FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20096 Generic Copy Issue Date: 28-Jun-2013 TITLE: Assembly Qualification of uDFN and uQFN Analog Switch Family at ATP3 for expansion. PROPOSED FIRST SHIP DATE: 28-Sep-2013 AFFECTED CHANGE CATEGORY(S): Assembly Location AmKor-P3 (ATP-3) FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or [email protected]. SAMPLES: Contact your local ON Semiconductor Sales Office or [email protected] ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or [email protected]. NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is pleased to announce additional assembly capacity at AmKor-Philipines. The device family is Analog Switches which are currently produced at ON Semiconductor’s Seremban Malaysia location and subcontractor UTAC Bangkok Thailand location. The Analog Switch product family will continue to be assembled in qualified locations as the qualification of AmKor Philipines is for additional capacity. No changes to packaging will occur as a result of this assembly qualification. Upon expiration (or approval) of this Final PCN, devices may be supplied by either assembly location to include AmKor Philipines, ON Semiconductor’s Seremban Malaysia location and UTAC Bangkok Thailand. Issue Date: 28-Jun-2013 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20096 RELIABILITY DATA SUMMARY: Reliability Test Results: The Analog Switch Products assembled at AmKor Philipines have been qualified based on the following test results: Test Conditions Results High Temp Op Life Ta= +125C; 504hrs, 1008hrs DPA 0/80 3 lots High Temp Storage Ta=150C; 504hrs, 1008hrs, 2016hrs 0/80 3 lots Preconditioning + Temperature Cycling MSL1 @ 260C; -65C/ +150C; Air to Air; 500cy, 1000Cy DPA CDPA 0/80 3 lots Preconditioning + Highly Accelerated Stress Test MSL @ 260C, 130C/ 85% RH/ PSIG=18.8 bias 96hrs 0/80 3 lots Preconditioning + Unbiased Highly Accelerated Stress Test MSL @ 260C, 130C/ 85% RH/ PSIG=18.8 no bias 96hrs 0/80 3 lots Ball Shear Test CPK > 1.33 on 30 Bonds from 5 units Pass Wire Pull Strength Cpk > 1.67 on 30 Bonds from 5 units Pass Electrical Distribution 3Temps -40°, 25°, 80°C. Cpk > 1.67 Pass ELECTRICAL CHARACTERISTIC SUMMARY: Electrical characterization test data has been obtained on ATP3 assembled product. No significant changes in part performance as compared to the existing SBN or UTAC assembled product were observed. Electrical characteristics meet or exceed the device specification. CHANGED PART IDENTIFICATION: Devices with date codes of 2013 work week31 or later may be sourced from either assembly location ATP3, SBN or UTAC. Issue Date: 28-Jun-2013 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20096 List of affected General Parts: NLAS4717EPMTR2G NLAS5123MNR2G NLAS5123MUR2G NLAS5124MUR2G NLAS5157MUTCG NLAS5213AMUTAG NLAS5213BMUTAG NLAS52231MUR2G NLAS5223AMNR2G NLAS5223BLMNR2G NLAS5223BMUR2G NLAS5223MNR2G NLAS7213MUTBG NLAS7222AMTR2G NLAS7222AMUR2G NLAS7222AMUTAG NLAS7222BMUTAG NLAS7222BMUTBG NLAS7222CMUTBG NLAS7223BMUTBG NLAS7223CMUTBG NLAS7242MUTBG NLAS9031MTR2G NLAS9051MNR2G Issue Date: 28-Jun-2013 Rev. 06-Jan-2010 Page 3 of 3