8D -2 DF N1 60 SOD1608 DFN1608D-2: leadless ultra small plastic package; 2 terminals 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code DFN1608D-2 Package type industry code DFN1608D-2 Package style descriptive code SOD (small outline diode) Package style suffix code NA (not applicable) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 29-11-2011 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 0.75 - 0.8 0.85 mm E package width 1.55 - 1.6 1.65 mm A seated height 0.34 - 0.37 0.4 mm n2 actual quantity of termination - - 2 - SOD1608 NXP Semiconductors DFN1608D-2: leadless ultra small plastic package; 2 terminals 2. Package outline SOD1608 Leadless ultra small plastic package; DFN1608D-2; 2 terminals; body 1.6 x 0.8 x 0.37 mm indication of Cathode D (2) (2) E A A1 e1 e2 1 b (2 x) 2 L1 L2 0 1 mm scale Dimensions Unit mm A(1) A1 E D e1 e2 b L1 L2 max 0.40 0.04 1.65 0.85 0.75 0.80 0.40 nom 0.37 1.60 0.80 0.37 0.57 0.70 0.75 0.35 min 0.34 1.55 0.75 0.67 0.72 0.32 Note 1. Dimension A is including plating thickness. 2. Solderable lead end, protrusion max. 0.02 mm Outline version sod1608_po References IEC JEDEC JEITA European projection Issue date 11-11-22 12-06-07 SOD1608 Fig. 1. Package outline DFN1608D-2 (SOD1608) SOD1608 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOD1608 NXP Semiconductors DFN1608D-2: leadless ultra small plastic package; 2 terminals 3. Soldering Footprint information for reflow soldering of DFN1608D-2 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1 1.8 0.2 1.9 2.0 solder land solder land plus solder paste solder paste deposit solder resist Dimensions in mm sod1608_fr Fig. 2. Reflow soldering footprint for DFN1608D-2 (SOD1608) SOD1608 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOD1608 NXP Semiconductors DFN1608D-2: leadless ultra small plastic package; 2 terminals 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOD1608 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOD1608 NXP Semiconductors DFN1608D-2: leadless ultra small plastic package; 2 terminals 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOD1608 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5