4QX 006 TDFN2x2x08 NiPdAu

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type: MYY
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e4
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
(4QX) 006 TDFN 2x2x0.8mm NiPdAu
Basic Substance
CAS Number
"Contained In"
Sub-Component
% Total
Weight
mg/part
ppm
Silica, vitreous (or fused)
Epoxy Resin
Phenolic Resin
Carbon Black
Copper
Iron
Phosphorous
Zinc (Metal)
Silver
Epoxy Resin
t-Butyl phenyl glycidyl ether
Phenolic hardener
60676-86-0
Trade Secret
Trade Secret
1333-86-4
7440-50-8
7439-89-6
7723-14-0
7440-66-0
7440-22-4
9003-36-5
3101-60-8
92-88-6
Mold Compound
Mold Compound
Mold Compound
Mold Compound
Lead Frame
Lead Frame
Lead Frame
Lead Frame
Die Attach
Die Attach
Die Attach
Die Attach
50.975
5.217
3.598
0.180
32.712
0.773
0.084
0.050
0.886
0.226
0.076
0.004
6.117
0.626
0.432
0.022
3.925
0.093
0.010
0.006
0.106
0.027
0.009
0.000
509,745
52,174
35,982
1,799
327,123
7,733
841
504
8,856
2,256
756
36
Butyl cellosolve acetate
112-07-2
Die Attach
0.010
0.001
96
Silicon
Gold
Nickel
Palladium
Gold
7440-21-3
7440-57-5
7440-02-0
7440-05-3
7440-57-5
Chip (Die)
Wire Bond
Plating on external leads (pins)
Plating on external leads (pins)
Plating on external leads (pins)
4.010
0.770
0.406
0.022
0.002
100.000
0.481
0.092
0.049
0.003
0.000
12.000
40,100
7,700
4,064
215
22
1,000,000
TOTALS:
7.20
(mg) Total
Mold Compound
Silica, vitreous (or fused)
Epoxy Resin
Phenolic Resin
Carbon Black
60676-86-0
Trade Secret
Trade Secret
1333-86-4
(mg) Total
Copper
Iron
Phosphorous
Zinc (Metal)
Lead Frame
7440-50-8
(mg) Total
Die Attach
Silver
7440-22-4
73.80
9003-36-5
3101-60-8
92-88-6
112-07-2
18.80
6.30
0.30
0.80
7439-89-6
7723-14-0
7440-66-0
Total
0.14
Epoxy Resin
t-Butyl phenyl glycidyl ether
Phenolic hardener
Butyl cellosolve acetate
Total
0.48
0.0120 g Total Mass
Total (mg)
Chip (Die)
Doped Silicon
7440-21-3
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
0.09
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology
Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if
any, is not below the threshold of regulatory concern for any regulatory scheme world-wide.
(mg) Total
Wire Bond
Doped Gold
7440-57-5
100.00
% of Total Weight
% of Total Weight
0.77
100.00
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices
in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the
completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers.
Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers.
Information is provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not
include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
Nickel
7440-02-0
94.50
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product
warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s
quotations, sales order acknowledgement, and invoices.
Palladium
7440-05-3
5.00
Gold
7440-57-5
0.50
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
4.01
100.00
Plating on external
leads (pins)
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or
otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS)
or of this Certificate of Compliance for semiconductor products.
1.2
100.00
(mg) Total
0.05
33.62
100.00
Total
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box
and certain “reels” may be made from PVC plastic.
100.00
% of Total Weight
97.30
.
2.30
0.25
0.15
100.00
% of Total Weight
Total
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March
2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
59.97
85.00
8.70
6.00
0.30
Total
4.03
% ot Total Weight
Total
% of Total Weight
0.43
100.00
12.00
Au
100.00
10:16 AM : 8/17/2015
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