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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286
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Issue Date: 30-Oct-2013
TITLE: NCP347, NCP348 & Other DFN/ QFN Devices (Gold Wire) Qualification at ASE-SH and
AMKOR-Philippines Assembly Facilities.
PROPOSED FIRST SHIP DATE: 30-Jan-2014
AFFECTED CHANGE CATEGORY(S): Assembly Site
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Ken Fergus <[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
This is to notify customers ON Semiconductor’s that NCP347x, NCP348x and other devices built in
DFN packages (largest size is WDFN 2 x 2.5 x 0.8mm) with Gold Wire are now qualified at ASE
(Shanghai, China) and Amkor, Philippines.
The affected devices listed on this PCN are currently assembled at the ON Semiconductor
Seremban, Malaysia facility and/ or UTAC Thailand Assembly facilities. At the expiration of this PCN,
these devices may be processed at these locations or the newly qualified ASESH and Amkor
facilities.
The package outline and electrical performance of the part from the two new assembly sites fully
meet datasheet specifications.
Issue Date: 30-Oct-2013
Rev. 06-Jan-2010
Page 1 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286
RELIABILITY DATA SUMMARY:
Reliability Test Results:
All qualification requirements were successfully met.
Qual Vehicles
• NCP347MTAHTBG – WDFN 2x2.5x.8mm
Amkor Philippines
#
Test
Name
Test Conditions
End Point
Req’s
1
Prep
Sample preparation and
initial part testing
various
---
2
HTOL
High Temp Op Life
TA = 125°C
Tj=150°C
c = 0, Room
Test
Results
Initial
Electrical
Lot A
(rej/ ss)
504 hrs
0/80
0/80
1008 hrs
0/80
0/80
504 hrs
1008 hrs
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/30
0/30
0/30
0/30
Done
Lot B
Lot C Control
(rej/ ss) (rej/ ss) (rej/ ss)
Done
Done
Done
3
HTSL
High Temperature
Storage Life
TA = 150°C
c = 0, Room
4
RSH
Resistance to solder
Heat
260C
c = 0, Room
5
PC
Moisture
Preconditioning
MSL 1 @ 260°C
c = 0, Room
After PC
0/240
0/240
0/240
0/240
6
UHASTPC
Precond. Autoclave
TA= +130°C, RH
= 85%, PSIG=
18.8,
No bias
c = 0, Room
96 hrs
0/80
0/80
0/80
0/80
7
TC-PC
Precond. Temp Cycle
-65/+150°C
air to air
c = 0, Room
500 cy
0/80
0/80
0/80
0/80
8
HAST-PC
Precond. HAST
TA= +130°C, RH
= 85%, PSIG=
18.8, bias
c = 0, Room
96 hrs
0/80
0/80
0/80
0/80
Issue Date: 30-Oct-2013
Rev. 06-Jan-2010
Page 2 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286
Amkor Philippines (contd)
Test
Results
Initial
Electrical
Lot A
(rej/ ss)
Done
Done
Done
30 bonds
from 5 units
Results
Pass
Pass
Pass
3 gm Pull Force
min
Cpk>1.67
30 bonds
from 5 units
Results
Pass
Pass
Pass
3T°
-40/Room/85°C
Cpk >1.67
Critical
parameters
Results
Pass
Test
Results
Initial
Electrical
Lot A
(rej/ ss)
504 hrs
0/80
0/80
1008 hrs
0/80
0/80
504 hrs
1008 hrs
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/80
0/30
0/30
0/30
0/30
0/240
0/240
0/240
0/240
#
Test
Name
Test Conditions
End Point
Req’s
1
Prep
Sample preparation and
initial part testing
various
---
9
BS
Bond Shear test
Cpk 1.33
10
WBPS
11
ED
Wire Bond Pull Strength
Electrical Distribution
Lot B
Lot C
(rej/ ss) (rej/ ss)
Control
(rej/ ss)
Done
Pass
ASESH
#
Test
Name
Test Conditions
End Point
Req’s
1
Prep
Sample preparation and
initial part testing
various
---
2
HTOL
High Temp Op Life
TA = 125°C
Tj=125°C
c = 0, Room
3
HTSL
High Temperature
Storage Life
TA = 150°C
c = 0, Room
4
RSH
Resistance to Solder
Heat
260°C
C=0
5
PC
Moisture
Preconditioning
MSL 1 @ 260°C
c = 0, Room
Issue Date: 30-Oct-2013
Rev. 06-Jan-2010
After PC
Done
Lot B
Lot C
(rej/ ss) (rej/ ss)
Done
Done
Page 3 of 5
Control
(rej/ ss)
Done
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286
ASESH (contd)
End Point Req’s
Test
Results
various
---
Initial
Electrical
Precond. Autoclave
TA= +130°C, RH
= 85%, PSIG=
18.8,
No bias
c = 0, Room
TC-PC
Precond. Temp Cycle
-65/+150°C
air to air
c = 0, Room
8
HAST-PC
Precond. HAST
TA= +130°C, RH
= 85%, PSIG=
18.8, bias
9
BS
Bond Shear test
10
BPS
11
ED
#
Test
Name
1
Prep
Sample preparation and
initial part testing
6
UHASTPC
7
Wire Bond Pull Strength
Electrical Distribution
Test Conditions
Lot A
Lot B
Lot C
Control
(rej/ ss)
(rej/ ss)
(rej/ ss)
(rej/ ss)
Done
Done
Done
Done
96 hrs
0/80
0/80
0/80
0/80
500 cy
0/80
0/80
0/80
0/80
c = 0, Room
96 hrs
0/80
0/80
0/80
0/80
Cpk 1.33
30 bonds
from 5 units
Results
Pass
Pass
Pass
3 gm Pull Force
min
Cpk>1.67
30 bonds
from 5 units
Results
Pass
Pass
Pass
3T°
-40/Room/85°C
Cpk >1.67
Critical
parameters
Results
Pass
ELECTRICAL CHARACTERISTIC SUMMARY:
Electrical characteristic meet device specifications.
Issue Date: 30-Oct-2013
Rev. 06-Jan-2010
Page 4 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286
CHANGED PART IDENTIFICATION:
At the expiration of this FPCN devices can be assembled in the existing facilities or ASE, Shanghai
or Amkor, Philippines. Devices assembled in the new facilities will have date code of WW05
(January 28), 2014 or later.
AMKOR and ASE facilities will follow the ON Semiconductor standard marking for DFN / QFN
packages. These devices have a one digit date code that can be a number or alphabet per ON
Semiconductor’s date-code scheme. Assembly location can be identified by the orientation of the
date code seen on the top marking, as shown below. The one digit date code is represented as M
below.
Seremban: M
UTL:
ASE, Shanghai:
Amkor, Philippines:
List of affected General Parts:
NCP347MTAHTBG
NCP347MTAETBG
NCP347MTAFTBG
NCP348AEMTTBG
NCP348MTTBG
NLAS5223BMNR2G
NCN1154MUTAG
NCN1188MUTAG
NS5S1153MUTAG
Issue Date: 30-Oct-2013
Rev. 06-Jan-2010
Page 5 of 5
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