Compliant with IEC 62474/ D9.00 Compliant to IEC 61249-2-21:2003 Termination Base Alloy: Copper Alloy (Cu) Semiconductor Device Type: B3KE / CD (8TX) 048 TFBGA 6x8x1.2mm SAC Basic Substance CAS Number "Contained In" Sub-Component % Total Weight mg/part ppm FUSED SILICA EPOXY RESINS, CURED 60676-86-0 Trade Secret Trade Secret 14808-60-7 1333-86-4 7440-50-8 65997-17-3 9003-36-5 7631-86-9 7440-02-0 7727-43-7 14807-96-6 25068-38-6 34590-94-8 system 24623-77-6 7440-57-5 7440-22-4 26834-02-6 7440-21-3 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Mold Compound Mold Compound Mold Compound Mold Compound Mold Compound Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Lead Frame Die Attach Die Attach Chip (Die) Wire Bond Plating on external leads (pins) Plating on external leads (pins) Plating on external leads (pins) 38.981 4.905 4.905 1.258 0.252 8.052 4.800 4.800 1.794 0.875 0.561 0.449 0.449 0.179 0.336 0.112 0.022 0.552 0.138 7.650 0.860 17.257 0.723 0.090 100.000 36.681 4.615 4.615 1.184 0.237 7.577 4.517 4.517 1.689 0.823 0.528 0.422 0.422 0.169 0.317 0.106 0.021 0.519 0.130 7.199 0.809 16.239 0.680 0.085 94.100 389,810 49,048 49,048 12,580 2,515 80,524 48,000 48,000 17,944 8,748 5,608 4,486 4,486 1,794 3,365 1,122 224 5,520 1,380 76,500 8,600 172,569 7,228 904 1,000,000 HIGH CROSS-LINKED HIGH MOLECULAR EPOXY / EPOXY PHENOL RESIN CRYSTALLINE SILICA CARBON BLACK Copper Glass fibers Phenol, formaldehyde, (chloromethyl)oxirane polymer Silica, chemically prepared Nickel Barite Magnesium silicate Araldite GY 250 (2-Methoxymethylethoxy)propanol Misc. Aluminium-hydroxide-oxide Gold Silver Basic Duromer:Phenolic resin (Compound of polymeric network) Silicon Doped Gold Tin Silver Copper JEDEC 97 Product Marking and/or Pkg. Labeling e1 Package Homogeneous Materials: 8.1 Electronics (e.g. pc boards, displays) TOTALS: 47.33 (mg) Total Mold Compound FUSED SILICA EPOXY RESINS, CURED MOLECULAR EPOXY / EPOXY PHENOL RESIN CRYSTALLINE SILICA CARBON BLACK (mg) Total Copper Glass fibers Phenol, polymer Silica, chemically prepared Nickel Barite Magnesium silicate Araldite GY 250 (2-Methoxymethylethoxy)propanol Misc. Aluminium-hydroxide-oxide Gold Lead Frame 7440-50-8 0.65 (mg) Total Silver Phenolic resin Die Attach 7440-22-4 26834-02-6 7.20 (mg) Total 65997-17-3 9003-36-5 7631-86-9 7440-02-0 7727-43-7 14807-96-6 25068-38-6 34590-94-8 system 24623-77-6 7440-57-5 Total Total Chip (Die) Doped Silicon 0.81 (mg) Total Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data. 7440-21-3 Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/ 100.00 % of Total Weight 35.90 21.40 21.40 8.00 3.90 2.50 2.00 2.00 0.80 1.50 0.50 0.10 100.00 % of Total Weight 80.00 20.00 100.00 % of Total Weight % of Total Weight 7440-57-5 Plating on external leads (pins) The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain “reels” may be made from PVC plastic. Tin 7440-31-5 95.50 Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts. Silver 7440-22-4 4.00 Copper 7440-50-8 0.50 Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices. Total Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products. Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at http://echa.europa.eu/web/guest/candidate-list-table 94.10 Au 0.69 7.65 0.86 100.00 (mg) Total 17.00 22.43 100.00 Total If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme world-wide. 50.3 100 Wire Bond Doped Gold % ot Total Weight 77.50 9.75 9.75 2.50 0.50 Total 21.11 0.0941 g Total Mass This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero) 60676-86-0 Trade Secret Trade Secret 14808-60-7 1333-86-4 % of Total Weight 18.07 100.00 100.00 10:30 AM : 8/17/2015