INFINEON BTS410H2

PROFET® BTS 410 H2
Smart Highside Power Switch
Features
Product Summary
Overvoltage protection
Operating voltage
On-state resistance
Load current (ISO)
Current limitation
• Overload protection
• Current limitation
• Short circuit protection
• Thermal shutdown
• Overvoltage protection (including load dump)
• Fast demagnetization of inductive loads
• Reverse battery protection1)
• Undervoltage and overvoltage shutdown with
auto-restart and hysteresis
• Open drain diagnostic output
• Open load detection in OFF-state
• CMOS compatible input
• Loss of ground and loss of Vbb protection
• Electrostatic discharge (ESD) protection
Vbb(AZ)
Vbb(on)
RON
IL(ISO)
IL(SCr)
65
V
4.7 ... 42 V
220 mΩ
1.8
A
1.5
A
TO-220AB/5
5
5
5
1
Straight leads
Standard
1
SMD
Application
• µC compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads
• Most suitable for inductive loads
• Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection
functions.
+ V bb
Voltage
Overvoltage
Current
Gate
source
protection
limit
protection
3
V Logic
2
Voltage
Charge pump
sensor
Level shifter
Limit for
unclamped
ind. loads
Rectifier
IN
OUT
5
Temperature
sensor
Open load
ESD
4
Logic
Load
detection
ST
Short circuit
detection
GND

PROFET
1
Signal GND
1)
Load GND
With external current limit (e.g. resistor RGND=150 Ω) in GND connection, resistors in series with IN and ST
connections, reverse load current limited by connected load.
Semiconductor Group
1
03.97
BTS 410 H2
Pin
Symbol
Function
1
GND
-
Logic ground
2
IN
I
Input, activates the power switch in case of logical high signal
3
Vbb
+
Positive power supply voltage,
the tab is shorted to this pin
4
ST
S
Diagnostic feedback, low on failure
5
OUT
(Load, L)
O
Output to the load
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter
Supply voltage (overvoltage protection see page 3)
Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V
RI3)= 0.5 Ω, RL= 6.6 Ω, td= 400 ms, IN= low or high
Load current (Short circuit current, see page 4)
Operating temperature range
Storage temperature range
Power dissipation (DC), TC ≤ 25 °C
Inductive load switch-off energy dissipation, single pulse
Vbb = 12V, Tj,start = 150°C, TC = 150°C const.
IL = 1.8 A, ZL = 2.3 H, 0 Ω:
Electrostatic discharge capability (ESD)
IN:
(Human Body Model)
all other pins:
Symbol
Vbb
VLoad dump4)
IL
Tj
Tstg
Ptot
EAS
VESD
Values
65
100
Unit
V
V
self-limited
-40 ...+150
-55 ...+150
50
A
°C
4.5
1
2
J
kV
-0.5 ... +6
±5.0
±5.0
V
mA
Values
typ
max
-2.5
-75
35
--
Unit
W
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
VIN
IIN
IST
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 6
Thermal Characteristics
Parameter and Conditions
Thermal resistance
2)
3)
4)
5)
Symbol
chip - case: RthJC
junction - ambient (free air): RthJA
SMD version, device on PCB5):
min
----
K/W
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a
150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the
protection of the input is integrated.
RI = internal resistance of the load dump test pulse generator
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
Semiconductor Group
2
BTS 410 H2
Electrical Characteristics
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Values
min
typ
max
Unit
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
IL = 1.6 A
Tj=25 °C:
Tj=150 °C:
Nominal load current, ISO Norm (pin 3 to 5)
VON = 0.5 V, TC = 85 °C
Output current (pin 5) while GND disconnected or
GND pulled up, Vbb=30 V, VIN= 0, see diagram
page 7
Turn-on time
IN
to 90% VOUT:
to 10% VOUT:
Turn-off time
IN
RL = 12 Ω, Tj =-40...+150°C
Slew rate on
10 to 30% VOUT, RL = 12 Ω, Tj =-40...+150°C
Slew rate off
70 to 40% VOUT, RL = 12 Ω, Tj =-40...+150°C
Operating Parameters
Operating voltage 6)
Undervoltage shutdown
Tj =-40...+150°C:
Tj =25°C:
Tj =-40...+150°C:
Tj =-40...+150°C:
Undervoltage restart
Undervoltage restart of charge pump
see diagram page 12
Undervoltage hysteresis
∆Vbb(under) = Vbb(u rst) - Vbb(under)
Tj =-40...+150°C:
Overvoltage shutdown
Tj =-40...+150°C:
Overvoltage restart
Tj =-40...+150°C:
Overvoltage hysteresis
Tj =-40...+150°C:
Overvoltage protection7)
Ibb=40 mA
Standby current (pin 3),
VIN=0
Tj=-40...+150°C:
8)
Operating current (Pin 1) , VIN=5 V
6)
7)
8)
RON
--
190
220
390
440
IL(ISO)
IL(GNDhigh)
1.6
--
1.8
--
-1
A
mA
ton
toff
15
5
---
125
85
µs
dV /dton
--
--
3
V/µs
-dV/dtoff
--
--
6
V/µs
Vbb(on)
Vbb(under)
4.7
2.9
2.7
---
----5.6
42
4.5
4.7
4.9
6.0
V
V
∆Vbb(under)
--
0.1
--
V
Vbb(over)
Vbb(o rst)
∆Vbb(over)
Vbb(AZ)
42
40
-65
--0.1
70
52
----
V
V
V
V
Vbb(u rst)
Vbb(ucp)
IGND
3
V
V
µA
Ibb(off)
---
40
1
70
--
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT ≈Vbb - 2 V
Meassured without load. See also VON(CL) in table of protection functions and circuit diagram page 7.
Add IST, if IST > 0, add IIN, if VIN>5.5 V
Semiconductor Group
mΩ
mA
BTS 410 H2
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Protection Functions
Initial peak short circuit current limit (pin 3 to 5)9),
IL(SCp)
( max 450 µs if VON > VON(SC) )
Tj =-40°C:
Tj =25°C:
Tj =+150°C:
Overload shutdown current limit
IL(SCr)
VON= 3 V, Tj = Tjt (see timing diagrams, page 10)
Short circuit shutdown delay after input pos. slope
VON > VON(SC) , Vbb > 8 V,
Tj =-40..+150°C: td(SC)
Values
min
typ
max
4.0
3.5
2.0
-5.5
3.5
11
10
7.5
A
--
1.5
--
A
--
--
450
µs
VON(CL)
61
--
68
--
73
75
V
VON(SC)
Tjt
∆Tjt
-Vbb
-150
---
3.5
-10
--
---32
V
°C
K
V
15
30
60
µA
2
3
4
V
min value valid only, if input "low" time exceeds 60 µs
Output clamp (inductive load switch off)
at VOUT = Vbb - VON(CL) IL= 40 mA, Tj =-40..+150°C:
IL= 1 A, Tj =-40..+150°C:
Short circuit shutdown detection10) voltage
(pin 3 to 5)
Thermal overload trip temperature
Thermal hysteresis
Reverse battery (pin 3 to 1) 11)
Diagnostic Characteristics
Open load detection current
(included in standby current Ibb(off))
Open load detection voltage
Tj=-40...+150°C: IL(off)
Tj=-40..150°C: VOUT(OL)
9)
Unit
Short circuit current limit for max. duration of td(SC) max=450 µs, prior to shutdown
Short circuit detection only active for Vbb > 8 V typ.
11) Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 2 and circuit page 7).
10)
Semiconductor Group
4
BTS 410 H2
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Input and Status Feedback12)
Input turn-on threshold voltage
Tj =-40..+150°C:
Tj =-40..+150°C:
Input turn-off threshold voltage
Input threshold hysteresis
Off state input current (pin 2), VIN = 0.4 V
On state input current (pin 2), VIN = 3.5 V
Delay time for status with open load
Values
min
typ
max
Unit
VIN(T+)
VIN(T-)
∆ VIN(T)
IIN(off)
IIN(on)
td(ST OL3)
1.5
1.0
-1
10
--
--0.5
-25
200
2.4
--30
70
--
V
V
V
µA
µA
µs
td(ST SC)
Status invalid after positive input slope
Tj=-40 ... +150°C:
(short circuit)
Status output (open drain)
Zener limit voltage Tj =-40...+150°C, IST = +50 uA: VST(high)
ST low voltage Tj =-40...+150°C, IST = +1.6 mA: VST(low)
--
--
450
µs
5.0
--
6
--
-0.4
V
after Input neg. slope (see diagram page 11)
12)
If a ground resistor RGND is used, add the voltage drop across this resistor.
Semiconductor Group
5
BTS 410 H2
Truth Table
Input-
Output
level
level
412
B2
410
D2
410
E2/F2
410
G2
410
H2
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
H
L
H
H
L
L
H
L
L
L15)
L15)
L
L
H
H
H
L
H
L
H
H (L14))
L
L
L15)
L15)
L
L
H
H
H
L
H
L
H
H (L14))
L
L
H
H
H
H
H
H
H
L
H
H
H
H (L14))
L
L
H
H
H
H
H
H
L
H
H
L
L
H
L
L
H
H
H
H
Normal
operation
Open load
Short circuit
to GND
Short circuit
to Vbb
Overtemperature
Undervoltage
Overvoltage
L = "Low" Level
H = "High" Level
Status
13)
H
L
L
H
H
L
L
L
L
L
L
X = don't care
Z = high impedance, potential depends on external circuit
Status signal after the time delay shown in the diagrams (see fig 5. page 11...12)
Terms
Status output
+5V
Ibb
3
I IN
2
Vbb
IN
V
VST
IN
OUT
PROFET
I ST
V
R ST(ON)
IL
4
5
ST
GND
1
bb
R
GND
IGND
ST
VON
VOUT
ESDZD
ESD-Zener diode: 6 V typ., max 5 mA;
RST(ON) < 250 Ω at 1.6 mA, ESD zener diodes are not
to be used as voltage clamp at DC conditions.
Operation in this mode may result in a drift of the zener
voltage (increase of up to 1 V).
GND
Input circuit (ESD protection)
R
IN
Short circuit detection
Fault Condition: VON > 3.5 V typ.;Vbb > 8 V typ., IN high
I
+ V bb
ESDZDI1 ZDI2
I
I
V
ON
GND
ZDI1 6 V typ., ESD zener diodes are not to be used as
voltage clamp at DC conditions. Operation in this mode
may result in a drift of the zener voltage (increase of up
to 1 V).
13)
OUT
Logic
unit
Short circuit
detection
Power Transistor off, high impedance, versions BTS 410H, BTS 412B: internal pull up current source for
open load detection.
14) Low resistance short V to output may be detected in ON-state by the no-load-detection
bb
15) No current sink capability during undervoltage shutdown
Semiconductor Group
6
BTS 410 H2
GND disconnect
Inductive and overvoltage output clamp
+ V bb
V
3
Z
2
IN
VON
PROFET
4
OUT
PROFET
GND
Vbb
V
VON clamped to 68 V typ.
V
bb
IN
V
OUT
5
ST
GND
1
ST
V
GND
Any kind of load. In case of Input=high is VOUT ≈ VIN - VIN(T+) .
Due to VGND >0, no VST = low signal available.
Overvolt. and reverse batt. protection
GND disconnect with GND pull up
+ V bb
V
R IN
3
Z2
IN
2
IN
Vbb
Logic
PROFET
R ST
OUT
ST
V
4
PROFET
Z1
5
ST
GND
1
GND
R GND
V
V
bb
V
IN ST
V
GND
Signal GND
VZ1 = 6.2 V typ., VZ2 = 70 V typ., RGND= 150 Ω, RIN,
RST= 15 kΩ
Any kind of load. If VGND > VIN - VIN(T+) device stays off
Due to VGND >0, no VST = low signal available.
Open-load detection
Vbb disconnect with energized inductive
load
OFF-state diagnostic condition: VOUT > 3 V typ.; IN low
3
high
2
IN
Vbb
PROFET
4
OFF
I
Logic
unit
5
ST
GND
1
L(OL)
Open load
detection
OUT
V
V
bb
OUT
Normal load current can be handled by the PROFET
itself.
Signal GND
Semiconductor Group
7
BTS 410 H2
Vbb disconnect with charged external
inductive load
high
2
L = f (IL ); Tj,start = 150°C,TC = 150°C const.,
Vbb = 12 V, RL = 0 Ω
S
3
IN
Vbb
L [mH]
10000
OUT
PROFET
4
Maximum allowable load inductance for
a single switch off
5
D
ST
GND
1
V
bb
If other external inductive loads L are connected to the PROFET,
additional elements like D are necessary.
1000
Inductive Load switch-off energy
dissipation
E bb
E AS
IN
PROFET
=
ELoad
V bb
OUT
100
ST
1.5
EL
GND
ZL
{
1.75
2
2.25
2.5
2.75
L
RL
3
IL [A]
ER
Typ. transient thermal impedance chip case
ZthJC = f(tp, D), D=tp/T
ZthJC [K/W]
10
Energy stored in load inductance:
2
EL = 1/2·L·I L
While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= ∫ VON(CL)·iL(t) dt,
1
with an approximate solution for RL > 0 Ω:
EAS=
IL· L
IL·RL
·(V + |VOUT(CL)|)· ln (1+
)
|VOUT(CL)|
2·RL bb
D=
0.5
0.2
0.1
0.05
0.02
0.01
0
0.1
0.01
1E-5
1E-4
1E-3
1E-2
1E-1
1E0
1E1
tp [s]
Semiconductor Group
8
BTS 410 H2
Options Overview
all versions: High-side switch, Input protection, ESD protection, load dump and
reverse battery protection with 150 Ω in GND connection, protection against loss of
ground
Type
Logic version
BTS 412 B2 410D2 410E2 410G2 410H2
Overtemperature protection with hysteresis
Tj >150 °C, latch function16)17)
Tj >150 °C, with auto-restart on cooling
Short circuit to GND protection
B
D
X
X
E
G
X
X
X
X
X
X
X
308
H
X
switches off when VON>3.5 V typ. and Vbb> 8 V
typ16) (when first turned on after approx. 210 µs)
switches off when VON>8.5 V typ.16)
(when first turned on after approx. 210 µs)
307
X
X
X
Achieved through overtemperature protection
X
Open load detection
in OFF-state with sensing current 30 µA typ.
in ON-state with sensing voltage drop across
power transistor
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
-
X
overtemperature
X
X
X
X
X
X
X
short circuit to GND
X
X
X
-
X
X
X
short to Vbb
X
-19)
-19)
-19)
X
X
X
open load
X
X
X
X
X
X
X
undervoltage
X
X
-
-
-
X
-
overvoltage
X
X
-
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Undervoltage shutdown with auto restart
Overvoltage shutdown with auto
restart18)
Status feedback for
Status output type
CMOS
Open drain
Output negative voltage transient limit
(fast inductive load switch off)
to Vbb - VON(CL)
X
X
X
X
X
X
Load current limit
high level (can handle loads with high inrush currents)
low level (better protection of application)
Protection against loss of GND
X
16)
X
X
Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT ≠
0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch
between turn on and td(SC).
17) With latch function. Reseted by a) Input low, b) Undervoltage
18) No auto restart after overvoltage in case of short circuit
19) Low resistance short V to output may be detected in ON-state by the no-load-detection
bb
Semiconductor Group
9
BTS 410 H2
Timing diagrams
Figure 3a: Turn on into short circuit,
Figure 1a: Vbb turn on:
IN
IN
t d(bb IN)
V
bb
ST
V
VOUT
OUT
td(SC)
A
I
ST open drain
L
t
t
A
in case of too early VIN=high the device may not turn on (curve A)
td(bb IN) approx. 150 µs
td(SC) approx. -- µs Vbb - VOUT < 3.5 V typ.
Figure 3b: Turn on into overload,
Figure 2a: Switching an inductive load
IN
IN
IL
ST
I L(SCp)
I L(SCr)
V
OUT
ST
I
L
t
t
Semiconductor Group
Heating up may require several seconds Vbb - VOUT < 3.5 V typ.
10
BTS 410 H2
Figure 3c: Short circuit while on:
Figure 5a: Open load: detection in OFF-state, turn
on/off to open load
IN
IN
t
ST
d(ST OL3)
ST
V OUT
IL
VOUT
I
**)
L
normal
open
t
*)
t
**) current peak approx. 20 µs
in case of external capacity td(ST,OL3) may be higher due to high
impedance
*) IL = 30 µA typ
Figure 4a: Overtemperature,
Figure 5b: Open load: detection in OFF-state, open
load occurs in off-state
Reset if (IN=low) and (Tj<Tjt)
IN
IN
ST
V
ST
V
OUT
OUT
T
I
J
L
normal
load
t
*)
*) ST goes high , when VIN=low and Tj<Tjt
*) IL = 30 µA typ
Semiconductor Group
11
open
load
normal
load
*)
t
BTS 410 H2
Figure 6a: Undervoltage:
Figure 7a: Overvoltage:
IN
IN
V
Vbb
bb
V ON(CL)
Vbb(over)
V bb(o rst)
Vbb(u cp)
Vbb(u rst)
V
bb(under)
V
OUT
V OUT
ST
ST open drain
t
t
Figure 6b: Undervoltage restart of charge pump
Figure 9a: Overvoltage at short circuit shutdown:
VON(CL)
V on
IN
V
V
V
bb(u rst)
V
bb(over)
off-state
on-state
off-state
Vbb
V bb(o rst)
Output short to GND
V OUT
short circuit shutdown
I
bb(o rst)
L
bb(u cp)
V bb(under)
ST
V bb
t
charge pump starts at Vbb(ucp) =5.6 V typ.
Semiconductor Group
Overvoltage due to power line inductance. No overvoltage autorestart of PROFET after short circuit shutdown.
12
BTS 410 H2
SMD TO-220AB/5, Opt. E3062 Ordering code
Package and Ordering Code
BTS410H2 E3062A T&R:
All dimensions in mm
Standard TO-220AB/5
BTS 410 H2
Ordering code
Q67060-S6105-A2
TO-220AB/5, Option E3043 Ordering code
BTS 410 H2 E3043
Semiconductor Group
Q67060-S6105-A3
13
Q67060-S6105-A4