511CB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511CB
ISSUE O
DATE 25 MAR 2014
SCALE 4:1
D
A B
ÍÍ
ÍÍ
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉÉ ÇÇ
ÉÉÇÇÇ
ÇÇÇ ÇÇÇÇÇ
EXPOSED Cu
MOLD CMPD
DETAIL B
E
ALTERNATE TERMINAL
CONSTRUCTIONS
DIM
A
A1
A3
b
b2
D
D2
E
E2
e
F
G
L
L1
L2
L
L
TOP VIEW
L1
DETAIL A
A3
DETAIL B
0.10 C
ALTERNATE
CONSTRUCTIONS
A
6X
0.08 C
A1
NOTE 4
C
SIDE VIEW
2X
DETAIL A
GENERIC
MARKING DIAGRAM*
e
F
0.10 C A B
2X
1
XX M
D2
3
1
2X
6
E2
XX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.10 C A B
L
G
L2
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
0.35
0.45
2.00 BSC
0.55
0.65
2.00 BSC
0.55
0.65
0.65 BSC
0.52 BSC
0.20 BSC
0.20
0.30
--0.15
0.55
0.65
4
b2
5X
BOTTOM VIEW
b
0.10
M
C A
0.05
M
C
RECOMMENDED
MOUNTING FOOTPRINT
B
1.72
0.65
PITCH
0.48
PACKAGE
OUTLINE
0.80
5X
2.30
0.44
2X
0.67
0.54
5X
0.35
1
2X
0.67
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
98AON83453F
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WDFN6 2X2, 0.65P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON55829E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
25 MAR 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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© Semiconductor Components Industries, LLC, 2014
March, 2014 − Rev. O
Case Outline Number:
511CB
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