April 2009 LTM9003 108LD 15.00mm X 11.25mm X 2.32mm (TABLE OF MATERIAL DECLARATION) The LTM9003 is RoHS compliant per EU RoHS Directive 2003/95/EC. No. 1 2 3 4 5 6 7 8 Note: It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Material Mass Materials Analysis Part Name Material Name Materials Analysis (element) CAS Number Weight (gram) (gram) (weight %) Barium Compounds 7727-43-7 0.00299 1.50000 Substrate Circuit Board 0.1992 Filler Substances (Silica 0.07951 39.91457 Crystalline) Copper Metal 7440-50-8 0.11155 56.00000 Copper Compounds 1328-53-6 0.00004 0.01800 Ecotoxic substances 7439-92-1 0.00000 0.00043 Gold metal or alloy 7440-57-5 0.00092 0.46000 Nickel 7440-02-0 0.00418 2.10000 Zinc 7440-66-6 0.00001 0.00700 Alloy 0.0103 Solder Paste Sn 7440-31-5 0.00980 95.00000 Sb 7440-36-0 0.00052 5.00000 Die attach Epoxy Resin 0.0034 epoxy _ 0.00340 100.00000 adhesive Capacitor 0.05719 88.23511 Passive/Active 0.0648 Resistor 0.00181 2.78618 Components Inductor 0.00582 8.97717 Diode 0.00000 0.00000 Active Ics Silicon 0.0038 Silicon 7440-21-3 0.00380 100.00000 Wire Gold 0.0017 Au 7440-57-5 0.00171 99.99000 LT5557EUF see LTC web site for 0.0370 see LTC web site _ 0.03700 100.00000 Encapsulation Epoxy Resin 0.6276 Fused Silica 60676-86-0 0.48451 77.20000 Epoxy Resin 0.05586 8.90000 Phenol Resin 0.05586 8.90000 Crytalline Silica 14808-60-7 0.01883 3.00000 Carbon Black 1333-86-4 0.00314 0.50000 Metal Hydroxide 0.00941 1.50000 Total Package Weight 0.9479 Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts