BZA868AL NXP Product Reliability

Reliability Investigation Results, Type: BZA868AL
Time period Q4/2012 to Q3/2013
AEC Q101 Test
Conditions
Duration
Quantity
Rejects
all parts
see
below
41480
0
#1
TEST
Pre- and Post-Stress
Electrical Test
Ta = 25 °C
N/A
#2
PC
Preconditioning
JESD22 -A113
Bake Ta = 125 °C
Soak Ta = 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
#5
#7
HTRB
High Temperature
Reverse Bias
TC
Temperature Cycling
JESD22 -A108
Tj = Tjmax, Vr > 80% of max.
breakdown Voltage
1000 hours
5840
0
JESD22- A104
-55 °C to Tjmax
1000 cycles
11040
0
#8
AC
Autoclave
JESD22- A102
Ta = 121 °C, RH = 100 %
Pressure = 205 kPa (29.7 psia)
96 hours
11040
0
#9
H3TRB
High Humidity High
Temperature Reverse
Bias
JESD22- A101
Ta = 85 °C, 85% RH, Vr > 80% of
rated breakdown voltage
1000 hours
11040
0
# 10
IOL
Intermittent Operating Life
MIL-STD-750 Method 1037
ton = toff, Devices powered to insure
ΔTj = 125 °C for 7500 cycles or
ΔTj = 100 °C for 15000 cycles
1000 hours
8720
0
JESD22-A111 / JESD22- B106
260 °C ± 5 °C
10 s
2700
0
J-STD-002
245 °C ± 5 °C
3s
3330
0
# 20
# 21
RSH
Resistance to Solder Heat
SD
Solderability
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temp. Reverse Bias (HTRB, AEC Q101 Test # 5)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168-1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
NXP DHAM
Zener / Protection
5840
0
0.73 FIT
156880 years
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