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Datasheet
Constant Current LED Drivers
50V 200mA
1ch Source Driver for Automotive
BD8372HFP-M BD8372EFJ-M
General Description
Key Specifications




BD8372HFP-M and BD8372EFJ-M are LED source
drivers capable of withstanding high input voltage (50V
MAX). The constant current output is set by either of
two external resistors. It has built-in LED open/short
protection, external resistance open/short protection
and overvoltage protection that can achieve high
reliability. It is possible to control all LEDs together and
turn OFF even if LED causes short/open in a certain
row when driving two or more LEDs by using multiple
ICs.
Input Voltage Range:
Max Output Current:
Output Current Accuracy:
Operating Temperature Range:
Packages
HRP7
HTSOP-J8
5.5V to 40V
200mA(MAX)
±8%(Max)
-40°C to +125°C
W (Typ) x D (Typ) x H (Max)
9.395mm x 10.540mm x 2.005mm
4.90mm x 6.00mm x 1.00mm
Features






Variable form Constant- Current Source
H/L Current Setting Switch Control
LED Open/Short Protection Circuit Integrated
ISET Open/Short Protection Circuit Integrated
Overvoltage Mute and Temperature Protection
Function Integrated
Abnormal Output Detection and Output Functions
(PBUS)
HRP7
Applications
For automotive (Rear lamp, Interior light, etc.).
HTSOP-J8
Basic Application Circuit
VIN
IOUT
BD8372HFP-M
BD8372EFJ-M
STOP
PBUS
FIN
GND
ISETL
ISETH
Figure 1. Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit
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Pin Configurations
HTSOP-J8
(TOP VIEW)
HRP7
(TOP VIEW)
Figure 2. HRP7 Package Pin Configuration
8
7
6
5
1
2
3
4
Figure 3. HTSOP-J8 Package Pin Configuration
Pin Descriptions
HRP7
HTSOP-J8
Pin No.
Pin Name
1
STOP
2
Description
Pin No.
Pin Name
Input terminal for Brake lamp
1
VIN
PBUS
Error detection I/O terminal
2
IOUT
Current output terminal
3
ISETL
Current setting terminal (L mode)
3
GND
GND
4
GND
GND
4
GND
GND
5
ISETH
Current setting terminal (H mode)
5
STOP
Input terminal for Brake lamp
6
VIN
Power supply input
6
PBUS
Error detection I/O terminal
7
IOUT
Current output terminal
7
ISETL
Current setting terminal (L mode)
8
ISETH
Current setting terminal (H mode)
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Description
Power supply input
TSZ02201-0T1T0C700150-1-2
09.Dec.2015 Rev.001
BD8372HFP-M BD8372EFJ-M
Block Diagram
IOUT
VIN
VREF
STOP
H/L MODE
SET
Current
CONTROL
VREF
LED OPEN
DET
VIN
mode
0.6V
VIN-0.2V
PBUS
PROTECT
led open
VREF
led short
led off
Iref_l
Iref_h
Iref_l
0.8V
Iref_h
GND
0.8V
ISETL
ISETH
Figure 4. Block Diagram
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +50
V
VSTOP, VIOUT, VPBUS
-0.3 to VIN+0.3
V
VISETH, VISETL
-0.3 to +7
V
Power Supply Voltage
STOP, IOUT, PBUS Terminal
ISETH, ISETL Terminal
Power Consumption
HRP7
2.3 (Note 1)
HTSOP-J8
1.1 (Note 2)
Pd
W
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
IIOUT
200
mA
Junction Temperature
IOUT Output Maximum Current
(Note 1) HRP7
IC mounted on glass epoxy 2-layer board area 15mmx15mm of the back copper foil, measuring 70mmx70mmx1.6mm.
Pd decreased at 18.4mw/°C for temperatures above Ta=25°C.
(Note 2) HTSOP-J8
IC mounted on glass epoxy 2-layer board area 15mmx15mm of the back copper foil, measuring 70mmx70mmx1.6mm.
Pd decreased at 8.8mW/°C for temperatures above Ta=25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to +125°C)
(Please set after considering power consumption for the power-supply voltage.)
Rating
Parameter
Power Supply Voltage
Symbol
Unit
Conditions
40
V
-
-
100
kΩ
STOP=H
10
-
100
kΩ
STOP=L
0.1
-
-
μF
Min
Typ
Max
VIN
5.5
13
RISETH
10
RISETL
CIOUT
Current Setting Resistor
Minimum Capacitor
connecting IOUT terminal
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Electrical Characteristics
(Unless otherwise specified, Ta=-40°C to 125°C, VIN=13V, RISETL=RISETH=40kΩ, RPBUS=10kΩ)
Limit
Parameter
Symbol
Circuit Current
IIN
IOUT Output Current H
Unit
Min
Typ
Max
-
2.9
5
mA
48.5
50
51.5
mA
46
50
54
mA
4.85
5
5.15
mA
4.6
5
5.4
mA
IOUT_H
IOUT Output Current L
IOUT_L
Conditions
50mA setting (ISET=40kΩ)
STOP=High, Ta=25°C
50mA setting (ISET=40kΩ)
STOP=High, Ta=-40°C to +125°C
5mA setting (ISET=40kΩ)
STOP=Low, Ta=25°C
5mA setting (ISET=40kΩ)
STOP=Low, Ta=-40°C to +125°C
200mA setting(ISET=10kΩ)
STOP=High
20mA setting(ISET=10kΩ)
STOP=Low
IOUT Drop Voltage H
VDRH_IOUT
-
0.7
1.2
V
IOUT Drop Voltage L
VDRL_IOUT
-
0.5
0.7
V
IOUT OFF Current
IIOUT_OFF
-
-
1
µA
VIOUT=2V, PBUS=L, Ta=25°C
IIOUT_SHORT
-
-
40
µA
VIOUT=0V
VISET
-
0.8
-
V
At ISETL or ISETH pins
ISET Short Detection Resistor
RISET_SHORT
-
5.1k
7.5k
Ω
At ISETL or ISETH pins
ISET Open Detection Resistor
RISET_OPEN
125k
400k
-
Ω
At ISETL or ISETH pins
IOUT LED OPEN Detection
VIOUT_OPEN
IOUT LED Short Detection
VIOUT_SHORT
0.2
0.6
1.0
V
STOP Input Voltage H
VIH_STOP
4.0
-
VIN+0.2
V
STOP Input Voltage L
VIL_STOP
GND
-
1.0
V
STOP Input Current
VIN_STOP
-
40
100
µA
PBUS Input Voltage H
VIH_PBUS
4.0
-
VIN+0.2
V
PBUS Input Voltage L
VIL_PBUS
GND
-
2.0
V
PBUS Low Voltage
VOL_PBUS
-
-
1.5
V
IPBUS=20mA
PBUS Input Current
IIN_PBUS
-
38
100
µA
VPBUS=13V
IN Under Voltage Open
Detection Mask Voltage
VUVLO_IOPEN
7.5
8.0
8.5
V
IN Over Voltage Mute Current
VIN_OVPMUTE
16
19
24
V
IOUT Current at GND Short
ISET Terminal Voltage
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VIN-0.3 VIN-0.2 VIN-0.1
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V
VSTOP=13V
200mA setting (ISET=10kΩ)
STOP=High
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09.Dec.2015 Rev.001
BD8372HFP-M BD8372EFJ-M
Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta=25°C, VIN=13V)
Figure 6. IOUT vs RISETH
(STOP=High)
Figure 5. IOUT vs RISETL
(STOP=Low)
VIOUT=3V
VIOUT=3V
RISETL=10kΩ
RISETH=10kΩ
RISETL=20kΩ
RISETH=20kΩ
RISETL=40kΩ
RISETH=40kΩ
Figure 7. IOUT vs VIN
(STOP=Low)
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Figure 8. IOUT vs VIN
(STOP=High)
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Typical Performance Curves (Reference Data) - continued
(Unless otherwise specified Ta=25°C, VIN=13V)
Figure 9. IOUT vs Ta
(STOP=Low)
Figure 10. IOUT vs Ta
(STOP=High)
Figure 12. ΔIOUT vs RISETH
(STOP=High)
Figure 11. ΔIOUT vs RISETL
(STOP=Low)
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Timing Chart
VIN
VIN
IOUT
Current
Control
STOP
STOP
PBUS
H/Lmode
Switch
PBUS
LED
SHORT
LED
OPEN
ISETL ISETH
LED
OPEN
LED
SHORT
VVIN
IN
VIH_STOP
VIH_STOP
STOP VIL_STOP
VIL_STOP
IIOUTH
IIOUTH
VIOUT
VIOUT
IIOUTL
IIOUTL
ISETL
ISETL
ISETH
ISETH
PBUS
Figure 13. Timing Chart
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Function Description
(Unless otherwise specified, Ta=25°C, VIN=13V, RISETL=RISETH=40kΩ, the numerical value in the table are TYP values.)
1.
Table for Operation
STOP
VIOUT
RISETL
RISETH
MODE
IOUT
PBUS
L
2V<VIOUT
<VIN-0.7V(Max)
10kΩ≤RISETL
≤100kΩ
-
L mode normal
operation
2mA to 20mA
Hi-Z
H
2V<VIOUT
<VIN-1.2V(Max)
-
10kΩ≤RISETH
≤100kΩ
H mode normal
operation
20mA to 200mA
Hi-Z
L/H
VIOUT≤0.6V(Typ)
-
-
Output short
40µA(Max)
LOW output
L/H
VIOUT≥
VIN-0.2V(Typ)
-
-
Output open
1µA(Max)
LOW output
L
-
RISETL<7.5kΩ(Max)
-
ISETL short
1µA(Max)
LOW output
L
-
RISETL>125kΩ(Min)
-
ISETL open
1µA(Max)
LOW output
H
-
-
RISETH<7.5kΩ(Max)
ISETH short
1µA(Max)
LOW output
H
-
-
RISETH>125kΩ(Min)
ISETH open
1µA(Max)
LOW output
L
2V<VIOUT
<VIN-0.7V(Max)
10kΩ≤RISETL
≤100kΩ
-
PBUS control OFF
1µA(Max)
LOW input
H
2V<VIOUT
<VIN-1.2V(Max)
-
10kΩ≤RISETH
≤100kΩ
PBUS control OFF
1µA(Max)
LOW input
Protection Mode Operation Voltage( The numerical value are typical )
VIN
LED open
LED short
ISET open
ISET short
PBUS
Overvoltage
protection
5.5V<VIN≤8V
×
○
○
○
○
×
8V≤VIN≤19V
○
○
○
○
○
×
19V≤VIN
○
○
○
○
○
○
○ : Protection mode ON
× : Protection mode OFF
The LED open function is masked with VIN≤8V.
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2.
Method of Setting Current
The IC regulates the voltage at ISETL/ISETH to VISET (0.8V typ) across the external resistor to set IOUT.
Then IOUT is set by setting STOP High or Low.
+B
VIN
IOUT
Current
Control
STOP
H/Lmode
Switch
PBUS
LED
OPEN
Iref_l
Iref_l
GND
ISETL
0.8V(typ)
ISETH
0.8V(typ)
RISETL
RISETH
IOUT Output
vs ISET
Connect
Resistance
IOUT
OutputCurrent
current VS
ISET
connect
resistance
1.0000
short protection
open protection
0.1000
IOUT[A]
IOUT[A]
H mo de
L mo de
0.0100
R_ISET setting range
0.0010
1.00E+03
1.00E+04
1.00E+05
1.00E+06
RISET[Ω] ]
RISET[Ω
Figure 14. Current setting method
 L mode (STOP=Low)
I IOUT 
 H mode (STOP=High)
0.8V
 250A
RISETL
exp) R ISETL  1.6k I I OUT 
I IOUT 
0.8V
 250  5mA
40k
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0.8V
 2500A
RISETH
exp) R ISETH  40k I I OUT 
10/25
0.8V
 2500  50mA
40k
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BD8372HFP-M BD8372EFJ-M
3.
Current Control at Output Saturation
When VIOUT (=VF) - VIN > 0.5V (TYP), the LED current IF is decreased to a set current 20µA (TYP). Therefore, VF
decreases due to the decrease in the current. Open detection can be prevented by keeping V IOUT ≤ VIN-0.5V. The
current controlled to IOUT<20µA and the LED current IF must be set so that VF does not exceed VUVLO_OPEN by 20µA.
If VIN < VUVLO_OPEN this function is not active.
VVIN
IN
V
IOUT_OPEN
VIOUT_OPEN
0.5V
VIOUT
>V
IOUT_OPEN
VVIOUT>VIOUT_OPEN
>V
IOUT
IOUT_OPEN
However,
masked
However,open
opendetection
detection is masked
byby
VINVIN<VUVLO_OPEN.
<VUVLO_OPEN
VVIN-VDRH_IOUT
IN-VDRH_IOUT
VVIOUT(=VF)
IOUT(=VF)
VVUVLO_OPEN
UVLO_OPEN
0
Setting current
IIIOUT(=IF)
IOUT(=IF)
LED VVF_IF
Characteristic
LED
F_IF Characteristic
0
The current
current decreases
decreases by
The
by VIOUT>VIN-VDR_IOUT
VIOUT>VIN-VDR_IOUT
fora aset
setcurrent.
current.
to
IIOUT=20uA(max)
IOUT=20µA (Max)
To keep
VIOUT ≤ VIN-0.5V, the current is controlled.
controlled to IOUT=20µA (Max)
keep VIOUT≦VIN-0.4V,
※To IOUT=20uA(max)
VIN
Current
control
-
LED_OPEN
VIN-0.2V
+
IOUT
+
VIN0.5V
Current limit
ISET
Figure 15. Current Control at Output Saturation
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4.
PROTECT BUS (PBUS)
PBUS is an I/O terminal that outputs any detected error by switching PBUS from Hi-Z (Note 1) to Low. The output current
can also be turned OFF by pulling the PBUS Low. When driving multiple LEDs through multiple ICs, as shown in the
figure below, all the rows of LEDs can be turned OFF by any fault by connecting PBUS terminal to each IC.
(Note1) PBUS terminal is an open drain terminal. Even when used separately, please be pulled up(10kΩ) to power supply voltage.
VIN
IOUT
STOP
LED
OPEN
PBUS
LED
OFF
GND
ISETH
ISETL
GND
ISETL
PROTECT BUS
LED
OFF
PBUS
ISETH
GND
PBUS=Hi-Z ⇒ LOW
IOUT
VIN
STOP
PBUS
ISETH
ISETL
+B
IOUT
VIN
STOP
Figure 16. PBUS Function
● Example of operating protection for an LED open condition
LED Open
V
IOUT_OPEN
VIOUT-OPEN
VIOUT
VIOUT
CH1
0
IIOUT
IIOUT
0
PBUS
Hi-Z
Hi-Z
LOW
clamps to 1.4V
VIOUT
VIOUT
CH2
V
VIOUT_SHORT
IOUT_SHORT
0
IIOUT
IIOUT
0
VIOUT
VIOUT
CH3
V
VIOUT_SHORT
IOUT_SHORT
0
IIOUT
IIOUT
0
Figure 17. Example of protective Operation
When LED becomes open on the first IC, PBUS of IC1 is switched from Hi-Z to Low. As PBUS becomes Low, the other ICs
detect the error and turns OFF their own LEDs. VIOUT clamps to 1.4V during the OFF period in order to prevent ground
short protection.
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5. Protection Function
This IC has built-in short/open protection function for the external components. Any error detected will pull the PBUS
+B
terminal low.
OFFする
VIN
(1) LED Open Detecting Function
When any LED connected at the IOUT becomes open, VIOUT will
go HIGH. When an error is detected at VIOUT < VIOUT_OPEN the
PBUS is pulled LOW.
IOUT
Current
Control
VIN-0.2V
PBUS
Open
× オープン
Figure 18. LED Open detection function
+B
(2) LED Short Detecting Function
When the LEDs connected at the IOUT terminal are shorted to
ground, VIOUT will go LOW. When an error is detected at VIOUT <
VIOUT_SHORT 0.6V (TYP) the output current is turned OFF to prevent
IC heating and the PBUS is pulled LOW.
OFF
VIN
IOUT
Current
Control
OFF control
PBUS
Short
0.6V
Figure 19. LED Short detection function
+B
(3) ISET(H/L) Open Detecting Function
When the external resistance connected at ISETL or ISETH
terminal > RISET_OPEN 400k (TYP), the output current is turned OFF
to prevent IC heating and the PBUS is pulled LOW. This detection
is not affected by the current setting mode.
OFF
VIN
IOUT
Current
Control
PBUS
4.3V
ISET
×
Figure 20. ISET Pin open detection function
+B
(4) ISET(H/L) Short Detecting Function
When the external resistance connected at ISETL or ISETH
terminal < RISET_SHORT 5.1k (TYP), the output current is turned OFF
to protect the LEDs and the PBUS is pulled LOW. This detection is
not affected by the current setting mode.
OFF
VIN
IOUT
Current
Control
PBUS
0.05V
ISET
Figure 21. ISET Pin short detection function
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BD8372HFP-M BD8372EFJ-M
6.
Over Voltage Protection
Overvoltage protection works in (RISETH=40kΩ), 18V (TYP) ≤ VIN at IOUT=200mA setting and limits output current to
suppress the upswing in heat generation of LSI.
The overvoltage mute protection is effective only for (STOP=High) at H mode time.
IOMAX
Iomax
200mA
Over Voltage Protection
電源過電圧による
Current Limit
出力電流ミュート
10mA
0V
13V
19V
24V
40V
VIN
Figure 22. Overvoltage mute function
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Recommended application circuit
+B
TAIL
D1
FL1
D2
[email protected]
VIN
ZD1
IOUT
4.7μF
BD8372
D3
0.1μF
STOP
STOP
10k
10k
0.1μF
10k
PBUS
ISETL
39k
ISETH
GND
39k
Figure 23. Recommended application circuit
(Note) EMC
ISO 11452-2 (ALSE)
ISO 11452-4 (BCI)
ISO 7637-2
・ pulse1
・ Pulse2a,2b (level4)
・ Pulse3a,3b (level4)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
Component
Name
Component
Value
Product
Name
Company
D1
-
RF201L2S
ROHM
RF201L2S
ROHM
RF201L2S
ROHM
TNR12H-220K
NIPPON CHEMICON
D2
D3
ZD1
FL1
-
HMZ2012R102A
TDK
CVIN
4.7µF
GCM32ER71H475KA40
murata
CIOUT
0.1µF
GCM188R11H104KA42
murata
CSTOP
0.1µF
GCM188R11H104KA42
murata
RISETL
39kΩ
MCR03 Series
ROHM
RISETH
39kΩ
MCR03 Series
ROHM
RPBUS
10kΩ
MCR03 Series
ROHM
R1
10kΩ
MCR03 Series
ROHM
R2
10kΩ
MCR03 Series
ROHM
Table 1. BOM List
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Power Dissipation
HRP7 Package
5.0
2 layer copper foil 50mm x 50mm
θ ja = 30℃/W
4.16W
Power dissipation Pd [W]
4.0
2 layer copper foil 15mm x 15mm
θ ja = 54.4℃/W
1 layer
θ ja = 78.1℃/W
3.0
2.3W
2.0
1.6W
1.0
0.0
0
25
50
75
100
125
150
Temp Ta [℃]
HTSOP-J8 Package
2.0
2 layer copper foil 50mm x 50mm
θ ja = 69℃/W
Power dissipation Pd [W]
1.81W
2 layer copper foil 15mm x 15mm
θ ja = 113.6℃/W
1 layer
θ ja = 153.2℃/W
1.1W
1.0
0.82W
0.0
0
25
50
75
100
125
150
Temp Ta [℃]
(Caution1)
(Caution2)
(Caution3)
When mounted with 70.0mm x 70.0mm x 1.6mm glass epoxy substrate.
Abobe copper foil area indicates backside copper foil area.
Value changes according to number of substrate layers and copper foil area.Note that this value is a measured value. Not a guaranteed value.
Figure 24. Thermal Dissipation Curve
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Pd (Power dissipation) and IOMAX (Permissible current)
The relation between Pd and IOMAX by VF of LED connected with IOUT is shown.
13V
13.5V
VIN
IOUT
8V to 11V
8V~11V
Current
Control
IOMAX
Iomax
HRP7 Iomax -Ta、Pd-Ta characteristics (Pd=2.3W)
5.0
0.2
Iomax
(VF=9V)
4.5
Iomax
(VF=6V)
Pd[W]
2.5
0.16
Iomax
(VF=3V)
3.5
3.0
0.18
0.14
0.12
Pd (2 layer copper foil 15mm×15mm)
θ ja = 54.4℃/W
0.1
2.0
0.08
1.5
0.06
1.0
0.04
0.5
0.02
0.0
Iomax[A]
4.0
HRP7
0
0
25
50
75
100
125
150
Ta[℃]
HTSOP-J8 Iomax -Ta、Pd-Ta characteristics (Pd=1.1W)
5.0
0.2
4.5
0.18
Iomax
(VF=9V)
4.0
3.0
Pd[W]
0.14
Iomax
(VF=6V)
2.5
0.12
0.1
Iomax
(VF=3V
2.0
0.08
1.5
0.06
Pd (2 layer copper foil 15mm×15mm)
θ ja = 113.6℃/W
1.0
Iomax[A]
3.5
0.16
0.04
0.5
0.02
0.0
0
0
25
50
75
100
125
150
Ta[℃]
Figure 25. Heat reduction curve
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I/O Equivalent Circuit
Pin No.
Pin Name
I/O Equivalent Circuit
5V
VIN
(6pin)
1
STOP
STOP
(1pin)
300kΩ
100kΩ
GND
(4pin)
VIN
(6pin)
5V
200kΩ
2
PBUS
PBUS
(28pin)
5V
GND
(4pin)
5V
VIN
(6pin)
5V
3
ISETL
ISETL
(3pin)
GND
(4pin)
4
GND
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I/O Equivalent Circuit – continued
Pin No.
Pin Name
I/O Equivalent Circuit
5V
VIN
(6pin)
5V
5
ISETH
ISETH
(5pin)
GND
(4pin)
6
VIN
-
VIN
(6pin)
7
IOUT
5V
IOUT
(7pin)
GND
(4pin)
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 26. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Sudden Voltage Surge on VIN
Because MOSFETs are used in the output, a very steep change in the VCC voltage may cause the transistors to
conduct large current. Take this condition into account when selecting the value of external circuit constants for a
certain application.
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Ordering Information
B
D
8
3
7
2
D
F
P
-
Package
HFP : HRP7
Form name
B
H
8
3
7
2
E
F
Packaging and forming specification
TR: Embossed tape and reel
(HRP7)
J
Package
EFJ : HTSOP-J8
Form name
MTR
-
ME2
Packaging and forming specification
E2: Embossed tape and reel
(HTSOP-J8)
Marking Diagrams
HTSOP-J8(TOP VIEW)
HRP7 (TOP VIEW)
Part Number Marking
Part Number Marking
BD8372HFP
B D 8 3 7 2
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Part Number Marking
Package
Part Number
BD8372HFP
HRP7
Reel of 2000
BD8372HFP-MTR
BD8372
HTSOP-J8
Reel of 2500
BD8372EFJ-ME2
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Physical Dimension, Tape and Reel Information
Package Name
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HRP7
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Physical Dimension, Tape and Reel Information – continued
Package Name
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Revision History
Date
Revision
09.Dec.2015
001
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Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001
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