FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16727A Generic Copy Issue Date: 17-Nov-2011 TITLE: Copper Wire for SOIC and TSSOP packages in Carmona, Philippines PROPOSED FIRST SHIP DATE: 17-Feb-2012 AFFECTED CHANGE CATEGORY(S): Assembly Process FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Shannon Riggs<[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office, Shannon Riggs <[email protected]> ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Ken Fergus<[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wirebond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippine assembly location. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles. Issue Date: 17-Nov-2011 Rev. 06-Jan-2010 Page 1 of 2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16727A RELIABILITY DATA SUMMARY: Reliability Test Results: # 1 Test Prep A1 PC A2 PC -HAST A3 A4 PC-TC PC-AC Name Test Conditions Sample preparation and initial part testing Done Done MSL 1 260 Test at R and Hot 0/240 0/240 0/240 0/240 0/240 TA= +130°C, RH = 85%, PSIG= 18.8, bias c = 0, Room, Hot 96 hours 0/80 0/80 0/80 0/80 144 hours 192 hours 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 500 0/80 0/80 0/80 0/80 1000cyc 0/78 0/80 0/68 0/78 -65/+150 C 121C/100%RH,15psi g c = 0, Room, Hot c = 0, Room 150C at 1008hrs c = 0, Room, Hot B1 HTOL High Temp Op Life TA = 150°C for 1008hrs c = 0, Room, Hot Solderability (>95% coverage) Resistance to solder heat Control Done High Temperature Storage Life SD Lot C Done HTSL RSH Lot B Initial Electrical A6 C3 96 hours 0/80 0/80 0/80 0/80 192 hours 240 hours 0/80 0/80 0/78 0/78 0/78 0/78 0/78 0/ 504 hours 1008 hours 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 504 hours 0/80 0/80 0/80 0/80 1008 hours 0/80 0/80 0/80 0/80 10 units per lot Pass 0/10 0/10 0/10 0/10 Test at R Pass 0/10 0/10 0/10 0/10 JESD22 – B106 260°C Immersion ELECTRICAL CHARACTERISTIC SUMMARY: There is no electrical characterization difference in products assembled with copper wire. Electrical data is available upon request. CHANGED PART IDENTIFICATION: Products affected on this FPCN will have part number date code greater than WW7, 2012. List of affected General Parts: MC33172DR2GH NCV33072DR2G NCV33074DR2G NCV33174DTBR2G NCV833DR2G SA33072DR2G Issue Date: 17-Nov-2011 (rej/ss) Lot A --- Preconditioned Temperature Cycle Preconditioned Autoclave/Unbiased HAST (rej/ ss) (rej/ ss) Read Point Various Preconditioning Test (Test@Room/hot) SMD only; Mositure preconditioning for THB/HAST, AC/UHAST, TC; Peak reflow Temp = 260C Preconditioned Highly accelerated stress test End Point Req’s Test Results (rej/ ss) Rev. 06-Jan-2010 Page 2 of 2