PHILIPS TDA8925

INTEGRATED CIRCUITS
DATA SHEET
TDA8925
Power stage 2 x 15 to 25 W class-D
audio amplifier
Product specification
Supersedes data of 2004 Jan 05
2004 May 06
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
CONTENTS
15
TEST AND APPLICATION INFORMATION
SE application
Package ground connection
Output power
Reference design
Reference design bill of material
Version 2; revision 5
Printed-circuit board
Curves measured in reference design
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
15.1
15.2
15.3
15.4
15.5
15.5.1
15.5.2
15.6
7
PINNING
16
PACKAGE OUTLINES
8
FUNCTIONAL DESCRIPTION
17
SOLDERING
8.1
8.2
8.2.1
8.2.2
Power stage
Protection
Overtemperature
Short-circuit across the loudspeaker terminals
17.1
9
LIMITING VALUES
10
THERMAL CHARACTERISTICS
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
11
QUALITY SPECIFICATION
12
DC CHARACTERISTICS
13
AC CHARACTERISTICS
14
SWITCHING CHARACTERISTICS
2004 May 06
17.2
17.3
17.4
2
18
DATA SHEET STATUS
19
DEFINITIONS
20
DISCLAIMERS
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
1
TDA8925
FEATURES
3
• High efficiency (> 94 %)
GENERAL DESCRIPTION
The TDA8925 is a switching power stage for a high
efficiency class-D audio power amplifier system.
• Operating voltage from ±7.5 V to ±30 V
With this power stage a compact 2 × 15 W self oscillating
digital amplifier system can be built, operating with high
efficiency and very low dissipation. No heatsink is
required. The system operates over a wide supply voltage
range from ±7.5 V up to ±30 V and consumes a very low
quiescent current.
• Very low quiescent current
• High output power
• Diagnostic output
• Usable as a stereo Single-Ended (SE) amplifier
• Electrostatic discharge protection (pin to pin)
• No heatsink required.
2
APPLICATIONS
• Television sets
• Home-sound sets
• Multimedia systems
• All mains fed audio systems.
4
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
General
VP
supply voltage
Iq(tot)
total quiescent current
η
efficiency endstage
±7.5
±15
±30
V
no load connected; VP = ±15 V
−
25
45
mA
Po = 15 W; RL = 8 Ω; VP = ±15 V
−
94
−
%
RL = 8 Ω; THD = 10 %; VP = ±15 V
14
15
−
W
RL = 6 Ω; THD = 10 %; VP = ±15 V
−
20
−
W
Stereo single-ended configuration
Po
5
output power
ORDERING INFORMATION
TYPE
NUMBER
TDA8925ST
TDA8925J
2004 May 06
PACKAGE
NAME
RDBS17P
DBS17P
DESCRIPTION
VERSION
plastic rectangular-DIL-bent-SIL power package; 17 leads (row
spacing 2.54 mm)
SOT577-2
plastic DIL-bent-SIL power package; 17 leads (lead length
7.7 mm)
SOT243-3
3
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
6
TDA8925
BLOCK DIAGRAM
VDD2 VDD1
handbook, full pagewidth
13
TDA8925
EN1
SW1
REL1
STAB
DIAG
POWERUP
EN2
SW2
REL2
6
4
1
2
5
DRIVER
HIGH
CONTROL
AND
HANDSHAKE
7
OUT1
DRIVER
LOW
9
temp
3
TEMPERATURE SENSOR
AND
current
CURRENT PROTECTION
15
14
17
16
VSS1
VDD2
12
BOOT2
DRIVER
HIGH
CONTROL
AND
HANDSHAKE
11
OUT2
DRIVER
LOW
8
10
VSS1 VSS2
Fig.1 Block diagram.
2004 May 06
BOOT1
4
MDB610
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
7
TDA8925
PINNING
SYMBOL
PIN
DESCRIPTION
SW1
1
digital switch input; channel 1
REL1
2
digital control output; channel 1
DIAG
3
digital open-drain output for
overtemperature and overcurrent
report
handbook, halfpage
SW1
1
REL1
2
DIAG
3
EN1
4
VDD1
5
BOOT1
6
EN1
4
digital enable input; channel 1
VDD1
5
positive power supply; channel 1
BOOT1
6
bootstrap capacitor; channel 1
OUT1
7
PWM output; channel 1
VSS1
8
negative power supply; channel 1
OUT1
7
STAB
9
decoupling internal stabilizer for
logic supply
VSS1
8
STAB
9
VSS2
10
negative power supply; channel 2
OUT2
11
PWM output; channel 2
BOOT2
12
bootstrap capacitor; channel 2
VDD2
13
positive power supply; channel 2
EN2
14
digital enable input; channel 2
POWERUP
15
enable input for switching on
internal reference sources
REL2
16
digital control output; channel 2
SW2
17
digital switch input; channel 2
TDA8925ST/J
VSS2 10
OUT2 11
BOOT2 12
VDD2 13
EN2 14
POWERUP 15
REL2 16
SW2 17
MDB611
Fig.2 Pin configuration.
2004 May 06
5
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
8
TDA8925
8.2
FUNCTIONAL DESCRIPTION
Temperature and short-circuit protection sensors are
included in the TDA8925. In the event that the maximum
current or maximum temperature is exceeded the
diagnostic output is pulled down to VSS. Since the
diagnostic is connected to the enable pins in the
application the system shuts down itself.
The TDA8925 is a two-channel audio power amplifier
system using the class-D technology (see Fig.1).
The power stage TDA8925S is used for driving the
loudspeaker load. It performs a level shift from the
low-power digital PWM signal, at logic levels, to a
high-power PWM signal that switches between the main
supply lines. A 2nd-order low-pass filter converts the PWM
signal into an analog audio signal across the loudspeaker.
8.1
8.2.1
OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 °C, then
pin DIAG becomes LOW. The diagnostic pin is released if
the temperature is dropped to approximately 130 °C, so
there is a hysteresis of approximately 20 °C.
Power stage
The power stage contains the high-power DMOS
switches, the drivers, timing and handshaking between the
power switches and some control logic (see Fig.1). For
protection, a temperature sensor and a maximum current
detector are built-in on the chip.
8.2.2
SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
When the loudspeaker terminals are short-circuited this
will be detected by the current protection. If the output
current exceeds the maximum output current of 3 A, then
pin DIAG becomes LOW. Using pin DIAG in combination
with the enable pins the system will shut down
immediately, and restart again. The result is that the output
current is limited at the overcurrent detection level.
The following functions are available:
• Switch (pins SW1 and SW2): digital inputs; switching
from VSS to VSS + 12 V and driving the power DMOS
switches
• Release (pins REL1 and REL2): digital outputs;
switching from VSS to VSS + 12 V; follow SW1 and SW2
with a small delay. Note: for self oscillating applications
this pin is not used.
• Power-up (pin POWERUP): must be connected to a
continuous supply voltage of at least VSS + 5 V with
respect to VSS
• Enable (pins EN1 and EN2): digital inputs; at a level
of VSS the power DMOS switches are open and the
PWM outputs are floating; at a level of VSS + 12 V the
power stage is operational
• Diagnostics (pin DIAG): digital open-drain output; pulled
to VSS if the temperature or maximum current is
exceeded.
2004 May 06
Protection
6
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
±30
V
VP(sc)
supply voltage for
short-circuits across the load
−
±30
V
IORM
repetitive peak current in
output pins
−
3.5
A
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tvj
virtual junction temperature
−
150
°C
Vesd(HBM)
electrostatic discharge voltage note 1
(HBM)
all pins with respect to VDD (class 1a)
−500
+500
V
all pins with respect to VSS (class 1a)
−1500
+1500
V
all pins with respect to each other
(class 1a)
−1500
+1500
V
Vesd(MM)
electrostatic discharge voltage note 2
(MM)
all pins with respect to VDD (class B)
−250
+250
V
all pins with respect to VSS (class B)
−250
+250
V
all pins with respect to each other
(class B)
−250
+250
V
Notes
1. Human Body Model (HBM); Rs = 1500 Ω; C = 100 pF.
2. Machine Model (MM); Rs = 10 Ω; C = 200 pF; L = 0.75 µH.
10 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
40
K/W
Rth(j-c)
thermal resistance from junction to case
in free air
1.5
K/W
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ611” if this device is used as an audio amplifier.
2004 May 06
7
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
12 DC CHARACTERISTICS
VP = ±15 V; Tamb = 25 °C; measured in test diagram of Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq(tot)
total quiescent current
±7.5
±15
±30
V
no load connected
−
25
45
mA
outputs floating
−
5
10
mA
referenced to VSS
11.7
13
14.3
V
Internal stabilizer logic supply (pin STAB)
VO(STAB)
stabilizer output voltage
Switch inputs (pins SW1 and SW2)
VIH
HIGH-level input voltage
referenced to VSS
10
−
15
V
VIL
LOW-level input voltage
referenced to VSS
0
−
2
V
Control outputs (pins REL1 and REL2)
VOH
HIGH-level output voltage
referenced to VSS
10
−
15
V
VOL
LOW-level output voltage
referenced to VSS
0
−
2
V
Diagnostic output (pin DIAG, open-drain)
VOL
LOW-level output voltage
IDIAG = 1 mA; note 1
0
−
1.0
V
ILO
output leakage current
no error condition
−
−
50
µA
Enable inputs (pins EN1 and EN2)
VIH
HIGH-level input voltage
referenced to VSS
9
−
15
V
VIL
LOW-level input voltage
referenced to VSS
0
5
−
V
VEN(hys)
hysteresis voltage
−
4
−
V
II(EN)
input current
−
−
300
µA
Switching-on input (pin POWERUP)
VPOWERUP
operating voltage
referenced to VSS
5
−
12
V
II(POWERUP)
input current
VPOWERUP = 12 V
−
100
170
µA
Temperature protection
Tdiag
temperature activating diagnostic VDIAG = VDIAG(LOW)
150
−
−
°C
Thys
hysteresis on temperature
diagnostic
−
20
−
°C
−
3.5
−
A
VDIAG = VDIAG(LOW)
Current protection
IO(ocpl)
overcurrent protection level
Note
1. Temperature sensor or maximum current sensor activated.
2004 May 06
8
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
13 AC CHARACTERISTICS
VP = ±15 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Single-ended application; note 1
Po
output power
RL = 8 Ω
THD = 0.5 %
10(2)
12
−
W
THD = 10 %
14(2)
15
−
W
THD = 0.5 %
−
16
−
W
THD = 10 %
−
20
−
W
fi = 1 kHz
−
0.05
0.1
%
fi = 10 kHz
−
0.2
−
%
−
94
−
%
RL = 6 Ω
THD
η
total harmonic distortion
efficiency endstage
Po = 1 W; note 3
Po = 2 × 15 W; fi = 1 kHz; note 4
Notes
1. VP = ±15 V; RL = 8 Ω; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 Ω (series resistance of filter coil); Tamb = 25 °C; measured
in reference design (SE application) shown in Fig.5; unless otherwise specified.
2. Indirectly measured; based on Rds(on) measurement.
3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When
distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching
frequency outside the audio band. Measured using the typical application circuit, given in Fig.5.
4. Efficiency for power stage.
2004 May 06
9
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
14 SWITCHING CHARACTERISTICS
VP = ±15 V; Tamb = 25 °C; measured in Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.3
tr
rise time
−
30
−
ns
tf
fall time
−
30
−
ns
tblank
blanking time
−
70
−
ns
tPD
propagation delay
−
200
−
ns
tW(min)
minimum pulse width
−
220
270
ns
Rds(on)
on-resistance of the output
transistors
−
0.2
0.4
Ω
from pin SW1 (SW2) to
pin OUT1 (OUT2)
1/f osc
handbook, full pagewidth
VDD
PWM
output
(V)
0V
VSS
tr
tf
t blank
t PD
VSTAB
VSW
(V)
VSS
VSTAB
VREL
(V)
VSS
MGW145
100 ns
Fig.3 Timing diagram PWM output, switch and release signals.
2004 May 06
10
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
5
6
BOOT1
7
OUT1
12 kΩ
EN1 4
SW1 1
REL1 2
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
15 nF
DRIVER
LOW
STAB 9
temp
DIAG 3
11
12 V
POWERUP 15
TEMPERATURE SENSOR
AND
current
CURRENT PROTECTION
EN2 14
100
nF
SW2 17
REL2 16
V
VEN
VSW1
12 V
0
V
VREL1
V
VSTAB
CONTROL
AND
HANDSHAKE
V
VDIAG VSW2
VREL2
12 V
0
VOUT1 V
VSS1
2VP
VDD2
12
BOOT2
11
OUT2
DRIVER
HIGH
Philips Semiconductors
13
TDA8925
Power stage 2 x 15 to 25 W class-D
audio amplifier
VDD1
15 TEST AND APPLICATION INFORMATION
dbook, full pagewidth
2004 May 06
VDD2
15 nF
DRIVER
LOW
8
10
VSS1
VSS2
VOUT2 V
MDB613
Product specification
TDA8925
Fig.4 Test diagram.
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
15.1
TDA8925
SE application
For SE application the application diagram as shown in Fig.5 can be used.
15.2
Package ground connection
The heatsink of the TDA8925 is connected internally to VSS.
15.3
Output power
The output power in SE self oscillating class-D applications can be estimated using the formula
2
RL
------------------------------------------- × V P
R L + R ds(on) + R s
P o(1%) = ----------------------------------------------------------------2 × RL
VP
The maximum current I O(max) = ------------------------------------------should not exceed 3 A.
R L + R ds(on) + R s
Where:
RL = load impedance
Rs = series resistance of filter coil
Po(1%) = output power just at clipping.
The output power at THD = 10 %: Po(10%) = 1.25 × Po(1%).
15.4
Reference design
The reference design for a self oscillating class-D system for the TDA8925 is shown in Fig.5. The Printed-Circuit
Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.5.1.
2004 May 06
12
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
C2
100 nF
C4
470 µF
(35 V) L2
bead
C39
R32
2.2 nF 100 Ω
R3
VDDP
VSSP
R1
10 kΩ
VDDP
R33
3.9
kΩ
R9
1 kΩ
C14
22 µF (100 V)
C5
1 kΩ
470 µF
(35 V)
2
C20
2.2 nF
3
R5
13
C40
In1
In2
100 nF
C41
R8
3.9 kΩ 47 nF
R6
S1
power-ON
R25
2 kΩ
R29
0Ω
VSSP
5
C22
2.2 nF
6
DZ1
36 V
Q1
BC848
R15
10 kΩ
2 J2 1
R24
DIAG
0Ω
EN1
EN2
VSSP
REL2
SW2
C38
100 nF
1 kΩ
DZ2
3.3 V
1
VDD1
5
2
6
15
3
4
R17
5.6 kΩ
U2B
LM393
7
C37
220 pF
12
16
17
10
11
C6
470 µF
(35 V)
BOOT1
C24
1 µF
C32
470 nF
R30
C27
22 µF (100 V)
C28
100 nF
VSS2
C11
220 nF
VSSP
R31
BOOT2
OUT2
VDDP
C25
1 µF
VDDP
39 kΩ
L4
33 µH
R21
5.6 Ω
C35
220 nF
R23
22 Ω
C13
15 nF
LS2
8Ω
C33
470 nF
R12
2 kΩ
VDDP
STAB (U1,9)
C30
560 pF
R34
3.9 kΩ
C31
560 pF
R2
10 kΩ
VSSP
mdb614
Fig.5 SE self oscillating class-D system application diagram for TDA8925.
Product specification
R35
LS1
8Ω
TDA8925
C42
2.2 nF 150 Ω
C12
15 nF
39 kΩ
R4
1 kΩ
C34
220 nF
R22
22 Ω
U1
9
TDA8925ST/J
14
VSSP
OUT1
VSSP
VSSP
33 µH
STAB
VSS1
Q2
BC856
7
C29
560 pF
L3
VDD2
13
8
R16
C21
2.2 nF
R14
15 kΩ
R28
0Ω
220 kΩ
POWERUP
22 µF
(100 V)
C9
220 nF
220 nF
REL1
R13
15 kΩ
VSSP
C8
SW1
VDDP
C15
R10
0Ω
22 µF
(100 V)
VSSP
R7
47 nF 3.9 kΩ
C7
C17
4
1
J3
2
220 kΩ
R11
2 kΩ
C16
100 nF
R19
5.6 Ω
R26
0Ω
C19
2.2 nF
C28
560 pF
C10
220 nF
STAB (U1,9)
U2A
8 LM393
1
VDDP
VDDP
2 J1 1
Philips Semiconductors
C1
100 nF
bead
C3
470 µF
(35 V)
Power stage 2 x 15 to 25 W class-D
audio amplifier
2004 May 06
L1
CON1
supply
+14.5 V
1
2
3
−14.5 V
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
handbook, full pagewidth
TDA8925
R24
pin 1
C10
R26
R30
C28
R1 R11
R32
C8
C45
R35
C26 R19
C36
C26
R21
R33
C31
R34
C9
R12
C25
R2
C16
C30
R31
R15 C37
R13
U2
R4
R14
Q1 R9 C22
C21
R28
R7
R17 R6
R10
C17
C41
Q2
C2
C1
R8
C40
R16
C24
C34
C11
R22
R29
C35
R23
+
OUT1
− −
OUT2
+
22 V
C12
C13
IN2
V
GND DD
R3
C19
C50
R5
IN1
C38
R25
Bottom silk
MDB615
Fig.6 Printed-circuit board (bottom silk) layout for TDA8925ST.
handbook, full pagewidth
Bottom copper
MDB617
Fig.7 Printed-circuit board (bottom copper) layout for TDA8925ST.
2004 May 06
14
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
handbook, full pagewidth
TDA8925
TDA8925ST
L3
C5
J2
U1
J1
state of D art
C27
C7
VP typ +/- 15 V
2 x 15 W in 8 Ω
single layer
C6
L4
demo PCB v2r4
RL 1 2003
DZ1
C4
L1
C14
C3
C15
L2
C32
J3
C33
S1
DZ2
Out2
VSS
Out1
Con1
GND
Con2
VDD
Con3
CO2
CO1
In1
In2
power_on
Top silk
MDB616
Fig.8 Printed-circuit board (top silk) layout for TDA8925ST.
15.5
Reference design bill of material
15.5.1
Version 2; revision 5
COMPONENT
DESCRIPTION
TYPE
COMMENTS
U1
TDA8925ST
Philips Semiconductors,
SOT577-2
U2
LM393AD
National, SO8
alternatives: TI
semiconductors and On
semiconductors
DZ1
36 V Zener diode
BZX-79C36V, DO-35
used as jumper
DZ2
3.3 V Zener diode
BZX-79C3V3, DO-35
used as jumper, optional
Q1
BC848 transistor
NPN, SOT23
Q2
BC856 transistor
PNP, SOT23
L1, L2
bead
Murata BL01RN1-A62
used as jumper
L3, L4
33 µH coil
Toko 11RHBP-330M ws
totally shielded
S1
power-on switch
PCB switch, SACME
09-03290-01
optional
CON1
VSS, GND, VDD connector
Augat 5KEV-03
optional
CON2, CON3
Out2, Out1 connector
Augat 5KEV-02
optional
CO1, CO2
In1, In2 connector
Cinch Farnell 152-396
optional
J1, J2, J3
wire
Jumpers, D = 0.5 mm
220 pF/50 V
SMD0805
Capacitors
C37
2004 May 06
15
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
COMPONENT
TDA8925
DESCRIPTION
TYPE
C28, C29, C30,
C31
560 pF/100 V
SMD0805
C19, C20, C21,
C22, C39, C42
2.2 nF/50 V
SMD0805
C12, C13
15 nF/50 V
SMD0805
C40, C41
47 nF/50 V
SMD1206
COMMENTS
50 V is OK
C1, C2, C16, C17, 100 nF/50 V
C26, C38
SMD0805
C8, C9, C10, C11, 220 nF/50 V
C34, C35
SMD1206
C32, C33
470 nF/63 V
MKT
C24, C25
1 µF/16 V
SMD1206
1206 due to supply range
C7, C14, C15,
C27
22 µF/100 V
Panasonic NHG Series
ECA1JHG220
63 V is OK
C3, C4, C5, C6
470 µF/35 V
Panasonic M Series
ECA1VM471
C18, C23, C36
these capacitors have been
removed
C8 to C11 used as jumper
Resistors
R10, R26, R28,
R29
0Ω
SMD1206
used as jumpers
R24
0Ω
SMD0805
short-circuited in a new
printed-circuit board layout
R19, R21
5.6 Ω/0.25 W
SMD1206
1206 due to dissipation
R22, R23
22 Ω/1 W
SMD2512
2512 due to dissipation
R35
150 Ω
SMD1206
used as jumper
R32
100 Ω
SMD1206
used as jumper
R9
1 kΩ
SMD1206
used as jumper
R3, R4, R16
1 kΩ
SMD0805
R11, R12
2 kΩ
SMD1206
R25
2 kΩ
SMD0805
R7, R8, R33, R34
3.9 kΩ
SMD0805
R17
5.6 kΩ
SMD0805
R1, R2, R15
10 kΩ
SMD0805
R13, R14
15 kΩ
SMD0805
R30, R31
39 kΩ
SMD0805
R5, R6
220 kΩ
SMD0805
R18, R20, R27
these resistors have been
removed
15.5.2
used as jumpers
PRINTED-CIRCUIT BOARD
The printed-circuit board dimensions are 8.636 × 5.842 cm; single-sided copper of 35 µm; silk screen on both sides;
79 holes; 94 components (32 resistors and 41 capacitors).
2004 May 06
16
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
15.6
TDA8925
Curves measured in reference design
MDB618
102
handbook, halfpage
MDB620
102
handbook, halfpage
THD + N
(%)
10
THD + N
(%)
10
1
(1)
1
(1)
10−1
10−1
(2)
(2)
(3)
10−2
10−2
10−3
10−2
10−1
1
10
Po (W)
10−3
10
102
2 × 8 Ω SE; VP = ±15 V.
(1) 6 kHz.
(2) 1 kHz.
(3) 100 Hz.
102
103
104
fi (Hz)
105
2 × 8 Ω SE; VP = ±15 V.
(1) Po = 10 W.
(2) Po = 1 W.
Fig.9 THD + N as function of output power.
Fig.10 THD + N as function of frequency.
MDB622
100
η
(%)
MDB619
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
80
−20
60
(1)
−40
(2)
(3)
40
(4)
−60
20
−80
0
0
4
8
12
10
16
20
Po (W)
103
104
105
fi (Hz)
VP = ±15 V; Vripple(p-p) = 2 V.
(1) Both supply lines in phase.
(2) One supply line (VSS) rippled.
(3) One supply line (VDD) rippled.
(4) Both supply lines in antiphase.
2 × 8 Ω SE; VP = ±15 V;
fi = 1 kHz.
Fig.11 Efficiency as function of output power.
2004 May 06
102
Fig.12 SVRR as function of frequency.
17
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
MDB621
100
S/N
MDB623
0
handbook, halfpage
handbook, halfpage
αcs
(dB)
(dB)
80
−20
60
−40
40
−60 (1)
20
−80
(2)
0
10−2
10−1
1
10
Po (W)
−100
102
10
102
103
104
fi (Hz)
105
2 × 8 Ω SE; VP = ±15 V.
(1) Po = 1 W.
(2) Po = 10 W.
2 × 8 Ω SE; VP = ±15 V.
Fig.14 Channel separation as function of
frequency.
Fig.13 S/N as function of output power.
MDB624
35
G
(dB)
MDB625
25
handbook, halfpage
handbook, halfpage
Po
(W)
30
21
25
17
20
13
(1)
15
10
(2)
9
10
102
103
104
fi (Hz)
5
10
105
14
16
18
20
VP (V)
2 × 8 Ω SE; fi = 1 kHz.
(1) THD + N = 10 %.
(2) THD + N = 1 %.
2 × 8 Ω SE; VP = ±15 V;
Vi = 100 mV.
Fig.15 Gain as function of frequency.
2004 May 06
12
Fig.16 Output power as function of supply voltage.
18
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
16 PACKAGE OUTLINES
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads
(row spacing 2.54 mm)
SOT577-2
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L
1
e1
Z
w M
bp
e
c
e2
17
v M
0
5
Q
L1
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D(1)
d
Dh
E(1)
e
e1
e2
Eh
j
L
L1
Q
v
w
x
Z (1)
mm
13.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
1.27
2.54
6
3.4
3.1
3.75
3.15
3.75
3.15
2.1
1.8
0.6
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
01-01-05
03-03-12
SOT577-2
2004 May 06
EUROPEAN
PROJECTION
19
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
SOT243-3
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L3
L
c
Q
1
v M
17
e1
Z
e2
m
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
j
L
L3
m
Q
v
w
x
Z (1)
6
3.4
3.1
8.4
7.0
2.4
1.6
4.3
2.1
1.8
0.6
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
99-12-17
03-03-12
SOT243-3
2004 May 06
EUROPEAN
PROJECTION
20
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
The total contact time of successive solder waves must not
exceed 5 seconds.
17 SOLDERING
17.1
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
17.2
17.3
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
17.4
Manual soldering
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
WAVE
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable(1)
PMFP(2)
−
not suitable
Notes
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2. For PMFP packages hot bar soldering or manual soldering is suitable.
2004 May 06
21
Philips Semiconductors
Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier
TDA8925
18 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19 DEFINITIONS
20 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 May 06
22
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R30/02/pp23
Date of release: 2004
May 06
Document order number:
9397 750 13042