0LFURFRPSXWHU&RPSRQHQWV %LW&0260LFURFRQWUROOHU &8 'DWD6KHHW .d s e n r/ m to e i s uc . w nd w o w c i / :/ m p t e ht S C541U Data Sheet Revision History : 05.99 Previous Releases : 10.97(Original Version) Page (10.97 version) Page (05.99 version) Subjects (changes since last revision) All sections All sections 1 2 2 2 4 5 6 to 9 All sections All sections 1 2 2 2 4 5 5 to 8 21 22 24 31 38 39 to 40 43 43 20 22 24 31 37 38 to 39 42 42 43 44 44 44 44 45 45 46 59 61 63 42 42 43 43 43 43 44 44 45 58 60 61 All references to C540U is removed. VCC is changed to VDD. Compliant to USB Specification “Rev 1.0”. Power supply voltage range changed to 4.25V to 5.5V. Line “* P-SDIP-52 package ...” is added. Table 1 is removed and replaced by “Ordering Information”. Figure 3; pin 2 is changed to ECAP. Figure 4 is removed. Table 1; column P-SDIP-52 is deleted and any references to P-SDIP-52 is also removed, the definition of pin 2 is changed to ECAP. Table 3; modified with addition of bit DRVI in GEPIR register. Table 4; modified with addition of bits DRVIE and XVREG in DPWDR register. First sentence; reference to P-SDIP-52 is removed. Figure 16 is modified to include DRVI and DRVIE. Figure 22 is removed. Table 8; column P-SDIP-52 is removed. “Absolute Maximum Ratings” is changed to tabular form. Fifth line; “During overload conditions ...” changed to “During absolute maximum rating conditons ...”. “Operating Conditions” is added. VDD is changed to 4.25V to 5.5V (5V +10%, -15%) “VCC = 5 V + 10% ... “ is replaced by “(Operating Conditions apply)”. VIH min of EA is changed to 0.6 VDD. VOL max of Port 0 is changed to 0.6 V. IIL max is changed to -60 µA. Values for IDD (active and idle mode) and IPD Notes (6); modified. “VCC = 5 V + 10% ... “ is replaced by “(Operating Conditions apply)”. “VCC = 5 V + 10% ... “ is replaced by “(Operating Conditions apply)”. Figure 37 is added. Figure 40 is removed. Edition 05.99 This edition was realized using the software system FrameMaker. Published by Siemens AG, Bereich Halbleiter, MarketingKommunikation, Balanstraße 73, 81541 München © Siemens AG 6/2/99. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! C541U 8-Bit CMOS Microcontroller C541U Advance Information • Enhanced 8-bit C500 CPU – Full software/toolset compatible to standard 80C51/80C52 microcontrollers • 12 MHz external operating frequency – 500 ns instruction cycle • Built-in PLL for USB synchronization • On-chip OTP program memory On-Chip Emulation Support Module • – 8K byte – Alternatively up to 64K byte external program memory – Optional memory protection On-chip USB module – Compliant to USB specification Rev1.0 – Full speed or low speed operation – Five endpoints : one bidirectional control endpoint four versatile programmable endpoints – Registers are located in special function register area – On-chip USB transceiver Oscillator Watchdog Watchdog Timer SSC RAM 256 × 8 Port 0 I/O Port 1 I/O Port 2 I/O OTP Prog. Memory Port 3 8k×8 I/O T0 CPU Power Saving Modes USB Module USB Transceiver T1 D+ D- Figure 1 C541U Functional Units Semiconductor Group 1 C541U Features (continued) : • Up to 64K byte external data memory • 256 byte on-chip RAM • Four parallel I/O ports • • • • • • • • • – P-LCC-44 package : three 8-bit ports and one 6-bit port – P-SDIP-52* package : four 8-bit ports – LED current drive capability for 3 pins (10 mA) Two 16-bit timer/counters (C501 compatible) SSC synchronous serial interface (SPI compatible) – Master and slave capable – Programmable clock polarity / clock-edge to data phase relation – LSB/MSB first selectable – 1.5 MBaud transfer rate at 12 MHz operating frequency 7 interrupt sources (2 external, 5 internal with 2 USB interrupts) selectable at 2 priority levels Enhanced fail safe mechanisms – Programmable watchdog timer – Oscillator watchdog Power saving modes – idle mode – software power down mode with wake-up capability through INT0 pin or USB On-chip emulation support logic (Enhanced Hooks Technology TM) P-LCC-44 and P-SDIP-52* packages Power supply voltage range : 4.25V to 5.5V Temperature Range : TA = 0 to 70 °C * P-SDIP-52 package is available on specific request from customer Semiconductor Group 2 C541U VDD VSS XTAL2 XTAL1 Port 0 8-bit Digital I/O ALE PSEN EA Port 1 6-bit Digital I/O C541U RESET Port 2 8-bit Digital I/O D+ Port 3 8-bit Digital I/O D- Figure 2 Logic Symbol Semiconductor Group 3 7 44 43 42 41 40 39 VDD VSS 8 38 9 37 10 36 11 35 3 12 2 1 C541U 33 14 32 15 31 16 30 4 P2.0/A8 P2.1/A9 P2.2/A10 P2.3/A11 P2.4/A12 VSS VDD 29 17 18 19 20 21 22 23 24 25 26 27 28 Figure 3 Pin Configuration (Top View) Semiconductor Group 34 13 P3.6/WR P3.7/RD XTAL2 XTAL1 RESET P3.0/LED2 P1.3/SRI P3.1/DADD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 4 P1.5/SLS P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 P1.2/SCLK 6 5 VDDU P1.1/LED1 P1.0/LED0 DD+ ECAP C541U P0.4/AD4 P0.5/AD5 P0.6/AD6 P0.7/AD7 EA P1.4/STO ALE PSEN P2.7/A15 P2.6/A14 P2.5/A13 C541U Table 1 Pin Definitions and Functions Symbol Pin I/O*) Function Numbers P-LCC-44 D+ 3 I/O USB D+ Data Line The pin D+ can be directly connected to USB cable (transceiver is integrated on-chip). D- 4 I/O USB D- Data Line The pin D- can be directly connected to USB cable (transceiver is integrated on-chip). P1.0 - P1.4 5 - 7, I/O 12, 34, 44 Port 1 is an 6-bit quasi-bidirectional I/O port with internal pullup resistors. Port 1 pins that have 1’s written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 1 pins being externally pulled low will source current (I IL, in the DC characteristics) because of the internal pullup resistors. Port 1 also contains two outputs with LED drive capability as well as the four pins of the SSC. The pins with LED drive capability are able to sink current up to 10 mA. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate (except when used for the compare functions). The secondary functions are assigned to the port 1 pins as follows : P1.0 / LED0 LED0 output P1.1 / LED1 LED1 output P1.2 / SCLK SSC Master Clock Output / SSC Slave Clock Input P1.3 / SRI SSC Receive Input P1.4 / STO SSC Transmit Output P1.5 / SLS SSC Slave Select Inp. 5 6 7 12 34 44 RESET 10 I RESET A high level on this pin for the duration of two machine cycles while the oscillator is running resets the C541U. A small internal pulldown resistor permits power-on reset using only a capacitor connected to VDD . *) I = Input O = Output Semiconductor Group 5 C541U Table 1 Pin Definitions and Functions Symbol (cont’d) Pin I/O*) Function Numbers P-LCC-44 P3.0 - P3.7 11, 13 - 19 I/O 11 13 14 15 16 17 18 19 Port 3 is an 8-bit quasi-bidirectional I/O port with internal pullup resistors. Port 3 pins that have 1’s written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 3 pins being externally pulled low will source current (I IL, in the DC characteristics) because of the internal pullup resistors. Port 3 also contains the interrupt, timer, serial port and external memory strobe pins that are used by various options. The pin with LED drive capability are able to sink current up to 10 mA. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate. The secondary functions are assigned to the pins of port 3, as follows: P3.0 / LED2 LED2 output P3.1 / DADD Device attached input External interrupt 0 input / P3.2 / INT0 timer 0 gate control input External interrupt 1 input / P3.3 / INT1 timer 1 gate control input P3.4 / T0 Timer 0 counter input P3.5 / T1 Timer 1 counter input WR control output; latches the P3.6 / WR data byte from port 0 into the external data memory RD control output; enables the P3.7 / RD external data memory XTAL2 20 – XTAL2 is the output of the inverting oscillator amplifier. This pin is used for the oscillator operation with crystal or ceramic resonator. XTAL1 21 – XTAL1 is the input to the inverting oscillator amplifier and input to the internal clock generator circuits. To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 is left unconnected. Minimum and maximum high and low times as well as rise/fall times specified in the AC characteristics must be observed. *) I = Input O = Output Semiconductor Group 6 C541U Table 1 Pin Definitions and Functions Symbol (cont’d) Pin I/O*) Function Numbers P-LCC-44 P2.0 - P2.7 24 - 31 I/O Port 2 is an 8-bit quasi-bidirectional I/O port with internal pullup resistors. Port 2 pins that have 1’s written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 2 pins being externally pulled low will source current (I IL, in the DC characteristics) because of the internal pullup resistors. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullup resistors when issuing 1’s. During accesses to external data memory that use 8-bit addresses (MOVX @Ri), port 2 issues the contents of the P2 special function register. PSEN 32 O The Program Store Enable output is a control signal that enables the external program memory to the bus during external fetch operations. It is activated every three oscillator periods except during external data memory accesses. The signal remains high during internal program execution. ALE 33 O The Address Latch enable output is used for latching the address into external memory during normal operation. It is activated every three oscillator periods except during an external data memory access. EA 35 I External Access Enable When held high, the C541U executes instructions from the internal OTP program memory as long as the PC is less than 2000H for the C541U. When held low, the C541U fetches all instructions from external program memory. For the C541U-L this pin must be tied low. P0.0 - P0.7 43 - 36 I/O Port 0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1’s written to them float, and in that state can be used as highimpedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. In this application it uses strong internal pullup resistors when issuing 1’s. *) I = Input O = Output Semiconductor Group 7 C541U Table 1 Pin Definitions and Functions Symbol (cont’d) Pin I/O*) Function Numbers P-LCC-44 ECAP 2 – External Capacitor This pin is required to be connected to an external capacitor which is connected to V SS . The recommended value for the capacitor is 6.8 nF. VDDU 1 – Supply voltage for the on-chip USB transceiver circuitry VDD 8, 23 – Supply voltage for ports and internal logic circuitry during normal, idle, and power down mode. VSS 9, 22 – Ground (0V) during normal, idle, and power down mode. *) I = Input O = Output Semiconductor Group 8 C541U Oscillator Watchdog RAM OTP Memory 256 x 8 8k x 8 XTAL2 OSC & Timing XTAL1 ALE PSEN CPU EA RESET Emulation Support Logic Progr. Watchdog Timer Timer 0 Timer 1 Port 0 Port 0 8-bit digit. I/O Port 1 Port 1 6-bit digit. I/O Port 2 Port 2 8-bit digit. I/O Port 3 Port 3 8-bit digit. I/O D+ D- Transceiver SSC (SPI) Interface PLL USB Module Interrupt Unit C541U Figure 4 Block Diagram of the C541U Semiconductor Group 9 C541U CPU The C541U is efficient both as a controller and as an arithmetic processor. It has extensive facilities for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program memory results from an instruction set consisting of 44 % one-byte, 41 % two-byte, and 15% threebyte instructions. With a 12 MHz crystal, 58% of the instructions are executed in 500ns. Special Function Register PSW (Address D0H) Reset Value : 00H Bit No. MSB D0H LSB D7H D6H D5H D4H D3H D2H D1H D0H CY AC F0 RS1 RS0 OV F1 P Bit Function CY Carry Flag Used by arithmetic instruction. AC Auxiliary Carry Flag Used by instructions which execute BCD operations. F0 General Purpose Flag RS1 RS0 Register Bank Select Control Bits These bits are used to select one of the four register banks. PSW RS1 RS0 Function 0 0 Bank 0 selected, data address 00H-07H 0 1 Bank 1 selected, data address 08H-0FH 1 0 Bank 2 selected, data address 10H-17H 1 1 Bank 3 selected, data address 18H-1FH OV Overflow Flag Used by arithmetic instruction. F1 General Purpose Flag P Parity Flag Set/cleared by hardware after each instruction to indicate an odd/even number of "one" bits in the accumulator, i.e. even parity. Semiconductor Group 10 C541U Memory Organization The C541U CPU manipulates operands in the following four address spaces: – – – – – 8KByte on-chip OTP program memory Totally up to 64 Kbyte internal/external program memory up to 64 Kbyte of external data memory 256 bytes of internal data memory a 128 byte special function register area Figure 5 illustrates the memory address spaces of the C541U. FFFFH FFFFH External indirect addr. External Internal RAM 2000H direct addr. FFH 80H 1FFFH Internal (EA = 1) External (EA = 0) 0000H 0000H "Code Space" "External Data Space" Figure 5 C541U Memory Map Memory Map Semiconductor Group 11 Internal RAM Special Function Register 7FH 00H "internal Data Space" FFH 80H C541U Reset and System Clock The reset input is an active high input at pin RESET. Since the reset is synchronized internally, the RESET pin must be held high for at least two machine cycles (12 oscillator periods) while the oscillator is running. A pulldown resistor is internally connected to VSS to allow a power-up reset with an external capacitor only. An automatic reset can be obtained when VDD is applied by connecting the RESET pin to VDD via a capacitor. Figure 6 shows the possible reset circuitries. b) a) VDD C541U C541U + RESET & c) VDD VDD C541U + RESET Figure 6 Reset Circuitries Semiconductor Group 12 RESET C541U The oscillator and clock generation circuitry of the C541U is shown in figure 5-7. The crystal oscillator generates the system clock for the microcontroller. The USB module can be provided with the following clocks : – Full speed operation : 48 MHz with a data rate of 12 Mbit/s – Low speed operation : 6 MHz with a data rate of 1.5 Mbit/s The low speed clock is generated by a dividing the system clock by 2. The full speed clock is generated by a PLL, which multiplies the system clock by a fix factor of 4. This PLL can be enabled or disabled by bit PCLK of SFR DCR. Depending on full or low speed operation of the USB bit SPEED of SFR has to be set or cleared for the selection of the USB clock. Bit UCLK is a general enable bit for the USB clock. XTAL1 Pin System clock of the microcontroller 12 MHz Crystal Oscillator 12 MHz XTAL2 Pin Divider by 2 6 MHz PLL x4 Enable PCLK DCR.0 48 MHz 1 0 SPEED C541U DCR.7 Figure 7 Block Diagram of the Clock Generation Circuitry Semiconductor Group 13 UCLK DCR.1 to USB Module C541U The clock generator provides the internal clock signals to the chip. These signals define the internal phases, states and machine cycles. Figure 8 shows the recommended oscillator circuits for crystal and external clock operation. C XTAL2 C541U 12 MHz C XTAL1 C = 20pF ± 10pF for crystal operation C541U VDD N.C. External Clock Signal XTAL1 Figure 8 Recommended Oscillator Circuitries Semiconductor Group XTAL2 14 C541U Enhanced Hooks Emulation Concept The Enhanced Hooks Emulation Concept of the C500 microcontroller family is a new, innovative way to control the execution of C500 MCUs and to gain extensive information on the internal operation of the controllers. Emulation of on-chip ROM based programs is possible, too. Each production chip has built-in logic for the supprt of the Enhanced Hooks Emulation Concept. Therefore, no costly bond-out chips are necessary for emulation. This also ensure that emulation and production chips are identical. The Enhanced Hooks TechnologyTM 1), which requires embedded logic in the C500 allows the C500 together with an EH-IC to function similar to a bond-out chip. This simplifies the design and reduces costs of an ICE-system. ICE-systems using an EH-IC and a compatible C500 are able to emulate all operating modes of the different versions of the C500 microcontrollers. This includes emulation of ROM, ROM with code rollover and ROMless modes of operation. It is also able to operate in single step mode and to read the SFRs after a break. ICE-System Interface to Emulation Hardware RESET EA ALE PSEN SYSCON PCON TCON C500 MCU RSYSCON RPCON RTCON EH-IC Enhanced Hooks Interface Circuit Port 0 Port 2 Optional I/O Ports Port 3 Port 1 RPort 2 RPort 0 Target System Interface TEA TALE TPSEN MCS02647 Figure 9 Basic C500 MCU Enhanced Hooks Concept Configuration Port 0, port 2 and some of the control lines of the C500 based MCU are used by Enhanced Hooks Emulation Concept to control the operation of the device during emulation and to transfer informations about the programm execution and data transfer between the external emulation hardware (ICE-system) and the C500 MCU. 1 “Enhanced Hooks Technology“ is a trademark and patent of Metalink Corporation licensed to Siemens. Semiconductor Group 15 C541U Special Function Registers The registers, except the program counter and the four general purpose register banks, reside in the special function register area. The special function register area consists of two portions: the standard special function register area and the mapped special function register area. One special function register of the C541U (PCON1) is located in the mapped special function register area. All other SFRs are located in the standard special function register area. For accessing PCON1 in the mapped special function register area, bit RMAP in special function register SYSCON must be set. Special Function Register SYSCON (Address B1H) Bit No. MSB 7 B1H – Reset Value : XX10XXXXB 6 5 4 3 2 1 LSB 0 – EALE RMAP – – – – SYSCON The functions of the shaded bits are not described in this section. Bit Function RMAP Special function register map bit RMAP = 0 : The access to the non-mapped (standard) special function register area is enabled. RMAP = 1 : The access to the mapped special function register area (PCON1) is enabled. As long as bit RMAP is set, a mapped special function register can be accessed. This bit is not cleared by hardware automatically. Thus, when non-mapped/mapped registers are to be accessed, the bit RMAP must be cleared/set by software, respectively each. The registers, except the program counter and the four general purpose register banks, reside in the special function register area. All SFRs with addresses where address bits 0-2 are 0 (e.g. 80H, 88H, 90H, 98H, ..., F8H, FFH) are bitaddressable. The 75 special function registers (SFRs) in the SFR area include pointers and registers that provide an interface between the CPU and the other on-chip peripherals. The SFRs of the C541U are listed in table 2 to table 4. In table 2 they are organized in groups which refer to the functional blocks of the C541U. Table 4 and table 4 illustrate the contents of the SFRs in numeric order of their addresses. Semiconductor Group 16 C541U Table 2 Special Function Registers - Functional Blocks Block Symbol Name Address Contents after Reset CPU ACC B DPH DPL PSW SP VR0 VR1 VR2 SYSCON Accumulator B Register Data Pointer, High Byte Data Pointer, Low Byte Program Status Word Register Stack Pointer Version Register 0 Version Register 1 Version Register 2 System Control Register E0H 1) F0H 1) 83H 82H D0H 1) 81H FCH FDH FEH B1H 00H 00H 00H 00H 00H 07H C5H C1H YYH 3) XX10XXXXB 2) Interrupt System IEN0 IEN1 IP0 IP1 ITCON Interrupt Enable Register 0 Interrupt Enable Register 1 Interrupt Priority Register 0 Interrupt Priority Register 1 External Interrupt Trigger Condition Register A8H1) A9H B8H 1) B9H) 9AH 0XXX0000B 2) XXXXX000B 2) XXXX0000B 2) XXXXX000B 2) XXXX1010B 2) Ports P0 P1 P2 P3 Port 0 Port 1 Port 2 Port 3 80H 1) 90H 1) A0H 1) B0H 1) FFH FFH FFH FFH Timer 0 / Timer 1 TCON TH0 TH1 TL0 TL1 TMOD Timer 0/1 Control Register Timer 0, High Byte Timer 1, High Byte Timer 0, Low Byte Timer 1, Low Byte Timer Mode Register 88H 1) 8CH 8DH 8AH 8BH 89H 00H 00H 00H 00H 00H 00H SSC Interface SSCCON STB SRB SCF SCIEN SSCMOD SSC Control Register SSC Transmit Buffer SSC Receive Register SSC Flag Register SSC Interrupt Enable Register SSC Mode Test Register 93H 1) 94H 95H ABH 1) ACH 96H 07H XXH 2) XXH 2) XXXXXX00B 2) XXXXXX00B 2) 00H Watchdog Timer Control Register Watchdog Timer Reload Register C0H 1) 86H XXXX0000B 2) 00H Watchdog WDCON WDTREL 1) Bit-addressable special function registers 2) “X“ means that the value is undefined and the location is reserved 3) The content of this SFR varies with the actual of the step C541U (eg. 01H for the first step) 4) This SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 17 C541U Table 2 Special Function Registers - Functional Blocks (cont’d) Block Symbol Name Address Contents after Reset Pow. Sav. Modes PCON PCON1 Power Control Register Power Control Register 1 87H 88H 4) X00X0000B 2) 0XX0XXXXB 2) USB Module EPSEL USBVAL ADROFF GEPIR DCR DPWDR DIER DIRR FNRL FNRH EPBCn 1) EPBSn 1) EPIEn 1) EPIRn 1) EPBAn 1) EPLENn 1) USBPWD4) USBDCR 4) USBDR0 4) USBDR1 4) USBDR2 4) USBDR3 4) USBDR4 4) USBDR5 4) USBDR6 4) USBDR7 4) USB Endpoint Select Register USB Data Register USB Address Offset Register USB Global Endpoint Interrupt Request Reg. USB Device Control Register USB Device Power Down Register USB Device Interrupt Control Register USB Device Interrupt Request Register USB Frame Number Register, Low Byte USB Frame Number Register, High Byte USB Endpoint n Buffer Control Register USB Endpoint n Buffer Status Register USB Endpoint n Interrupt Enable Register USB Endpoint n Interrupt Request Register USB Endpoint n Base Address Register USB Endpoint n Buffer Length Register USB Power Down Register USB Control Register USB Data Register 0 USB Data Register 1 USB Data Register 2 USB Data Register 3 USB Data Register 4 USB Data Register 5 USB Data Register 6 USB Data Register 7 D2H D3H D4H D6H C1H C2H C3H C4H C6H C7H C1H C2H C3H C4H C5H C6H E6H E7H E8H E9H EAH EBH ECH EDH EEH EFH 80H 00H 00H 2) 00H 000X0000B 00H 00H 00H XXH 00000XXXB 00H 20H 00H 10H 3) 00H 0XXXXXXXB 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 1) These register are multiple registers (n=0-4) with the same SFR address; selection of register “n“ is done by SFR EPSEL. 2) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset. 3) The reset value of EPIR0 is 11H. 4) These registers are only used in USB low-speed operation. Semiconductor Group 18 C541U Table 3 Contents of the SFRs, SFRs in numeric order of their addresses Addr Register Reset Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 80H 2) P0 81H SP FFH .7 .6 .5 .4 .3 .2 .1 .0 07H .7 .6 .5 .4 .3 .2 .1 .0 82H 83H DPL 00H .7 .6 .5 .4 .3 .2 .1 .0 DPH 00H .7 .6 .5 .4 .3 .2 .1 .0 86H WDTREL 00H WDT PSEL .6 .5 .4 .3 .2 .1 .0 87H PCON X00X0000B – PDS IDLS – GF1 GF0 PDE IDLE 00H TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 0XX0XXXXB EWPD – – WS – – – – 88H 2) TCON 88H PCON1 2) 3) 89H 8AH TMOD 00H GATE C/T M1 M0 GATE C/T M1 M0 TL0 00H .7 .6 .5 .4 .3 .2 .1 .0 8BH TL1 00H .7 .6 .5 .4 .3 .2 .1 .0 8CH 8DH TH0 00H .7 .6 .5 .4 .3 .2 .1 .0 TH1 00H .7 .6 .5 .4 .3 .2 .1 .0 P1 FFH .7 .6 SLS STO SRI SCLK LED1 LED0 SSCCON 07H SCEN TEN MSTR CPOL CPHA BRS2 BRS1 BRS0 94H 95H STB .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 96H 9AH SSCMOD 00H LOOPB TRIO 0 0 0 0 0 LSBSM ITCON XXXX1010B FFH – – – – I1ETF I1ETR I0ETF I0ETR .7 .6 .5 .4 .3 .2 .1 .0 0XXX0000B EA – – – ET1 EX1 ET0 EX0 IEN1 XXXXX000B – – – – – EUDI EUEI ESSC ABH SCF XXXXXX00B – – – – – – WCOL TC 90H 93H 2) SRB A0H2) P2 A8H2) IEN0 A9H XXH XXH 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers 3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 19 C541U Table 3 Contents of the SFRs, SFRs in numeric order of their addresses (cont’d) Addr Register Reset Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 ACH SCIEN – – – – – – WCEN TCEN XXXXXX00B Bit 0 B0H2) P3 FFH B1H SYSCON XX10XXXXB RD WR T1 T0 INT1 INT0 DADD LED2 – – EALE RMAP – – – – B8H2) IP0 XXXX0000B – – – – PT1 PX1 PT0 PX0 B9H XXXXX000B – – – – – PUDI PUEI PSSC C0H 2) WDCON XXXX0000B – – – – OWDS WDTS WDT SWDT C1H to C7H D0H PSW USB Device and Endpoint Register definition see table 3-3 IP1 00H CY AC F0 RS1 RS0 OV F1 P 80H EPS7 0 0 0 0 EPS2 EPS1 EPS0 .7 .6 .5 .4 .3 .2 .1 .0 0 0 AO5 AO4 AO3 AO2 AO1 AO0 DRVI 0 0 EPI4 EPI3 EPI2 EPI1 EPI0 .7 .6 .5 .4 .3 .2 .1 .0 0 0 SUSPIE DADDIE SUSP DADD TPWD RPWD TYPE3 TYPE2 TYPE1 TYPE0 LEN3 LEN2 LEN1 LEN0 E8H 7) USBDR0 00H E9H 7) USBDR1 00H EAH 7) USBDR2 00H .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 EBH 7) USBDR3 00H ECH7) USBDR4 00H EDH7) USBDR5 00H .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 EEH 7) USBDR6 00H .7 .6 .5 .4 .3 .2 .1 .0 2) D2H D3H D4H D6H EPSEL USBVAL 00H ADROFF 00H GEPIR 00H E0H2) ACC 00H E6H 7) USBPWD 00H E7H 7) USBDCR 00H 6) 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers 3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. 4) These are read-only registers 5) The content of this SFR varies with the actual step of the C541U (e.g. 01H for the first step) 6) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset 7) These registers are only used in USB low-speed operation. Semiconductor Group 20 C541U Table 3 Contents of the SFRs, SFRs in numeric order of their addresses (cont’d) Addr Register Reset Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 EFH 7) USBDR7 00H F0H2) B 00H C5H FCH 3) VR0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 1 1 0 0 0 1 0 1 4) FDH VR1 C1H 1 1 0 0 0 0 0 1 FEH 3) VR2 5) .7 .6 .5 .4 .3 .2 .1 .0 3) 4) 4) 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers 3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. 4) These are read-only registers 5) The content of this SFR varies with the actual step of the C541U (e.g. 01H for the first step) 6) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset. 7) These registers are only used in USB low-speed operation. Semiconductor Group 21 C541U Table 4 Contents of the USB Device and Endpoint Registers (Addr. C1H to C7H) Addr Register Reset Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 EPSEL = 1XXX.XXXXB Device Registers C1H DCR 000X. 0000B C2H DPWDR 00H C3H DIER 00H C4H DIRR 00H SPEED DA SWR SUSP DINIT RSM UCLK PCLK DRVIE XVREG 0 0 0 0 TPWD RPWD SE0IE DAIE DDIE SBIE SEIE STIE SUIE SOFIE SE0I DAI DDI SBI SEI STI SUI SOFI FNR6 FNR5 FNR4 FNR3 FNR2 FNR1 FNR0 0 0 0 0 FNR10 FNR9 FNR8 0 DBM0 C5H reserved FNR7 C6H FNRL XXH C7H FNRH 0000. 0 0XXXB EPSEL = 0XXX.X000B Endpoint 0 Registers C1H EPBC0 C2H EPBS0 00H 20H STALL0 0 0 GEPIE0 SOFDE0 INCE0 UBF0 CBF0 DIR0 ESP0 SETRD0 SETWR0 CLREP0 DONE0 C3H EPIE0 C4H EPIR0 00H 11H AIE0 NAIE0 RLEIE0 – DNRIE0 NODIE0 EODIE0 SODIE0 ACK0 NACK0 RLE0 – DNR0 NOD0 EOD0 SOD0 0 0 0 A06 A05 A04 A03 L06 L05 L04 L03 L02 L01 L00 0 DBM1 PAGE0 C5H EPBA0 00H C6H EPLEN0 0XXX. 0 XXXXB C7H reserved EPSEL = 0XXX.X001B Endpoint 1 Registers C1H EPBC1 C2H EPBS1 00H 20H STALL1 0 0 GEPIE1 SOFDE1 INCE1 UBF1 CBF1 DIR1 ESP1 SETRD1 SETWR1 CLREP1 DONE1 C3H EPIE1 C4H EPIR1 00H 10H AIE1 NAIE1 RLEIE1 – DNRIE1 NODIE1 EODIE1 SODIE1 ACK1 NACK1 RLE1 – DNR1 NOD1 EOD1 SOD1 0 0 0 A16 A15 A14 A13 L16 L15 L14 L13 L12 L11 L10 PAGE1 C5H EPBA1 00H C6H EPLEN1 0XXX. 0 XXXXB C7H reserved Semiconductor Group 22 C541U Table 4 Contents of the USB Device and Endpoint Registers (Addr. C1H to C7H) (cont’d) Addr Register Reset Value Bit 7 Bit 4 Bit 3 EPSEL = 0XXX.X010B Endpoint 2 Registers C1H EPBC2 C2H EPBS2 00H 20H STALL2 0 0 GEPIE2 SOFDE2 INCE2 UBF2 CBF2 DIR2 ESP2 SETRD2 SETWR2 CLREP2 DONE2 C3H EPIE2 C4H EPIR2 00H 10H AIE2 NAIE2 RLEIE2 – DNRIE2 NODIE2 EODIE2 SODIE2 ACK2 NACK2 RLE2 – DNR2 NOD2 EOD2 SOD2 0 0 0 A62 A52 A42 A32 L62 L52 L42 L32 L22 L12 L02 0 DBM3 PAGE2 C5H EPBA2 00H C6H EPLEN2 0XXX. 0 XXXXB C7H reserved EPSEL = 0XXX.X011B Bit 6 Bit 5 Bit 2 Bit 1 Bit 0 0 DBM2 Endpoint 3 Registers C1H EPBC3 C2H EPBS3 00H 20H STALL3 0 0 GEPIE3 SOFDE3 INCE3 UBF3 CBF3 DIR3 ESP3 SETRD3 SETWR3 CLREP3 DONE3 C3H EPIE3 C4H EPIR3 00H 10H AIE3 NAIE3 RLEIE3 – DNRIE3 NODIE3 EODIE3 SODIE3 ACK3 NACK3 RLE3 – DNR3 NOD3 EOD3 SOD3 0 0 0 A63 A52 A43 A33 L63 L53 L43 L33 L23 L13 L03 0 DBM4 PAGE3 C5H EPBA3 00H C6H EPLEN3 0XXX. 0 XXXXB C7H reserved EPSEL = 0XXX.X100B Endpoint 4 Registers C1H EPBC4 C2H EPBS4 00H 20H STALL4 0 0 GEPIE4 SOFDE4 INCE4 UBF4 CBF4 DIR4 ESP4 SETRD4 SETWR4 CLREP4 DONE4 C3H EPIE4 C4H EPIR4 00H 10H AIE4 NAIE4 RLEIE4 – DNRIE4 NODIE4 EODIE4 SODIE4 ACK4 NACK4 RLE4 –4 DNR4 NOD4 EOD4 SOD4 0 0 0 A64 A54 A44 A34 L64 L54 L44 L34 L24 L14 L04 PAGE4 C5H EPBA4 00H C6H EPLEN4 0XXX. 0 XXXXB C7H reserved Semiconductor Group 23 C541U Digital I/O Ports The C541U three 8-bit I/O ports and one 6-bit I/O port (Port 1). Port 0 is an open-drain bidirectional I/O port, while ports 1 to 3 are quasi-bidirectional I/O ports with internal pullup resistors. That means, when configured as inputs, ports 1 to 3 will be pulled high and will source current when externally pulled low. Port 0 will float when configured as input. The output drivers of port 0 and 2 and the input buffers of port 0 are also used for accessing external memory. In this application, port 0 outputs the low byte of the external memory address, time multiplexed with the byte being written or read. Port 2 outputs the high byte of the external memory address when the address is 16 bits wide. Otherwise, the port 2 pins continue emitting the P2 SFR contents. In this function, port 0 is not an open-drain port, but uses a strong internal pullup FET. Two port lines of port 1 (P1.0/LED0, P1.1/LED1) and one port line of port 3 (P3.0/LED2) have the capability of driving external LEDs in the output low state. Semiconductor Group 24 C541U Timer / Counter 0 and 1 Timer/Counter 0 and 1 can be used in four operating modes as listed in table 5 : Table 5 Timer/Counter 0 and 1 Operating Modes Mode Description TMOD Input Clock M1 M0 internal external (max) fOSC/6x32 fOSC/12x32 fOSC/6 fOSC/12 0 8-bit timer/counter with a divide-by-32 prescaler 0 0 1 16-bit timer/counter 1 1 2 8-bit timer/counter with 8-bit autoreload 1 0 3 Timer/counter 0 used as one 8-bit timer/counter and one 8-bit timer Timer 1 stops 1 1 In the “timer” function (C/T = ‘0’) the register is incremented every machine cycle. Therefore the count rate is fOSC/6. In the “counter” function the register is incremented in response to a 1-to-0 transition at its corresponding external input pin (P3.4/T0, P3.5/T1). Since it takes two machine cycles to detect a falling edge the max. count rate is fOSC/12. External inputs INT0 and INT1 (P3.2, P3.3) can be programmed to function as a gate to facilitate pulse width measurements. Figure 10 illustrates the input clock logic. OSC ÷6 f OSC /6 C/T = 0 Timer 0/1 Input Clock C/T = 1 P3.4/T0 P3.5/T1 Gate (TMOD) Control TR0 TR1 =1 & <_ 1 P3.2/INT0 P3.3/INT1 MCS03117 Figure 10 Timer/Counter 0 and 1 Input Clock Logic Semiconductor Group 25 C541U SSC Interface The C541U microcontroller provides a Synchronous Serial Channel unit, the SSC. This interface is compatible to the popular SPI serial bus interface. Figure 11 shows the block diagram of the SSC. The central element of the SSC is an 8-bit shift register. The input and the output of this shift register are each connected via a control logic to the pin P1.3 / SRI (SSC Receiver In) and P1.4 / STO (SSC Transmitter Out). This shift register can be written to (SFR STB) and can be read through the Receive Buffer Register SRB. Pin P1.2 / SCLK Pin P1.3 / SRI Pin P1.4 / STO Pin P1.5 / SLS f OSC Clock Divider STB ... Clock Selection Pin Control Logic Shift Register SRB Receive Buffer Register Interrupt SCIEN Int. Enable Reg. Control Logic SSCCON Control Register SCF Status Register Internal Bus MCB03379 Figure 11 SSC Block Diagram The SSC has implemented a clock control circuit, which can generate the clock via a baud rate generator in the master mode, or receive the transfer clock in the slave mode. The clock signal is fully programmable for clock polarity and phase. The pin used for the clock signal is P1.2/ SCLK. When operating in slave mode, a slave select input is provided which enables the SSC interface and also will control the transmitter output. The pin used for this is P1.5 / SLS. The SSC control block is responsible for controlling the different modes and operation of the SSC, checking the status, and generating the respective status and interrupt signals. Semiconductor Group 26 C541U USB Module The USB module in the C541U handles all transactions between the serial USB bus and the internal (parallel) bus of the microcontroller. The USB module includes several units which are required to support data handling with the USB bus : the on-chip USB bus transceiver, the USB memory with two pages of 128 bytes each, the memory management unit (MMU) for USB and CPU memory access control, the UDC device core for USB protocol handling, the microcontroller interface with the USB specific special function registers and the interrupt control logic. A clock generation unit provides the clock signal for the USB module for full speed and low speed USB operation. Figure 12 shows the block diagram of the functional units of the USB module with their interfaces. XTAL1 Pin XTAL2 Pin USB Bus DD+ Pin Pin Osc. 12 MHz 7F H Transceiver (On-chip) x4 PLL 48 MHz 7F H Page 1 Page 0 USB Memory 00 H (128 x 8) 2 USB Module 00 H 6 MHz Data Data USB Device Core MCU Interface Internal Bus Address 11 SFR Addr. MMU (UDC) Control USB Memory Management Control Interrupt Generation MCB03380 Figure 12 USB Module Block Diagram Semiconductor Group 27 C541U USB Full-Speed Registers Two different kinds of registers are implemented for full speed operation in the USB module. The global registers (GEPIR, EPSEL, ADROFF, USBVAL) describe the basic functionality of the complete USB module and can be accessed via unique SFR addresses. For reduction of the number of SFR addresses which are needed to control the USB module inside the C541U, device registers and endpoint registers are mapped into an SFR address block of seven SFR addresses (C1H to C7H). The endpoint specific functionality of the USB module is controlled via the device registers DCR, DPWDR, DIER, DIRR and the frame number registers. An endpoint register set is available for each endpoint (n=0..4) and describes the functionality of the selected endpoint. Figure 13 explains the structure of the USB module registers. Global Registers USBVAL(D3H) GEPIR(D6H) D 0 0 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 EPSEL(D2H) ADROFF(D4H) 0 0 .5 .4 .3 .2 .1 .0 .7 0 0 0 0 .2 .1 .0 Decoder Device Registers C1H Endpoint 0 Registers Endpoint 1 Registers Endpoint 2 Registers Endpoint 3 Registers Endpoint 4 Registers C1H EPBC0 C1H EPBC1 C1H EPBC2 C1H EPBC3 C1H EPBC4 C2H DPWDR C2H EPBS0 C2H EPBS1 C2H EPBS2 C2H EPBS3 C2H EPBS4 C3H DIER C3H EPIE0 C3H EPIE1 C3H EPIE2 C3H EPIE3 C3H EPIE4 C4H C4H EPIR0 C4H EPIR1 C4H EPIR2 C4H EPIR3 C4H EPIR4 C5H DIRR reserved C6H C7H DCR C5H EPBA0 C5H EPBA1 C5H EPBA2 C5H EPBA3 C5H EPBA4 FNRL C6H EPLEN0 C6H EPLEN1 C6H EPLEN2 C6H EPLEN3 C6H EPLEN4 FNRH C7H reserved C7H reserved C7H reserved C7H reserved C7H reserved Figure 13 Register Structure of the USB Module Semiconductor Group 28 C541U Interrupt System The C541U provides seven interrupt sources with two priority levels. Five interrupts can be generated by the on-chip peripherals (timer 0, timer 1, SSC interface, and USB module), and two interrupts may be triggered externally (P3.2/INT0 and P3.3/INT1). Figure 14 to 16 give a general overview of the interrupt sources and illustrate the request and control flags which are described in the next sections. Timer 0 Overflow Low Priority TF0 TCON.5 ET0 000B H IEN0.1 Timer 1 Overflow TF1 TCON.7 ET1 IP0.1 001B H PT1 IEN0.3 P3.2 / High Priority PT0 IP0.3 >1 INT0 IE0 IT0 TCON.0 TCON.1 ITCON.0 EX0 0003 H PX0 IEN0.0 IP0.0 ITCON.1 P3.3 / >1 INT1 IE0 IT1 TCON.2 ITCON.2 TCON.3 EX1 0013 H PX1 IEN0.2 IP0.2 EA Bit addressable IEN0.7 ITCON.3 Request flag is cleared by hardware MCT03684 Figure 14 Interrupt Request Sources (Part 1) Semiconductor Group 29 C541U Endpoint Interrupts Low Speed Interrupts Endpoint 4 Interrupts SUSP SUSPIE USBPWD.3 USBPWD.5 Endpoint 3 Interrupts Endpoint 2 Interrupts DADDIE USBPWD.2 USBPWD.4 Endpoint 0 Interrupts ACK0 EPIR0.7 NACK0 EPIR0.6 RLE0 EPIR0.5 DNR0 EPIR0.3 NOD0 EPIR0.2 EOD0 EPIR0.1 SOD0 EPIR0.0 SETUP packet OUT packet USB Reset AIE0 EPIE0.7 NAIE0 EPIE0.6 RLEIE0 EPIE0.5 DNRIE0 EPIE0.3 NODIE0 EPIE0.2 ≥1 DADD Endpoint 1 Interrupts ≥1 EPI0 GEPIR.0 Low Priority ≥1 High Priority EUEI GEPIE0 EPBC0.4 004BH PUEI IEN1.1 IP1.1 EODIE0 EPIE0.1 SODIE0 EPIE0.0 WCOL SSC Interrupts SCF.1 WCEN SCIEN.1 ≥1 ESSC TC SCF.0 0043H IEN1.0 TCEN PSSC IP1.0 EA SCIEN.0 IEN0.7 Bit addressable Request flag is cleared by hardware after the corresponding register has been read. Figure 15 Interrupt Request Sources (Part 2) Semiconductor Group 30 C541U Device Interrupts SE0I DIRR.7 DAI DIRR.6 DDI DIRR.5 SBI DIRR.4 SEI DIRR.3 STI DIRR.2 SUI DIRR.1 SOFI DIRR.0 DRVI GEPIR.7 SE0IE DIER.7 DAIE DIER.6 Low Priority DDIE DIER.5 SBIE DIER.4 High Priority ≥1 EUDI SEIE DIER.3 0053H IEN1.2 PUDI IP1.2 STIE DIER.2 SUIE DIER.1 SOFIE DIER.0 EA IE0.7 DRVIE DPWDR.7 Bit addressable Request flag is cleared by hardware after the corresponding register has been read. Figure 16 Interrupt Request Sources (Part 3) Table 6 Interrupt Source and Vectors Interrupt Source Interrupt Vector Address Interrupt Request Flags (SFRs) External Interrupt 0 0003H IE0 Timer 0 Overflow 000BH 0013H TF0 External Interrupt 1 Timer 1 Overflow IE1 SSC Interrupt 001BH 0043H TC, WCOL USB Endpoint Interrupt 004BH in SFRs EPIR0-4 and GEPIR USB Device Interrupt 0053H in SFRs DIRR and GEPIR Wake-up from power down 007BH – Semiconductor Group TF1 31 C541U Fail Save Mechanisms The C541U offers enhanced fail safe mechanisms, which allow an automatic recovery from software upset or hardware failure : – a programmable watchdog timer (WDT), with variable time-out period from 256 µs up to approx. 0.55 µs at 12 MHz. – an oscillator watchdog (OWD) which monitors the on-chip oscillator and forces the microcontroller into reset state in case the on-chip oscillator fails; it also provides the clock for a fast internal reset after power-on. The watchdog timer in the C541U is a 15-bit timer, which is incremented by a count rate of fOSC/12 or fOSC/192. The system clock of the C541U is divided by two prescalers, a divide-by-two and a divide-by-16 prescaler which are selected by bit WDTPSEL (WDTREL.7). For programming of the watchdog timer overflow rate, the upper 7 bit of the watchdog timer can be written. Figure 8-17 shows the block diagram of the watchdog timer unit. 0 f OSC / 6 7 16 2 WDTL 14 WDT Reset-Request 8 WDTH WDCON (CO H ) - - - - OWDS WDTS WDT SWDT WDTPSEL Control Logic 7 6 0 External HW Reset WDTREL MCB03384 Figure 17 Block Diagram of the Watchdog Timer The watchdog timer can be started by software (bit SWDT) but it cannot be stopped during active mode of the C541U. If the software fails to refresh the running watchdog timer an internal reset will be initiated on watchdog timer overflow. For refreshing of the watchdog timer the content of the SFR WDTREL is transfered to the upper 7-bit of the watchdog timer. The refresh sequence consists of two consequtive instructions which set the bits WDT and SWDT each. The reset cause (external reset or reset caused by the watchdog) can be examined by software (flag WDTS). It must be noted, however, that the watchdog timer is halted during the idle mode and power down mode of the processor. Semiconductor Group 32 C541U Oscillator Watchdog The oscillator watchdog unit serves for three functions: – Monitoring of the on-chip oscillator’s function The watchdog supervises the on-chip oscillator's frequency; if it is lower than the frequency of the auxiliary RC oscillator in the watchdog unit, the internal clock is supplied by the RC oscillator and the device is brought into reset; if the failure condition disappears (i.e. the onchip oscillator has a higher frequency than the RC oscillator), the part executes a final reset phase of typ. 1 ms in order to allow the oscillator to stabilize; then the oscillator watchdog reset is released and the part starts program execution again. – Fast internal reset after power-on The oscillator watchdog unit provides a clock supply for the reset before the on-chip oscillator has started. The oscillator watchdog unit also works identically to the monitoring function. – Control of external wake-up from software power-down mode (description see chapter 9) When the power-down mode is left by a low level at the INT0 pin or by the USB, the oscillator watchdog unit assures that the microcontroller resumes operation (execution of the powerdown wake-up interrupt) with the nominal clock rate. In the power-down mode the RC oscillator and the on-chip oscillator are stopped. Both oscillators are started again when power-down mode is released. When the on-chip oscillator has a higher frequency than the RC oscillator, the microcontroller starts operation after a final delay of typ. 1 ms in order to allow the on-chip oscillator to stabilize. Semiconductor Group 33 C541U EWPD (PCON1.7) WS (PCON1.4) Power - Down Mode Activated Power-Down Mode Wake - Up Interrupt Activity on USB Bus P3.2 / INT0 Control Logic Control Logic Internal Reset Start / Stop RC Oscillator f RC 3 MHz Start / Stop XTAL1 XTAL2 10 f1 f2 Frequency Comparator f 2 <f 1 Delay On-Chip Oscillator >1 WDCON (C0 H ) OWDS Int. Clock MCD03385 Figure 18 Functional Block Diagram of the Oscillator Watchdog Semiconductor Group 34 C541U Power Saving Modes The C541U provides two basic power saving modes, the idle mode and the power down mode. – Idle mode In the idle mode the main oscillator of the C541U continues to run, but the CPU is gated off from the clock signal. However, the interrupt system, the SSC, the USB module, and the timers with the exception of the watchdog timer are further provided with the clock. The CPU status is preserved in its entirety : the stack pointer, program counter, program status word, accumulator, and all other registers maintain their data during idle mode. The idle mode can be terminated by activating any enabled interrupt. or by a hardware reset. – Power down mode In the power down mode, the RC osciillator and the on-chip oscillator which operates with the XTAL pins is stopped. Therefore, all functions of the microcontroller are stopped and only the contents of the on-chip RAM, XRAM and the SFR's are maintained. The power down mode can be left either by an active reset signal or by a low signal at the P3.2/INT0 pin or any activity on the USB bus. Using reset to leave power down mode puts the microcontroller with its SFRs into the reset state. Using the INT0 pin or USB bus for power down mode exit maintains the state of the SFRs, which has been frozen when power down mode is entered. In the power down mode of operation, VDD can be reduced to minimize power consumption. It must be ensured, however, that VDD is not reduced before the power down mode is invoked, and that VDD is restored to its normal operating level, before the power down mode is terminated. Table 7 gives a general overview of the entry and exit procedures of the power saving modes. Table 7 Power Saving Modes Overview Mode Entering 2-Instruction Example Leaving by Remarks Idle mode ORL PCON, #01H ORL PCON, #20H Ocurrence of an interrupt from a peripheral unit CPU clock is stopped; CPU maintains their data; peripheral units are active (if enabled) and provided with clock Hardware Reset Power Down Mode ORL PCON, #02H ORL PCON, #40H Semiconductor Group Hardware Reset Short low pulse at pin P3.2/INT0 or activity on the USB bus 35 Oscillator is stopped; contents of on-chip RAM and SFR’s are maintained; C541U OTP Memory Operation The C541U contains a 8k byte one-time programmable (OTP) program memory. With the C541U fast programming cycles are achieved (1 byte in 100 µsec). Also several levels of OTP memory protection can be selected. For programming of the device, the C541U must be put into the programming mode. This typically is done not in-system but in a special programming hardware. In the programming mode the C541U operates as a slave device similar as an EPROM standalone memory device and must be controlled with address/data information, control lines, and an external 11.5V programming voltage. Figure 19 shows the pins of the C541U-1E which are required for controlling of the OTP programming mode. VDD A0-A7 / A8-A12 PALE PMSEL0 PMSEL1 Port 2 VSS Port 0 C541U EA/VPP PROG PRD RESET XTAL1 XTAL2 PSEN PSEL Figure 19 Programming Mode Configuration Semiconductor Group D0-D7 36 C541U N.C. N.C. N.C. N.C. N.C. N.C. N.C. D0 D1 D2 D3 Pin Configuration in Programming Mode N.C. 7 44 43 42 41 40 39 VDD VSS 8 38 9 37 10 36 6 11 12 4 3 2 1 C541U 13 14 15 35 34 33 Programming Mode 32 31 30 16 D4 D5 D6 D7 EA/VPP N.C. PROG PSEN A7 A6 A5 A0/A8 A1/A9 A2/A10 A3/A11 A4/A12 VSS VDD 29 17 18 19 20 21 22 23 24 25 26 27 28 GND GND XTAL2 XTAL1 RESET PMSEL0 N.C. PMSEL1 PSEL PRD PALE GND 5 Figure 20 Pin Configuration of the C541U in Programming Mode (Top View) Semiconductor Group 37 C541U The following table 8 contains the functional description of all C541U-1E pins which are required for OTP memory programming. Table 8 Pin Definitions and Functions in Programming Mode Symbol Pin Num- I/O*) Function bers P-LCC-44 RESET 10 I Reset This input must be at static “1“ (active) level during the whole programming mode. PMSEL0 PMSEL1 11 13 I I Programming mode selection pins These pins are used to select the different access modes in programming mode. PMSEL1,0 must satisfy a setup time to the rising edge of PALE. When the logic level of PMSEL1,0 is changed, PALE must be at low level. PMSEL PMSEL Access Mode 1 0 0 0 Reserved 0 1 Read version bytes 1 0 Program/read lock bits 1 1 Program/read OTP memory byte PSEL 14 I Basic programming mode select This input is used for the basic programming mode selection and must be switched according figure 10-21. PRD 15 I Programming mode read strobe This input is used for read access control for OTP memory read, version byte read, and lock bit read operations. PALE 16 I Programming mode address latch enable PALE is used to latch the high address lines. The high address lines must satisfy a setup and hold time to/from the falling edge of PALE. PALE must be at low level whenever the logic level of PMSEL1,0 is changed. XTAL2 20 O XTAL2 Output of the inverting oscillator amplifier. XTAL1 21 I XTAL1 Input to the oscillator amplifier. *) I = Input O = Output Semiconductor Group 38 C541U Table 8 Pin Definitions and Functions in Programming Mode (cont’d) Symbol Pin Num- I/O*) Function bers P-LCC-44 A0/A8 A7 24 - 31 I Address lines P2.0-7 are used as multiplexed address input lines A0-A7 and A8A12. A8-A12 must be latched with PALE. PSEN 32 I Program store enable This input must be at static “0“ level during the whole programming mode. PROG 33 I Programming mode write strobe This input is used in programming mode as a write strobe for OTP memory program and lock bit write operations During basic programming mode selection a low level must be applied to PROG. EA/VPP 35 I External Access / Programming voltage This pin must be at 11.5 V (VPP) voltage level during programming of an OTP memory byte or lock bit. During an OTP memory read operation this pin must be at high level (VIH). This pin is also used for basic programming mode selection. At basic programming mode selection a low level must be applied to EA/VPP. D0 - 7 43 - 36 I/O Data lines 0-7 During programming mode, data bytes are read or written from or to the C541U via the bidirectional D0-7 lines which are located at port 0. VSS 9, 22 – Circuit ground potential must be applied to these pins in programming mode. VDD 8, 23 – Power supply terminal must be applied to these pins in programming mode. N.C. 1 - 7, 12,, 34, 44 – Not Connected These pins should not be connected in programming mode. GND 17 - 19 I Ground pins In programming mode these pins must be connected to VIL level. *) I = Input O = Output Semiconductor Group 39 C541U Basic Programming Mode Selection The basic programming mode selection scheme is shown in figure 21. 5V VDD Clock (XTAL1/XTAL2) stable RESET “1“ PSEN “0“ 0,1 PMSEL1,0 “0“ PROG PRD “1“ PSEL “0“ PALE EA/VPP 0V During this period signals are not actively driven Figure 21 Basic Programming Mode Selection Semiconductor Group 40 VPP VIH1 Ready for access mode selection C541U Table 9 Access Modes Selection Access Mode EA/ VPP Program OTP memory byte VPP Read OTP memory byte VIH Program OTP lock bits VPP Read OTP lock bits VIH H Read OTP version byte VIH H PROG PRD PMSEL Address (Port 2) Data (Port 0) 1 0 H H H A0-7 A8-15 D0-7 H H L – D1,D0 see table 10 L H Byte addr. of sign. byte D0-7 H Lock Bits Programming / Read The C541U has two programmable lock bits which, when programmed according tabie 10, provide four levels of protection for the on-chip OTP code memory. The state of the lock bits can also be read. Table 10 Lock Bit Protection Types Lock Bits at D1,D0 D1 D0 Protection Protection Type Level 1 1 Level 0 The OTP lock feature is disabled. During normal operation of the C541U, the state of the EA pin is not latched on reset. 1 0 Level 1 During normal operation of the C541U, MOVC instructions executed from external program memory are disabled from fetching code bytes from internal memory. EA is sampled and latched on reset. An OTP memory read operation is only possible using the OTP verification mode for protection level 1. Further programming of the OTP memory is disabled (reprogramming security). 0 1 Level 2 Same as level 1, but also OTP memory read operation using OTP verification mode is disabled. 0 0 Level 3 Same as level 2; but additionally external code execution by setting EA=low during normal operation of the C541U is no more possible. External code execution, which is initiated by an internal program (e.g. by an internal jump instruction above the ROM boundary), is still possible. Semiconductor Group 41 C541U Absolute Maximum Ratings Parameter Symbol Limit Values Unit Notes min. max. TST – 65 150 °C – Voltage on VDD pins with respect VDD to ground (VSS) –0.5 6.5 V – VIN –0.5 VDD + 0.5 V – Input current on any pin during overload condition –10 10 mA – Absolute sum of all input currents during overload condition – | 100 | mA – – TBD W – Storage temperature Voltage on any pin with respect to ground (VSS) Power dissipation PDISS Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage of the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for longer periods may affect device reliability. During absolute maximum rating overload conditions (VIN > VDD or VIN < VSS) the voltage on VDD pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Operating Conditions Parameter Symbol Limit Values min. max. 4.25 5.5 Supply voltage VDD Ground voltage VSS Ambient temperature TA 0 CPU clock fCPU 2 Semiconductor Group V – V – 70 °C – 12 MHz – 0 42 Unit Notes C541U DC Characteristics (Operating Conditions apply) Parameter Symbol Limit Values min. max. Unit Test Condition Input low voltage (except EA, RESET) VIL – 0.5 0.2 VDD – 0.1 V – Input low voltage (EA) VIL1 – 0.5 0.2 VDD – 0.3 V – Input low voltage (RESET) VIL2 – 0.5 0.2 VDD + 0.1 V – 0.2 VDD + 0.9 VDD + 0.5 V – Input high voltage (except XTAL1, VIH RESET and EA) Input high voltage to XTAL1 VIH1 0.7 VDD VDD + 0.5 V – Input high voltage to RESET and EA VIH2 0.6 VDD VDD + 0.5 V – Output low voltage Ports 1, 2, 3 P1.0, P1.1, P3.0 VOL – – 0.45 0.45 V V IOL = 1.6 mA 1) IOL = 10 mA 1) Output low voltage (ALE, PSEN) VOL1 – 0.45 V IOL = 3.2 mA 1) Output low voltage (Port 0) VOL2 – 0.6 V IOL = 3.2 mA 1) 2.4 0.9 VDD – – V IOH = – 80 µA, IOH = – 10 µA 2.4 0.9 VDD – – V IOH = – 800 µA IOH = – 80 µA 2) Logic 0 input current (ports 1, 2, 3) IIL – 10 – 60 µA VIN = 0.45 V Logical 1-to-0 transition current (ports 1, 2, 3) ITL – 65 – 650 µA VIN = 2 V Input leakage current (port 0, EA) ILI – ±1 µA 0.45 < VIN < VDD Pin capacitance CIO – 10 pF fc = 1 MHz, TA = 25 °C 7) Overload current IOV – ±5 mA Programming voltage VPP 10.9 12.1 V Output high voltage (ports 1, 2, 3) VOH Output high voltage (port 0 in external bus mode, ALE, PSEN) VOH2 Notes see next page Semiconductor Group 43 6) 7) 11.5 V ± 5% C541U Power Supply Current Parameter Symbol Limit Values typ. 8) max. 9) Unit Test Condition Active mode 12 MHz IDD 25 30 mA 4) Idle mode 12 MHz IDD 15 20 mA 5) IPD 5 50 µA VDD = 2…5.5 V 3) Power-down mode Notes : 1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE and port 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF), the noise pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger, or use an address latch with a schmitt-trigger strobe input. 2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the 0.9 VDD specification when the address lines are stabilizing. 3) IPD (power-down mode) is measured under following conditions: EA = Port 0 = VDD ; XTAL2 = N.C.; XTAL1 = VSS ; RESET = VSS; all other pins are disconnected. the USB transceiver is switched off; 4) IDD (active mode) is measured with: XTAL1 driven with tCLCH , tCHCL = 5 ns , VIL = VSS + 0.5 V, VIH = VDD – 0.5 V; XTAL2 = N.C.; EA = RESET = Port 0 = Port 1 = VDD ; all other pins are disconnected. IDD would be slightly higher if a crystal oscillator is used (appr. 1 mA). 5) IDD (idle mode) is measured with all output pins disconnected and with all peripherals disabled; XTAL1 driven with tCLCH , tCHCL = 5 ns, VIL = VSS + 0.5 V, VIH = VDD – 0.5 V; XTAL2 = N.C.; EA = RESET = Vss ; Port 0 = VDD ; all other pins are disconnected; 6) Overload conditions under operating conditions occur if the voltage on the respective pin exceeds the specified operating range (i.e. VOV > VDD + 0.5 V or VOV < VSS - 0.5 V). The absolute sum of input currents on all port pins may not exceed 50 mA. The supply voltage VDD and VSS must remain within the specified limits. 7) Not 100% tested, guaranteed by design characterization. 8) The typical IDD values are periodically measured at TA = +25 °C but not 100% tested. 9) The maximum IDD values are measured under worst case conditions (TA = 0 °C and VDD = 5.5 V) Semiconductor Group 44 C541U AC Characteristics (Operating Conditions apply) (CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF) Program Memory Characteristics Parameter Symbol Limit Values 10-MHz clock Duty Cycle 0.4 to 0.6 Unit Variable Clock 1/CLP = 2 MHz to 12 MHz **) min. max. min. max. ALE pulse width tLHLL 43 – CLP - 40 – ns Address setup to ALE tAVLL 13 – TCLHmin -20 – ns Address hold after ALE tLLAX 13 – TCLHmin -20 – ns ALE to valid instruction in tLLIV – 80 – ns ALE to PSEN tLLPL 13 – TCLLmin -20 – ns PSEN pulse width tPLPH 86 – – CLP+ TCLHmin -30 ns PSEN to valid instruction in tPLIV – 51 – CLP+ ns TCLHmin- 65 Input instruction hold after PSEN tPXIX 0 – 0 – Input instruction float after PSEN tPXIZ *) – 23 – TCLLmin -10 ns Address valid after PSEN tPXAV *) 28 – TCLLmin - 5 – Address to valid instruction in tAVIV – 140 – ns 2 CLP + TCLHmin -60 Address float to PSEN tAZPL 0 0 – 2 CLP - 87 ns ns ns *) Interfacing the C541U to devices with float times up to 28 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. **) For correct function of the USB module the C541U must operate with 12 MHz external clock. The microcontroller (except the USB module) operates down to 2 MHz. Semiconductor Group 45 C541U AC Characteristics (cont’d) External Data Memory Characteristics Parameter Symbol Limit Values 10-MHz clock Duty Cycle 0.4 to 0.6 Unit Variable Clock 1/CLP= 2 MHz to 12 MHz min. max. min. max. RD pulse width tRLRH 180 – 3 CLP - 70 – ns WR pulse width tWLWH 180 – 3 CLP - 70 – ns Address hold after ALE tLLAX2 56 – CLP - 27 – ns RD to valid data in tRLDV – 110 – 2 CLP+ TCLHmin - 90 ns Data hold after RD tRHDX 0 0 – ns Data float after RD tRHDZ – 63 – CLP - 20 ns ALE to valid data in tLLDV – 200 – 4 CLP - 133 ns Address to valid data in tAVDV – 211 – 4 CLP + TCLHmin -155 ns ALE to WR or RD tLLWL 66 166 CLP + TCLLmin - 50 CLP+ TCLLmin+ 50 ns Address valid to WR tAVWL 70 – 2 CLP - 97 – ns WR or RD high to ALE high tWHLH 8 58 TCLHmin - 25 TCLHmin + 25 ns Data valid to WR transition tQVWX 8 – TCLLmin - 25 – ns Data setup before WR tQVWH 163 – 3 CLP + – TCLLmin - 120 ns Data hold after WR tWHQX 8 – TCLHmin - 25 – ns Address float after RD tRLAZ – 0 – 0 ns Semiconductor Group 46 C541U AC Characteristics (cont’d) External Clock Drive Characteristics Parameter Symbol CPU Clock = 12 MHz Duty cycle 0.4 to 0.6 Variable CPU Clock 1/CLP = 2 to 12 MHz min. max. min. max. Unit Oscillator period CLP 83.3 83.3 83.3 500 ns High time TCLH 33 – 33 CLP-TCLL ns Low time TCLL 33 – 33 CLP-TCLH ns Rise time tR – 12 – 12 ns Fall time tF – 12 – 12 ns Oscillator duty cycle DC 0.4 0.6 33 / CLP 1 - 33 / CLP – Clock cycle TCL 33 50 CLP * DCmin CLP * DCmax ns SSC Interface Characteristics Parameter Symbol Limit Values min. max. Unit Clock Cycle Time : Master Mode Slave Mode tSCLK tSCLK 667 667 – – ns ns Clock high time tSCH 300 – ns Clock low time tSCL 300 – ns Data output delay tD – 100 ns Data output hold tHO 0 – ns Data input setup tS 100 – ns Data input hold tHI 50 – ns TC bit set delay tDTC – 8 CLP ns SLS low to first SCLK clock edge tSC 2 tCLCL – ns tCLCL – ns Last SCLK clock edge to SLS high tCS SLS low to STO active tTS 0 100 ns SLS high to STO tristate tST – 100 ns – 100 ns Data output delay (already defined) tD Semiconductor Group 47 C541U t LHLL ALE t AVLL t PLPH t LLPL t LLIV t PLIV PSEN t AZPL t PXAV t LLAX t PXIZ t PXIX Port 0 A0 - A7 Instr.IN A0 - A7 t AVIV Port 2 A8 - A15 A8 - A15 MCT00096 Figure 22 Program Memory Read Cycle Semiconductor Group 48 C541U t WHLH ALE PSEN t LLDV t LLWL t RLRH RD t RLDV t AVLL t RHDZ t LLAX2 t RLAZ Port 0 t RHDX A0 - A7 from Ri or DPL Data IN A0 - A7 from PCL Instr. IN t AVWL t AVDV Port 2 P2.0 - P2.7 or A8 - A15 from DPH A8 - A15 from PCH MCT00097 Figure 23 Data Memory Read Cycle Semiconductor Group 49 C541U t WHLH ALE PSEN t LLWL t WLWH WR t QVWX t AVLL t WHQX t LLAX2 Port 0 A0 - A7 from Ri or DPL t QVWH A0 - A7 from PCL Data OUT Instr.IN t AVWL Port 2 P2.0 - P2.7 or A8 - A15 from DPH A8 - A15 from PCH MCT00098 Figure 24 Data Memory Write Cycle tR TCL H tF VCC 0.7 V DD XTAL1 0.2 V V CC DD - 0.1 TCL L CLP Figure 25 External Clock Drive on XTAL1 Semiconductor Group 50 MCT03310 C541U Notes : Shown is the data/clock relationship for CPOL=CPHA=1. The timing diagram is valid for the other cases accordingly. In the case of slave mode and CPHA=0, the output delay for the MSB applies to the falling edge of SLS (if transmitter is enabled). In the case of master mode and CPHA=0, the MSB becomes valid after the data has been written into the shift register, i.e. at least one half SCLK clock cycle before the first clock transition. Figure 26 SSC Master Mode Timing Semiconductor Group 51 C541U t SCLK t SCH t SCL SCLK (CPOL = 1) SCLK (CPOL = 0) t SC t CS SLS t ST t TS STO (CPHA = 0) tD DOUT 7 tD DOUT 0 tD STO (CPHA = 1) tD tD DOUT 7 DOUT 1 DOUT 0 MCT03390 Figure 27 SSC Slave Mode Timing Semiconductor Group 52 C541U AC Characteristics of Programming Mode VDD = 5 V ± 10 %; VPP = 11.5 V ± 5 %; TA = 25 °C ± 10 °C Parameter Symbol Limit Values min. max. Unit ALE pulse width tPAW 35 – PMSEL setup to ALE rising edge tPMS 10 – Address setup to ALE, PROG, or PRD falling edge tPAS 10 – ns Address hold after ALE, PROG, or PRD falling edge tPAH 10 – ns Address, data setup to PROG or PRD tPCS 100 – ns Address, data hold after PROG or PRD tPCH 0 – ns PMSEL setup to PROG or PRD tPMS 10 – ns PMSEL hold after PROG or PRD tPMH 10 – ns PROG pulse width tPWW 100 – µs PRD pulse width tPRW 100 – ns Address to valid data out tPAD – 75 ns PRD to valid data out tPRD – 20 ns Data hold after PRD tPDH 0 – ns Data float after PRD tPDF – 20 ns PROG high between two consecutive PROG low pulses tPWH1 1 – µs PRD high between two consecutive PRD low tPWH2 pulses 100 tCLKP 83.3 XTAL clock period Semiconductor Group 53 ns ns 500 ns C541U t PAW PALE t PMS H, H PMSEL1,0 t PAS Port 2 t PAH A8-A13 A0-A7 D0-D7 Port 0 PROG t PWH t PCS t PWW t PCH MCT03369 Figure 28 Programming Code Byte - Write Cycle Timing Semiconductor Group 54 C541U t PAW PALE t PMS H, H PMSEL1,0 t PAS Port 2 t PAH A8-13 A0-7 t PAD t PDH D0-7 Port 0 t PRD t PDF PRD t PWH t PCS t PRW Notes: PROG must be high during a programming read cycle. Figure 29 Verify Code Byte - Read Cycle Timing Semiconductor Group 55 t PCH MCT03392 C541U PMSEL1,0 H, L H, L Port 0 D0, D1 D0, D1 t PCH t PCS t PMS t PMH PROG t PDH t PMS t PRD t PWW t PDF t PRW t PMH PRD Note: PALE should be low during a lock bit read / write cycle. MCT03393 Figure 30 Lock Bit Access Timing L, H PMSEL1,0 e. g. FD H Port 2 t PCH D0-7 Port 0 t PCS t PDH t PDF t PRD t PMS t PRW PRD t PMH Note: PROG must be high during a programming read cycle. MCT03394 Figure 31 Version Byte Read Timing Semiconductor Group 56 C541U OTP Verification Characteristics OTP Verification Mode for Protection Level 1 Parameter Symbol Limit Values Unit min. typ max. ALE pulse width tAWD – 2 tCLCL – ns ALE period tACY – 12 tCLCL – ns Data valid after ALE tDVA – – 4 tCLCL ns Data stable after ALE tDSA 8 tCLCL – – ns P3.5 setup to ALE low tAS – tCLCL – ns Oscillator frequency 1/tCLCL 4 – 6 MHz t ACY t AWD ALE t DSA t DVA Port 0 Data Valid t AS P3.5 MCT02613 Figure 32 OTP Verification Mode for Protection Level 1 Semiconductor Group 57 C541U USB Transceiver Characteristics (Operating Conditions apply) Parameter Symbol Limit Values min. max. Unit Test Condition 1) Output impedance (high state) RDH 28 43 Ω Output impedance (low state) RDL 28 51 Ω Input leakage current II – ±5 µA VIN = VSS or VDD Tristate output off-state current I OZ – ± 10 µA VOUT = VSS or VDD 1) Crossover point VCR 1.3 2.0 V 2) Notes : 1) This value includes an external resistor of 30Ω ± 1% (see “Load for D+/D-“ diagram for testing details) 2) The crossover point is in the range of 1.3V to 2.0V for the high speed mode with a 50pF capacitance. In the low-speed mode with a 100pF or greater capacitance, the crossover point is in the range of 1.3V to 2.0V. Parameter Symbol Limit Values min. max. Unit High speed mode rise time tFR 4 20 ns High speed mode fall time tFF 4 20 ns Low speed mode rise time tLR 75 300 ns Low speed mode fall time tLF 75 300 ns Semiconductor Group 58 C541U VDD VDD VDD AC Inputs during testing are driven at VDD - 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’. Timing measurements are made at VIHmin for a logic ’1’ and VILmax for a logic ’0’. Figure 33 AC Testing: Input, Output Waveforms For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs. IOL/IOH ≥ ± 20 mA Figure 34 AC Testing : Float Waveforms 3.3V 2.8 V D.U.T. Test Point 30 k Ω D.U.T 1.5 k Ω *) S1 D+/D- 27Ω 15 k Ω CL C L = 50 pF, full speed C L = 50 pF, low speed (min. timing) C L = 350 pF, low speed (max. timing) *) 1.5 kΩ on D- (low speed) or D+ (full speed) only Test S1 D- / LS D+ / LS D- / FS D+ / FS Close Open Open Close MCS03425 Figure 35 Load for D+/D- Semiconductor Group 59 C541U Crystal Oscillator Mode Driving from External Source C N.C. XTAL2 2 - 12 MHz External Oscillator Signal XTAL1 XTAL2 XTAL1 C Crystal Mode: C = 20 pF 10 pF (Incl. Stray Capacitance) MCS03426 Figure 36 Recommended Oscillator Circuits for Crystal Oscillator 2 C = 6.8nF C541U 9 VSS Figure 37 Recommended External Capacitor for On-Chip USB Transceiver Semiconductor Group 60 C541U GPL05102 Plastic Package, P-LCC-44-1 (SMD) (Plastic Leaded Chip Carrier Package) Figure 38 P-LCC-44-1 Package Outline Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information” SMD = Surface Mounted Device Semiconductor Group 61 Dimensions in mm