528AB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−89, 5 LEAD
CASE 528AB−01
ISSUE O
DATE 23 NOV 2009
SCALE 2:1
D
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE
MEASURED AT DATUM PLANE C.
H
DIM
A
b
b1
c
D
D2
E
e
H
L
L2
L3
L4
L5
1
TOP VIEW
c
A
0.10 C
C
SIDE VIEW
e
b1
L
GENERIC
MARKING DIAGRAM*
e
b
MILLIMETERS
MIN
MAX
1.40
1.60
0.32
0.52
0.37
0.57
0.30
0.50
4.40
4.60
1.40
1.80
2.40
2.60
1.40
1.60
4.25
4.45
1.10
1.50
0.80
1.20
0.95
1.35
0.65
1.05
0.20
0.60
L2
1
1
2
3
XXX
XMM
L5
5
L3
4
XXXX
MM
G
D2
L4
BOTTOM VIEW
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
4X
= Specific Device Code
= Lot Number
= Pb−Free Package
0.57
1.75
2.79
1.50
0.45
4.65
1.30
1.65
1
2X
2X
0.62
1.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON47037E
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOT−89, 5 LEAD
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON47037E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
DATE
23 NOV 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 01O
Case Outline Number:
528AB