INTEGRATED CIRCUITS DATA SHEET TDA8925 Power stage 2 x 15 to 25 W class-D audio amplifier Product specification Supersedes data of 2004 Jan 05 2004 May 06 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 CONTENTS 15 TEST AND APPLICATION INFORMATION SE application Package ground connection Output power Reference design Reference design bill of material Version 2; revision 5 Printed-circuit board Curves measured in reference design 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 15.1 15.2 15.3 15.4 15.5 15.5.1 15.5.2 15.6 7 PINNING 16 PACKAGE OUTLINES 8 FUNCTIONAL DESCRIPTION 17 SOLDERING 8.1 8.2 8.2.1 8.2.2 Power stage Protection Overtemperature Short-circuit across the loudspeaker terminals 17.1 9 LIMITING VALUES 10 THERMAL CHARACTERISTICS Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods 11 QUALITY SPECIFICATION 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 SWITCHING CHARACTERISTICS 2004 May 06 17.2 17.3 17.4 2 18 DATA SHEET STATUS 19 DEFINITIONS 20 DISCLAIMERS Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 1 TDA8925 FEATURES 3 • High efficiency (> 94 %) GENERAL DESCRIPTION The TDA8925 is a switching power stage for a high efficiency class-D audio power amplifier system. • Operating voltage from ±7.5 V to ±30 V With this power stage a compact 2 × 15 W self oscillating digital amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required. The system operates over a wide supply voltage range from ±7.5 V up to ±30 V and consumes a very low quiescent current. • Very low quiescent current • High output power • Diagnostic output • Usable as a stereo Single-Ended (SE) amplifier • Electrostatic discharge protection (pin to pin) • No heatsink required. 2 APPLICATIONS • Television sets • Home-sound sets • Multimedia systems • All mains fed audio systems. 4 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT General VP supply voltage Iq(tot) total quiescent current η efficiency endstage ±7.5 ±15 ±30 V no load connected; VP = ±15 V − 25 45 mA Po = 15 W; RL = 8 Ω; VP = ±15 V − 94 − % RL = 8 Ω; THD = 10 %; VP = ±15 V 14 15 − W RL = 6 Ω; THD = 10 %; VP = ±15 V − 20 − W Stereo single-ended configuration Po 5 output power ORDERING INFORMATION TYPE NUMBER TDA8925ST TDA8925J 2004 May 06 PACKAGE NAME RDBS17P DBS17P DESCRIPTION VERSION plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) SOT577-2 plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 3 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 6 TDA8925 BLOCK DIAGRAM VDD2 VDD1 handbook, full pagewidth 13 TDA8925 EN1 SW1 REL1 STAB DIAG POWERUP EN2 SW2 REL2 6 4 1 2 5 DRIVER HIGH CONTROL AND HANDSHAKE 7 OUT1 DRIVER LOW 9 temp 3 TEMPERATURE SENSOR AND current CURRENT PROTECTION 15 14 17 16 VSS1 VDD2 12 BOOT2 DRIVER HIGH CONTROL AND HANDSHAKE 11 OUT2 DRIVER LOW 8 10 VSS1 VSS2 Fig.1 Block diagram. 2004 May 06 BOOT1 4 MDB610 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 7 TDA8925 PINNING SYMBOL PIN DESCRIPTION SW1 1 digital switch input; channel 1 REL1 2 digital control output; channel 1 DIAG 3 digital open-drain output for overtemperature and overcurrent report handbook, halfpage SW1 1 REL1 2 DIAG 3 EN1 4 VDD1 5 BOOT1 6 EN1 4 digital enable input; channel 1 VDD1 5 positive power supply; channel 1 BOOT1 6 bootstrap capacitor; channel 1 OUT1 7 PWM output; channel 1 VSS1 8 negative power supply; channel 1 OUT1 7 STAB 9 decoupling internal stabilizer for logic supply VSS1 8 STAB 9 VSS2 10 negative power supply; channel 2 OUT2 11 PWM output; channel 2 BOOT2 12 bootstrap capacitor; channel 2 VDD2 13 positive power supply; channel 2 EN2 14 digital enable input; channel 2 POWERUP 15 enable input for switching on internal reference sources REL2 16 digital control output; channel 2 SW2 17 digital switch input; channel 2 TDA8925ST/J VSS2 10 OUT2 11 BOOT2 12 VDD2 13 EN2 14 POWERUP 15 REL2 16 SW2 17 MDB611 Fig.2 Pin configuration. 2004 May 06 5 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 8 TDA8925 8.2 FUNCTIONAL DESCRIPTION Temperature and short-circuit protection sensors are included in the TDA8925. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is pulled down to VSS. Since the diagnostic is connected to the enable pins in the application the system shuts down itself. The TDA8925 is a two-channel audio power amplifier system using the class-D technology (see Fig.1). The power stage TDA8925S is used for driving the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. 8.1 8.2.1 OVERTEMPERATURE If the junction temperature (Tj) exceeds 150 °C, then pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 °C, so there is a hysteresis of approximately 20 °C. Power stage The power stage contains the high-power DMOS switches, the drivers, timing and handshaking between the power switches and some control logic (see Fig.1). For protection, a temperature sensor and a maximum current detector are built-in on the chip. 8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER TERMINALS When the loudspeaker terminals are short-circuited this will be detected by the current protection. If the output current exceeds the maximum output current of 3 A, then pin DIAG becomes LOW. Using pin DIAG in combination with the enable pins the system will shut down immediately, and restart again. The result is that the output current is limited at the overcurrent detection level. The following functions are available: • Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches • Release (pins REL1 and REL2): digital outputs; switching from VSS to VSS + 12 V; follow SW1 and SW2 with a small delay. Note: for self oscillating applications this pin is not used. • Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS + 5 V with respect to VSS • Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM outputs are floating; at a level of VSS + 12 V the power stage is operational • Diagnostics (pin DIAG): digital open-drain output; pulled to VSS if the temperature or maximum current is exceeded. 2004 May 06 Protection 6 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 9 LIMITING VALUES In accordance with the Absolute Maximum Rate System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage − ±30 V VP(sc) supply voltage for short-circuits across the load − ±30 V IORM repetitive peak current in output pins − 3.5 A Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Tvj virtual junction temperature − 150 °C Vesd(HBM) electrostatic discharge voltage note 1 (HBM) all pins with respect to VDD (class 1a) −500 +500 V all pins with respect to VSS (class 1a) −1500 +1500 V all pins with respect to each other (class 1a) −1500 +1500 V Vesd(MM) electrostatic discharge voltage note 2 (MM) all pins with respect to VDD (class B) −250 +250 V all pins with respect to VSS (class B) −250 +250 V all pins with respect to each other (class B) −250 +250 V Notes 1. Human Body Model (HBM); Rs = 1500 Ω; C = 100 pF. 2. Machine Model (MM); Rs = 10 Ω; C = 200 pF; L = 0.75 µH. 10 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case in free air 1.5 K/W 11 QUALITY SPECIFICATION In accordance with “SNW-FQ611” if this device is used as an audio amplifier. 2004 May 06 7 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 12 DC CHARACTERISTICS VP = ±15 V; Tamb = 25 °C; measured in test diagram of Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage Iq(tot) total quiescent current ±7.5 ±15 ±30 V no load connected − 25 45 mA outputs floating − 5 10 mA referenced to VSS 11.7 13 14.3 V Internal stabilizer logic supply (pin STAB) VO(STAB) stabilizer output voltage Switch inputs (pins SW1 and SW2) VIH HIGH-level input voltage referenced to VSS 10 − 15 V VIL LOW-level input voltage referenced to VSS 0 − 2 V Control outputs (pins REL1 and REL2) VOH HIGH-level output voltage referenced to VSS 10 − 15 V VOL LOW-level output voltage referenced to VSS 0 − 2 V Diagnostic output (pin DIAG, open-drain) VOL LOW-level output voltage IDIAG = 1 mA; note 1 0 − 1.0 V ILO output leakage current no error condition − − 50 µA Enable inputs (pins EN1 and EN2) VIH HIGH-level input voltage referenced to VSS 9 − 15 V VIL LOW-level input voltage referenced to VSS 0 5 − V VEN(hys) hysteresis voltage − 4 − V II(EN) input current − − 300 µA Switching-on input (pin POWERUP) VPOWERUP operating voltage referenced to VSS 5 − 12 V II(POWERUP) input current VPOWERUP = 12 V − 100 170 µA Temperature protection Tdiag temperature activating diagnostic VDIAG = VDIAG(LOW) 150 − − °C Thys hysteresis on temperature diagnostic − 20 − °C − 3.5 − A VDIAG = VDIAG(LOW) Current protection IO(ocpl) overcurrent protection level Note 1. Temperature sensor or maximum current sensor activated. 2004 May 06 8 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 13 AC CHARACTERISTICS VP = ±15 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Single-ended application; note 1 Po output power RL = 8 Ω THD = 0.5 % 10(2) 12 − W THD = 10 % 14(2) 15 − W THD = 0.5 % − 16 − W THD = 10 % − 20 − W fi = 1 kHz − 0.05 0.1 % fi = 10 kHz − 0.2 − % − 94 − % RL = 6 Ω THD η total harmonic distortion efficiency endstage Po = 1 W; note 3 Po = 2 × 15 W; fi = 1 kHz; note 4 Notes 1. VP = ±15 V; RL = 8 Ω; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 Ω (series resistance of filter coil); Tamb = 25 °C; measured in reference design (SE application) shown in Fig.5; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. Measured using the typical application circuit, given in Fig.5. 4. Efficiency for power stage. 2004 May 06 9 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 14 SWITCHING CHARACTERISTICS VP = ±15 V; Tamb = 25 °C; measured in Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT PWM outputs (pins OUT1 and OUT2); see Fig.3 tr rise time − 30 − ns tf fall time − 30 − ns tblank blanking time − 70 − ns tPD propagation delay − 200 − ns tW(min) minimum pulse width − 220 270 ns Rds(on) on-resistance of the output transistors − 0.2 0.4 Ω from pin SW1 (SW2) to pin OUT1 (OUT2) 1/f osc handbook, full pagewidth VDD PWM output (V) 0V VSS tr tf t blank t PD VSTAB VSW (V) VSS VSTAB VREL (V) VSS MGW145 100 ns Fig.3 Timing diagram PWM output, switch and release signals. 2004 May 06 10 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 5 6 BOOT1 7 OUT1 12 kΩ EN1 4 SW1 1 REL1 2 CONTROL AND HANDSHAKE DRIVER HIGH 15 nF DRIVER LOW STAB 9 temp DIAG 3 11 12 V POWERUP 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION EN2 14 100 nF SW2 17 REL2 16 V VEN VSW1 12 V 0 V VREL1 V VSTAB CONTROL AND HANDSHAKE V VDIAG VSW2 VREL2 12 V 0 VOUT1 V VSS1 2VP VDD2 12 BOOT2 11 OUT2 DRIVER HIGH Philips Semiconductors 13 TDA8925 Power stage 2 x 15 to 25 W class-D audio amplifier VDD1 15 TEST AND APPLICATION INFORMATION dbook, full pagewidth 2004 May 06 VDD2 15 nF DRIVER LOW 8 10 VSS1 VSS2 VOUT2 V MDB613 Product specification TDA8925 Fig.4 Test diagram. Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 15.1 TDA8925 SE application For SE application the application diagram as shown in Fig.5 can be used. 15.2 Package ground connection The heatsink of the TDA8925 is connected internally to VSS. 15.3 Output power The output power in SE self oscillating class-D applications can be estimated using the formula 2 RL ------------------------------------------- × V P R L + R ds(on) + R s P o(1%) = ----------------------------------------------------------------2 × RL VP The maximum current I O(max) = ------------------------------------------should not exceed 3 A. R L + R ds(on) + R s Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping. The output power at THD = 10 %: Po(10%) = 1.25 × Po(1%). 15.4 Reference design The reference design for a self oscillating class-D system for the TDA8925 is shown in Fig.5. The Printed-Circuit Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.5.1. 2004 May 06 12 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... C2 100 nF C4 470 µF (35 V) L2 bead C39 R32 2.2 nF 100 Ω R3 VDDP VSSP R1 10 kΩ VDDP R33 3.9 kΩ R9 1 kΩ C14 22 µF (100 V) C5 1 kΩ 470 µF (35 V) 2 C20 2.2 nF 3 R5 13 C40 In1 In2 100 nF C41 R8 3.9 kΩ 47 nF R6 S1 power-ON R25 2 kΩ R29 0Ω VSSP 5 C22 2.2 nF 6 DZ1 36 V Q1 BC848 R15 10 kΩ 2 J2 1 R24 DIAG 0Ω EN1 EN2 VSSP REL2 SW2 C38 100 nF 1 kΩ DZ2 3.3 V 1 VDD1 5 2 6 15 3 4 R17 5.6 kΩ U2B LM393 7 C37 220 pF 12 16 17 10 11 C6 470 µF (35 V) BOOT1 C24 1 µF C32 470 nF R30 C27 22 µF (100 V) C28 100 nF VSS2 C11 220 nF VSSP R31 BOOT2 OUT2 VDDP C25 1 µF VDDP 39 kΩ L4 33 µH R21 5.6 Ω C35 220 nF R23 22 Ω C13 15 nF LS2 8Ω C33 470 nF R12 2 kΩ VDDP STAB (U1,9) C30 560 pF R34 3.9 kΩ C31 560 pF R2 10 kΩ VSSP mdb614 Fig.5 SE self oscillating class-D system application diagram for TDA8925. Product specification R35 LS1 8Ω TDA8925 C42 2.2 nF 150 Ω C12 15 nF 39 kΩ R4 1 kΩ C34 220 nF R22 22 Ω U1 9 TDA8925ST/J 14 VSSP OUT1 VSSP VSSP 33 µH STAB VSS1 Q2 BC856 7 C29 560 pF L3 VDD2 13 8 R16 C21 2.2 nF R14 15 kΩ R28 0Ω 220 kΩ POWERUP 22 µF (100 V) C9 220 nF 220 nF REL1 R13 15 kΩ VSSP C8 SW1 VDDP C15 R10 0Ω 22 µF (100 V) VSSP R7 47 nF 3.9 kΩ C7 C17 4 1 J3 2 220 kΩ R11 2 kΩ C16 100 nF R19 5.6 Ω R26 0Ω C19 2.2 nF C28 560 pF C10 220 nF STAB (U1,9) U2A 8 LM393 1 VDDP VDDP 2 J1 1 Philips Semiconductors C1 100 nF bead C3 470 µF (35 V) Power stage 2 x 15 to 25 W class-D audio amplifier 2004 May 06 L1 CON1 supply +14.5 V 1 2 3 −14.5 V Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier handbook, full pagewidth TDA8925 R24 pin 1 C10 R26 R30 C28 R1 R11 R32 C8 C45 R35 C26 R19 C36 C26 R21 R33 C31 R34 C9 R12 C25 R2 C16 C30 R31 R15 C37 R13 U2 R4 R14 Q1 R9 C22 C21 R28 R7 R17 R6 R10 C17 C41 Q2 C2 C1 R8 C40 R16 C24 C34 C11 R22 R29 C35 R23 + OUT1 − − OUT2 + 22 V C12 C13 IN2 V GND DD R3 C19 C50 R5 IN1 C38 R25 Bottom silk MDB615 Fig.6 Printed-circuit board (bottom silk) layout for TDA8925ST. handbook, full pagewidth Bottom copper MDB617 Fig.7 Printed-circuit board (bottom copper) layout for TDA8925ST. 2004 May 06 14 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier handbook, full pagewidth TDA8925 TDA8925ST L3 C5 J2 U1 J1 state of D art C27 C7 VP typ +/- 15 V 2 x 15 W in 8 Ω single layer C6 L4 demo PCB v2r4 RL 1 2003 DZ1 C4 L1 C14 C3 C15 L2 C32 J3 C33 S1 DZ2 Out2 VSS Out1 Con1 GND Con2 VDD Con3 CO2 CO1 In1 In2 power_on Top silk MDB616 Fig.8 Printed-circuit board (top silk) layout for TDA8925ST. 15.5 Reference design bill of material 15.5.1 Version 2; revision 5 COMPONENT DESCRIPTION TYPE COMMENTS U1 TDA8925ST Philips Semiconductors, SOT577-2 U2 LM393AD National, SO8 alternatives: TI semiconductors and On semiconductors DZ1 36 V Zener diode BZX-79C36V, DO-35 used as jumper DZ2 3.3 V Zener diode BZX-79C3V3, DO-35 used as jumper, optional Q1 BC848 transistor NPN, SOT23 Q2 BC856 transistor PNP, SOT23 L1, L2 bead Murata BL01RN1-A62 used as jumper L3, L4 33 µH coil Toko 11RHBP-330M ws totally shielded S1 power-on switch PCB switch, SACME 09-03290-01 optional CON1 VSS, GND, VDD connector Augat 5KEV-03 optional CON2, CON3 Out2, Out1 connector Augat 5KEV-02 optional CO1, CO2 In1, In2 connector Cinch Farnell 152-396 optional J1, J2, J3 wire Jumpers, D = 0.5 mm 220 pF/50 V SMD0805 Capacitors C37 2004 May 06 15 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier COMPONENT TDA8925 DESCRIPTION TYPE C28, C29, C30, C31 560 pF/100 V SMD0805 C19, C20, C21, C22, C39, C42 2.2 nF/50 V SMD0805 C12, C13 15 nF/50 V SMD0805 C40, C41 47 nF/50 V SMD1206 COMMENTS 50 V is OK C1, C2, C16, C17, 100 nF/50 V C26, C38 SMD0805 C8, C9, C10, C11, 220 nF/50 V C34, C35 SMD1206 C32, C33 470 nF/63 V MKT C24, C25 1 µF/16 V SMD1206 1206 due to supply range C7, C14, C15, C27 22 µF/100 V Panasonic NHG Series ECA1JHG220 63 V is OK C3, C4, C5, C6 470 µF/35 V Panasonic M Series ECA1VM471 C18, C23, C36 these capacitors have been removed C8 to C11 used as jumper Resistors R10, R26, R28, R29 0Ω SMD1206 used as jumpers R24 0Ω SMD0805 short-circuited in a new printed-circuit board layout R19, R21 5.6 Ω/0.25 W SMD1206 1206 due to dissipation R22, R23 22 Ω/1 W SMD2512 2512 due to dissipation R35 150 Ω SMD1206 used as jumper R32 100 Ω SMD1206 used as jumper R9 1 kΩ SMD1206 used as jumper R3, R4, R16 1 kΩ SMD0805 R11, R12 2 kΩ SMD1206 R25 2 kΩ SMD0805 R7, R8, R33, R34 3.9 kΩ SMD0805 R17 5.6 kΩ SMD0805 R1, R2, R15 10 kΩ SMD0805 R13, R14 15 kΩ SMD0805 R30, R31 39 kΩ SMD0805 R5, R6 220 kΩ SMD0805 R18, R20, R27 these resistors have been removed 15.5.2 used as jumpers PRINTED-CIRCUIT BOARD The printed-circuit board dimensions are 8.636 × 5.842 cm; single-sided copper of 35 µm; silk screen on both sides; 79 holes; 94 components (32 resistors and 41 capacitors). 2004 May 06 16 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier 15.6 TDA8925 Curves measured in reference design MDB618 102 handbook, halfpage MDB620 102 handbook, halfpage THD + N (%) 10 THD + N (%) 10 1 (1) 1 (1) 10−1 10−1 (2) (2) (3) 10−2 10−2 10−3 10−2 10−1 1 10 Po (W) 10−3 10 102 2 × 8 Ω SE; VP = ±15 V. (1) 6 kHz. (2) 1 kHz. (3) 100 Hz. 102 103 104 fi (Hz) 105 2 × 8 Ω SE; VP = ±15 V. (1) Po = 10 W. (2) Po = 1 W. Fig.9 THD + N as function of output power. Fig.10 THD + N as function of frequency. MDB622 100 η (%) MDB619 0 handbook, halfpage handbook, halfpage SVRR (dB) 80 −20 60 (1) −40 (2) (3) 40 (4) −60 20 −80 0 0 4 8 12 10 16 20 Po (W) 103 104 105 fi (Hz) VP = ±15 V; Vripple(p-p) = 2 V. (1) Both supply lines in phase. (2) One supply line (VSS) rippled. (3) One supply line (VDD) rippled. (4) Both supply lines in antiphase. 2 × 8 Ω SE; VP = ±15 V; fi = 1 kHz. Fig.11 Efficiency as function of output power. 2004 May 06 102 Fig.12 SVRR as function of frequency. 17 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 MDB621 100 S/N MDB623 0 handbook, halfpage handbook, halfpage αcs (dB) (dB) 80 −20 60 −40 40 −60 (1) 20 −80 (2) 0 10−2 10−1 1 10 Po (W) −100 102 10 102 103 104 fi (Hz) 105 2 × 8 Ω SE; VP = ±15 V. (1) Po = 1 W. (2) Po = 10 W. 2 × 8 Ω SE; VP = ±15 V. Fig.14 Channel separation as function of frequency. Fig.13 S/N as function of output power. MDB624 35 G (dB) MDB625 25 handbook, halfpage handbook, halfpage Po (W) 30 21 25 17 20 13 (1) 15 10 (2) 9 10 102 103 104 fi (Hz) 5 10 105 14 16 18 20 VP (V) 2 × 8 Ω SE; fi = 1 kHz. (1) THD + N = 10 %. (2) THD + N = 1 %. 2 × 8 Ω SE; VP = ±15 V; Vi = 100 mV. Fig.15 Gain as function of frequency. 2004 May 06 12 Fig.16 Output power as function of supply voltage. 18 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 16 PACKAGE OUTLINES RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 0 5 Q L1 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D(1) d Dh E(1) e e1 e2 Eh j L L1 Q v w x Z (1) mm 13.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 1.27 2.54 6 3.4 3.1 3.75 3.15 3.75 3.15 2.1 1.8 0.6 0.4 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 01-01-05 03-03-12 SOT577-2 2004 May 06 EUROPEAN PROJECTION 19 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L3 L c Q 1 v M 17 e1 Z e2 m w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 8.4 7.0 2.4 1.6 4.3 2.1 1.8 0.6 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 99-12-17 03-03-12 SOT243-3 2004 May 06 EUROPEAN PROJECTION 20 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 The total contact time of successive solder waves must not exceed 5 seconds. 17 SOLDERING 17.1 Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 17.3 Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. 17.4 Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable(1) PMFP(2) − not suitable Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. 2004 May 06 21 Philips Semiconductors Product specification Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925 18 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS 20 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 May 06 22 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R30/02/pp23 Date of release: 2004 May 06 Document order number: 9397 750 13042