FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 26 Jun 2008 SUBJECT: ON Semiconductor Final Product/Process Change Notification # 16127 TITLE: Qualification of FlipChip International (FCI) for Flipchip Products PROPOSED FIRST SHIP DATE: 26 Sep 2008 AFFECTED CHANGE CATEGORY(S): Subcontractor Assembly Site AFFECTED PRODUCT DIVISION(S): DCG FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Angela Tam<[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available upon request Contact your local ON Semiconductor Sales Office or Laura Rivers <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is a Final Product Change Notification announcing the qualification of FlipChip International (FCI) for the listed flipchip products. FCI currently manufactures other bump products for ON Semiconductor. FCI is a fully certified ISO9001-2000 supplier. There will be no change in the wafer/die source therefore; no electrical performance or specifications will be changed. This change is classified as a capacity expansion since the products listed below may be bumped at either FCI or the existing ASE qualified site once the final PCN expires. Issue Date: 26 Jun 2008 Rev.14 Jun 2007 Page 1 of 3 Final Product/Process Change Notification # 16127 RELIABILITY DATA SUMMARY: Reliability Test Results: The qualification for FlipChip International (FCI) facility located in Phoenix, Arizona as an additional source for bump processing of micro-bump devices was previously qualified per FPCN# 15016, issued 14-Oct-2005; results as shown below. This FPCN is extending that qualification to additional devices in the same technology family, with additional Temp Cycle testing. FCI Reliability Summary: Temperature Cycle Tests (in all cases, TA=-40C to +125C, 500cycles): Device Lot Result 1. NCP2890AFCT2G A 0/90 2. NCP2890AFCT2G B 0/90 3. NCP2890AFCT2G C 0/90 4. NCP2890AFCT2 A 0/90 5. NCP2890AFCT2 B 0/90 6. NUF4105FCT1 A 0/90 7. NUF6105FCT1 A 0/90 8. NUF6106FCT1 A 0/90 Ball Shear Tests (in-line monitoring): Device Lot Result 1. NCP2890AFCT2G A 0/5 2. NCP2890AFCT2 A 0/5 3. NUF4105FCT1 A 0/5 4. NUF6105FCT1 A 0/5 5. NUF6106FCT1 A 0/5 For Additional Products covered by this FPCN: Temperature Cycle Tests (in all cases, TA=-40C to +125C, 500cycles): Device Lot Result 1. NUF4105FCT1 A 0/90 2. NUF6105FCT1 A 0/90 3. NUF6106FCT1 A 0/90 4. NUF2441FCT1G A 0/80 5. NUF2441FCT1G B 0/80 6. NUF2441FCT1G C 0/80 7. NUF9001FCT1G A 0/80 8. NUF9001FCT1G B 0/80 9. NUF9001FCT1G C 0/80 ELECTRICAL CHARACTERISTIC SUMMARY: N/A CHANGED PART IDENTIFICATION: Devices marked with date code 837 or later may be bumped at either qualified site (FCI or ASE) Issue Date: 26 Jun 2008 Rev.14 Jun 2007 Page 2 of 3 Final Product/Process Change Notification # FPCN16127 AFFECTED DEVICE LIST NUF2222FCT1G NUF2441FCT1G NUF3101FCT1G NUF4107FCT1G NUF6105FCT1G NUF6106FCT1G NUF9001FCT1G NUF9002FCT1G NUP4103FCT1G Issue Date: 26 Jun 2008 Rev.14 Jun 2007 Page 3 of 3