Click Here for Military Performance (JAN Class S) Datasheet -

INCH-POUND
MIL-M-38510/114B
20 August 2003
SUPERSEDING
MIL-M-38510/114A
09 November 1979
MILITARY SPECIFICATION
MICROCIRCUITS, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON
Reactivated after 20 August 2003 and may be used for either new or existing design acquisitions.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, BI-FET operational amplifier
microcircuit. Two product assurance classes and a choice of case outlines and lead finishes are provided and are
reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by
MIL-PRF-38535, (see 6.3)
1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are internally compensated and should be as follows:
Device type
01
02
03
04
05
06
Circuit
Operational amplifier, JFET input, low power
Operational amplifier, JFET input, wide band
Operational amplifier, JFET input, wide band, undercompensated
Operational amplifier, JFET input, low power, low offset
Operational amplifier, JFET input, wide band, low offset
Operational amplifier, JFET input, wide band, under compensated, low offset
1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outline. The case outline should be as designated in MIL-STD-1835 and as follows:
Outline letter
G
H
P
Descriptive designator
MACY1-X8
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
Terminals
8
10
8
Package style
Can
Flat pack
Dual-in-line
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed
to [email protected] Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5962
MIL-M-38510/114B
1.3 Absolute maximum ratings.
Supply voltage range .......................................................................
Input voltage range ..........................................................................
Differential input voltage range .........................................................
Storage temperature range ..............................................................
Output short-circuit duration .............................................................
Lead temperature (soldering, 60 seconds) ......................................
Junction temperature (TJ) ................................................................
±22 V
±20 V 1/
±40 V
-65°C to +150°C
Unlimited 2/
+300°C.
+175°C 3/
1.4 Recommended operating conditions.
Supply voltage range ....................................................................... ±5 V dc to ±20 V dc
Ambient operating temperature range (TA) ...................................... -55°C to +125°C
1.5
Power and thermal characteristics.
Case outlines
Maximum allowable power
dissipation
Maximum
Maximum
θJC
θJA
150°C/W
G
330 mW at TA = +125°C
40°C/W
H
330 mW at TA = +125°C
400 mW at TA = +125°C
60°C/W
150°C/W
35°C/W
120°C/W
P
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those
listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement
thereto, cited in the solicitation.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
- Test Method Standard for Microelectronics.
- Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available from the Standardization Document Order Desk, 700 Robbins Avenue,
Building 4D, Philadelphia, PA 19111-5094.
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein the text of this document shall takes precedence. Nothing in this document, however, supersedes applicable
laws and regulations unless a specific exemption has been obtained.
______
1/ The absolute maximum negative input voltage is equal to the negative power supply voltage.
2/ Short circuit may be to ground or either supply. Rating applies to +125°C case temperature or +75°C
ambient temperature.
3/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours
maximum), TJ = 275°C.
2
MIL-M-38510/114B
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity (DSCC-VA) upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended ambient operating temperature range, unless otherwise specified.
3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 1 mV beyond the specified offset
voltage limits for –55°C ≤ TA ≤ 125°C using the circuit of figure 2.
3.5.2 Instability oscillations. The devices shall be free of oscillations when operated in the test circuits
of this specification.
3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535.
3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 49 (see MIL-PRF-38535, appendix A).
3
MIL-M-38510/114B
TABLE I. Electrical performance characteristics.
Test
Symbol
Input offset voltage
VIO
Conditions
-55°C ≤ TA ≤ +125°C
unless otherwise specified
See figure 3
±VCC = ±5 V, VCM = 0 V
Group A
subgroups
Device
type
1
01,02,
03
Max
5
04,05,
06
-2
2
01,02,
03
-7
7
04,05,
06
-2.5
2.5
01,02,
03
-30
30
04,05,
06
-10
10
All
-20
20
pA
-20
20
nA
-100
3500
pA
TJ =
+125°C
-10
60
nA
TJ = +25°C
-100
300
pA
TJ =
+125°C
-10
50
nA
TJ = +25°C
-100
100
pA
TJ =
-10
50
nA
VCM = ±15 V, 0 V
Input offset voltage
temperature sensitivity
∆VIO /
∆T
Input offset current
±VCC = ±20 V, VCM = 0 V
±VCC = ±20 V, VCM = 0 V
IIO
1,2,3
TJ = +25°C
TJ =
+125°C
Input bias current
1/ 2/
+IIB
±VCC = ±20 V,
VCM = +15 V, t ≤ 25 ms
-IIB
3/
±VCC = ±15 V,
VCM = +10 V, t ≤ 25 ms
±VCC = ±20 V,
-15 V ≤ VCM ≤ 0 V,
t ≤ 25 ms
Power supply rejection
ratio
Input voltage common
mode rejection
4/
Unit
Min
-5
2,3
±VCC = ±20 V,
Limits
TJ = +25°C
All
mV
µV/°C
+125°C
+PSRR
+VCC = 10 V, -VCC = -20 V
-PSRR
+VCC = 20 V, -VCC = -10 V
CMR
±VCC = ±20 V,
1,2,3
All
85
dB
85
1,2,3
All
85
dB
1,2,3
All
+8
mV
VIN = ±15 V
Adjustment for input
offset voltage
VIO
±VCC = ±20 V
ADJ(+)
-8
VIO
ADJ(-)
Output short circuit
current (for positive
output)
5/
IOS(+)
±VCC = ±15 V, t ≤ 25 ms,
(short circuit to ground)
See footnotes at end of table.
4
1,2,3
All
-50
mA
MIL-M-38510/114B
TABLE I. Electrical performance characteristics – Continued.
Test
Output short circuit
current (for negative
output)
Supply current
Symbol
5/
IOS(-)
Conditions
-55°C ≤ TA ≤ +125°C
unless otherwise specified
See figure 3
±VCC = ±15 V, t ≤ 25 ms,
Group A
subgroups
Device
type
1,2,3
All
Max
50
mA
1,2
01,04
4
mA
02,03,
05,06
7
01,04
6
02,03,
05,06
11
Min
ICC
Output voltage swing
(maximum)
±VCC = ±15 V
VOP
±VCC = ±20 V, RL = 10 kΩ
1,2,3
All
6/
6/
Transient response,
rise time
AVS(+)
±VCC = ±20 V, RL = 2 kΩ,
AVS(-)
VOUT = ±15 V
AVS
±VCC = ±5 V, RL = 2 kΩ,
±16
V
±15
±VCC = ±20 V, RL = 2 kΩ
Open loop voltage
gain (single ended)
Unit
(short circuit to ground)
3
Open loop voltage
gain (single ended)
Limits
1
All
2,3
50
V/mV
25
1
All
10
V/mV
4,5,6
01,04
150
CL = 100 pF, VIN = 50 mV,
AV = 1, see figure 4
02,05
100
±VCC = ±15 V, RL = 2 kΩ,
03,06
450
01,02,
04,05
40
03,06
25
VOUT = ±2 V
TR(tr)
±VCC = ±15 V, RL = 2 kΩ,
ns
CL = 100 pF, VIN = 50 mV,
AV = 5, see figure 4
Transient response,
overshoot
TR(os)
±VCC = ±15 V, RL = 2 kΩ,
CL = 100 pF, VIN = 50 mV,
AV = 1, see figure 4
±VCC = ±15 V, RL = 2 kΩ,
CL = 100 pF, VIN = 50 mV,
AV = 5, see figure 4
See footnotes at end of table.
5
%
MIL-M-38510/114B
TABLE I. Electrical performance characteristics – Continued.
Test
Slew rate
Symbol
Conditions
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
SR(+)
See figure 3
VIN = ±5 V, ±VCC = ±15 V,
1
01
Min
2
and
AV = 1, see figure 4
02
7.5
04
3
05
10
01
1
02
5
04
1.5
05
7
03
30
06
40
03
20
06
25
SR(-)
2,3
VIN = ±5 V, ±VCC = ±15 V,
1
AV = 5, see figure 4
2,3
Settling time
ts(+)
and
ts(-)
±VCC = ±15 V, (0.1% error)
9
Limits
Unit
Max
V/µs
ns
01,04
4000
02,05
1500
03,06
800
9
All
10
µVrms
9
All
80
µVpk
TA = +25°C, AV = -1,
see figure 5
±VCC = ±15 V, (0.1% error)
TA = +25°C, AV = -5,
see figure 5
Noise (referred to input)
broadband
NI(BB)
Noise (referred to input)
popcorn
NI(PC)
±VCC = ±20 V,
bandwidth = 5 kHz
±VCC = ±20 V,
bandwidth = 5 kHz
See footnotes at end of table.
6
MIL-M-38510/114B
TABLE I. Electrical performance characteristics – Continued.
1/
Bias currents are actually junction leakage currents which double (approximately) for each 10°C increase in junction
temperature (TJ). Measurement of bias current is specified at TJ rather than TA, since normal warm up thermal
transients will affect the bias currents. The measurements for bias currents must be made within 25 ms or 5 loop
time constants, whichever is greater after power is first applied to the device for test. Measurement at TA = -55°C
is not necessary since expected values are too small for typical test systems.
2/
Bias current is sensitive to power supply voltage, common mode voltage and temperature as shown by the
following typical curves:
3/
Negative IIB minimum limits reflect the characteristics of device with bias current compensation.
4/
CMR is calculated from VIO measurements at VCM = +15 V and –15 V.
5/
Continuous limits shall be considerably lower. Protection for shorts to either supply exists providing that
TJ(max) ≤ 175°C.
6/
Because of thermal feedback effects from output to input, open loop gain is not guaranteed to be linear or
positive over the operating range. These requirements, if needed, should be specified by the user in additional
procurement documents.
7
MIL-M-38510/114B
TABLE II. Electrical test requirements.
Subgroups (see table III)
Class S
Class B
devices
devices
MIL-PRF-38535
test requirements
Interim electrical parameters
1
Final electrical test parameters
1*, 2, 3, 4
Group A test requirements
Group B electrical test parameters when
using the method 5005 QCI option
Group C end-point electrical
parameters
Additional electrical subgroups for
Group C periodic inspections
Group D end-point electrical
parameters
1, 2, 3, 4, 5,
6, 7, 8, 12
1, 2, 3 and
table IV delta
limits
1, 2, 3 and
table IV delta
limits
N/A
1, 2, 3
1
1*, 2, 3, 4
1, 2, 3, 4, 5,
6, 7
N/A
1 and table IV
delta limits
8, 12
1
*PDA applies to subgroup 1.
4. VERIFICATION.
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or
as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not
effect the form, fit, or function as function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior
to qualification and quality conformance inspection. The following additional criteria shall apply:
a.
The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified
in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be
maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c.
Additional screening for space level product shall be as specified in MIL-PRF-38535.
NOTE: If accelerated high-temperature test conditions are used, the device manufacturer shall ensure that at
least 85 percent of the applied voltage is dropped across the device at temperature. The device is not
considered functional under accelerated test conditions.
8
MIL-M-38510/114B
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 9, 10, and 11 shall be omitted.
c.
Subgroup 12 shall be added to group A inspection for class S devices only as shown in table III herein.
The sample size series number for subgroup 12 shall be 5.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a.
End point electrical parameters shall be as specified in table II herein. Delta limits shall apply only to
subgroup 1 of group C inspection for class B devices.
b.
The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit
shall be maintained under document control by the device manufacturer's Technology Review Board (TRB)
in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1005 of MIL-STD-883.
c.
Subgroup 3 and 4 shall be added to group C inspection and shall consist of group A, subgroup 8 and 12,
as specified in table III herein. The sample size series number for subgroup 3 shall be 10 for class B;
the sample size series number for subgroup 4 shall be 5 for class B.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table IV of MIL-PRF-38535. End point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows.
4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are
referenced to the external zero reference level of the supply voltage. Currents given are conventional current and
positive when flowing into the referenced terminal.
4.5.2 Life test cooldown procedure. When devices are measured at +25°C following application of the
operating life or burn-in test condition, they shall be cooled to room temperature prior to removal of the bias.
9
MIL-M-38510/114B
Figure 1. Terminal connections.
10
MIL-M-38510/114B
Figure 1. Terminal connections – Continued.
Figure 2. Offset null circuit.
11
MIL-M-38510/114B
NOTES:
1. All resistors are ±0.1% tolerance and all capacitors are ±10% tolerance unless otherwise specified.
2. Precautions shall be taken to prevent damage to the device under test during insertion into socket
and change of state of relays (i.e. disable voltage supplies, current limit ±VCC, etc).
3. Compensation capacitors should be added as required for test circuit stability. Two general methods
for stability compensation exist. One method is with a capacitor for nulling amp feedback. The other
method is with a capacitor in parallel with the 49.9 kΩ closed loop feedback resistor. Both methods should
not be used simultaneously. Proper wiring procedures shall be followed to prevent unwanted coupling
and oscillations, etc. Loop response and settling time shall be consistent with the test rate such that
any value has settled for at least 5 loop time constants before the value is measured.
4. Adequate settling time should be allowed such that each parameter has settled to within 5% of its
final value.
5. All relays are shown in the normal de-energized state.
6. The nulling amplifier shall be a M38510/10101XXX. Saturation of the nulling amplifier is not allowed
on tests where E (pin 5) value is measured.
7. The load resistors 2050 Ω and 11.1 kΩ yield effective load resistances of 2 kΩ and 10 kΩ respectively.
8. Any oscillation greater than 300 mV in amplitude (peak-to-peak) shall be cause for device failure.
FIGURE 3. Test circuit for static tests.
12
MIL-M-38510/114B
Notes:
1. Resistors are ±1.0% tolerance and capacitors are ±10% tolerance.
2. This capacitance includes the actual measured value with stray and wire capacitance.
3. Precaution shall be taken to prevent damage to the device under test during insertion into socket and
in applying power.
4. Pulse input and output characteristics are shown on the next page.
FIGURE 4. Test circuit for transient response and slew rate.
13
MIL-M-38510/114B
Parameter
symbol
Device type
Output pulse
signal
Equation
All
Input pulse signal
at
tr ≤ 50 ns
+50 mV
TR (tr)
Waveform 1
TR (tr) = ∆t
TR (os)
All
+50 mV
Waveform 1
SR (+)
01,02,04,05
-5 V to +5 V step
Waveform 2
TR (os) =
100 (∆VO / VO) %
SR(+) =
03,06
-1 V to +1 V step
Waveform 2
∆VO(+) / ∆t(+)
01,02,04,05
+5 V to –5 V step
Waveform 3
SR(-) =
03,06
-1 V to +1 V step
Waveform 3
∆VO(-) / ∆t(-)
SR (-)
FIGURE 4. Test circuit for transient response and slew rate – Continued.
14
MIL-M-38510/114B
Notes:
1. Resistors are ±1.0% and capacitors are ±10% unless otherwise specified.
2. Precaution shall be taken to prevent damage to the device under test during insertion into socket and
In applying power.
3. For device types 01, 02, 04 and 05, S1 is open, AV = -1 and VIN = 10 V.
4. For device types 03 and 06, S1 is closed, AV = -5 and VIN = 2 V.
5. Settling time, tS, measured on pin 5, is the interval during which the summing node is not nulled
relative to the specified percentage of the final output value. (See table I settling time test conditions).
FIGURE 5. Test circuit for settling time.
15
16
TA =
+125°C
2
-IIB
∆VIO/
∆T
+IIB
VIO
ICC
CMR
VIO
ADJ(+)
VIO
ADJ(-)
IOS(+)
IOS(-)
IIO
+PSRR
-PSRR
-IIB
+IIB
VIO
1
TA =
+25°C
Symbol
Subgroup
27
28
29
30
31
32
33
34
“
“
“
“
“
“
“
“
“
24
25
“
“
4001
22
23
4001
“
26
21
3005
“
19
20
3011
18
16
17
13
14
15
“
4003
4003
4003
11
12
“
“
7
8
“
“
9
6
“
“
10
5
4001
“
3
4
“
“
“
“
2/
“
1
2
“
“
“
“
“
“
“
“
“
2/
6/
“
“
2/
“
5/
5/
3/
“
“
“
“
“
“
“
“
“
“
“
“
“
Notes
Test
no.
MILSTD883
method
4001
“
-20 V
-5 V
-25 V
-25 V
-35 V
-20 V
-5 V
-25 V
-25 V
-35 V
-20 V
-5 V
-5 V
-35 V
2
4
“
“
“
“
“
“
“
“
“
“
“
“
0V
-15 V
10 V
10 V
15 V
0V
-15 V
10 V
10 V
15 V
0V
0V
Open -15 V
“
15 V
3
K2
K2
None
K2
K2, K8
K1
K1
None
K1
K1, K8
“
“
None
“
Energized
relays
“
“
“
“
“
“
“
“
“
“
“
“
5
“
No.
-20 V
-10 V
Open
Open
0V
0V
None
None
5
5
-20 V
-5 V
-5 V
-35 V
-15 V
0V
“
“
0V
0V
Open -15 V
“
15 V
“
“
“
None
“
None
“
“
5
“
2
20 V
35 V
5V
5V
5V
20 V
35 V
5V
5V
5V
-20 V
-5 V
-35 V
-25 V
-25 V
-20 V
-5 V
-25 V
-25 V
-35 V
“
“
“
“
“
“
“
“
“
Open
0V
-15 V
15 V
10 V
10 V
0V
-15 V
10 V
10 V
15 V
K2, K8
K2, K8
K2, K8
None
K2, K8
K1, K8
K1, K8
None
K1, K8
K1, K8
“
“
“
“
“
“
“
“
“
5
∆VIO / ∆T = [VIO (Test 24) – VIO (Test 3)] / 100°C
20 V
5V
35 V
5V
15 V
Calculate value using data from tests 1 and 2
K7
5
20 V -20 V Open 0 V
“
“
0V
K6, K7
5
20 V -20 V
“
15 V -15 V
“
-10 V
None
6
15 V -15 V
“
10 V
None
6
10 V
20 V
E31
E32
E30
E28
E29
E26
E27
E24
E25
E23
E21
E22
E19
E20
I3
I1
I2
E18
E17
E15
E16
E13
E14
E12
E11
E10
E8
E9
E6
E7
E5
E3
E4
E1
E2
Value
“
“
“
“
“
“
“
“
“
V
“
“
V
“
mA
mA
mA
V
V
V
V
“
“
“
“
“
“
“
“
“
“
“
“
V
“
Units
Measured pin
Calculate value using data from tests 3, 7, and 11
20 V
35 V
5V
5V
5V
20 V
35 V
5V
5V
5V
20 V
5V
35 V
5V
1
Adapter pin numbers
-IIB = 10 (E31 – E21)
-IIB = 10 (E32 – E19)
-IIB = 10 (E28 – E20)
-IIB = 10 (E30 – E29)
+IIB = 10 (E21 – E26)
+IIB = 10 (E19 – E27)
+IIB = 10 (E24 – E25)
+IIB = 10 (E20 – E23)
VIO = E21
VIO = E22
VIO = E19
VIO = E20
ICC = I3
IOS(+) = I1
IOS(-) = I2
VIO ADJ(-) = (E3 – E18)
+PSRR = 20 log| 10 /(E3 – E15) |
4
-PSRR = 20 log| 10 /(E3 – E16) |
CMR = 20 log| 3 x 104/(E1 – E2) |
VIO ADJ(+) = (E3 – E17)
4
-IIB = 200 (E13 – E3)
-IIB = 200 (E14 – E1)
-IIB = 200 (E12 – E11)
-IIB = 10,000 (E10 – E2)
+IIB = 200 (E3 – E8)
+IIB = 200 (E1 – E9)
+IIB = 200 (E6 – E7)
+IIB = 10,000 (E2 – E5)
VIO = E3
VIO = E4
VIO = E1
VIO = E2
1/
Equation
IIO = 200(2E3 – E8 – E13)
TABLE III. Group A inspection for all device types.
2
5
Max
“
“
All
“
“
“
“
“
“
-10
-10
-10
-10
-10
-10
-10
-30
-10
-10
01,02,03
-2.5
04,05,06
All
04,05,06
50
50
60
50
50
50
50
10
60
30
2.5
7
4
7
50
-8
20
100
100
01,04
-7
-50
85
8
85
85
-20
-100
-100
300
“
“
“
“
“
“
“
“
“
°C
nA
µV/
“
“
mV
“
mA
mA
mA
mV
dB
mV
dB
pA
“
“
“
“
“
-100
100
100
-100 3500
-100
-100
“
“
“
“
pA
“
“
mV
“
Unit
300
-100
-100 3500
-2
-5
Min
Test limits
02,03,
05,06
01,02,03
“
“
“
“
“
“
“
“
“
“
“
“
All
“
“
“
“
All
04,05,06
01,02,03
Device
type
MIL-M-38510/114B
17
4003
CMR
4003
CMR
60
61
62
63
“
“
“
AVS(+)
AVS(-)
AVS
“
59
“
“
57
58
56
3005
4004
“
54
55
3011
4/
4/
5/
5/
0V
0V
0V
4
None
None
K1,K2,K8
5
5
5
No.
-20 V
-5 V
“
“
0V
0V
-15 V
15 V
0V
-10 V
10 V
0V
0V
“
“
None
“
None
None
None
K6, K7
K7
“
“
5
“
2
6
6
5
5
-20 V
-10 V
Open
Open
0V
0V
None
None
5
5
-15 V
-15 V
-15 V
15 V
15 V
“
“
5V
-5 V
-5 V
“
“
5V
“
“
“
“
20 V
“
15 V
-20 V
“
“
-20 V
20 V
“
“
“
“
“
“
Open
“
“
“
“
Open
-20 V
2V
-2 V
15 V
-15 V
20 V
-20 V
-20 V
20 V
-10 V
10 V
0V
0V
0V
“
“
“
“
“
K4
K3
K3
None
None
None
K6, K7
K7
“
“
“
5
“
“
6
“
6
6
6
5
5
Calculate value using data from tests 44 and 45.
10 V
20 V
E49
E48
E47
E46
(E0)4
(E0)3
(E0)1
(E0)2
I7
I8
I9
E45
E44
E42
E43
E40
E41
E38
E39
I6
I4
I5
E37
E36
E34
E35
E33
Value
4
-VOP = (E0)4
“
“
“
“
AVS = 4/(E49 – E48)
AVS(-) = 15/(E47 – E3)
AVS(+) = 15/(E3 – E46)
+VOP = (E0)3
“
“
+VOP = (E0)1
-VOP = (E0)2
ICC = I9
IOS(+) = I7
IOS(-) = I8
VIO ADJ(-) = (E40 – E45)
VIO ADJ(+) = (E40 – E44)
CMR = 20 log| 3 x 10 /(E38 – E39) |
4
4
+PSRR = 20 log| 10 /(E40 – E42) |
4
-PSRR = 20 log| 10 /(E40 – E43) |
VIO = E40
VIO = E41
VIO = E38
VIO = E39
ICC = I6
IOS(+) = I4
IOS(-) = I5
VIO ADJ(-) = (E21 – E37)
VIO ADJ(+) = (E21 – E36)
CMR = 20 log| 3 x 104/(E19 – E20) |
+PSRR = 20 log| 10 /(E21 – E34) |
4
-PSRR = 20 log| 10 /(E21 – E35) |
IIO = 10(E21 –E33)
1/
Equation
V
“
mA
mA
mA
V
V
V
V
“
“
V
“
mA
mA
mA
V
V
V
V
V
Units
Measured pin
∆VIO / ∆T = [VIO (Test 46) – VIO (Test 3)] / 80°C
20 V
5V
35 V
5V
53
-VOP
TA =
+25°C
“
-15 V
15 V
Open
“
“
“
-15 V
-15 V
15 V
15 V
-5 V
-35 V
“
-20 V
20 V
20 V
3/
6/
“
“
2/
“
5/
5/
Open
52
+VOP
+VOP
-VOP
VIO
ADJ(+)
VIO
ADJ(-)
IOS(+)
IOS(-)
ICC
49
50
4003
4003
51
48
“
46
47
44
45
4001
“
“
“
43
3005
∆VIO/
∆T
+PSRR
-PSRR
VIO
ICC
41
42
Open
Open
Open
3
-20 V
40
3011
-20 V
-10 V
-20 V
2
Energized
relays
Calculate value using data from tests 22 and 23.
10 V
20 V
20 V
1
Adapter pin numbers
20 V
3/
2/
Notes
39
38
36
37
4003
4003
VIO
ADJ(+)
VIO
ADJ(-)
IOS(+)
IOS(-)
35
4001
IIO
+PSRR
-PSRR
Symbol MIL-STD- Test
883
no.
method
4
TA =
-55°C
3
TA =
+125°C
2
Subgroup
TABLE III. Group A inspection for all device types – Continued.
“
“
“
“
“
“
All
“
“
“
“
“
“
10
50
50
15
16
-50
8
85
-10
85
85
“
-30
01,02,03
04,05,06
All
“
04,05,06 -2.5
-15
-16
11
50
-8
10
30
2.5
7
4
7
50
-8
20
Max
01,04
-7
-50
8
85
85
85
-20
Min
Test limits
02,03,
05,06
01,02,03
“
“
“
“
“
“
“
All
Device
type
“
“
“
V/mV
“
“
V
“
mA
mA
mA
mV
mV
dB
°C
dB
µV/
“
“
“
“
mV
“
mA
mA
mA
mV
mV
dB
dB
nA
Unit
MIL-M-38510/114B
70
AVS
74
75
76
77
“
“
“
“
+VOP
-VOP
AVS(+)
AVS(-)
AVS
18
82
83
NI(BB)
“
“
“
“
“
7/
7/
9/
8/
81
NI(PC)
SR(-)
9/
8/
“
4002
SR(+)
4/
4/
4/
4/
Notes
“
“
“
“
80
TR(os)
TA =
+25°C
4002
79
TR(tr)
7
78
73
“
“
71
72
4004
“
TA =
-55°C
69
“
“
AVS(-)
+VOP
-VOP
68
“
AVS(+)
6
67
“
66
“
“
-VOP
TA =
+125°C
64
65
4004
“
+VOP
+VOP
-VOP
Symbol MIL-STD- Test
883
no.
method
5
Subgroup
“
“
“
“
20 V
“
20 V
“
“
“
“
“
15 V
“
“
“
“
-20 V
“
-20 V
“
“
“
“
“
-15 V
“
“
“
“
-15 V
“
15 V
“
“
“
“
-15 V
-5 V
15 V
5V
-5 V
“
5V
“
“
“
-20 V
“
“
“
“
20 V
“
5V
“
“
-5 V
“
“
-20 V
“
2
“
“
20 V
“
1
Open
“
Open
notes
“
“
“
“
See
notes
“
“
“
See
“
“
“
+50 mV
“
“
“
“
“
“
Open
“
“
“
“
“
“
“
Open
“
3
4
0V
“
0V
“
“
“
“
“
Open
“
“
“
“
Open
“
“
“
Open
2V
-2 V
15 V
20 V
-15 V
-20 V
-20 V
20 V
2V
-2 V
15 V
-15 V
20 V
-20 V
-20 V
20 V
Adapter pin numbers
K1,K2,K5,
K8
K5
K9
None
K9
None
K9
None
K9
None
“
“
“
“
“
K4
K3
K3
“
“
“
“
“
K4
K3
K3
Energized
relays
“
“
6
“
“
“
“
“
6
“
“
“
“
6
“
“
“
6
“
“
“
“
5
“
6
“
“
“
“
5
“
“
6
“
No.
V
∆V01(+)
(E0)14
(E0)13
∆t1(-)
∆V01(-)
mVpk
µs
“
mVrms
µs
“
V
mV
∆V01
∆t1(+)
mV
ns
∆tr
V01
ns
“
“
“
“
“
“
V
“
“
“
“
“
“
“
V
“
Units
E57
∆tr
E56
E55
(E0)12
E54
(E0)11
(E0)9
(E0)10
E53
E52
E51
E50
(E0)8
(E0)7
(E0)5
(E0)6
Value
Measured pin
-VOP = (E0)8
+VOP = (E0)7
+VOP = (E0)5
-VOP = (E0)6
1/
Equation
NI(PC) = (E0)14 / 1000
NI(BB) = (E0)13 / 1000
(see figure 4)
SR(-) = ∆V01(-) / ∆t1(-)
(see figure 4)
SR(+) = ∆V01(+) / ∆t1(+)
(see figure 4)
TR(os) = 100 (∆V01/V01)
TR(tr) = ∆t1
(see figure 4)
AVS = 4/(E57 – E56)
AVS(-) = 15/(E55 – E40)
-VOP = (E0)12
AVS(+) = 15/(E40 – E54)
+VOP = (E0)11
+VOP = (E0)9
-VOP = (E0)10
AVS = 4/(E53 – E52)
AVS(-) = 15/(E51 – E21)
AVS(+) = 15/(E21 – E50)
TABLE III. Group A inspection for all device types – Continued.
10
40
All
7.5
3
10
30
40
40
2
7.5
3
10
30
25
02
04
05
03
06
All
06
01
02
04
05
03
01
40
01,02,
04,05
03,06
150
-15
-16
-15
-16
Max
100
450
2
10
25
25
15
16
10
25
25
15
16
Min
Test limits
02,05
03,06
01,04
“
“
“
“
“
“
All
“
“
“
“
“
“
“
All
“
Device
type
µVpk
“
V/µs
“
“
“
“
“
µVrms
V/µs
“
“
“
“
%
ns
“
“
“
V/mV
“
“
V
“
“
“
“
V/mV
“
“
V
“
Unit
MIL-M-38510/114B
TR(os)
TA =
-55°C
19
ts(-)
TA =
+25°C
ts(+)
12
SR(-)
SR(+)
TR(tr)
8
SR(-)
“
“
“
“
4002
“
15 V
93
“
“
“
“
“
-15 V
“
-15 V
“
“
“
“
-15 V
“
“
“
“
“
-15 V
“
-15 V
“
-15 V
“
“
“
“
“
“
“
“
“
“
-15 V
“
“
“
“
“
-15 V
“
“
“
“
“
15 V
“
“
“
“
“
15 V
“
92
9/
“
-15 V
“
15 V
“
“
“
“
-15 V
“
“
2
“
“
notes
See
“
“
“
“
“
“
“
Open
“
“
“
“
“
Open
“
Open
“
“
“
“
“
“
“
“
Open
“
“
“
“
“
Open
“
Open
“
“
“
“
Open
4
notes
See
notes
See
notes
See
“
“
“
“
+50 mV
notes
See
notes
See
“
“
“
“
+50 mV
3
Adapter pin numbers
15 V
1
“
“
“
“
15 V
91
8/
“
“
“
“
“
4002
8/
9/
90
89
88
“
4002
“
“
“
“
9/
8/
87
“
“
“
“
4002
“
9/
8/
Notes
“
86
SR(+)
4002
85
TR(os)
TA =
+125°C
84
TR(tr)
Symbol MIL-STD- Test
883
no.
method
8
Subgroup
“
“
“
“
“
None
K9
None
K9
None
K9
None
K9
None
K9
None
K9
None
K9
None
K9
None
Energized
relays
5
“
“
“
“
5
“
“
“
“
“
6
“
6
“
“
“
“
“
“
“
“
6
“
“
“
“
“
6
“
6
“
“
“
“
6
No.
ns
∆t2
ts(-)
ns
ns
∆t3(-)
ts(+)
V,
µs
µs
∆t3(+)
∆V03(-)
V,
mV
∆V03
∆V03(+)
mV
“
“
ns
V03,
∆t3
V,
µs
∆t2(+)
µs
V,
∆t2(+)
mV
∆V02
∆V02(+)
∆V02(+)
mV
V02,
“
“
Units
Value
Measured pin
TR(tr) = ∆t2
(see figure 4)
1/
Equation
(See figure 5)
(See figure 5)
SR(-) = ∆V03(-) / ∆t3(-)
(see figure 4)
SR(+) = ∆V03(+) / ∆t3(+)
(see figure 4)
(see figure 4)
TR(os) = 100 (∆V03 / V03)
TR(tr) = ∆t3
(see figure 4)
SR(-) = ∆V02(-) / ∆t2(-)
(see figure 4)
SR(+) = ∆V02(+) / ∆t2(+)
(see figure 4)
(see figure 4)
TR(os) = 100 (∆V02 / V02)
TABLE III. Group A inspection for all device types – Continued.
02,05
03,06
02,05
03,06
01,04
04
05
03
06
01,04
02
04
05
03
06
01
02
01
01,02,
04, 05
03,06
02,05
03,06
04
05
03
06
01,04
02
04
05
03
06
01
02
01
01,02,
04, 05
03,06
02,05
03,06
01,04
Device
type
1.5
7
20
25
5
1.5
7
20
25
1
5
1
1.5
7
20
25
5
1.5
7
20
25
1
5
1
Min
1500
800
1500
800
4000
4000
25
40
100
450
150
25
40
100
450
150
Max
Test limits
“
“
“
“
“
“
“
“
ns
“
“
“
“
V/µs
“
V/µs
“
%
“
“
“
“
ns
“
“
“
“
V/µs
“
V/µs
“
%
ns
Unit
MIL-M-38510/114B
MIL-M-38510/114B
TABLE III. Group A inspection – Continued.
1/
The equations take into account both the closed loop gain of 1,000 and the scale factor multiplier so that the calculated
value is in table I units. The measured value units should, therefore, be used in the equation.
(For example: If E1 = 2 V and VIO = E1, then VIO = 2 mV).
2/
Each device shall be tested over the common mode range as specified in table III. VCM conditions are achieved
by grounding the inputs and algebraically subtracting VCM from each supply.
(For example: If VCM = -15 V, then +VCC = +20 V – (-15 V) = +35 V and –VCC = -20 V – (-15 V) = -5 V ).
3/
Common mode rejection is calculated using the offset voltage values measured at the common mode range and end points.
4/
To minimize thermal drift the reference voltage for the gain measurement (E3, E21 and E40) shall be taken immediately
prior to or after the reading corresponding to device gain (E46, E47, E50, E51, E54, and E55).
5/
The output shall be shorted to ground for 25 ms or less.
6/
Tests 26 and 48 which require a read and record measurement plus a calculation may be omitted except when
subgroups 2 and 3 are being accomplished for group A sampling inspection and groups C and D end point measurements.
7/
Broadband noise NI(BB) shall be measured using a true RMS voltmeter with a minimum bandwidth of 10 Hz to 20 kHz.
“Popcorn” noise NI(PC) shall be measured for 15 seconds.
8/
Device types 01, 02, 04, and 05 are tested with a –5 V to +5 V step input as shown in figure 4. The circuit gain is 1 V/V.
9/
Device types 03 and 06 are tested with a –1 V to +1 V step input as shown in figure 4. The circuit gain is 5 V/V.
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the
responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the
Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's
System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
20
MIL-M-38510/114B
TABLE IV. Group C end point electrical parameters.
(TA = 25°C, ±VCC = ±20 V for all device types)
Table III
test no.
3
7
11
Symbol
VIO
+IIB
-IIB
Device types
Delta limits
Limits
Units
Min
Max
Min
Max
01, 02, 03
-1
+1
-5
+5
04, 05, 06
-0.5
0.5
-2
2
01, 02, 03
-50
+50
-100
+100
04, 05, 06
-50
+50
-100
+100
01, 02, 03
-50
+50
-100
+100
04, 05, 06
-50
+50
-100
+100
mV
pA
pA
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and
logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
Complete part number (see 1.2).
c.
Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to acquiring activity in addition to
notification of the qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003),
corrective action and reporting of results, if applicable.
g.
Requirements for product assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not
affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by
or direct shipment to the Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
21
MIL-M-38510/114B
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in
this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this
specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid
adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are
urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-STD-1331.
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified, microcircuits
acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4).
Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered
by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have
equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M38510 device types and may have slight physical variations in relation to case size. The presence of this information should not
be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of
MIL-PRF-38535.
Military device type
01
02
03
04
05
06
Generic-industry type
LF 155
LF 156
LF 157
LF 155A
LF 156A
LF 157A
6.8 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous
issue, due to the extensiveness of the changes.
Custodians:
Army – CR
Navy - EC
Air Force - 11
NASA - NA
DLA – CC
Preparing activity:
DLA - CC
Project 5962-1980
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force – 03, 19, 99
22
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
INSTRUCTIONS
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given.
2. The submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity.
3. The preparing activity must provide a reply within 30 days from receipt of the form.
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts.
Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend
contractual requirements.
I RECOMMEND A CHANGE:
1. DOCUMENT NUMBER
MIL-M-38510/114B
2. DOCUMENT DATE (YYYYMMDD)
2003/08/20
3. DOCUMENT TITLE
MICROCIRCUITS, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON, PART NUMBER M38510/11401 THROUGH
M38510/11406
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)
5. REASON FOR RECOMMENDATION
6. SUBMITTER
a. NAME (Last, First Middle Initial)
c. ADDRESS (Include Zip Code)
8. PREPARING ACTIVITY
a. NAME
Rick Officer
c. ADDRESS (Include Zip Code)
DSCC-VAS
3990 East Broad Street
Columbus, Ohio 43216-5000
DD Form 1426, FEB 1999 (EG)
Feb 99
b. ORGANIZATION
d. TELEPHONE (Include Area Code)
(1) Commercial
(2) DSN
(If applicable)
7. DATE SUBMITTED
(YYYYMMDD)
b. TELEPHONE (Include Area Code
(1) Commercial
(2) DSN
614-692-0518
850-0518
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:
Defense Standardization Program Office (DLSC-LM)
8725 John J. Kingman Road, Suite 2533
Fort Belvoir, Virginia 22060-6221
Telephone (703)767-6888 DSN 427-6888
PREVIOUS EDITIONS ARE OBSOLETE.
WHS/DIOR,
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