MC33984PNATAD Rev 3.0, 05/2012 Freescale Semiconductor Technical Data Dual Intelligent High-Current Self-Protected Silicon High-Side Switch (4.0 mOhm) 33984 Thermal Addendum High-Side Switch Introduction This thermal addendum is provided as a supplement to the MC33984 technical datasheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All electrical, application, and packaging information is provided in the datasheet. Packaging and Thermal Considerations This package is a dual die package. There are two heat sources in the package independently heating with P1 and P2. This results in two junction temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn. For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference temperature while only heat source 1 is heating with P1. 98ARL10521D 16-TERMINAL PQFN 12 mm x 12 mm For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the reference temperature while heat source 2 is heating with P2. This applies to RθJ21 and RθJ22, respectively. Note For package dimensions, refer to 98ARL10521D. TJ1 TJ2 = RθJA11 RθJA12 . RθJA21 RθJA22 P1 P2 The stated values are solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated values were obtained by measurement and simulation according to the standards listed below. Standards Table 1. Thermal Performance Comparison 1 = Power Chip, 2 = Logic Chip [°C/W] Thermal Resistance m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 RθJAmn (1) (2) 20 16 39 (2) (3) 6.0 2.0 26 RθJAmn (1) (4) 53 40 72 <0.5 0.0 1.0 RθJBmn RθJCmn (5) Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7 and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad; “infinite” heat sink attached to exposed pad. 1.0 0.2 1.0 0.2 * All measurements are in millimeters Note: Recommended via diameter is 0.5 mm. PTH (plated through hole) via must be plugged / filled with epoxy or solder mask in order to minimize void formation and to avoid any solder wicking into the via. Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2006-2012. All rights reserved. Figure 1. Surface Mount for Power PQFN with Exposed Pads AA Transparent Top View RST CSNS 4 WAKE 6 5 FS FSI 7 IN0 CS SI SCLK SO VDD IN1 12 11 10 9 8 3 2 1 A 13 GND 14 VPWR 15 HS1 16 HS0 33984 Terminal Connections 16-Terminal PQFN 0.90 mm Pitch 12.0 mm x 12.0 mm Body Figure 2. Thermal Test Board Device on Thermal Test Board Material: Outline: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness 80 mm x 100 mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 2. Thermal Resistance Performance 1 = Power Chip, 2 = Logic Chip (°C/W) Thermal Resistance RθJAmn Area A (mm2) m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 0 55 42 74 300 41 31 66 600 38 29 64 RθJA is the thermal resistance between die junction and ambient air. This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. 33984 2 Analog Integrated Circuit Device Data Freescale Semiconductor 80 Thermal Resistance [ºC/W] 70 60 50 40 30 x 20 10 RθJA11 RθJA22 RθJA12 = RθJA21 0 0 300 600 Heat spreading area A [mm²] Figure 3. Device on Thermal Test Board RθJA Thermal Resistance [ºC/W] 100 10 x 1 0.1 1.00E-03 1.00E-02 RθJA11 RθJA22 RθJA12 = RθJA21 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 Time[s] Figure 4. Transient Thermal Resistance RθJA (1 W Step Response) Device on Thermal Test Board Area A = 600 (mm2) 33984 Analog Integrated Circuit Device Data Freescale Semiconductor 3 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits on the Freescale reserves the right to make changes without further notice to any products herein. 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