Data Sheet

Freescale Semiconductor
Advance Information
Document Number: MC33982
Rev. 18.0, 9/2014
Single Intelligent High-current Selfprotected High-side Switch
(2.0 mOhm)
33982
The 33982 is a self-protected silicon 2.0 mOhm high-side switch used to replace
electromechanical relays, fuses, and discrete devices in power management
applications. The 33982 is designed for harsh environments and includes selfrecovery features. The device is suitable for loads with high inrush current, as
well as motors and all types of resistive and inductive loads.
Programming, control, and diagnostics are implemented via the serial peripheral
interface (SPI). A dedicated parallel input is available for alternate and pulsewidth modulation (PWM) control of the output. SPI-programmable fault trip
thresholds allow the device to be adjusted for optimal performance in the
application.
HIGH-SIDE SWITCH
Features
Single 2.0 m max high-side switch with parallel input or SPI control
6.0 V to 27 V operating voltage with standby currents < 5.0 A
Output current monitoring with two SPI-selectable current ratios
SPI control of overcurrent limit, overcurrent fault blanking time, output OFF
open load detection, output ON/OFF control, watchdog timeout, slew
rates, and fault status reporting
• SPI status reporting of overcurrent, open and shorted loads,
overtemperature shutdown, undervoltage and overvoltage shutdown,
Fail-safe pin status, and program status
• Enhanced -16 V reverse polarity VPWR protection
Bottom View
•
•
•
•
VDD
VDD
VDD
FK SUFFIX
SCALE
1:1
98ARL10521D
16-PIN PQFN
Applications
• DC motor or solenoid
• Resistive and inductive loads
• Low-voltage lighting
VPWR
33982
VDD
I/O
FS
I/O
WAKE
SO
SI
SCLK
MCU
VPWR
GND
SCLK
CS
CS
SI
SO
I/O
RST
I/O
IN
HS
LOAD
A/D
CSNS
FSI
GND
GND
PWR GND
Figure 1. 33982 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007-2014. All rights reserved.
ORDERABLE PARTS
ORDERABLE PARTS
Table 1. Orderable Part Variations (1)
Part Number
Temperature (TA)
Package
Output Clamp
Energy
Reference
Location
OD3 bit for X111
address
Reference
Location
MC33982CHFK
-40 °C to 125 °C
16 PQFN
1.0J
Table 3
1
Table 16
Notes
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
33982
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
VPWR
Internal
Regulator
IUP
CS
Overvoltage
Protection
Programmable
Switch Delay
0 ms to525 ms
SO
SPI
3.0 MHz
SI
SCLK
FS
IN
RST
WAKE
VIC
Selectable Slew
Rate Gate Drive
HS
Selectable Overcurrent
High Detection
150 A or 100 A
Logic
Selectable Overcurrent
Low Detection
Blanking Time
0.15 ms to 155 ms
IDWN
Selectable
Overcurrent
Low Detection
15 A to 50 A
Open Load
Detection
RDWN
Overtemperature
Detection
Programmable
Watchdog
310 ms to 2500 ms
VIC
Selectable
Output Current
Recopy
1/5400 or 1/40000
IUP
FSI
GND
CSNS
Figure 2. 33982 Simplified Internal Block Diagram
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
4
3 2
CSNS
RST
WAKE
6 5
IN
FS
CS
8 7
FSI
SI
SCLK
SO
VDD
NC
12 11 10 9
1
13
GND
TRANSPARENT
TOP VIEW
14
VPWR
15
HS
16
HS
Figure 3. 33982 Pin Connections
Functional descriptions of many of these pins can be found in the Functional Pin Description section beginning on page 16.
Table 2. Pin Definitions
Pin Number
Pin Name
Pin Function
Formal Name
Definition
1
CSNS
Output
Output Current
Monitoring
This pin is used to output a current proportional to the high-side output current
and used externally to generate a ground-referenced voltage for the
microcontroller to monitor output current.
2
WAKE
Input
Wake
This pin is used to input a logic [1] signal in order to enable the watchdog timer
function.
3
RST
Input
Reset (Active Low)
This input pin is used to initialize the device configuration and fault registers, as
well as place the device in a low current sleep mode.
4
IN
Input
Direct Input
The Input pin is used to directly control the output.
5
FS
Output
Fault Status
(Active Low)
This is an open drain configured output requiring an external pull-up resistor to
VDD for fault reporting.
6
FSI
Input
Fail-Safe Input
The value of the resistance connected between this pin and ground determines
the state of the output after a watchdog timeout occurs.
7
CS
Input
Chip Select
(Active Low)
This input pin is connected to a chip select output of a master microcontroller
(MCU).
8
SCLK
Input
Serial Clock
This input pin is connected to the MCU providing the required bit shift clock for SPI
communication.
9
SI
Input
Serial Input
This is a command data input pin connected to the SPI Serial Data Output of the
MCU or to the SO pin of the previous device in a daisy chain of devices.
10
VDD
Input
Digital Drain Voltage
(Power)
11
SO
Output
Serial Output
This output pin is connected to the SPI Serial Data Input pin of the MCU or to the
SI pin of the next device in a daisy chain of devices.
12
NC
NC
No Connect
This pin may not be connected.
This is an external voltage input pin used to supply power to the SPI circuit.
33982
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 2. Pin Definitions (continued)
Pin Number
Pin Name
Pin Function
Formal Name
13
GND
Ground
Ground
14
VPWR
Input
Positive Power
Supply
15, 16
HS
Output
High-side Output
Definition
This pin is the ground for the logic and analog circuitry of the device.
This pin connects to the positive power supply and is the source input of
operational power for the device.
Protected high-side power output to the load. Output pins must be connected in
parallel for operation.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Symbol
Rating
Value
Unit
Notes
Operating Voltage Range
Steady-state
-16 to 41
V
VDD
VDD Supply Voltage
-0.3 to 5.5
V
VIN, RST, FSI,
CSNS, SI, SCLK,
CS, FS
Input/Output Voltage
- 0.3 to 7.0
V
(2)
- 0.3 to VDD + 0.3
V
(2)
ELECTRICAL RATINGS
VPWR
VSO
SO Output Voltage
ICL(WAKE)
WAKE Input Clamp Current
2.5
mA
ICL(CSNS)
CSNS Input Clamp Current
10
mA
IHS
Output Current
60
A
VHS
Output Voltage
Positive
Negative
41
-15
V
ECL
Output Clamp Energy
33982B
33982C
1.5
1.0
J
(4)
V
(5)
VESD1
VESD3
ESD Voltage
Human Body Model (HBM)
Charge Device Model (CDM)
Corner Pins (1, 12, 15, 16)
All Other Pins (2, 11, 13, 14)
± 2000
(3)
±750
±500
Notes
2. Exceeding this voltage limit may cause permanent damage to the device.
3. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current
using package thermal resistance is required.
4. Active clamp energy using single-pulse method (L = 16 mH, RL = 0, VPWR = 12 V, TJ = 150°C).
5.
ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ESD3 testing is performed in
accordance with the Charge Device Model (CDM), Robotic (Czap = 4.0 pF).
33982
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Symbol
Rating
Value
Unit
Notes
Operating Temperature
Ambient
Junction
- 40 to 125
- 40 to 150
C
TSTG
Storage Temperature
- 55 to 150
C
RJC
RJA
Thermal Resistance
Junction-to-Case
Junction-to-Ambient
<1.0
30
C/W
(6)
TPPRT
Peak Package Reflow Temperature During Reflow
Note 8
°C
(7), (8)
THERMAL RATINGS
TA
TJ
Notes
6. Device mounted on a 2s2p test board per JEDEC JESD51-2.
7. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40 C  TA  125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
6.0
–
27
V
Notes
POWER INPUT
VPWR
Battery Supply Voltage Range
Full Operational
IPWR(ON)
VPWR Operating Supply Current
Output ON, IHS = 0 A
–
–
20
mA
IPWR(SBY)
VPWR Supply Current
Output OFF, Open Load Detection Disabled, WAKE > 0.7 VDD,
RST = VLOGIC HIGH
–
–
5.0
mA
–
–
–
–
10
50
A
IPWR(SLEEP)
Sleep State Supply Current (VPWR < 14 V, RST < 0.5 V, WAKE 
< 0.5 V)
TJ = 25 C
TJ = 85 C
VDD(ON)
VDD Supply Voltage
4.5
5.0
5.5
V
IDD(ON)
VDD Supply Current
No SPI Communication
3.0 MHz SPI Communication
–
–
–
–
1.0
5.0
mA
IDD(SLEEP)
VDD Sleep State Current
–
–
5.0
A
VPWR(OV)
Overvoltage Shutdown Threshold
28
32
36
V
VPWR(OVHYS)
Overvoltage Shutdown Hysteresis
0.2
0.8
1.5
V
Undervoltage Output Shutdown Threshold
5.0
5.5
6.0
V
(9)
(10)
VPWR(UV)
VPWR(UVHYS)
Undervoltage Hysteresis
–
0.25
–
V
VPWR(UVPOR)
Undervoltage Power-ON Reset
–
–
5.0
V
–
–
–
–
–
–
3.0
2.0
2.0
–
–
–
–
–
–
5.1
3.4
3.4
–
2.0
4.0
m
120
80
150
100
180
120
A
POWER OUTPUT
RDS(on)
Output Drain-to-Source ON Resistance (IHS = 30 A, TJ = 25 C)
VPWR = 6.0 V
VPWR = 10 V
VPWR = 13 V
RDS(on)
Output Drain-to-Source ON Resistance (IHS = 30 A, TJ = 150 C)
VPWR = 6.0 V
VPWR = 10 V
VPWR = 13 V
RDS(on)
Output Source-to-Drain ON Resistance (IHS = 30 A, TJ = 25 C)
VPWR = -12 V
IOCH0
IOCH1
Output Overcurrent High Detection Levels (9.0 V < VPWR < 16 V)
SOCH = 0
SOCH = 1
m
m
(11)
Notes
9. This applies to all internal device logic that is supplied by VPWR and assumes that the external VDD supply is within specification.
10. This applies when the undervoltage fault is not latched (IN = 0).
11. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR.
33982
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40 C  TA  125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER OUTPUT (CONTINUED)
IOCL0
IOCL1
IOCL2
IOCL3
IOCL4
IOCL5
IOCL6
IOCL7
Overcurrent Low Detection Levels (SOCL[2:0])
000
001
010
011
100
101
110
111
41
36
32
29
25
20
16
12
50
45
40
35
30
25
20
15
59
54
48
41
35
30
24
18
CSR0
CSR1
Current Sense Ratio (9.0 V < VPWR < 16 V, CSNS < 4.5 V)
DICR D2 = 0
DICR D2 = 1
–
–
1/5400
1/40000
–
–
- 20
-14
-13
-12
-13
-13
–
–
–
–
–
–
20
14
13
12
13
13
- 25
-19
-18
-17
-18
-18
–
–
–
–
–
–
25
19
18
17
18
18
Current Sense Clamp Voltage
CSNS Open, IHS = 59.0 A
4.5
6.0
7.0
V
Current Sense Leakage
IN = 1 with OUT opened of load or IN = 0
0.0
10
20
A
(12)
Open Load Detection Current
30
–
100
A
(13)
Output Fault Detection Threshold
Output Programmed OFF
2.0
3.0
4.0
V
VCL
Output Negative Clamp Voltage
0.5 A < IHS < 2.0 A, Output OFF
- 20
–
-15
V
TSD
Overtemperature Shutdown
160
175
190
C
(14)
Overtemperature Shutdown Hysteresis
5.0
–
20
C
(14)
Current Sense Ratio (CSR0) Accuracy
Output Current
10 A
CSR0_ACC
20 A
25 A
30 A
40 A
50 A
Current Sense Ratio (CSR1) Accuracy
Output Current
10 A
CSR1_ACC
20 A
25 A
30 A
40 A
50 A
VCL(CSNS)
ILEAK(CSNS)
IOLDC
VOLD(THRES)
TSD(HYS)
A
–
%
%
Notes
12. This parameter is achieved by the design characterization by measuring a statistically relevant sample size across process variations but, not
tested in production.
13. Output OFF open load detection current is the current required to flow through the load for the purpose of detecting the existence of an open load
condition when the specific output is commanded OFF.
14. Guaranteed by process monitoring. Not production tested.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40 C  TA  125 C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
CONTROL INTERFACE
VIH
Input Logic High-voltage
0.7 x VDD
–
–
V
(15)
VIL
Input Logic Low-voltage
–
–
0.2 x VDD
V
(15)
Input Logic Voltage Hysteresis
100
600
1200
mV
(16)
IDWN
Input Logic Pull-down Current (SCLK, IN, SI)
5.0
–
20
A
VRST
RST Input Voltage Range
4.5
5.0
5.5
V
CSO
SO, FS Tri-state Capacitance
–
–
20
pF
100
200
400
k
–
4.0
12
pF
(17)
(18)
VIN(HYS)
RDWN
CIN
Input Logic Pull-down Resistor (RST) and WAKE
Input Capacitance
VCL(WAKE)
WAKE Input Clamp Voltage
ICL(WAKE) < 2.5 mA
7.0
–
14
V
VF(WAKE)
WAKE Input Forward Voltage
ICL(WAKE) = -2.5 mA
- 2.0
–
-0.3
V
VSOH
SO High-state Output Voltage
IOH = 1.0 mA
0.8 x VDD
–
–
V
VSOL
FS, SO Low-state Output Voltage
IOL = -1.6 mA
–
0.2
0.4
V
SO Tri-state Leakage Current
CS > 0.7 x VDD
-5.0
0.0
5.0
A
Input Logic Pull-up Current
CS, VIN > 0.7 x VDD
5.0
–
20
A
–
6.0
30
0.0
10
–
1.0
14
–
ISO(LEAK)
IUP
RFS
RFSDIS
RFSOFF
RFSON
FSI Input Pin External Pull-down Resistance
FSI Disabled, HS Indeterminate
FSI Enabled, HS OFF
FSI Enabled, HS ON
(17)
(19)
k
Notes
15. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN, and WAKE input signals. The WAKE and RST signals may be
supplied by a derived voltage reference to VPWR.
16.
17.
18.
19.
No hysteresis on FSI and wake pins. Parameter is guaranteed by process monitoring but is not production tested.
Input capacitance of SI, CS, SCLK, RST, and WAKE. This parameter is guaranteed by process monitoring but is not production tested.
The current must be limited by a series resistance when using voltages > 7.0 V.
Pull-up current is with CS OPEN. CS has an active internal pull-up to VDD.
33982
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40C  TA  125C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER OUTPUT TIMING
SRRA_SLOW
Output Rising Slow Slew Rate A (DICR D3 = 0)
9.0 V < VPWR < 16 V
0.15
0.5
1.0
V/s
(20)
SRRB_SLOW
Output Rising Slow Slew Rate B (DICR D3 = 0)
9.0 V < VPWR < 16 V
0.06
0.2
0.6
V/s
(21)
SRRA_FAST
Output Rising Fast Slew Rate A (DICR D3 = 1)
9.0 V < VPWR < 16 V
0.3
0.8
3.2
V/s
(20)
SRRB_FAST
Output Rising Fast Slew Rate B (DICR D3 = 1)
9.0 V < VPWR < 16 V
0.06
0.2
2.4
V/s
(21)
SRFA_SLOW
Output Falling Slow Slew Rate A (DICR D3 = 0)
9.0 V < VPWR < 16 V
0.15
0.5
1.0
V/s
(20)
SRFB_SLOW
Output Falling Slow Slew Rate B (DICR D3 = 0)
9.0 V < VPWR < 16 V
0.06
0.2
0.6
V/s
(21)
SRFA_FAST
Output Falling Fast Slew Rate A (DICR D3 = 1)
9.0 V < VPWR < 16 V
0.6
1.6
3.2
V/s
(20)
SRFB_FAST
Output Falling Fast Slew Rate B (DICR D3 = 1)
9.0 V < VPWR < 16 V
0.2
0.7
2.4
V/s
(21)
Output Turn-ON Delay Time in Fast/Slow Slew Rate
DICR = 0, DICR = 1
1.0
18
100
s
(22)
tDLY_SLOW(OFF)
Output Turn-OFF Delay Time in Slow Slew Rate Mode
DICR = 0
10
115
250
s
(23)
tDLY_FAST(OFF)
Output Turn-OFF Delay Time in Fast Slew Rate Mode
DICR = 1
5.0
30
100
s
(23)
–
300
–
Hz
tDLY(ON)
f PWM
Direct Input Switching Frequency (DICR D3 = 0)
t OCL0
t OCL1
t OCL2
t OCL3
Overcurrent Low Detection Blanking Time (OCLT [1:0])
00
01
10
11
108
7.0
0.8
0.08
155
10
1.2
0.15
202
13
1.6
0.25
t OCH
Overcurrent High Detection Blanking Time
1.0
10
20
ms
s
Notes
20. Rise and Fall Slew Rates A measured across a 5.0 resistive load at high-side output = 0.5 V to VPWR - 3.5 V. These parameters are guaranteed
by process monitoring.
21. Rise and Fall Slow Slew Rates B measured across a 5.0 resistive load at high-side output = VPWR - 3.5 V to VPWR - 0.5 V. These parameters
are guaranteed by process monitoring.
22. Turn-ON delay time measured from rising edge of any signal (IN, SCLK, CS) that would turn the output ON to VHS = 0.5 V with 
RL = 5.0  resistive load.
23.
Turn-OFF delay time measured from falling edge of any signal (IN, SCLK, CS) that would turn the output OFF to VHS = VPWR - 0.5 V with RL =
5.0  resistive load.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40C  TA  125C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
–
–
10
s
(24)
Output Switching Delay Time (OSD [2:0])
000
001
010
011
100
101
110
111
–
52
105
157
210
262
315
367
0.0
75
150
225
300
375
450
525
–
95
195
293
390
488
585
683
Watchdog Timeout (WD [1:0])
00
01
10
11
434
207
1750
875
620
310
2500
1250
806
403
3250
1625
Recommended Frequency of SPI Operation
–
–
3.0
MHz
Required Low-state Duration for RST
–
50
167
ns
POWER OUTPUT TIMING (CONTINUED)
t CNSVAL
t OSD0
t OSD1
t OSD2
t OSD3
t OSD4
t OSD5
t OSD6
t OSD7
t WDTO0
t WDTO1
t WDTO2
t WDTO3
CS to CSNS Valid Time
ms
ms
(25)
SPI INTERFACE CHARACTERISTICS
f SPI
t WRST
(26)
Notes
24. Time necessary for the CSNS to be within ±5% of the targeted value.
25. Watchdog timeout delay measured from the rising edge of WAKE to RST from a sleep state condition to output turn-ON with the output driven
OFF and FSI floating. The values shown are for WDR setting of [00]. The accuracy of tWDTO is consistent for all configured watchdog timeouts.
26.
RST low duration measured with outputs enabled and going to OFF or disabled condition.
33982
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V  VDD  5.5 V, 6.0 V  VPWR  27 V, -40C  TA  125C, unless otherwise noted. Typical
values noted reflect the approximate parameter mean at TA = 25C under nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Rising Edge of CS to Falling Edge of CS (Required Setup Time)
–
–
300
ns
(27)
t ENBL
Rising Edge of RST to Falling Edge of CS (Required Setup Time)
–
–
5.0
s
(27)
t LEAD
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
–
50
167
ns
(27)
t WSCLKH
Required High-state Duration of SCLK (Required Setup Time)
–
–
167
ns
(27)
t WSCLKL
Required Low-state Duration of SCLK (Required Setup Time)
–
–
167
ns
(27)
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
–
50
167
ns
(27)
t SI(SU)
SI to Falling Edge of SCLK (Required Setup Time)
–
25
83
ns
(28)
t SI(HOLD)
Falling Edge of SCLK to SI (Required Setup Time)
–
25
83
ns
(28)
t RSO
SO Rise Time
CL = 200 pF
–
25
50
ns
t FSO
SO Fall Time
CL = 200 pF
–
25
50
ns
t RSI
SI, CS, SCLK, Incoming Signal Rise Time
–
–
50
ns
(28)
t FSI
SI, CS, SCLK, Incoming Signal Fall Time
–
–
50
ns
(28)
t SO(EN)
Time from Falling Edge of CS to SO Low-impedance
–
–
145
ns
(29)
t SO(DIS)
Time from Rising Edge of CS to SO High-impedance
–
65
145
ns
(30)
Time from Rising Edge of SCLK to SO Data Valid
0.2 VDD SO  0.8 VDD, CL = 200 pF
–
65
105
ns
(31)
SPI INTERFACE CHARACTERISTICS
t CS
t LAG
t VALID
Notes
27.
28.
29.
30.
31.
Maximum setup time required for the 33982 is the minimum guaranteed time needed from the microcontroller.
Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
Time required for output status data to be available for use at SO. 1.0 kon pull-up on CS.
Time required for output status data to be terminated at SO. 1.0 kon pull-up on CS.
Time required to obtain valid data out from SO following the rise of SCLK.
TIMING DIAGRAMS
CS
VPWR
VPWR
VPWR - 0.5V
VPWR -0.5 V
VPWR
3V V
VPWR--3.5
SR
FB_SLOW & SRFB_FAST
SRfB
SRRB_SLOW & SRRB_FAST
SRrB
SRfA
SR
FA_SLOW & SRFA_FAST
SRRA_SLOW & SRRA _FAST
SRrA
HS
0.5V 0.5
V
t DLY(ON)
Tdly
(on)
t DLY_SLOW(OFF) & tDLY_FAST(OFF)
Tdly(off)
Figure 4. Output Slew Rate and Time Delays
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
IOCHx
Load
Current
IOCLx
t OCH
Time
t OCLx
Figure 5. Overcurrent Shutdown
IOCH0
IOCH1
IOCL0
IOCL1
Load
Current
IOCL2
IOCL3
IOCL4
IOCL5
IOCL6
IOCL7
Time
t OCHx
t OCL3 t OCL2
t OCL1
t OCL0
Figure 6. Overcurrent Low and High Detection
Figure 6 illustrates the overcurrent detection level (IOCLX, IOCHX) the device can reach for each overcurrent detection blanking time (tOCHX,
tOCLX):
• During tOCHX, the device can reach up to Ioch0 overcurrent level.
• During tOCL3 or tOCL2 or tOCL1 or tOCL0, the device can be programmed to detect up to Iocl0.
33982
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VIH
V
IH
RSTB
RST
0.2
VDD
0.2
VDD
VIL
VIL
TwRSTB
t WRST
t ENBL
tTCSB
CS
TENBL
VIH
V
0.7
VDD
0.7VDD
CS
CSB
IH
0.2
VDD
0.7VDD
t WSCLKH
TwSCLKh
tTlead
LEAD
VIL
V
IL
t RSI
TrSI
t LAG Tlag
0.70.7VDD
VDD
SCLK
SCLK
VIH
VIH
0.2 VDD
0.2VDD
VIL
V
tTSIsu
SI(SU)
IL
t WSCLKl
TwSCLKl
t SI(HOLD)
TSI(hold)
VIH
V
0.7
0.7 V
VDD
DD
0.2VDD
0.2
VDD
Don’t Care
SI
SI
tTfSI
FSI
Don’t Care
Valid
Valid
Don’t Care
IH
VIH
VIL
Figure 7. Input Timing Switching Characteristics
tFSI
t RSI
TrSI
TfSI
VOH
VOH
3.5 V
3.5V
50%
SCLK
SCLK
1.0VV
1.0
VOL
VOL
t SO(EN)
TdlyLH
SO
SO
0.7 V
VDD
DD
0.20.2
VDD
VDD
Low-to-High
Low
to High
TrSO
t RSO
VOH
VOH
VOL
VOL
VALID
tTVALID
SO
TfSO
t FSO
SO
VOH
VOH
0.7VDD
VDD
High to Low 0.7
High-to-Low
0.2VDD
0.2 VDD
TdlyHL
VOL
VOL
t SO(DIS)
Figure 8. SCLK Waveform and Valid SO Data Delay Time
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33982 is a self-protected silicon 2.0 m high-side switch used to replace electromechanical relays, fuses, and discrete devices in
power management applications. The 33982 is designed for harsh environments, including self-recovery features. The device is suitable
for loads with high inrush current, as well as motors and all types of resistive and inductive loads.
Programming, control, and diagnostics are implemented via the Serial Peripheral Interface (SPI). A dedicated parallel input is available
for alternate and pulse width modulation (PWM) control of the output. SPI programmable fault trip thresholds allow the device to be
adjusted for optimal performance in the application.
The 33982 is packaged in a power-enhanced 12 mm x 12 mm non-leaded PQFN package with exposed tabs.
FUNCTIONAL PIN DESCRIPTION
OUTPUT CURRENT MONITORING (CSNS)
The CSNS pin outputs a current proportional to the high-side output current and used externally to generate a ground-referenced voltage
for the microcontroller to monitor output current.
WAKE (WAKE)
This pin is used to input a logic [1] signal in order to enable the watchdog timer function. An internal clamp protects this pin from high
damaging voltages when the output is current limited with an external resistor. This input has a passive internal pull-down.
RESET (RST)
This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current sleep mode. The
pin also starts the watchdog timer when transitioning from logic LOW to logic HIGH. This pin should not be allowed to be logic High until
VDD is in regulation. This pin has a passive internal pull-down.
DIRECT IN (IN)
The Input pin is used to directly control the output. This input has an active internal pull-down current source and requires CMOS logic
levels. This input may be configured via the SPI.
FAULT STATUS (FS)
This is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. When a device fault condition is
detected, this pin is active LOW. Specific device diagnostic faults are reported via the SPI SO pin.
FAIL-SAFE INPUT (FSI)
The value of the resistance connected between this pin and ground determines the state of the output after a watchdog timeout occurs.
Depending on the resistance value, either the output is OFF or ON. When the FSI pin is connected to GND, the watchdog circuit and Failsafe operation are disabled. This pin incorporates an active internal pull-up current source.
CHIP SELECT (CS)
This input pin is connected to a chip select output of a master microcontroller (MCU). The MCU determines which device is addressed
(selected) to receive data by pulling the CS pin of the selected device logic Low, enabling SPI communication with the device. Other
unselected devices on the serial link having their CS pins pulled up logic High disregard the SPI communication data sent. This pin
incorporates an active internal pull-up current source.
SERIAL CLOCK (SCLK)
This input pin is connected to the MCU providing the required bit shift clock for SPI communication. It transitions one time per bit transferred
at an operating frequency, fSPI, defined by the communication interface. The 50 percent duty cycle CMOS-level serial clock signal is idle
between command transfers. The signal is used to shift data into and out of the device. This input has an active internal pull-down current
source.
SERIAL INTERFACE (SI)
This is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device in a daisy
chain of devices. The input requires CMOS logic level signals and incorporates an active internal pull-down current source. Device control
is facilitated by the input's receiving the MSB first of a serial 8-bit control command. The MCU ensures data is available upon the falling
edge of SCLK. The logic state of SI present upon the rising edge of SCLK loads that bit command into the internal command shift register.
33982
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
DIGITAL DRAIN VOLTAGE POWER (VDD)
This is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost, an internal supply provides power to
a portion of the logic, ensuring limited functionality of the device. All device configuration registers are reset.
SERIAL OUTPUT (SO)
This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device in a daisy chain of devices.
This output remains tri-stated (high-impedance OFF condition) so long as the CS pin of the device is logic High. SO is only active when
the CS pin of the device is asserted logic Low. The generated SO output signals are CMOS logic levels. SO output data is available on
the falling edge of SCLK and transitions immediately on the rising edge of SCLK.
POSITIVE POWER SUPPLY (VPWR)
This pin connects to the positive power supply and is the source input of operational power for the device. The VPWR pin is a backside
surface mount tab of the package.
HIGH-SIDE OUTPUT (HS)
This pin protects high-side power output to the load. Output pins must be connected in parallel for operation.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33982 - Functional Block Diagram
Power Supply
Self-protected
High-side Switch
MCU Interface and Output Control
SPI Interface
Power Supply
HS
Parallel Control Inputs
MCU Interface and Output Control
High-side Switch
Figure 9. Functional Internal Block Diagram
POWER SUPPLY
The 33982 is designed to operate from 4.0 V to 28 V on the VPWR pin. Characteristics are provided from 6.0 V to 20 V for the device. The
VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for serial peripheral interface (SPI)
communication in order to configure and diagnose the device. This IC architecture provides a low quiescent current sleep mode. Applying
VPWR and VDD to the device places the device in the Normal mode. The device transits to Fail-safe mode in case of failures on the SPI
(watchdog timeout).
HIGH-SIDE SWITCH: HS
This pin is the high-side output controlling multiple automotive loads with high inrush current, as well as motors and all types of resistive
and inductive loads. This N-channel MOSFET with a 2.0 mRDS(on), is self-protected and presents extended diagnostics to detect load
disconnections and short-circuit fault conditions. The HS output is actively clamped during a turn-off of inductive loads.
MCU INTERFACE AND OUTPUT CONTROL
In Normal mode, the load is controlled directly from the MCU through the SPI. With a dedicated SPI command, it is possible to
independently turn on and off several loads that are PWMed at the same frequency, and duty cycles with only one PWM signal. An analog
feedback output provides a current proportional to the load current. The SPI is used to configure and to read the diagnostic status (faults)
of high-side output. The reported fault conditions are: open load, short-circuit to ground (OCLO-resistive and OCHI-severe short-circuit),
thermal shutdown, and under/overvoltage.
In Fail-safe mode, the load is controlled with dedicated parallel input pins. The device is configured in default mode.
33982
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
The 33982 has four operating modes: Sleep, Normal, Fault, and Fail-safe. Table 6 summarizes details contained in succeeding
paragraphs.
Table 6. Fail-safe Operation and Transitions to Other 33982 Modes
Mode
FS
WAKE
RST
WDTO
Sleep
x
0
0
x
Device is in Sleep mode. All outputs are OFF.
Normal
1
x
1
No
Normal mode. Watchdog is active if enabled.
0
1
x
x
1
No
The device is currently in Fault mode. The faulted output is OFF.
0
1
0
1
1
1
1
1
0
1
Yes
Watchdog has timed out and the device is in Fail-safe mode. The output is as configured with the RFS
resistor connected to FSI. RST and WAKE must be transitioned to logic [0] simultaneously to bring the
device out of the Fail-safe mode or momentarily tied the FSI pin to ground.
1
1
0
Fault
Fail-safe
Comments
x = Don’t care.
SLEEP MODE
The default mode of the 33982 is the Sleep mode. This is the state of the device after first applying battery voltage (VPWR), prior to any 
I/O transitions. This is also the state of the device when the WAKE and RST are both logic [0]. In the Sleep mode, the output and all unused
internal circuitry, such as the internal 5.0 V regulator, are off to minimize current draw. In addition, all SPI-configurable features of the
device are as if set to logic [0]. The device transitions to the Normal or Fail-safe operating modes based on the WAKE and RST inputs as
defined in Table 6.
NORMAL MODE
The 33982 is in Normal mode when:
• VPWR is within the normal voltage range.
• RST pin is logic [1].
• No fault has occurred.
FAIL-SAFE MODE AND WATCHDOG
If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or RST input pin transitions from logic [0]
to logic [1]. The WAKE input is capable of being pulled up to VPWR with a series of limiting resistance that limits the internal clamp current.
The watchdog timeout is a multiple of an internal oscillator and is specified in Table 15. As long as the WD bit (D7) of an incoming SPI
message is toggled within the minimum watchdog timeout period (WDTO), based on the programmed value of the WDR the device
operates normally. If an internal watchdog timeout occurs before the WD bit, the device reverts to a Fail-safe mode until the device is
reinitialized.
During the Fail-safe mode, the output is ON or OFF depending upon the resistor RFS connected to the FSI pin, regardless of the state of
the various direct inputs and modes (Table 7). In this mode, the SPI register content is retained except for overcurrent high and low
detection levels and timing, which are reset to their default value (SOCL, SOCH, OCLT). The watchdog, overvoltage, overtemperature,
and overcurrent circuitry (with default value for this one) are fully operational.
Table 7. Output State During Fail-safe Mode
RFS (k)
High-side State
0
Fail-safe Mode Disabled
10
HS OFF
30
HS ON
The Fail-safe mode can be detected by monitoring the WDTO bit D2 of the WDR register. This bit is logic [1] when the device is in Failsafe mode. The device can be brought out of the Fail-safe mode by transitioning the WAKE and RST pins from logic [1] to logic [0] or
forcing the FSI pin to logic [0]. Table 6 summarizes the various methods for resetting the device from the latched Fail-safe mode.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
If the FSI pin is tied to GND, the Watchdog Fail-safe operation is disabled.
LOSS OF VDD
If the external 5.0 V supply is not within specification, or even disconnected, all register content is reset. The output can still be driven by
the direct input IN. The 33982 uses the battery input to power the output MOSFET related current sense circuitry, and any other internal
logic, providing fail-safe device operation with no VDD supplied. In this state, the watchdog, overvoltage, overtemperature, and overcurrent
circuitry are fully operational with default values. Current recopy is active with the default current recopy value.
FAULT MODE
The 33982 indicates the following faults as they occur by driving the FS pin to logic [0]:
• Overtemperature fault
• Overvoltage and undervoltage fault
• Open load fault
• Overcurrent fault (high and low)
The FS pin automatically returns to logic [1] when the fault condition is removed, except for overcurrent and in some cases undervoltage.
Fault information is retained in the fault register and is available (and reset) via the SO pin during the first valid SPI communication (refer
to Table 17).
PROTECTION AND DIAGNOSTIC FEATURES
OVERTEMPERATURE FAULT (NON-LATCHING)
The 33982 incorporates overtemperature detection and shutdown circuitry in the output structure. Overtemperature detection is enabled
when the output is in the ON state.
For the output, an overtemperature fault (OTF) condition results in the faulted output turning OFF until the temperature falls below the
TSD(HYS). This cycle continues indefinitely until action is taken by the MCU to shut OFF the output, or until the offending load is removed.
When experiencing this fault, the OTF fault bit is set in the status register and cleared after either a valid SPI read or a power reset of the
device.
OVERVOLTAGE FAULT (NON-LATCHING)
The 33982 shuts down the output during an overvoltage fault (OVF) condition on the VPWR pin. The output remains in the OFF state until
the overvoltage condition is removed. When experiencing this fault, the OVF fault bit is set in bit OD1 and cleared after either a valid SPI
read or a power reset of the device. The overvoltage protection and diagnostic can be disabled through the SPI (bit OV_dis).
UNDERVOLTAGE SHUTDOWN (LATCHING OR NON-LATCHING)
The output(s) latches off at some battery voltage below 6.0 V. As long as the VDD level stays within the normal specified range, the internal
logic states within the device is sustained.
In cases where the battery voltage drops below the undervoltage threshold, (VPWRUV) the output turns off, FS goes to logic [0], and the
fault register UVF bit is set to 1.
Two cases need to be considered when the battery level recovers:
• If the output(s) command is (are) low, FS goes to logic [1], but the UVF bit remains set to 1 until the next read operation.
• If the output command is ON, then FS remains at logic [0]. The output must be turned OFF and ON again to re-enable the state of
output and release FS. The UVF bit remains set to 1 until the next read operation.
The undervoltage protection can be disabled through the SPI (bit UV_dis = 1). In this case, the FS and UVF bits do not report any
undervoltage fault condition and the output state is not changed as long as the battery voltage does not drop any lower than 2.5 V.
OPEN LOAD FAULT (NON-LATCHING)
The 33982 incorporates open load detection circuitry on the output. Output open load fault (OLF) is detected and reported as a fault
condition when the output is disabled (OFF). The open load fault is detected and latched into the status register after the internal gate
voltage is pulled low enough to turn OFF the output. The OLF fault bit is set in the status register. If the open load fault is removed, the
status register is cleared after reading the register.
The open load protection can be disabled through the SPI (bit OL_dis). It is recommended to disable the open load detection circuitry:
(OL_dis bit sets to logic [1]) in case of a permanent open load fault condition.
OVERCURRENT FAULT (LATCHING)
The 33982 has eight programmable overcurrent low detection levels (IOCL) and two programmable overcurrent high detection levels (IOCH)
for maximum device protection. The two selectable, simultaneously active overcurrent detection levels, defined by IOCH and IOCL, are
illustrated in Figure 6. The eight different overcurrent low detection levels (IOCL0 : IOCL7) are likewise illustrated in Figure 6.
33982
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
If the load current level ever reaches the selected overcurrent low detection level and the overcurrent condition exceeds the programmed
overcurrent time period (tOCx), the device latches the output OFF.
If at any time the current reaches the selected IOCH level, then the device immediately latches the fault and turn OFF the output, regardless
of the selected tOCL driver. For both cases, the device output stays off indefinitely until the device is commanded OFF and then ON again.
Table 8. Device Behavior in Case of Undervoltage
High-side
Switch (VPWR
Battery
Voltage) 
State
UV Enable
IN = 0
(Falling VPWR)
UV Enable
IN = 0
(Rising VPWR)
UV Enable
IN = 1
(Falling VPWR)
Output State
VPWR >
VPWRUV
OFF
OFF
ON
OFF
OFF
ON
FS State
1
1
1
0
1
1
SPI Fault
Register UVF Bit
0
1 until next read
0
1
0
0
OFF
OFF
OFF
OFF
OFF
ON
0
0
0
0
1
1
1
1
1
1
0
0
OFF
OFF
OFF
OFF
OFF
ON
1
1
1
1
1
1
1 until next read
1 until next read
0
0
OFF
OFF
OFF
OFF
OFF
OFF
1
1
1
1
1
1
1 until next read
1 until next read
1 until next read
0
0
Output State
VPWRUV >
FS State
VPWR > UVPOR
SPI Fault
Register UVF Bit
Output State
UVPOR > VPWR FS State
1
> 2.5 V 
SPI Fault
Register UVF Bit 1 until next read
Output State
FS State
2.5 V > VPWR >
0V
UV Disable
UV Disable
UV Enable
IN = 0
IN = 1
IN = 1
(Falling or Rising (Falling or Rising
(Rising VPWR)
VPWR)
VPWR)
SPI Fault
Register UVF Bit 1 until next read
Comments
UV fault is not
latched
UV fault is not
latched
UV fault is latched
 Typical value; not guaranteed
 While VDD remains within specified range.
= IN is equivalent to IN direct input or IN_spi SPI input.
REVERSE BATTERY
The output survives the application of reverse voltage as low as -16 V. Under these conditions, the output’s gate is enhanced to keep the
junction temperature less than 150 °C. The ON resistance of the output is fairly similar to that in the Normal mode. No additional passive
components are required.
GROUND DISCONNECT PROTECTION
In the event the 33982 ground is disconnected from load ground, the device protects itself and safely turns OFF the output regardless the
state of the output at the time of disconnection. A 10 k resistor needs to be added between the WAKE pin and the rest of the circuitry in
order to ensure that the device turns off in case of a ground disconnect and to prevent this pin to exceed its maximum ratings.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
SPI PROTOCOL DESCRIPTION
The SPI interface has a full duplex, three-wire synchronous data transfer with four I /O lines associated with it: Serial Clock (SCLK), Serial
Input (SI), Serial Output (SO), and Chip Select (CS).
The SI / SO pins of the 33982 follow a first-in first-out (D7 / D0) protocol with both input and output words transferring the most significant
bit (MSB) first. All inputs are compatible with 5.0 V CMOS logic levels. The SPI lines perform the following functions:
SERIAL CLOCK (SCLK)
The SCLK pin clocks the internal shift registers of the 33982 device. The serial input pin (SI) accepts data into the input shift register on
the falling edge of the SCLK signal while the serial output pin (SO) shifts data information out of the SO line driver on the rising edge of
the SCLK signal. It is important that the SCLK pin be in a logic LOW state whenever CS makes any transition. For this reason, it is
recommended that the SCLK pin be in a logic [0] state whenever the device is not accessed (CS logic [1] state). SCLK has an active
internal pull-down, IDWN. When CS is logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (high-impedance). (See
Figure 10 and Figure 11.)
SERIAL INTERFACE (SI)
This is a serial interface (SI) command data input pin. SI instruction is read on the falling edge of SCLK. An 8-bit stream of serial data is
required on the SI pin, starting with D7 to D0. The internal registers of the 33982 are configured and controlled using a 4-bit addressing
scheme, as shown in Table 9. Register addressing and configuration are described in Table 10. The SI input has an active internal pulldown, IDWN.
SERIAL OUTPUT (SO)
The SO pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CS pin is put into a
logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, and the state of the key inputs. The
SO pin changes states on the rising edge of SCLK and reads out on the falling edge of SCLK. Fault and input status descriptions are
provided in Table 16.
CHIP SELECT (CS)
The CS pin enables communication with the master microcontroller (MCU). When this pin is in a logic [0] state, the device is capable of
transferring information to and receiving information from the MCU. The 33982 latches in data from the input shift registers to the
addressed registers on the rising edge of CS. The device transfers status information from the power output to the shift register on the
falling edge of CS. The SO output driver is enabled when CS is logic [0]. CS should transition from a logic [1] to a logic [0] state only when
SCLK is a logic [0]. CS has an active internal pull-up, IUP.
CSB
CS
SCLK
SI
SO
SO
D7
OD7
D6
OD6
D5
OD5
D4
OD4
D3
OD3
D2
OD2
D1
OD1
D0
OD0
1. RST
a in
logic
[1] 1state
theabove
above
operation.
Notes 1.
RSTB
RSTis is
a logic
state during
during the
operation.
NOTES:
2.
D0, D1,relate
D2, ...,toand
relaterecent
to the most
recent
ordered
entryinto
of data
the SPSS
2. D7:D0
theD7most
ordered
entry
of data
theinto
device.
3.
OD0, OD1,relate
OD2, ...,
first 8 bits
of ordered
fault and
data
outdevice.
3. OD7:OD0
to and
the OD7
first relate
8 bitstoofthe
ordered
fault
and status
datastatus
out of
the
of the device.
Figure 10. Single 8-Bit Word SPI Communication
33982
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
C
S B
CS
SCLK
S
C L K
SIS
I
D 7
S O
SO
D 6
O D 7
1 .
N O T E S :
D 5
O D 6
R
R SST T B
D 2
O D 5
D 1
O D 2
D 0
O D 1
D 7 *
O D 0
D 6 *
D 7
D 6
D 5 *
D 5
D 2 *
D 1 *
D 2
D 1
D 0 *
D 0
is in a lo g ic 1 s t a t e d u r in g t h e a b o v e o p e r a t io n .
2 .
0 , logic
D 1 , D[1]
2 , .state
. . , a n dduring
D 7 r e la
t e tabove
o t h e m operation.
o s t r e c e n t o r d e r e d e n t r y o f d a t a in t o t h e S P S S
Notes 1. RST
isD a
the
3 .
O D 0 , O D 1 , O D 2 , . . ., a n d O D 7 r e la t e t o t h e fir s t 8 b it s o f o r d e r e d f a u lt a n d s t a t u s d a t a o u t o f t h e d e v ic e .
2. D7:D0
4 .
O relate
D 0 , O Dto
1 , the
O D most
2 , . . . , arecent
n d O D ordered
7 r e p r e s eentry
n t t h e of
f i r sdata
t 8 b into
i t s o f the
o r d device.
e r e d f a u lt a n d s t a t u s d a t a o u t o f t h e S P S S
3. D7*:D0* relate to the previous 8 bits (last command word) of data that was previously shifted into the device.
4. OD7:OD0 relate to the first
of 4ordered
device.
F I8
G bits
U R E
b . M U fault
L T I Pand
L E status
8 b i t Wdata
O R out
D Sof
P the
I C O
M M U N IC A T IO N
Figure 11. Multiple 8-Bit Word SPI Communication
SERIAL INPUT COMMUNICATION
SPI communication is accomplished using 8-bit messages. A message is transmitted by the MCU starting with the MSB, D7, and ending
with the LSB, D0 (Table 9). Each incoming command message on the SI pin can be interpreted using the following bit assignments: the
MSB (D7) is the watchdog bit and in some cases a register address bit; the next three bits, D6 : D4, are used to select the command
register; and the remaining four bits, D3 : D0, are used to configure and control the output and its protection features.
Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable or to confirm
transmitted data as long as the messages are all multiples of eight bits. Any attempt made to latch in a message that is not eight bits are
ignored. The 33982 has defined registers, which are used to configure the device and to control the state of the output. Table 10,
summarizes the SI registers. The registers are addressed via D6 : D4 of the incoming SPI word (Table 9).
Table 9. SI Message Bit Assignment
Bit Sig
SI Msg Bit
Message Bit Description
MSB
D7
Watchdog in: toggled to satisfy watchdog requirements; also used
as a register address bit.
D6 : D4
Register address bits.
D3 : D1
Used to configure the inputs, outputs, and the device protection
features and SO status content.
D0
Used to configure the inputs, outputs, and the device protection
features and SO status content.
LSB
Table 10. Serial Input Address and Configuration Bit Map
Serial Input Data
SI Register
D7
D6
D5
D4
D3
D2
D1
D0
STATR
x
0
0
0
0
SOA2
SOA1
SOA0
OCR
x
0
0
1
0
0
CSNS EN
IN_SPI
SOCHLR
x
0
1
0
SOCH
SOCL2
SOCL1
SOCL0
CDTOLR
x
0
1
1
OL_dis
CD_dis
OCLT1
OCLT0
DICR
x
1
0
0
IN dis
A/O
OSDR
0
1
0
1
0
OSD2
OSD1
OSD0
WDR
1
1
0
1
0
0
WD1
WD0
NAR
0
1
1
0
0
0
0
0
UOVR
1
1
1
0
0
0
UV_dis
OV_dis
TEST
x
1
1
1
FAST SR CSNS high
Freescale Internal Use (Test)
x = Don’t care.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
DEVICE REGISTER ADDRESSING
The following section describes the possible register addresses and their impact on device operation.
Address x000 — Status Register (STATR)
The STATR register is used to read the device status and the various configuration register contents without disrupting the device
operation or the register contents. The register bits D2, D1, and D0 determine the content of the first eight bits of SO data. In addition to
the device status, this feature provides the ability to read the content of the OCR, SOCHLR, CDTOLR, DICR, OSDR, WDR, NAR, and
UOVR registers. (Refer to the section entitled Serial Output Communication (Device Status Return Data) beginning on page 26.)
Address x001 — Output Control Register (OCR)
The OCR register allows the MCU to control the output through the SPI. Incoming message bit D0 (IN_SPI) reflects the desired states of
the high-side output: a logic [1] enables the output switch and a logic [0] turns it OFF. A logic [1] on message bit D1 enables the Current
Sense (CSNS) pin. Bits D2 and D3 must be logic [0]. Bit D7 is used to feed the watchdog if enabled.
Address x010 — Select Overcurrent High and Low Register (SOCHLR)
The SOCHLR register allows the MCU to configure the output overcurrent low and high detection levels, respectively. In addition to
protecting the device, this slow blow fuse emulation feature can be used to optimize the load requirements to match system characteristics.
Bits D2 : D0 are used to set the overcurrent low detection level to one of eight possible levels as defined in Table 11. Bit D3 is used to set
the overcurrent high detection level to one of two levels as defined in Table 12.
Table 11. Overcurrent Low Detection Levels
SOCL2 (D2) SOCL1 (D1) SOCL0 (D0)
Overcurrent Low Detection (Amperes)
0
0
0
50
0
0
1
45
0
1
0
40
0
1
1
35
1
0
0
30
1
0
1
25
1
1
0
20
1
1
1
15
Table 12. Overcurrent High Detection Levels
SOCH (D3)
Overcurrent High Detection (Amperes)
0
150
1
100
Address x011 — Current Detection Time and Open Load Register (CDTOLR)
The CDTOLR register is used by the MCU to determine the amount of time the device allows an overcurrent low condition before output
latches OFF occurs. Bits D1 and D0 allow the MCU to select one of four fault blanking times defined in Table 13. Note that these timeouts
apply only to the overcurrent low detection levels. If the selected overcurrent high level is reached, the device latchs off within 20 s.
Table 13. Overcurrent Low Detection Blanking Time
OCLT [1:0]
Timing
00
155 ms
01
10 ms
10
1.2 ms
11
150 s
A logic [1] on bit D2 disables the overcurrent low (CD_dis) detection timeout feature. A logic [1] on bit D3 disables the open load (OL)
detection feature.
33982
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Address x100 — Direct Input Control Register (DICR)
The DICR register is used by the MCU to enable, disable, or configure the direct IN pin control of the output. A logic [0] on bit D1 enables
the output for direct control by the IN pin. A logic [1] on bit D1 disables the output from direct control. While addressing this register, if the
input was enabled for direct control, a logic [1] for the D0 bit results in a Boolean AND of the IN pin with its corresponding D0 message bit
when addressing the OCR register. Similarly, a logic [0] on the D0 pin results in a Boolean OR of the IN pin with the corresponding
message bits when addressing the OCR register.
The DICR register is useful if there is a need to independently turn on and off several loads that are PWMed at the same frequency and
duty cycle with only one PWM signal. This type of operation can be accomplished by connecting the pertinent direct IN pins of several
devices to a PWM output port from the MCU, and configuring each of the outputs to be controlled via their respective direct IN pin. The
DICR is then used to Boolean AND the direct IN(s) of each of the outputs with the dedicated SPI bit that also controls the output. Each
configured SPI bit can now be used to enable and disable the common PWM signal from controlling its assigned output.
A logic [1] on bit D2 is used to select the high ratio (CSR1, 1/40000) on the CSNS pin. The default value [0] is used to select the low ratio
(CSR0, 1/5400). A logic [1] on bit D3 is used to select the high-speed slew rate. The default value [0] corresponds to the low-speed slew
rate.
Address 0101 — Output Switching Delay Register (OSDR)
The OSDR register is used to configure the device with a programmable time delay that is active during Output On transitions that are
initiated via the SPI (not via direct input). Whenever the input is commanded to transition from logic [0] to logic [1], the output are held OFF
for the time delay configured in the OSDR register.
The programming of the contents of this register has no effect on device Fail-safe mode operation. The default value of the OSDR register
is 000, equating to no delay, since the switching delay time is 0 ms. This feature allows the user a way to minimize inrush currents, or
surges, thereby allowing loads to be synchronously switched ON with a single command. Table 14 shows the eight selectable output
switching delay times, which range from 0 ms to 525 ms.
Table 14. Switching Delay
OSD[2:0] (D2 : D0)
Turn ON Delay (ms)
000
0
001
75
010
150
011
225
100
300
101
375
110
450
111
525
Address 1101 — Watchdog Register (WDR)
The WDR register is used by the MCU to configure the watchdog timeout. Watchdog timeout is configured using bits D1 and D0
(Table 15). When bits D1 and D0 are programmed for the desired watchdog timeout period, the WD bit (D7) should be toggled as well to
ensure that the new timeout period is programmed at the beginning of a new count sequence.
Table 15. Watchdog Timeout
WD [1:0] (D1: D0)
Timing (ms)
00
620
01
310
10
2500
11
1250
Address 0110 — No Action Register (NAR)
The NAR register can be used to no-operation fill SPI data packets in a daisy chain SPI configuration. This allows devices to not be
affected by commands being clocked over a daisy-chained SPI configuration, and by toggling the WD bit (D7) the watchdog circuitry
continues to be reset while no programming or data readback functions are being requested from the device.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Address 1110 — Undervoltage / Overvoltage Register (UOVR)
The UOVR register can be used to disable or enable the overvoltage and/or undervoltage protection. By default ([0]), both protections are
active. When disabled, an undervoltage or overvoltage condition fault is not reported in bits D1 and D0 of the output fault register.
Address x111 — TEST
The TEST register is reserved for test and is not accessible with SPI during normal operation.
SERIAL OUTPUT COMMUNICATION (DEVICE STATUS RETURN DATA)
When the CS pin is pulled low, the output status register is loaded. Meanwhile, the data is clocked out MSB- (OD7-) first as the new
message data is clocked into the SI pin. The first eight bits of data clocking out of the SO, and following a CS transition, are dependant
upon the previously written SPI word.
Any bits clocked out of the SO pin after the first eight are representative of the initial message bits clocked into the SI pin since the CS pin
first transitioned to a logic [0]. This feature is useful for daisy chaining devices as well as message verification.
A valid message length is determined following a CS transition of logic [0] to logic [1]. If there is a valid message length, the data is latched
into the appropriate registers. A valid message length is a multiple of eight bits. At this time, the SO pin is tri-stated and the fault status
register is now able to accept new fault status information.
The output status register correctly reflects the status of the STATR-selected register data at the time the CS is pulled to a logic [0] during
SPI communication and / or for the period of time since the last valid SPI communication, with the following exceptions:
• The previous SPI communication was determined to be invalid. In this case, the status reports as though the invalid SPI
communication never occurred.
• Battery transients below 6.0 V resulting in an undervoltage shutdown of the outputs may result in incorrect data loaded into the status
register. The SO data transmitted to the MCU during the first SPI communication following an undervoltage VPWR condition should
be ignored.
• The RST pin transition from a logic [0] to logic [1] while the WAKE pin is at logic [0] may result in incorrect data loaded into the status
register. The SO data transmitted to the MCU during the first SPI communication following this condition should be ignored.
Table 16. Serial Output Bit Map Descriptions
Previous STATR
D7, D2, D1, D0
Serial Output Returned Data
SOA3
SOA2
SOA1
SOA0
OD7
OD6
OD5
OD4
OD3
OD2
OD1
OD0
x
0
0
0
WDin
OTF
OCHF
OCLF
OLF
UVF
OVF
FAULT
x
0
0
1
WDin
0
0
1
0
0
CSNS EN
IN_SPI
x
0
1
0
WDin
0
1
0
SOCH
SOCL2
SOCL1
SOCL0
x
0
1
1
WDin
0
1
1
OL_dis
CD_dis
OCLT1
OCLT0
x
1
0
0
WDin
1
0
0
Fast SR
CSNS High
IN dis
A/O
0
1
0
1
0
1
0
1
FSM_HS
OSD2
OSD1
OSD0
1
1
0
1
1
1
0
1
0
WDTO
WD1
WD0
0
1
1
0
0
1
1
0
0
IN Pin
FSI Pin
WAKE Pin
1
1
1
0
1
1
1
0
0
1110
UV_dis
OV_dis
x
1
1
1
WDin
–
–
–
See Table 2
–
–
–
x = Don’t care.
SERIAL OUTPUT BIT ASSIGNMENT
The eight bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 16
summarizes the SO register content.
Bit OD7 reflects the state of the watchdog bit (D7) addressed during the prior communication. The contents of bits OD6 : OD0 depend upon
the bits D2 : D0 from the most recent STATR command SOA2 : SOA0.
Previous Address SOA[2:0] = 000
If the previous three MSBs are 000, bits OD6 : OD0 reflect the current state of the Fault register (FLTR) (Table 17).
33982
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Previous Address SOA[2:0] = 001
The data in bits OD1 and OD0 contain CSNS EN and IN_SPI programmed bits, respectively.
Previous Address SOA[2:0] = 010
The data in bit OD3 contain the programmed overcurrent high detection level (refer to Table 12), and the data in bits OD2, OD1, and OD0
contain the programmed overcurrent low detection levels (refer to Table 11).
Table 17. Fault Register
OD7
OD6
OD5
OD4
OD3
OD2
OD1
OD0
x
OTF
OCHF
OCLF
OLF
UVF
OVF
FAULT
OD7 (x) = Don’t care.
OD6 (OTF) = Overtemperature Flag.
OD5 (OCHF) = Overcurrent High Flag. (This fault is latched.)
OD4 (OCLF) = Overcurrent Low Flag. (This fault is latched.)
OD3 (OLF) = Open Load Flag.
OD2 (UVF) = Undervoltage Flag. (This fault is latched or not latched.)
OD1 (OVF) = Overvoltage Flag.
OD0 (FAULT) = This flag reports a fault and is reset by a read operation.
Note The FS pin reports a fault and is reset by a new Switch-ON command (via SPI or
direct input IN).
Previous Address SOA[2:0] = 011
The data returned in bits OD1 and OD0 are current values for the overcurrent fault blanking time, illustrated in Table 13. Bit OD2 reports
when the overcurrent detection timeout feature is active. OD3 reports whether the open load circuitry is active.
Previous Address SOA[2:0] =100
The returned data contain the programmed values in the DICR.
Previous Address SOA[2:0] =101
• SOA3 = 0. The returned data contain the programmed values in the OSDR. Bit OD3 (FSM_HS) reflects the state of the output in the
Fail-safe mode after a watchdog timeout occurs.
• SOA3 = 1. The returned data contain the programmed values in the WDR. Bit OD2 (WDTO) reflects the status of the watchdog circuitry.
If WDTO bit is logic [1], the watchdog has timed out and the device is in Fail-safe mode. If WDTO is logic [0], the device is in Normal
mode (assuming device is powered and not in the Sleep mode), with the watchdog either enabled or disabled.
Previous Address SOA[2:0] =110
• SOA3 = 0. OD2, OD1, and OD0 return the state of the IN, FSI, and WAKE pins, respectively (Table 18).
Table 18. Pin Register
OD2
OD1
OD0
IN Pin
FSI Pin
WAKE Pin
• SOA3 = 1. The returned data contains the programmed values in the UOVR register. Bit OD1 reflects the state of the undervoltage
protection, while bit OD0 reflects the state of the overvoltage protection (refer to Table 16).
Previous Address SOA[2:0] = 111
Null Data. No previous register Read Back command received, so bits OD2, OD1, and OD0 are null, or 000.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
TYPICAL APPLICATIONS
LOGIC COMMANDS AND REGISTERS
TYPICAL APPLICATIONS
VPWR
VDD
Voltage
Regulator
VDD
VDD NC VPWR
10 k
VDD
10 k
MCU
10
100nF
10µF
2
I/O
SCLK
CS
I/O
SI
SO
I/O
A/D
VPWR
10k
10k
10k
10k
4
8
7
3
11
10k
9
5
1
6
1k
VPWR
VDD
NC
WAKE
IN
SCLK
CS
RST
SO
SI
FS
CSNS
FSI
NC
33982
HS
HS
14
2.5µF
10nF
12
15
16
LOAD
GND
13
RFS
Figure 12. Typical Applications
The loads must be chosen in order to guarantee the device normal operating condition for junction temperatures from -40 °C to 150 °C.
In case of permanent short-circuit conditions, the duration and number of activation cycles must be limited with a dedicated MCU fault
management, using the fault reporting through the SPI. When driving DC motor or Solenoid loads demanding multiple switching, an
external recirculation device must be used to maintain the device in its safe operating area.
Two application notes are available:
• AN3274, which proposes safe configurations of the eXtreme switch devices in case of application faults, and to protect all circuitry with
minimum external components.
• AN2469, which provides guidelines for printed circuit board (PCB) design and assembly.
Development effort is required by the end users to optimize the board design and PCB layout, in order to reach electromagnetic
compatibility standards (emission and immunity).
33982
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
SOLDERING INFORMATION
The 33982 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board.
The AN2467 provides guidelines for Printed Circuit Board design and assembly.
PACKAGE DIMENSIONS
For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ARL10596D. Dimensions
shown are provided for reference ONLY.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
PACKAGING
PACKAGE DIMENSIONS
33982
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
ADDITIONAL DOCUMENTATION
33982
THERMAL ADDENDUM (REV 4.0)
Introduction
This thermal addendum is provided as a supplement to the 33982 technical datasheet. The
addendum provides thermal performance information that may be critical in the design and
development of system applications. All electrical, application, and packaging information
is provided in the datasheet.
High-side Switch
Packaging and Thermal Considerations
This package is a dual die package. There are two heat sources in the package
independently heating with P1 and P2. This results in two junction temperatures, TJ1 and
TJ2, and a thermal resistance matrix with RJAmn.
For m, n = 1, RJA11 is the thermal resistance from Junction 1 to the reference temperature
while only heat source 1 is heating with P1.
For m = 1, n = 2, RJA12 is the thermal resistance from Junction 1 to the reference
temperature while heat source 2 is heating with P2. This applies to RJ21 and RJ22,
respectively.
TJ1
TJ2
=
RJA11 RJA12
RJA21 RJA22
Note For package dimensions, refer to
98ARL10521D.
P1
P2
.
98ARL10521D
16-PIN PQFN
12 mm x 12 mm
The stated values are solely for a thermal performance comparison of one package to another in a standardized environment. This
methodology is not meant to and does not predict the performance of a package in an application-specific environment. Stated values
were obtained by measurement and simulation according to the standards listed below.
Standards
Table 19. Thermal Performance Comparison
1 = Power Chip, 2 = Logic Chip [C/W]
Thermal
Resistance
RJAmn (1), (2)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
20
16
39
RJBmn
(2), (3)
6
2.0
26
RJAmn
(1), (4)
53
40
73
<0.5
0.0
1.0
RJCmn (5)
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air condition.
2. 2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3. Per JEDEC JESD51-8, with the board temperature on the center trace near the
power outputs.
4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5.
5. Thermal resistance between the die junction and the exposed pad, “infinite” heat
sink attached to exposed pad.
33982
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
1.0
0.2
1.0
0.2
* All measurements
are in millimeters
Note: Recommended via diameter is 0.5 mm. PTH (plated through
hole) via must be plugged / filled with epoxy or solder mask in order
to minimize void formation and to avoid any solder wicking into the
via.
Figure 13. Surface Mount for Power PQFN
with Exposed Pads
Transparent Top View
IN
WAKE
CSNS
6 5
RST
FSI
7
FS
CS
SI
SCLK
VDD
SO
NC
12 11 10 9 8
A
4
3
2
1
A
13
GND
14
VPWR
15
HS
16
HS
33982 Pin Connections
16-Pin PQFN
0.90 mm Pitch
12.0 mm x 12.0 mm Body
Figure 14. Thermal Test Board
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
Table 20. Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area, including edge
connector for thermal testing
Area A:
Cu heat-spreading areas on board surface
Ambient Conditions:
Natural convection, still air
Table 21. Thermal Resistance Performance
Thermal
Resistance
RJAmn
1 = Power Chip, 2 = Logic Chip (C/W)
Area A
(mm2)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
0
55
42
74
300
41
32
66
600
39
29
65
RJAis the thermal resistance between die junction and ambient air. This device is a dual die package. Index m indicates the die that is
heated. Index n refers to the number of the die where the junction temperature is sensed.
Thermal Resistance [ºC/W]
80
70
60
50
40
30
20
x
10
0
0
RJA11
RJA22
RJA12 = RJA21
300
Heat spreading area A [mm²]
600
Figure 15. Device on Thermal Test Board RJA
33982
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
Thermal Resistance
(°CW)
100
10
1
x
0.1
1.00E-03
1.00E-02
1.00E-01
1.00E+00
1.00E+01
Time(s)
RJA11
RJA22
RJA12 = RJA21
1.00E+02
1.00E+03
1.00E+04
Figure 16. Transient Thermal Resistance RJA (1.0 W Step Response)
Device on Thermal Test Board Area A = 600(mm2)
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
10.0
2/2006
11.0
5/2006
12.0
1/2007
13.0
7/2007
14.0
6/2008
15.0
7/2009
16.0
10/2009
17.0
5/2012
18.0
DESCRIPTION OF CHANGES
•
•
•
•
•
•
•
•
Implemented Revision History page
Deletion of MC33982 part number, replaced with MC33982B.
Corrected Pin Connections to the proper case outline
Added final sentence to Open Load Fault (Non-Latching)
Corrected heading labels on Input Timing Switching Characteristics
Changed labels in the Typical Applications drawing
Corrected Package Dimensions to Revision C
Added Thermal Addendum (Rev 4.0).
• Added RoHS logo to the data sheet
•
•
•
•
Added Functional Internal Block Description
Minor corrections to Serial Output Bit Map Descriptions and Device Behavior in Case of Undervoltage
Changed the labeling header on Dynamic Electrical Characteristics from 150 to 125 degrees C
Updated Freescale form and style
• Added Current Sense Leakage to Static Electrical Characteristics table (Table 3).
•
•
•
•
•
•
•
Added MC33982C to the ordering information
Added a Device Variations table
Removed MC33982BPNA
Updated orderable part number from MC33982CPNA to MC33982CHFK
Updated (7)
Updated Soldering Information
Updated Freescale form and style
10/2012
• Made limit changes to Dynamic Electrical Characteristics min, typ, and max.
9/2014
• Corrected Orderable Part number information.
• Updated Freescale form and style
• Updated back page
33982
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
How to Reach Us:
Information in this document is provided solely to enable system and software implementers to use Freescale products.
Home Page:
freescale.com
There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based
Web Support:
freescale.com/support
Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no
on the information in this document.
warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance
may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by
customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others.
Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address:
freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off.
SMARTMOS is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their
respective owners.
© 2014 Freescale Semiconductor, Inc.
Document Number: MC33982
Rev. 18.0
9/2014
Similar pages