FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681 Generic Copy Issue Date: 30-Jun-2011 TITLE: Final Notification for Transfer of Zener Filtering products from Hynix (Magna Chip) in Korea to ON Semiconductor Pocatello (ID) in United State. PROPOSED FIRST SHIP DATE: 30-Sep-2011 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Fab Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or YEW HEE SOON <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Francis Lualhati <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is notifying customers of its plan to transfer fabrication of Zener EMI filter products from Hynix (Magna Chip) located in Seoul, South Korea, to ON Semiconductor Fab 10 located in Pocatello, ID (USA). Description of the change: The transfer and qualification of the Zener Z1C processes and the associated integrated circuits from the Hynix (Magna Chip) facility (South Korea) to the Fab 10 wafer fabrication site located in the Pocatello, Idaho. The Fab 10 facility is an ON Semiconductor owned wafer fab that has been producing products since 2000 (formerly as AMI). Several existing technologies within ON Semiconductor’s product families are currently sourced from Fab 10, including CMOS and LVFR products The Fab 10 Pocatello site is certified according to ISO9001:2008, 14001:2004, ISO/TS 16949:2009 and AS 9100B standards as well as MIL_PRF-38535, CTPAT and STACK. Issue Date: 30-Jun-2011 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681 Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards. Devices listed in this final PCN should be transferred to ON Semiconductor Fab 10 in Pocatello starting Sept 2011. After 27 Sept 2011, customer may receive devices from either facility. Parts are identifiable by date code 1139 (YYWW). RELIABILITY DATA SUMMARY: Package: CSP Qual Vehicles: CM6317 Qualification Results and Analysis: Test: HTRB HTSL UHAST TC Autoclave ESD IEC61000-4-2 Conditions: TA=125°C, V=5.5 Volts TA = 150°C Ta=130C RH=85%, unbiased Ta= -40 C to 125 C Ta=121C RH=100% ~15 psig ± 15KV min Interval: Results 1008 hrs 0/240 1008 hrs 0/240 1008 hrs 0/240 1000 cyc 0/240 96 hrs 0/240 ± 15KV ELECTRICAL CHARACTERISTIC SUMMARY: Available upon request CHANGED PART IDENTIFICATION: There will be no changes to standard device markings. Normal assembly lot traceability codes will identify the wafer fab source. Issue Date: 30-Jun-2011 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681 List of affected General Parts: PART CM6317 CM6320 CM1451-06CP CM1451-08CP EMI6317 EMI6320 Issue Date: 30-Jun-2011 Rev. 06-Jan-2010 Page 3 of 3