Download Datasheet

SPWF01SA
SPWF01SC
Serial-to-Wi-Fi b/g/n intelligent modules
Datasheet - production data
– 13.7 dBm @ 54 Mbps OFDM
 RX sensitivity
– -96.0 dBm @ 1 Mbps DSSS
– -74.5 dBm @ 54 Mbps OFDM
 16 configurable GPIOs available
 UART interface to host system
 Advanced low-power modes
– Standby with RTC: 43 µA
– Sleep connected (DTIM=1): 15 mA
– RX traffic: 105 mA typical
– TX traffic: 243 mA typical @ 10 dBm
 Simple AT command set host interface through
UART
Features
 2.4 GHz IEEE 802.11 b/g/n transceiver
 STM32 ARM Cortex-M3, with 64 KB RAM and
512 KB Flash memory
– 1 MB extended Flash available on
SPWF01Sx.1y
 Small form factor: 26.92 x 15.24 x 2.35 mm
 Single voltage supply (3.3 V typical)
 Multiple antenna options:
– Integrated antenna (SPWF01SA.xy
versions)
– Integrated u.fl connector (SPWF01SC.xy
versions)
 Integrated TCP/IP protocol stack
– 8 simultaneous TCP or UDP clients and 1
socket server
– 1 TLS/SSL socket client supporting up to
TLS 1.2, including common encryption
algorithms: AES (128, 256), hash (MD5,
SHA-1, SHA-256) and public key
algorithms (RSA, ECC)
– Web server supporting dynamic web pages
– RESTful API to get and post web content
Applications
 WEP/WPA/WPA2 personal security
 Smart appliances
 System modes: Station, IBSS, and miniAP
 Industrial control and data acquisition
 miniAP easily provisioned (SSID, PWD)
 Home automation and security systems
 Fast Wi-Fi reassociation after reset
 Wireless sensors
 Firmware update via UART and Over The Air
(FOTA); extended Flash on board with
SPWF01Sx.1y
 Cable replacement
 TX power
– 18.3 dBm @ 1 Mbps DSSS
March 2016
This is information on a product in full production.
 Industrial temperature range: -40 °C to 85 °C
 FCC/CE/IC/SRRC certified
 RoHS compliant
 Surface mount PCB module
 Medical equipment
 Machine-to-machine communication
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www.st.com
Description
1
SPWF01SA, SPWF01SC
Description
The SPWF01SA and the SPWF01SC intelligent Wi-Fi modules represent a plug-and-play
and standalone 802.11 b/g/n solution for easy integration of wireless Internet connectivity
features into existing or new products.
Configured around a single-chip 802.11 transceiver with integrated PA and comprehensive
power management subsystem, and an STM32 microcontroller with an extensive GPIO
suite, the modules also incorporate timing clocks and voltage regulators. Two different
options exist based on the integrated Flash memory. The SPWF01Sx.1y orderable parts
integrate 1.5 MB of Flash, while the SPWF01Sx.2y orderable parts integrate 512 KB of
Flash.
The module is available either configured with an embedded micro 2.45 GHz highly-efficient
ISM band antenna (SPWF01SA), or with an u.fl connector for external antenna connection
(SPWF01SC).
With low power consumption and ultra-compact (2.7 x 1.5 cm) footprint, the modules are
ideal for fixed and mobile wireless applications, as well as challenging battery-operated
applications.
The SPWF01Sx parts are released with an integrated full featured TCP/IP protocol stack
with added web server and additional application service capabilities, such as REST API for
accessing files on servers in the cloud and support for dynamic web pages with CGI/SSI
functions to easily interact with the module and the host processor over the air.
For secure end-to-end communication with the cloud, an SSL/TLS stack is embedded in
every module with no licensing charge. See application note AN4683 for details.
The SW package also includes an AT command layer interface for user-friendly access to
the stack functionalities via the UART serial port. For details, see user manual UM1695.
It is always possible to upgrade the module firmware via UART and Over The Air (FOTA).
Out of the 1 MB extended Flash available on the SPWF01Sx.1y module, 512 KB of the
Flash is dedicated to FW upgrade and the other 512 KB is dedicated to host proprietary
files, organized in a file system image, accessible through the integrated web server.
FOTA is also possible with the SPWF01Sx.2y module, temporarily storing the FW in the
external host Flash memory, if it exists.
ST may update the FW provided with the modules at any time. ST recommends that users
regularly check for documentation and the current FW version available at
www.st.com/wifimodules.
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Description
Figure 1. Block diagram
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General electrical specifications
2
SPWF01SA, SPWF01SC
General electrical specifications
Table 1. Absolute maximum ratings
Parameter
Test condition/comment
Voltage supply
Min.
Typ.
-0.3
Vin for 5 V tolerant pins
-
Vin for all other pins
Storage temperature range
-0.3
-0.3
-
-55
Max.
Unit
4.0
V
5.5
V
2.8
V
105
°C
Table 2. Operating conditions and input power specifications(1)
Parameter
Operating temperature range
Test condition/comment
Typ.
Max.
Unit
85
°C
3.6
V
Industrial
-40
Input supply voltage
3.3 V supply input
3.1
Standby
Both the STM32 and the radio
are in standby power states
43
uA
Sleep
The STM32 is in stop power
state and the radio is in sleep
power state
15
mA
Low power state
The STM32 is active and the
radio is in sleep power state
26
mA
236
mA
802.11b TX power=10 dBm
250
mA
TX power=18 dBm
344
mA
TX power=0 dBm
210
mA
802.11g TX power=10 dBm
243
mA
TX power=18 dBm
338
mA
802.11b
105
mA
802.11g
105
mA
3.3 V
supply
TX power=0 dBm
TX
RX
1. Typical results are at room temperature only.
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Min.
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SPWF01SA, SPWF01SC
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Digital interface specifications
Digital interface specifications
Table 3. Digital interface specifications, I/O pins
Parameter
Inputs
Outputs
Test condition/comment
VIH
Min.
Typ.
1.6
VIL
VOH
IOH=4 mA
VOL
IOL=4 mA
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-
Max.
Unit
2.8
V
0.9
V
2.5
V
0.4
V
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RF characteristics
4
SPWF01SA, SPWF01SC
RF characteristics
Table 4. RF characteristics
Parameter
RX
sensitivity(1)
Test condition/comment Min.
Max.
Unit
11b, 1 Mbps
-96
dBm
11b, 2 Mbps
-93
dBm
11b, 5.5 Mbps
-91
dBm
11b, 11 Mbps
-87
dBm
11g, 9 Mbps
-89.5
dBm
11g, 18 Mbps
-86
dBm
11g, 36 Mbps
-80
dBm
11g, 54 Mbps
-74.5
dBm
11n, MCS1, 13 Mbps
-86.5
dBm
11n, MCS3, 26 Mbps
-81.5
dBm
11n, MCS5, 52 Mbps
-74
dBm
11n, MCS7, 65 Mbps
-71
dBm
1
dB
-20
dBm
11Mbps
38
dBc
9 Mbps
20
dBc
54 Mbps
4
dBc
MCS1
24
dBc
MCS7
3
dBc
18.3
dBm
18.3
dBm
Channel-to-channel
de-sensitivity
CH1 to 14
11g, 54 Mbps, 10%PER
Maximum input signal
CH7
11g, 54 Mbps
Adjacent channel rejection
Typ.
11b, 1 Mbps
11b, 11 Mbps
@ 11b spectral mask
11g, 9 Mbps
@ 11g spectral mask
18.3
dBm
11g, 54 Mbps
EVM = -27 dB, 4.5%
13.7
dBm
11n, MCS1
@ 11n spectral mask
18.3
dBm
11n, MCS7
EVM = -27 dB
13.5
dBm
On-board antenna gain
Average
-1.2
dBi
External antenna gain
SG901-1066 average
including cable loss
2.8
dBi
TX output power (1)
1. Output power and sensitivities are measured with a 50 Ω connection at the antenna port.
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Pinout description
Pinout description
Table 5. Pinout description
Signal name
Type
Pin number
Main function
Alternate
functions(1)
Notes
GPIO - general purpose input/output
GPIO[0]
I/O
16
General purpose
input/output
Restore to factory
settings(2)
GPIO[1]
I/O
17
General purpose
input/output
GPIO[2]
I/O
19
General purpose
input/output
Floating and 5V
tolerant
GPIO[3]
I/O
1
General purpose
input/output
Input pull down and
5V tolerant
Input pull down and
5V tolerant
GPIO[6]
I/O
22
General purpose
input/output
Wake Up/Sleep
Inhibit(3)
GPIO[4]
I/O
18
General purpose
input/output
GPIO[5]
I/O
20
General purpose
input/output
GPIO[7]
I/O
13
General purpose
input/output
STA/Mini AP
switch (4)
GPIO[8]
I/O
4
General purpose
input/output
GPIO[9]
I/O
7
General purpose
input/output
GPIO[11]
I/O
11
GPIO[12]
I/O
12
General purpose
input/output
GPIO[15]
I/O
21
General purpose
input/output
Input pull down and
5V tolerant
PWM
Input pull down and
5V tolerant
ADC
DAC
Monitoring purpose with no alternate function
GPIO[10]
I/O
5
Drives LED, Blinks
while running
GPIO[13]
I/O
15
Drives LED, Wi-Fi
link up
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Pinout description
SPWF01SA, SPWF01SC
Table 5. Pinout description (continued)
Signal name
Type
Pin number
Main function
GPIO[14]
I/O
14
LED drive, Power
up
Alternate
functions(1)
Notes
UART pins
RXD1
I
8
UART1 Receive
data input
5V tolerant
TXD1
O
6
UART1 Transmit
data output
5V Tolerant
CTS1_DN
I
9
UART1 Clear to
send input
Active low, 5V tolerant
RTS1_DP
O
10
UART1 Request to
send output
Active low, 5V tolerant
Reset
RESETn
I
3
Active low for 5 ms
with pull up to
2.5VDC. Not 5V
tolerant
Reset input
Supply pins and paddle
3.3 V
24
Voltage supply
Ground
23
Ground
Ground Paddle
25
Ground
Decouple with 10uF
capacitor
Add plenty of ground
vias for thermal
dissipation and ground
return
Boot loader
BOOT0
I
2
Boot loader (5)
1. The activation of ALT function depends upon the firmware version or upon the variable configuration.
2. To perform the factory reset of the variables, pin GPIO0 must be high during powerup.
3. GPIO function running when low power mode variable is enabled.
4. Introduced with the release 3.0 of AT Full stack. To enable the STAToMiniAP switch the GPIO[7] needs to be put low
together with the HW reset
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SPWF01SA, SPWF01SC
Pinout description
5. To enable the firmware download, pin BOOT0 needs to be high during power up. RESETn need to be pulled low at least 5
ms to initiate the firmware download sequence.
Pin 26 to Pin 30 are reserved and they can be left floating in the final design
Application guidelines
As a general rule, when signals between the I/O pins of the external host processor and the module are
to be connected (e.g. from 2.5 V to 3.3 V), a level translator should be used to match the voltage of the
I/O pins.
Please refer to the data brief for the STEVAL-IDW001V1 evaluation board on st.com, which includes a
schematic diagram illustrating the use of the level translator.
The HOST processor should control the RESETn pin of the module in order to recover from unexpected
behavior using the HW reset.
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Module reflow
6
SPWF01SA, SPWF01SC
Module reflow
The SPWF01SA and SPWF01SC are surface mount modules with a 6-layer PCB. The
recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: in order to prevent an undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on the IPC/JEDEC JSTD-020C, July 2004 recommendations.
Table 6. Soldering values
Profile feature
PB-free assembly
Average ramp-up rate (TSMAX to TP)
3 °C/sec max
Preheat:
– Temperature min. (Ts min.)
– Temperature max. (Ts max.)
– Time (Ts min. to Ts max) (ts)
150 °C
200 °C
60-100 sec
Critical zone:
Temperature TL
Time TL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP) 10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.
Figure 2. Soldering profile
AM17477v1
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SPWF01SA, SPWF01SC
7
Regulatory compliance
Regulatory compliance
RF compliance
The RF certifications obtained are described in Table 7 below.
Table 7. RF certification summary
Comment
Note:
FCC ID VRA-SG9011203
On board antenna and external SG901-1066 with connector version
IC ID
7420A-SG9011203
On board antenna and external SG901-1066 with connector version
ETSI
Compliant
Approved with on board antenna and connector version
The SG901-1066 from Sagrad Inc. is the only approved antenna using the u.fl connector
version.
FCC and IC
This module has been tested and complies with the FCC part 15 and IC RSS-210
regulations. These limits are designed to provide reasonable protection against harmful
interference in approved installations. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
1.
The device must not cause harmful interference.
and
2.
The device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by the party responsible
for compliance may render void the user's authority to operate this equipment.
Modular approval, FCC and IC
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
In accordance with FCC part 15, the modules SPWF01SA and SPWF01SC are listed above
as a modular transmitter device.
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Regulatory compliance
SPWF01SA, SPWF01SC
Labeling instructions
When integrating the SPWF01SA and SPWF01SC into the final product, it must be ensured
that the FCC labeling requirements specified below are satisfied. Based on the Public
Notice from FCC, the product into which the ST transmitter module is installed must display
a label referring to the enclosed module. The label should use wording like the following:
Contains Transmitter Module
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
Any similar wording that expresses the same meaning may also be used.
CE
This module complies with the following European EMI/EMC and safety directives and
standards:
–
ETSI EN 300 328 V1.8.1:2012
–
EN 301 489-1 V1.9.2:2011 + EN 301 489-17 V2.2.1:2009
–
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013
–
EN 62479:2010
Figure 3. CE certified
SRRC
The SPWF01Sx.21 module complies with Chinese SRRC certification.
–
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SRRC CMIIT ID: 2015DJ6514
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8
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 4. Top view of the module shield
Shield
CE Logo
Figure 5. Bottom view of the module
Data Matrix
Board Design Reference
Model Series Name
FCC and IC IDs
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Package information
SPWF01SA, SPWF01SC
Figure 6. Wi-Fi module dimensions
Note:
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An antenna area of 217 x 520 mils must be free of any ground metalization or traces under
the unit. The area extending away from the antenna should be free from metal on the PCB
and housing to meet expected performance levels. Pin 25 is the required paddle ground and
is not shown in this diagram.
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SPWF01SA, SPWF01SC
Package information
Figure 7. Wi-Fi module footprint
PCB design requires a detailed review of the center exposed pad. This pad requires good
thermal conductivity. Soldering coverage should be maximized and checked via x-ray for
proper design. There is a trade-off between providing enough soldering for conductivity and
applying too much, which allows the module to “float” on the paddle creating reliability
issues. ST recommends two approaches, a large center via that allows excess solder to
flow down into the host PCB with smaller vias around it, or many smaller vias with just
enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the
smaller vias.
Either of these approaches must result in 60% or more full contact solder coverage on the
paddle after reflow. ST strongly encourages PCB layout teams to work with their EMS
providers to ensure vias and solder paste designs that will result in satisfactory
performance.
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Ordering information
9
SPWF01SA, SPWF01SC
Ordering information
Table 8. Ordering information
Order codes
Note:
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Description
SPWF01SA.11
Wi-Fi module with integrated antenna, 1.5 MB of Flash and Wi-Fi full stack
SPWF01SC.11
Wi-Fi module with integrated u.fl connector, 1.5 MB of Flash and Wi-Fi full stack
SPWF01SA.21
Wi-Fi module with integrated antenna, 512 KB of Flash and Wi-Fi full stack
SPWF01SC.21
Wi-Fi module with integrated u.fl connector 512 KB of Flash and Wi-Fi full stack
Refer to the user manual for a complete list of features and commands available in the Wi-Fi
full stack.
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Revision history
Revision history
Table 9. Document revision history
Date
Revision
05-Dec-2013
1
Initial release.
22-Jan-2014
2
Figure 3 has been modified.
16-Apr-2014
3
Updated with references to modules with reduced Flash
memory.
18-Sep-2014
4
Modified: Figure 1 and Table 3
20-May-2015
5
Modified: Features and Applications
11-Nov-2015
6
Update picture in first page.
7
– Added information regarding SRRC certification in
Features and Section 7: Regulatory compliance.
– Updated module photo on the coverpage and
Figure 1: Block diagram.
– Added information on upgrading the module firmware
in the Features and Description sections.
– Updated the text of Application guidelines on page 9.
– Changed title of Section 8 to Package information.
– Updated image and caption of Figure 6 and Figure 7.
– Minor text changes throughout the document.
16-Mar-2016
Changes
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SPWF01SA, SPWF01SC
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