FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646 Generic Copy Issue Date: 28-Jun-2011 TITLE: Pre Plated Frame Qualification for DFN12L 3.0 X 1.3 X 0.85 mm. PROPOSED FIRST SHIP DATE: 1-Oct-2011 AFFECTED CHANGE CATEGORY(S): Leadframe material FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Eben Lim <[email protected] > SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Redentor Canoza <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is notifying customers of its qualification of Pre-Plated leadframe for package DFN 12Lead 3*1.35*0.85MM PBF assembled in Seremban site. The purpose of qualification is to enhance the robustness of plating process. Pre-plated Leadframe provides a predictable and well characterized plating and thickness response. Lead finish change from JEDEC category e3 – 100% matte Sn to category e4- Precious metals (Gold-Silver Alloy). Reliability qualification and electrical characterization have been performed. There will be no change to the devices data sheet or functionalities. Issue Date: 28-Jun-2011 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646 RELIABILITY DATA SUMMARY: Reliability Test Results: Qualification Vehicles chosen for this qualification: NUF6401MNT1G NUF6400MNTBG NUF6401MNT1G Test: HTRB TC+PC Precondition Autoclave+PC HAST+PC SAT + PC SD RSH Conditions: TA=150C, 80% Rated Voltage Ta= -65 C to 150 C, MSL1@ 260C , 3 X IR at 260 C Ta=121C RH=100% ~15 psig Temp = 130C, RH=85%, 80% of rated Voltage pre & post PC Solderability Ta=260C, 10 sec Interval: 1008 hrs 1000 cyc 96 hrs 96 hrs Quantity 0/80 0/80 0/240 0/80 0/80 0/10 0/15 0/30 NUF6400MNTBG Test: HTRB TC+PC Precondition Autoclave+PC HAST+PC SAT + PC SD RSH Conditions: TA=150C, 80% Rated Voltage Ta= -65 C to 150 C, MSL1@ 260C , 3 X IR at 260 C Ta=121C RH=100% ~15 psig Temp = 130C, RH=85%, 80% of rated Voltage pre & post PC Solderability Ta=260C, 10 sec Interval: 1008 hrs 1000 cyc 96 hrs 96 hrs Quantity 0/160 0/160 0/480 0/160 0/160 0/20 0/30 0/60 ELECTRICAL CHARACTERISTIC SUMMARY: Datasheet specifications and product electrical performance will remain unchanged Characterization of each qual vehicle device will be performed to the following requirements: 1) ESD performance (HBM, MM) 2) Three temperature characterization CHANGED PART IDENTIFICATION: Devices with date code of 1140, representing Work Week 40, 2011 or newer may be built using preplated leadframe from ON Semiconductor Seremban. Issue Date: 28-Jun-2011 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646 List of affected General Parts: NUF6107MNTBG NUF6401MNT1G NUF6410MNT1G NUF6406MNT1G NUF6400MNTBG NUF6402MNT1G Issue Date: 28-Jun-2011 Rev. 06-Jan-2010 Page 3 of 3