Omnidirectional Microphone with Bottom Port and Analog Output ADMP401 Data Sheet FUNCTIONAL BLOCK DIAGRAM Smartphones and feature phones Teleconferencing systems Digital video cameras Bluetooth headsets Video phones Tablets GENERAL DESCRIPTION ADMP401 OUTPUT POWER VDD GND Figure 1. LE APPLICATIONS OUTPUT AMPLIFIER TE 4.72 mm × 3.76 mm × 1.0 mm surface-mount package High SNR of 62 dBA Sensitivity of −42 dBV Flat frequency response from 100 Hz to 15 kHz Low current consumption of <250 μA Single-ended analog output High PSR of 70 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant 07712-001 FEATURES enables long battery life for portable applications. The ADMP401 complies with the TIA-920 standard, Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones. The ADMP401 is available in a thin, 4.72 mm × 3.76 mm × 1.0 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP401 is halide free. O B SO The ADMP4011 is a high quality, high performance, low power, analog output, bottom-ported omnidirectional MEMS microphone. The ADMP401 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP401 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP401 has a high SNR and flat wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption 1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved. ADMP401 Data Sheet TABLE OF CONTENTS Connecting the ADMP401 to a Codec ......................................8 Applications ....................................................................................... 1 Connecting the ADMP401 to an Op Amp Gain Stage ............8 Functional Block Diagram .............................................................. 1 Supporting Documents ................................................................8 General Description ......................................................................... 1 Handling Instructions .......................................................................9 Revision History ............................................................................... 2 Pick-and-Place Equipment ..........................................................9 Specifications..................................................................................... 3 Reflow Solder .................................................................................9 Absolute Maximum Ratings ............................................................ 4 Board Wash ....................................................................................9 ESD Caution .................................................................................. 4 Reliability Specifications ................................................................ 10 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 11 Printed Circuit Board (PCB) Land Pattern Layout ...................... 6 Ordering Guide .......................................................................... 11 TE Features .............................................................................................. 1 Typical Performance Characteristics ............................................. 7 Applications Information ................................................................ 8 LE REVISION HISTORY 8/11—Rev. B to Rev. C Changes to Figure 1 ...........................................................................1 Changes to Table 3.............................................................................4 Removed Terminal Side Down from Figure 3 ...............................5 Changes to Bullet 2 in Pick-and-Place Equipment Section .........9 Changes to Ordering Guide .......................................................... 11 B SO 7/12—Rev. D to Rev. E Changes to Features Section, General Description Section, and Page 1 Layout .................................................................................... 1 Add Note 1......................................................................................... 1 Changes to Frequency Response Parameter, Table 1 and Powers Supply Rejection Parameter, Table 1 .............................................. 3 Changes to Temperature Range Parameter, Table 2..................... 4 Changes to Figure 6, Figure 7, and Figure 8.................................. 7 Changes to Applications Information Section and Figure 10..... 8 Added Supporting Documents Section, Application Notes Section, Circuit Notes Section, and Evaluation Board User Guides Section .................................................................................. 8 Changes to THB Description Column, Table 5 and Temperature Cycle Column, Table 5 ................................................................... 10 Changes to Ordering Guide .......................................................... 11 O 1/12—Rev. C to Rev. D Updated Outline Dimensions ....................................................... 11 Changes to Figure 12 ...................................................................... 11 Added Figure 13.............................................................................. 11 Change to Ordering Guide ............................................................ 11 12/10—Rev. A to Rev. B Changes to Applications and General Description Sections .......1 Changes to Table 1.............................................................................3 8/10—Rev. 0 to Rev. A Changes to Frequency Response Parameter, Table 1 ....................3 Changes to Supply Voltage Parameter, Table 2 ..............................4 Changes to Applications Information Section, Figure 9, and Figure 10 .............................................................................................8 Updated Outline Dimensions ....................................................... 11 4/10—Revision 0: Initial Version Rev. E | Page 2 of 12 Data Sheet ADMP401 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Symbol Total Harmonic Distortion Power Supply Rejection Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit THD PSR Min 1 kHz, 94 dB SPL −45 SNR EIN ZOUT Typ Omni −42 62 32 88 60 15 −3/+2 TE B SO See Figure 6 and Figure 7. LE VDD IS Derived from EIN and maximum acoustic input Low frequency, −3 dB point High frequency, −3 dB point Deviation limits from flat response within pass band 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak O 1 Test Conditions/Comments Rev. E | Page 3 of 12 Max Unit −39 dBV dBA dBA SPL dB Hz kHz dB % dB dB SPL 3 70 120 1.5 200 0.8 90 3.3 250 V µA Ω V µA ADMP401 Data Sheet ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 2. Temperature Range Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CRITICAL ZONE TL TO TP LE tP TP TE Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration TSMAX TSMIN tL tS RAMP-DOWN B SO PREHEAT 07712-002 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 2. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits O Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C (t25°C) to Peak Temperature Rev. E | Page 4 of 12 Sn-Pb 1.25°C/sec maximum Pb Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C +3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 min maximum 100°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 245°C +0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 min maximum Data Sheet ADMP401 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND 3 GND 6 VDD 4 5 BOTTOM VIEW Not to Scale 07712-003 GND Table 4. Pin Function Descriptions Description Analog Output Signal Ground Ground Ground Power Supply Ground LE Mnemonic OUTPUT GND GND GND VDD GND O B SO Pin No. 1 2 3 4 5 6 TE Figure 3. Pin Configuration (Bottom View) Rev. E | Page 5 of 12 ADMP401 Data Sheet PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT A suggested solder paste stencil pattern layout is shown in Figure 5. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP401 should have a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 4. Take care to avoid applying solder paste to the sound hole in the PCB. 2.62 TE ø0.90 (3×) ø1.10 ø1.68 2.54 2.40 1.20 1.27 07712-004 LE ø0.70 (2×) 0.79 B SO Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm) 1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×) 0.649mm DIA. (2×) 0.85mm DIA. (3×) 2.4mm 1.27mm 2.62mm 3.41mm Figure 5. Suggested Solder Paste Stencil Pattern Layout Rev. E | Page 6 of 12 07712-005 O 1.2mm 2.54mm Data Sheet ADMP401 TYPICAL PERFORMANCE CHARACTERISTICS 0 10 8 –10 6 –30 2 PSR (dB) SENSITIVITY (dB) –20 4 0 –2 –40 –50 –4 –60 TE –6 100 10k 1k FREQUENCY (Hz) –80 100 07712-006 –10 50 Figure 6. Frequency Response Mask LE 0 –20 10 100 1k 10k FREQUENCY (Hz) 07712-007 –10 Figure 8. Typical Power Supply Rejection vs. Frequency B SO AMPLITUDE (dB) 10 1k FREQUENCY (Hz) O Figure 7. Typical Frequency Response (Measured) Rev. E | Page 7 of 12 10k 07712-008 –70 –8 ADMP401 Data Sheet APPLICATIONS INFORMATION CONNECTING THE ADMP401 TO AN OP AMP GAIN STAGE GAIN = (R1 + R2)/R1 0.1µF R1 VDD ADMP401 R2 VREF 1µF MINIMUM VO OUTPUT 10kΩ fC = 1/(2π × C × R) ADA4897-1 GND VREF where R is the input impedance of the codec. Figure 10. ADMP401 Connected to the ADA4897-1 Op Amp TE A minimum value of 2.2 µF is recommended in Figure 9 because the input impedance of the ADAU1361/ADAU1761 can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 10 shows the ADMP401 connected to the ADA4897-1 op amp configured as a noninverting preamplifier. 07712-010 The ADMP401 output can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed close to the ADMP401 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. This capacitor creates a highpass filter with a corner frequency at SUPPORTING DOCUMENTS Application Notes AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone CONNECTING THE ADMP401 TO A CODEC LE AN-1112, Microphone Specifications Explained MICBIAS AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress 0.1µF ADAU1761 VDD OR ADMP401 ADAU1361 AN-1140, Microphone Array Beamforming LINN Circuit Notes B SO OUTPUT 2.2µF MINIMUM GND CM 07712-009 LINP Figure 9. ADMP401 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec CN-0207, High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec CN-0262, Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating Evaluation Board User Guides UG-126, EVAL-ADMP401Z: Bottom-Ported Analog Output MEMS Microphone Evaluation Board O UG-278, EVAL-ADMP401Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board Rev. E | Page 8 of 12 Data Sheet ADMP401 HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste that is used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 3. • • BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. O B SO LE • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. TE • Rev. E | Page 9 of 12 ADMP401 Data Sheet RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value. Table 5. TE Description −40°C, 500 hours, powered +125°C, 500 hours, powered +85°C/85% relative humidity, 500 hours, powered −40°C/+125°C, one cycle per hour, 1000 cycles +150°C, 500 hours −40°C, 500 hours All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV O B SO LE Stress Test Low Temperature Operating Life High Temperature Operating Life THB Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Rev. E | Page 10 of 12 Data Sheet ADMP401 OUTLINE DIMENSIONS 3.30 REF REFERENCE CORNER 4.10 REF PIN 1 3.86 3.76 3.66 1 1.10 DIA. 0.61 REF 0.70 DIA. (PINS 2, 4) BOTTOM VIEW TE 0.73 REF 2.54 BSC 1.27 BSC 0.25 DIA. (THRU HOLE) 4 5 0.68 REF SIDE VIEW 1.68 DIA. 6 1.20 BSC TOP VIEW 1.10 1.00 0.90 2 3 2.40 BSC 3.14 REF 0.79 BSC 2.62 BSC 0.90 DIA. (PINS 1, 5, 6) 0.24 REF 12-12-2011-C 4.82 4.72 4.62 LE Figure 11. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 4.72 mm × 3.76 mm Body (CE-6-1) Dimensions shown in millimeters B SO DIRECTION OF FEED 07712-011 PIN 1 Figure 12. Microphone Orientation in Tape Until Date Code 1213 DIRECTION OF FEED 07712-012 O PIN 1 Figure 13. Microphone Orientation in Tape Starting with Date Code 1213 ORDERING GUIDE Model 1 ADMP401ACEZ-RL ADMP401ACEZ-RL7 EVAL-ADMP401Z EVAL-ADMP401Z-FLEX 1 2 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 6-Terminal LGA_CAV, 13” Tape and Reel 6-Terminal LGA_CAV, 7” Tape and Reel Evaluation Board Evaluation Board Z = RoHS Compliant Part. The CE-6-1 package option is halide free. Rev. E | Page 11 of 12 Package Option 2 CE-6-1 CE-6-1 Ordering Quantity 4,500 1,000 ADMP401 Data Sheet O B SO LE TE NOTES ©2010–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. 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