanking time tb after the current has exceeded the current limit threshold IL. If the short circuit detection current IOUK is reached within this blanking time, a short circuit is detected (see Figure 5). All output transistors are turned OFF and the according error bit “Short Circuit to Battery on output 1 (2)”, SCB1 (SCB2) is set. Data Sheet 7 Rev. 1.5, 2010-11-05 TLE 7209-2R IN IN Circuit Description IOUK IOUK tb ta tb tb IL IOUT IOUT IL time Figure 5 2.3.3 time Short to Vs detection. Left: normal operation. Right: short circuit is detected Short circuit across the load If short circuit messages from high- and low-side switch occur simultaneously within a delay time of typically 2μs, the error bit “Short Circuit Over Load”, SCOL is set. 2.3.4 Over-Temperature In case of high DC-currents, insufficient cooling or high ambient temperature, the chip temperature may rise above the thermal shut-down temperature TSD. In that case, all output transistors are shut-down and the error-bit “Over-Temperature”, OT is set. 2.3.5 Under-Voltage shut-down If the supply-voltage at the VS pins falls below the under-voltage detection threshold, the outputs are set to tristate and the error-bit “Under-Voltage at VS“ is set. 2.4 Diagnosis The Diagnosis-Mode can be selected between SPI-Diagnosis and Status-Flag Diagnosis. The choice of the Diagnosis-Mode is selected by the voltage-level on Pin 12 (DMS Diagnosis Mode Selection): • DMS = GND, Status-Flag Mode • DMS = VCC, SPI-Diagnosis Mode For the connection of Pins SDI, SDO, CSN and SCK/SF see Figure 14 and Figure 15. Data Sheet 8 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 2.4.1 Status-Flag (SF) Mode (DMS = GND) 188.8.131.52 SF output In SF-mode, pin 2 is used as an open-drain output status-flag. The pin has to be pulled to the logic supply voltage with a pull-up resistor, 47 kOhm recommended. In case of any failure that leads to a shut-down of the outputs, the status-flag is set (e.g. SF pin pulled to low). These failures are: – – – – – Under Voltage on VS Short circuit of OUT1 or OUT2 against VS or GND Short circuit between OUT1 and OUT2 Over-current Over-temperature SF is also pulled low when the outputs are disabled by EN or DIS. 184.108.40.206 Fault storage and reset – In case of under-Voltage, the failure is not latched. As soon as VS falls below the under-Voltage detection threshold, the output stage switches in tristate and the statusflag is set from high level to low-level. If the voltage has risen above the specified value again, the output stage switches on again and the status-flag is reset to high-level. The Under Voltage failure is shown at the SF pin for VS in the voltage range below the detection threshold (typical 4.2V) down to 2.5V. – In the SF-mode, all internal circuitry is supplied by the voltage on VS. For that reason, a loss of VS supply voltage leads to a reset of all stored information (Power-ONReset). This Power-ON-Reset occurs as soon as under-Voltage is detected on VS – In case of short circuit, over-current or over-temperature, the fault will be stored. The output stage remains in tristate and the status-flag at low-level until the error is reset by one of the following conditions: H -> L on DIS, L -> H on EN or Power-ON Reset. 2.4.2 SPI-Mode (DMS = 5V) 220.127.116.11 SPI-Interface The serial SPI interface establishes a communication link between TLE 7209-2R and the systems microcontroller. The TLE 7209-2R always operates in slave mode whereas the controller provides the master function. The maximum baud rate is 2 MBaud (200pF on SDO). By applying an active slave select signal at CSN the TLE 7209-2R is selected by the SPI master. SDI is the data input (Slave In), SDO the data output (Slave Out). Via SCK (Serial Clock Input) the SPI clock is provided by the master. In case of inactive slave select signal (High) the data output SDO goes into tristate. Data Sheet 9 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description The first two bits of an instruction may be used to establish an extended deviceaddressing. This gives the opportunity to operate up to 4 Slave-devices sharing one common CSN signal from the Master-Unit (see Figure 7) S P I p o w e rs u p p ly DMS CSN S P I - C o n t r o l: SCK SDI SDO - > s t a t e m a c h in e - > c lo c k c o u n t e r - > in s t r u c t io n r e c o g n it io n s h if t - r e g is t e r 8 D IA _ R E G R eset 8 D ia g n o s t ic s D IS OR DMS U n d e rv o lt a g e EN Figure 6 18.104.22.168 SPI block-diagram Characteristics of the SPI Interface 1. When DMS is > 3.5V, the SPI is active, independently of the state of EN or DIS. During active reset conditions (DMS < 3.5V) the SPI is driven into its default state. When reset becomes inactive, the state machine enters into a wait-state for the next instruction. 2. If the slave select signal at CSN is inactive (high), the state machine is forced to enter the wait-state, i.e. the state machine waits for the following instruction. 3. During active (low) state of the select signal CSN the falling edge of the serial clock signal SCK will be used to latch the input data at SDI. Output data at SDO are driven with the rising edge of SCK (see timing diagram Figure 13) 4. Chip-address: In order to establish the option of extended addressing the uppermost two bits of the instruction-byte (i.e the first two SDI-bits of a Frame) are reserved to send a chipaddress. To avoid a bus conflict the output SDO must stay high impedance during the addressing phase of a frame (i.e. until the address-bits are recognized as valid chipaddress). If the chip-address does not match, the data at SDI will be ignored and SDO remains high impedance for the complete frame. See also Figure 7 5. Verification byte: Simultaneously to the receipt of an SPI instruction TLE 7209-2R transmits a verification byte via the output SDO to the controller. Refer to Figure 8. This byte indicates normal or abnormal operation of the SPI. It contains an initial bit pattern and a flag indicating an error occurred during the previous access. Data Sheet 10 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 6. Because only read access is used in the TLE 7209-2R, the SDI data-bits (2nd byte) are not used 7. Invalid instruction/access: An instruction is invalid if an unused instruction code is detected (see tables with SPI instructions). In case an unused instruction code occurred, the data byte “ffhex” (no error) will be transmitted after having sent the verification byte. This transmission takes place within the same SPI-frame that contained the unused instruction byte. In addition any transmission is invalid if the number of SPI clock pulses (falling edge) counted during active CSN differs from exactly 16 clock pulses. If an invalid instruction is detected, bit TRANS_F in the following verification byte (next SPI transmission) is set to HIGH. The TRANS_F bit must not be cleared before it has been sent to the microcontroller. 8. Transfer error bit TRANS_F: The bit TRANS_F indicates an error during the previous transfer. An error is considered to have occurred when an invalid command was sent, the number of SPI clock pulses (falling edge) counted during active CSN was less than or greater than 16 clock pulses, or SPI clock (SCK) was logical high during falling edge of CSN. Data Sheet 11 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description SDO remains tristated after CSN active Address sent by master is "00" Correct addres is recognized, data transmitted to SDO CSN SCK 6 7 SDI 7 5 6 Z SDO 4 2 3 1 7 0 5 6 4 2 3 0 1 5 4 3 2 1 0 7 6 5 4 3 2 1 0 5 4 3 2 1 0 7 6 5 4 3 2 1 0 SDO remains tristated after CSN active Address sent by master is differnt from "00" Correct addres is not recognized, SDO remains tristated and SDI data are ignored CSN SCK SDI SDO Figure 7 Data Sheet 6 7 7 5 6 4 5 2 3 4 3 1 2 7 0 1 0 5 6 7 6 4 5 2 3 4 3 0 1 2 1 0 Z Bus-arbitration by chip-address 12 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 22.214.171.124 SPI-Communication The 16 input bits consist of the SPI-instruction byte and a second, unused byte. The 16 output bits consist of the verification-byte and the data-byte (see also Figure 8). The definition of these bytes is given in the subsequent sections. CSN SCK 6 7 5 4 3 2 SDI MSB SPI Instruction SDO MSB Verification byte Figure 8 126.96.36.199 1 7 0 6 5 4 2 3 LSB not used LSB MSB data-byte 1 0 LSB SPI communication SPI instruction The uppermost 2 bit of the instruction byte contain the chip-address. The chip-address of the TLE 7209-2R is 00. During read-access, the output data according to the register requested in the instruction byte are applied to SDO within the same SPI frame. That means, the output data corresponding to an instruction byte sent during one SPI frame are transmitted to SDO during the same SPI frame. Table 3 SPI Instruction Format MSB 7 6 0 0 Table 4 5 4 3 2 1 0 INSTR4 INSTR3 INSTR2 INSTR1 INSTR0 INSW SPI instruction Description Bit Name Description 7,6 CPAD1,0 Chip Address (has to be ‘0’, ‘0’) 5-1 INSTR (4-0) SPI instruction (encoding) 0 INSW Even parity Data Sheet 13 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description Table 5 SPI Instruction-Bytes Encoding SPI Instruction Encoding Description bit 7,6 bit 5-1 CPAD1,0 INSTR(4-0) Bit 0 INSW RD_IDENT 00 00000 0 read identifier RD_VERSION 00 00001 1 read version 00 00100 1 read DIA_REG – RD_DIA 00 all others x unused, TRANS_F is set to high, ff_hex is sent as data bit – all others xxxxx x invalid address, SDO remains tristate during entire SPI frame 188.8.131.52 Verification Byte Table 6 Verification Byte Format MSB 7 6 5 4 3 2 1 0 Z Z 1 0 1 0 1 TRANS_F Table 7 Verification Byte Description Bit Name Description 0 TRANS_F Bit = 1: error detected during previous transfer Bit = 0: previous transfer was recognized as valid 1 Fixed to High 2 Fixed to Low 3 Fixed to High 4 Fixed to Low 5 Fixed to High 6 send as high impedance 7 send as high impedance The default value after power-up at DMS of the TRANS_F bit is L (previous transfer valid) Data Sheet 14 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 184.108.40.206 Data-byte: Diagnostics/Encoding of Failures (Register DIA_REG, SPI Instruction RD_DIA) ) Table 8 DIA_REG Format MSB 7 6 5 4 3 2 1 0 EN/DIS OT CurrRed CurrLim DIA21 DIA20 DIA11 DIA10 Table 9 DIA_REG Description Default value after reset is FFhex. Access by controller is read only Bit Name Description 0 DIA 10 Diagnosis-Bit1 of OUT1 see below 1 DIA 11 Diagnosis-Bit2 of OUT1 see below 2 DIA 20 Diagnosis-Bit1 of OUT2 see below 3 DIA 21 Diagnosis-Bit2 of OUT2 see below 4 CurrLim is set to „0“ in case of current limitation. latched 5 CurrRed is set to „0“ in case of temperature dependent current limitation latched 6 OT is set to „0“ in case of over-temperature latched 7 EN/DIS is set to „0“ in case of EN = L or DIS = H not latched EN DIS DIA_REG_7 H L 1 L L 0 H H 0 L H 0 Data Sheet latch behavior 15 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description Table 10 Encoding of the Diagnostic Bits of OUT1 and OUT2 DIA21 DIA20 DIA11 DIA10 Description latch behavior 1 1 0 0 Short circuit over load (SCOL) latched - - 0 1 Short circuit to battery on OUT1 (SCB1) latched - - 1 0 Short circuit to ground on OUT1 (SCG1) latched - - 1 1 No error detected on OUT1 - 0 0 1 1 Open load (OL) latched 0 1 - - Short circuit to battery on OUT2 (SCB2) latched 1 0 - - Short circuit to ground on OUT2 (SCG2) latched 1 1 - - No error detected on OUT2 - 0 0 0 0 Under Voltage on Pin Vs not latched Failure Encoding in case of multiple faults If multiple faults are stored in the failure register, the faults that are encoded in the DIAxx bits can not be displayed simultaneously due to the encoding scheme that is used. In this case, errors are encoded according to the following priority list. – Priority 1: Under Voltage (please note that after removal of Under Voltage, the original error will be restored, see below) – Priority 2: Short circuit across the load – Priority 3: all other short circuits – Priority 4: open load If a failure of higher priority is detected, the failures of lower priority are no longer visible in the encoded SPI message. Fault storage and reset of the Diagnosis Register DIA_REG Register DIA_REG is reset upon the following conditions: – With the rising edge of the CSN-Signal after the SPI-instruction RD_DIA. This reset only takes place if the correct number of 16 SCK pulses has been counted. – When the voltage on DMS exceeds the threshold for detecting SPI-Mode (after Under Voltage condition). Under Voltage on Vs (typ. < 5,0V) sets Bit 0.... Bit 3 of DIA_REG to 0000. If Vs rises above the Under Voltage level, Bits of DIA_REG are restored (when DMS > 3.5V). – A rising edge on EN while DIS=0 or a falling edge on DIS while EN=1 re-activates the output power-stages, and resets the DIA_REG register. Data Sheet 16 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 220.127.116.11 Data-byte: Device Identifier and Version (SPI instructions RD_IDENT and RD_VERSION) The IC‘s identifier (device ID) and version number are used for production test purposes and features plug & play functionality depending on the systems software release. The two numbers are read-only accessible via the SPI instructions RD_IDENT and RD_VERSION as described in Section 18.104.22.168. The device ID is defined to allow identification of different IC-Types by software and is fixed for the TLE 7209-2R. The Version number may be utilized to distinguish different states of hardware and is updated with each redesign of the TLE 7209-2R. The contents is divided into an upper 4 bit field reserved to define revisions (SWR) corresponding to specific software releases and a lower 4 bit field utilized to identify the actual mask set revision (MSR). Both (SWR and MSR) will start with 0000b and are increased by 1 every time an according modification of the hardware is introduced. Reading the IC Identifier (SPI Instruction: RD_IDENT): Table 11 Device Identifier Format MSB 7 6 5 4 3 2 1 0 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Table 12 Device Identifier Description Bit Name Description 7...0 device-ID(7...0) ID-No.: 10100010 Reading the IC version number (SPI Instruction: RD_VERSION): Table 13 IC version number Format MSB 7 6 5 4 3 2 1 0 SWR3 SWR2 SWR1 SWR0 MSR3 MSR2 MSR1 MSR0 Table 14 Bit IC version number Description Name Description 7...4 SWR(3...0) This register is set to 0 3...0 MSR(3...0) Version corresponding to Mask set Data Sheet 17 Rev. 1.5, 2010-11-05 TLE 7209-2R Circuit Description 22.214.171.124 Open-Load Diagnosis Open-load diagnostic in OFF-state is only possible in the SPI-mode (DMS = 5 V) if the device is Disabled (EN = L or DIS = H). The detection mechanism is depicted in Figure 9. The according diagnostic information can be read out via the SPI diagnostic register. The resulting overall diagnostic truth-table is shown as Table 15 VS VS DMS 1.5mA + AND DIS OR OUT1 OUT2 EN 1V + to diagnostic register 1V 1mA 1 Figure 9 Functional block diagram of open-load detection Table 15 Diagnosis Truth Table for open load detection AND Output stage inactive, EN = low or DIS = high, DMS > 4.5 V OUT1 OUT2 Load available H Open Load H H L OL detected SC -> GND on OUT1 and Open Load L L OL not detected – double Fault SC -> GND on OUT2 and Open Load H L OL detected SC -> VS on OUT1 and Open Load H L OL detected SC -> VS on OUT2 and Open Load H H OL not detected – double Fault Data Sheet 18 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Pos. Parameter Sym- Limit Values Unit Test Conditions bol min. max. 3.1.1 Junction temperature Tj -40 +150 °C – – +175 °C dynamic: t < 1 s Storage temperature Ts -55 +125 °C – 3.1.3 Ambient temperature Ta -40 +125 °C – 3.1.4 Supply voltage -1 40 V static destruction proof -2 40 V dynamic destruction proof t < 0.5 s (single pulse, Tj < 85 °C) In status-flag-mode, SF pull-up R ≥ 10 kΩ 3.1.2 VS 3.1.5 Voltage at logic inputs IN1, IN2, DIS, EN, SDI, SCK/SF V -0.5 18 V 3.1.6 Voltage at logic input V CSN -0.5 40 V 3.1.7 Voltage at logic input VDMS -0.5 DMS 18 V – 3.1.8 Voltage at logic output SDO V – 3.1.9 Voltage at VsCP VCP VDMS V +0.5 VS + V 3.1.10 ESD voltage human 3.1.11 body model (MIL STD 883D / ANSI EOS\ESD S5.1) -0.5 VS - 0.5 - 0.5 VESD – VESD-- – OUT – 4kV all pins – 8kV only pins 6, 7, 14 and 15 (outputs) Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. Data Sheet 19 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.2 Pos. Operating Range Symbol min. max. Supply Voltage VS 5 28 3.2.2 DMS Supply Voltage VDMS 3.5 5.5 V Device in SPI-mode 3.2.3 PWM frequency f – 30 kHz May be limited to lower values in the application due to switching losses or duty cycle requirements 3.2.4 Junction Temperature TJ -40 150 °C 3.2.1 Parameter Limit Values Unit Remark V Note: In the operating range, the circuit functionality as described in the circuit description is fulfilled. 3.3 Thermal Resistance 3.3.1 Junction-case RthJC – 1.5 K/W specified by design 3.3.2 Junction-ambient RthJA – 50 K/W minimal footprint 3.4 Electrical Characteristics 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values Unit Test Conditions V Switch off threshold min. typ. max. VUV OFF 3.4 4.2 5 VUV ON 3.6 4.4 5.2 VUV HY 100 – 1000 mV Hysteresis IUB – – 30 mA f = 20 kHz, IOUT = 0 A – – 20 mA f = 0 Hz, IOUT = 0 A Power Supply 3.4.1 3.4.2 Under voltage at VS Supply current Data Sheet 20 Switch on threshold Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.4 Electrical Characteristics (cont’d) 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. Unit Test Conditions Logic Inputs IN1, IN2, DIS, EN 3.4.3 Input “high” VIH 2 – – V – 3.4.4 Input “low” VIL – – 1 V – 3.4.5 Input hysteresis VIHY 0.1 – 0.6 V – 3.4.6 pull-up current IN1, IN2, DIS IIL -200 -125 – μA U≤1V 3.4.7 pull-down current EN IIH – – 100 μA U≥2V Power Outputs OUT1, OUT2 3.4.8 Switch on resistance – – – 300 mΩ ROUT-UB, ROUT-GND VS > 5 V, IOUT = 3 A 3.4.9 Switch-off current |IL| 5.5 6.6 7.7 A -40 °C < Tj < TILR 1.4 2.5 3.6 A Tj = TSD; specified by design 3.4.10 Switch-off time ta 8 16 26 μs Vs=13.2 V, L=2.2 mH, R=0.23 Ω 3.4.11 Blanking time tb 8 13 19 μs Vs=13.2 V, L=2.2 mH, R=0.23 Ω 3.4.12 Switch-off Tracking ta/tb 1.0 – – – Vs=13.2 V, L=2.2 mH, R=0.23 Ω 3.4.13 Short circuit detection current |IOUK| 8 – 18 A – 3.4.14 Current Tracking |IOUK||IL| 2 3.5 – A specified by design 3.4.15 Reactivation time after internal shut-down t – – 200 μs Over-current- or overtemperature shutdown to reactivation of the output stage Note: Reactivation time is not subject to production test; specified by design Data Sheet 21 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.4 Electrical Characteristics (cont’d) 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values Unit Test Conditions min. typ. max. 3.4.16 Leakage current – – – 200 μA Output stage switched off 3.4.17 Free-wheel diode forward voltage UD – – 2 V IOUT = 3 A 3.4.18 Free-wheel diode reverse recovery time trr – – 100 ns Reverse recovery time is not subject to production test; specified by design 20 μA VSF = 5 V Output Status-flag, Open Drain Output DMS < 0.8 V 3.4.19 Output “high” (SF not set) ISF 3.4.20 Output “low” (SF set) ISF 3.4.21 Output ON-delay 3.4.22 – – 300 – – μA VSF = 1 V 100 – – μA VSF = 0.5 V tdon – – 6 μs IN1 --> OUT1 resp. IN2 --> OUT2, IOUT = 3A Output OFF-delay tdoff – – 6 μs IN1 --> OUT1 resp. IN2 --> OUT2, IOUT = 3A 3.4.23 Output switching time tr, tf – – 5 μs OUT1H --> OUT1L, OUT2H --> OUT2L, IOUT = 3 A OUT1L --> OUT1H, OUT2L --> OUT2H 3.4.24 Disable delay time tddis – – 2 μs DIS --> OUTn, EN --> OUTn 3.4.25 Power on delay time – – – 1 ms VS = on --> output 3.4.26 Delay time for fault detection tdf 1.0 2 – μs specified by design 3.4.27 Minimum pulse width tden – 1.6 2.2 μs EN/DIS-->Reset DIA_REG Timing stage active; no load Data Sheet 22 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.4 Electrical Characteristics (cont’d) 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. Unit Test Conditions Input SCK, SPI Clock Input 3.4.28 Low Level USCKL – – 1 V – 3.4.29 High Level USCKH 2 – – V – 3.4.30 Hysteresis ΔUSCK 0.1 – 0.4 V – 3.4.31 Input Capacity CSCK – – 20 pF – 3.4.32 Input Current -ISCK – 20 50 μA Pull-up current source connected to VCC Input CSN, Chip Select Signal 3.4.33 Low Level UCSNL – – 1 V TLE 7209-2R is selected 3.4.34 High Level UCSNH 2 – – V – 3.4.35 Hysteresis ΔUCSN 0.1 – 0.4 V – 3.4.36 Input Capacity CCSN – – 20 pF – 3.4.37 Input Current -ICSN – 20 50 μA Pull up current source connected to VCC Input SDI, SPI Data Input 3.4.38 Low Level USDIL – – 1 V – 3.4.39 High Level USDIH 2 – – V – 3.4.40 Hysteresis ΔUSDI 0.1 – 0.4 V – 3.4.41 Input Capacity CSDI – – 20 pF – 3.4.42 Input Current -ISDI – 20 50 μA Pull up current source connected to VCC Data Sheet 23 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.4 Electrical Characteristics (cont’d) 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. – Unit Test Conditions Output SDO Tristate Output of the TLE 7209-2R (SPI output); 3.4.43 Low Level VSDOL – 0.4 V ISDO = 2 mA 3.4.44 High Level VSDOH VDMS – – V ISDO = -2 mA - 0.75 3.4.45 Capacity CSDO – – 30 pF Capacity of the pin in tristate 3.4.46 Leakage Current ISDO -10 – 10 μA In tristate Note: All in- and output pin capacities are not subject to production test; specified by design Input DMS Supply-Input for the SPI-Interface and Selection Pin for SPI- or SF-Mode 3.4.47 3.4.48 Input Voltage Input Current VDMS 3.5 – – V VDMS – – 0.8 V Status-Flag-Mode IDMS – – 10 mA SPI-Mode VOUT1 0.8 – 2.0 V VOUT2 0.8 – 2.0 V DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load -IOUT1 1000 1500 2000 μA VOUT1=0 V, IOUT2 700 SPI-Mode Open-Load Diagnosis 3.4.49 3.4.50 3.4.51 Diagnostic Threshold Pull-up Current Pull-down Current DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load 1000 1400 μA VOUT2=5 V, DMS > 4.5 V, EN < 0.8 V or DIS > 4.5 V; no load 3.4.52 Tracking Diag. C – 1.2 1.5 1.7 – IOUT1/IOUT2 3.4.53 Delay Time tD 30 – 100 ms – Note: Open Load is detected if VOUT1 > 2 V AND VOUT2 < 0.8 V (refer to fig. 9). Data Sheet 24 Rev. 1.5, 2010-11-05 TLE 7209-2R Electrical Characteristics 3.4 Electrical Characteristics (cont’d) 5V < VS < 28V; – 40 °C < Tj < 150 °C; unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. 200 – – Unit Test Conditions ns referred to master SPI Timing (see Figure 13) 3.4.54 Cycle-Time (1) tcyc (1) 3.4.55 Enable Lead Time tlead (2) 100 – – ns referred to master 3.4.56 Enable Lag Time tlag (3) 150 – – ns referred to master 3.4.57 Data Valid tv (4) – – – – 40 150 ns ns CL = 40 pF CL = 200 pF referred to TLE 72092R 3.4.58 Data Setup Time tsu (5) 3.4.59 Data Hold Time th (6) 20 – – ns referred to master 3.4.60 Disable Time tdis (7) – – 100 ns referred to TLE 72092R; specified by design 50 – – ns referred to master 3.4.61 Transfer Delay tdt (8) 150 – – ns referred to master 3.4.62 Select time tCSN (9) 50 – – ns referred to master 3.4.63 Access time tacc (10) 8.35 – – μs referred to master 3.4.64 Clock inactive before chip select becomes valid (11) 200 – – ns – 3.4.65 Clock inactive after chip select becomes invalid (12) 200 – – ns – Temperature Thresholds 3.4.66 Start of current limit reduction TILR 150 165 – °C 3.4.67 Thermal Shut-down TSD 175 – – °C Note: Temperature thresholds are not subject to production test; specified by design Data Sheet 25 Rev. 1.5, 2010-11-05 TLE 7209-2R Timing Diagrams 4 Timing Diagrams V 5 INx 50% 50% 0 80% OUTx 20% tdon Figure 10 tdoff Output Delay Time--Depicted for Low-Side FETs V 5 DIS / EN 50% 0 Z OUTx 20% tddis Figure 11 Data Sheet Disable Delay Time 26 Rev. 1.5, 2010-11-05 TLE 7209-2R Timing Diagrams tRISE tFALL 80% 80% OUTx 20% Figure 12 20% Output Switching Time 10 9 CSN 11 2 3 1 SCK 8 12 4 SDO tristate 5 SDI 7 Bit (n-3) Bit (n-4)...1 Bit 0; LSB 6 MSB IN Bit (n-2) Bit (n-3) Bit (n-4)...1 LSB IN n = 16 Figure 13 Data Sheet SPI-timing 27 Rev. 1.5, 2010-11-05 TLE 7209-2R Application Application Vs < 40V 5 100µF 100nF VSCP VS DMS 100nF V-Reg Vcc IN1 IN2 DIS CSN µC OUT 1 M SDI SDO OUT 2 SCK/SF from Watchdog or fail-safe Controller EN GND Application Example with SPI-Interface Vs < 40V Figure 14 100µF 100nF VSCP VS DMS Vcc V-Reg IN1 IN2 DIS µC 47k CSN OUT 1 M SDI SDO OUT 2 SCK/SF from Watchdog or fail-safe Controller EN GND Figure 15 Data Sheet Application Example with Status-Flag 28 Rev. 1.5, 2010-11-05 TLE 7209-2R Application Reverse polarity protection via main relay ignition switch Vs < 40V main relay VS 100µF TLE 7209-2R 100nF battery Figure 16 Data Sheet Application Examples for Over-Voltage- and Reverse-Voltage Protection 29 Rev. 1.5, 2010-11-05 TLE 7209-2R Package Outlines 6 Package Outlines +0.07 -0.02 5˚ ±3˚ 0.25 6.3 0.1 Heatslug (Mold) 0.95 ±0.15 +0.13 0.25 M A 20x 14.2 ±0.3 20 11 11 1 10 10 0.25 B 20 5.9 ±0.1 (Metal) 0.4 15.74 ±0.1 (Heatslug) 3.2 ±0.1 (Metal) 1.27 B 2.8 1.3 1.2 -0.3 11 ±0.15 1) 3.5 MAX. 0 +0.1 3.25 ±0.1 PG-DSO-20-37, -65 (Plastic Dual Small Outline Package) Index Marking 15.9 ±0.15 1) (Mold) 1) 13.7 -0.2 1 Heatslug (Metal) A Does not include plastic or metal protrusion of 0.15 max. per side GPS05791 1 x 45˚ Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm Data Sheet Rev. 1.5, 2010-11-05 30 TLE 7209-2R Package Outlines 7 Revision History Rev. Date Changes 1.3 2005-01-11 non RoHS compliant version of the TLE7209-2R 1.4 2007-04-05 RoHS compliant version of the TLE7209-2R RoHS Logo and references added Package changed to PG-DSO-20-37 Pos. 3.1.7, VDMS max. changed from 13V to 18V 1.5 2010-11-05 Data Sheet Package name updated 31 Rev. 1.5, 2010-11-05 Edition 2010-11-05 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.