8TX 048 TFBGA6x8x12 SAC

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type: B3KE / CD
(8TX) 048 TFBGA 6x8x1.2mm SAC
Basic Substance
CAS Number
"Contained In"
Sub-Component
% Total
Weight
mg/part
ppm
FUSED SILICA
EPOXY RESINS, CURED
60676-86-0
Trade Secret
Trade Secret
14808-60-7
1333-86-4
7440-50-8
65997-17-3
9003-36-5
7631-86-9
7440-02-0
7727-43-7
14807-96-6
25068-38-6
34590-94-8
system
24623-77-6
7440-57-5
7440-22-4
26834-02-6
7440-21-3
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Die Attach
Die Attach
Chip (Die)
Wire Bond
Plating on external leads (pins)
Plating on external leads (pins)
Plating on external leads (pins)
38.981
4.905
4.905
1.258
0.252
8.052
4.800
4.800
1.794
0.875
0.561
0.449
0.449
0.179
0.336
0.112
0.022
0.552
0.138
7.650
0.860
17.257
0.723
0.090
100.000
36.681
4.615
4.615
1.184
0.237
7.577
4.517
4.517
1.689
0.823
0.528
0.422
0.422
0.169
0.317
0.106
0.021
0.519
0.130
7.199
0.809
16.239
0.680
0.085
94.100
389,810
49,048
49,048
12,580
2,515
80,524
48,000
48,000
17,944
8,748
5,608
4,486
4,486
1,794
3,365
1,122
224
5,520
1,380
76,500
8,600
172,569
7,228
904
1,000,000
HIGH CROSS-LINKED HIGH MOLECULAR EPOXY / EPOXY PHENOL RESIN
CRYSTALLINE SILICA
CARBON BLACK
Copper
Glass fibers
Phenol, formaldehyde, (chloromethyl)oxirane polymer
Silica, chemically prepared
Nickel
Barite
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)propanol
Misc.
Aluminium-hydroxide-oxide
Gold
Silver
Basic Duromer:Phenolic resin (Compound of polymeric network)
Silicon
Doped Gold
Tin
Silver
Copper
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e1
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
TOTALS:
47.33
(mg) Total
Mold Compound
FUSED SILICA
EPOXY RESINS, CURED
MOLECULAR EPOXY / EPOXY PHENOL RESIN
CRYSTALLINE SILICA
CARBON BLACK
(mg) Total
Copper
Glass fibers
Phenol, polymer
Silica, chemically prepared
Nickel
Barite
Magnesium silicate
Araldite GY 250
(2-Methoxymethylethoxy)propanol
Misc.
Aluminium-hydroxide-oxide
Gold
Lead Frame
7440-50-8
0.65
(mg) Total
Silver
Phenolic resin
Die Attach
7440-22-4
26834-02-6
7.20
(mg) Total
65997-17-3
9003-36-5
7631-86-9
7440-02-0
7727-43-7
14807-96-6
25068-38-6
34590-94-8
system
24623-77-6
7440-57-5
Total
Total
Chip (Die)
Doped Silicon
0.81
(mg) Total
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
7440-21-3
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
100.00
% of Total Weight
35.90
21.40
21.40
8.00
3.90
2.50
2.00
2.00
0.80
1.50
0.50
0.10
100.00
% of Total Weight
80.00
20.00
100.00
% of Total Weight
% of Total Weight
7440-57-5
Plating on external
leads (pins)
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and
certain “reels” may be made from PVC plastic.
Tin
7440-31-5
95.50
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in
their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the
completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier
information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is
provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels
of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
Silver
7440-22-4
4.00
Copper
7440-50-8
0.50
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product
warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s
quotations, sales order acknowledgement, and invoices.
Total
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or
otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or
of this Certificate of Compliance for semiconductor products.
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
94.10
Au
0.69
7.65
0.86
100.00
(mg) Total
17.00
22.43
100.00
Total
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology
Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if
any, is not below the threshold of regulatory concern for any regulatory scheme world-wide.
50.3
100
Wire Bond
Doped Gold
% ot Total Weight
77.50
9.75
9.75
2.50
0.50
Total
21.11
0.0941 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March
2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
60676-86-0
Trade Secret
Trade Secret
14808-60-7
1333-86-4
% of Total Weight
18.07
100.00
100.00
10:30 AM : 8/17/2015
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