Compliant with IEC 62474/ D9.00 Compliant to IEC 61249-2-21:2003 Termination Base Alloy: Copper Alloy (Cu) Semiconductor Device Type: MYY JEDEC 97 Product Marking and/or Pkg. Labeling e4 Package Homogeneous Materials: 8.1 Electronics (e.g. pc boards, displays) (4QX) 006 TDFN 2x2x0.8mm NiPdAu Basic Substance CAS Number "Contained In" Sub-Component % Total Weight mg/part ppm Silica, vitreous (or fused) Epoxy Resin Phenolic Resin Carbon Black Copper Iron Phosphorous Zinc (Metal) Silver Epoxy Resin t-Butyl phenyl glycidyl ether Phenolic hardener 60676-86-0 Trade Secret Trade Secret 1333-86-4 7440-50-8 7439-89-6 7723-14-0 7440-66-0 7440-22-4 9003-36-5 3101-60-8 92-88-6 Mold Compound Mold Compound Mold Compound Mold Compound Lead Frame Lead Frame Lead Frame Lead Frame Die Attach Die Attach Die Attach Die Attach 50.975 5.217 3.598 0.180 32.712 0.773 0.084 0.050 0.886 0.226 0.076 0.004 6.117 0.626 0.432 0.022 3.925 0.093 0.010 0.006 0.106 0.027 0.009 0.000 509,745 52,174 35,982 1,799 327,123 7,733 841 504 8,856 2,256 756 36 Butyl cellosolve acetate 112-07-2 Die Attach 0.010 0.001 96 Silicon Gold Nickel Palladium Gold 7440-21-3 7440-57-5 7440-02-0 7440-05-3 7440-57-5 Chip (Die) Wire Bond Plating on external leads (pins) Plating on external leads (pins) Plating on external leads (pins) 4.010 0.770 0.406 0.022 0.002 100.000 0.481 0.092 0.049 0.003 0.000 12.000 40,100 7,700 4,064 215 22 1,000,000 TOTALS: 7.20 (mg) Total Mold Compound Silica, vitreous (or fused) Epoxy Resin Phenolic Resin Carbon Black 60676-86-0 Trade Secret Trade Secret 1333-86-4 (mg) Total Copper Iron Phosphorous Zinc (Metal) Lead Frame 7440-50-8 (mg) Total Die Attach Silver 7440-22-4 73.80 9003-36-5 3101-60-8 92-88-6 112-07-2 18.80 6.30 0.30 0.80 7439-89-6 7723-14-0 7440-66-0 Total 0.14 Epoxy Resin t-Butyl phenyl glycidyl ether Phenolic hardener Butyl cellosolve acetate Total 0.48 0.0120 g Total Mass Total (mg) Chip (Die) Doped Silicon 7440-21-3 Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data. 0.09 If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme world-wide. (mg) Total Wire Bond Doped Gold 7440-57-5 100.00 % of Total Weight % of Total Weight 0.77 100.00 Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts. Nickel 7440-02-0 94.50 Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices. Palladium 7440-05-3 5.00 Gold 7440-57-5 0.50 Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at http://echa.europa.eu/web/guest/candidate-list-table 4.01 100.00 Plating on external leads (pins) Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products. 1.2 100.00 (mg) Total 0.05 33.62 100.00 Total Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/ The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain “reels” may be made from PVC plastic. 100.00 % of Total Weight 97.30 . 2.30 0.25 0.15 100.00 % of Total Weight Total This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero) 59.97 85.00 8.70 6.00 0.30 Total 4.03 % ot Total Weight Total % of Total Weight 0.43 100.00 12.00 Au 100.00 10:16 AM : 8/17/2015