BXX_003_TO-39 _NiAu

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type:
N2
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e4
Package Homogeneous Materials:
8.1 Electronics (e.g. pc boards, displays)
( BXX) 03 TO-39 NiAu
Basic Substance
CAS Number
"Contained In"
Sub-Component
% Total
Weight
mg/part
ppm
Nickel
Manganese
Copper
Iron
Silicon
Iron
Manganese
Silicon
Carbon
Phosphorus
Sulphur
Nitrogen
Glass
Iron (Fe)
Nickel
7440-02-0
7439-96-5
7440-50-8
7439-89-6
7440-21-3
7439-89-6
7439-96-5
7440-21-3
7440-44-0
7439-96-5
7440-02-0
17778-88-0
Propriety
7439-89-6
7440-02-0
Cap
Cap
Cap
Cap
Cap
Header
Header
Header
Header
Header
Header
Header
Header
Header
Header
39.618
0.020
0.004
0.004
0.004
11.967
0.048
0.012
0.010
0.003
0.003
0.001
12.044
6.153
3.613
439.525
0.220
0.044
0.044
0.044
132.765
0.534
0.134
0.107
0.033
0.033
0.009
133.616
68.264
40.085
396,183
198
40
40
40
119,673
482
120
96
30
30
8
120,440
61,533
36,132
Cobalt
Manganese
Silicon
Carbon
Phosphorus
Sulphur
Nickel
Phosphorus
Gold
Gold
7440-48-4
7439-96-5
7440-21-3
7440-44-0
7723-14-0
7704-34-9
7440-02-0
7723-14-0
7440-57-5
7440-57-5
Header
Header
Header
Header
Header
Header
Header / Plating on external leads (pins)
Header / Plating on external leads (pins)
Header / Plating on external leads (pins)
Die Attach
2.168
0.060
0.036
0.006
0.004
0.004
10.840
1.204
12.044
0.020
24.051
0.668
0.401
0.067
0.040
0.040
120.255
13.362
133.616
0.217
21,679
602
361
60
36
36
108,396
12,044
120,440
196
Silicon
Silicon
Aluminum
Silicon
7440-21-3
7440-21-3
7429-90-5
7440-21-3
Die Attach
Chip (Die)
Wire Bond
Wire Bond
0.000
0.090
0.020
0.000
100.000
0.004
0.998
0.217
0.004
1,109.400
4
900
196
4
1,000,000
TOTALS:
439.88
(mg) Total
Cap
% ot Total Weight
Nickel
Manganese
Copper
Iron
Silicon
7440-02-0
7439-96-5
7440-50-8
7439-89-6
7440-21-3
(mg) Total
Iron
Manganese
Silicon
Carbon
Phosphorus
Sulphur
Nitrogen
Glass
Header
7439-89-6
7439-96-5
99.920
0.050
0.010
0.010
0.010
100.000
% of Total Weight
99.363
0.400
0.100
0.080
0.025
0.025
0.007
100.000
Total
668.08
Base (75%)
Glass (5%)
Isolated Pin
(15%)
Ni Plating (4%)
Au Plating (1%)
7440-21-3
7440-44-0
7439-96-5
7440-02-0
17778-88-0
Propriety
Iron (Fe)
Nickel
Cobalt
Manganese
Silicon
Carbon
Phosphorus
Sulphur
Nickel
Phosphorus
7439-89-6
7440-02-0
7440-48-4
7704-34-9
7440-02-0
7723-14-0
51.090
30.000
18.000
0.500
0.300
0.050
0.030
0.030
90.000
10.000
Gold
7440-57-5
100.000
7439-96-5
7440-21-3
7440-44-0
7723-14-0
0.22
(mg) Total
Gold
Silicon
Die Attach
7440-57-5
7440-21-3
1.00
(mg) Total
Chip (Die)
Total
1.1094 g Total Mass
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU
(31 March 2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip
Technology Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the
chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme world-wide.
Doped Silicon
1109.40
7440-21-3
Totals
39.65
60.22
75.00%
5.00%
15.00%
4.00%
1.00%
Total 100.000
% of Total Weight
0.02
98.000
2.000
100.000
% of Total Weight
0.09
100.000
100.00
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain “reels” may be made from PVC plastic.
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original packing materials is true and correct to the best of its knowledge and belief,
as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers.
Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight of these parts and the average
weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained
in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices.
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in
Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products.
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
Au
14:44 : 04/18/16
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