517DB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN4 3.0x3.0, 1.30P
CASE 517DB
ISSUE A
DATE 17 SEP 2014
SCALE 2:1
D
ÍÍ
ÍÍ
PIN ONE
INDICATOR
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.05 AND 0.15 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PADS AS WELL AS THE TERMINALS.
5. POSITIONAL TOLERANCE APPLIES TO ALL
OF THE EXPOSED PADS.
A B
E
TOP VIEW
A
DIM
A
A1
A3
b
D
D2
D3
E
E2
E3
E4
e
F
F1
G
L
A3
A1
0.05 C
0.05 C
NOTE 4
C
SIDE VIEW
0.10
2X
D3
C A B
M
F
NOTE 5
D2
1
SEATING
PLANE
F1
2
1
2
4
3
E2
E3
E4
4
4X
0.10
3
L
4X
M
NOTE 5
b
BOTTOM VIEW
C A B
0.10
M
C A B
0.05
M
C
NOTE 3
G
1.30
PITCH
1.40
1.20
4X
e
SUPPLEMENTAL
BOTTOM VIEW
1.17
0.87
1.00 1
0.70
0.75
2X
0.63
0.55
GENERIC
MARKING DIAGRAM*
e/2
RECOMMENDED
SOLDERING FOOTPRINT*
2.02 3.30
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.35
0.45
3.00 BSC
0.95
1.05
1.15
1.25
3.00 BSC
1.80
1.90
0.75
0.85
0.65
0.75
1.30 BSC
0.75 BSC
0.70 BSC
0.48 BSC
0.35
0.55
1
XXXX
AYWWG
G
XXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer
to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2X
0.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON91435F
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
UDFN4 3.0X3.0, 1.30P
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON91435F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
15 SEP 2014
A
CORRECTED GENERIC MARKING DIAGRAM. REQ. BY D. TRUHITTE.
17 SEP 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. A
Case Outline Number:
517DB
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