Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC33981ABHFK PWR QFN 16 12*12*2.1P0.9 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-04-11 6158A1.6 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No Yes e4 7a MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MC33981ABHFK PWR QFN 16 12*12*2.1P0.9 ALL 0.994500 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7a:Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Epoxy Die Attach 0.0062 Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Other acrylates - 0.00054716 g Epoxy Die Attach Solvents, additives, and other materials 1,1'-(methylenedi-p-phenylene)bismaleimide 13676-54-5 0.00020518 g Epoxy Die Attach Metals Palladium, metal 7440-05-3 0.00001026 Epoxy Die Attach Plastics/polymers Proprietary Material-Other polymers - Epoxy Die Attach Metals Silver, metal Epoxy Die Attach Plastics/polymers Proprietary Material-Other Methacrylate compounds Solder Die Attach Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 88252 8.8252 550 0.055 33094 3.3094 206 0.0206 g 1655 0.1655 10 0.001 0.00010259 g 16547 1.6547 103 0.0103 7440-22-4 0.00512963 g 827358 82.7358 5157 0.5157 - 0.00020518 g 33094 3.3094 206 0.0206 g 0.0123 7a g Solder Die Attach Lead/Lead Compounds Lead 7439-92-1 0.0113775 g 925000 92.5 11440 1.144 Solder Die Attach Metals Silver, metal 7440-22-4 0.0003075 g 25000 2.5 309 0.0309 Solder Die Attach Metals Tin, metal 7440-31-5 0.000615 g 50000 5 618 0.0618 Die Encapsulant 0.4766 g Die Encapsulant Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00475409 g 9975 0.9975 4780 0.478 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0.03565588 g 74813 7.4813 35853 3.5853 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00142646 g 2993 0.2993 1434 0.1434 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - 0.00451626 g 9476 0.9476 4541 0.4541 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.02614771 g 54863 5.4863 26292 2.6292 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.4040996 g 847880 84.788 406334 40.6334 1000000 100 13071 1.3071 Bonding Wire, Aluminum 0.013 Bonding Wire, Aluminum Silicon Semiconductor Die g Metals Aluminum, metal 7429-90-5 0.013 0.01555 g g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000311 g 20000 2 312 0.0312 Silicon Semiconductor Die Glass Silicon, doped - 0.015239 g 980000 98 15323 1.5323 Bonding Wire, PdCu 0.0009 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.00088938 g 988200 98.82 894 0.0894 Bonding Wire, PdCu Metals Gold, metal 7440-57-5 0.00000072 g 800 0.08 0 0 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.0000099 g 11000 1.1 9 0.0009 Copper Lead Frame 0.4544 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.44180312 g 972278 97.2278 444258 44.4258 Copper Lead Frame Metals Gold, metal 7440-57-5 0.00013632 g 300 0.03 137 0.0137 Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.0109156 g 24022 2.4022 10975 1.0975 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.00086336 g 1900 0.19 868 0.0868 Copper Lead Frame Metals Zirconium, metal 7440-67-7 0.0006816 g 1500 0.15 685 0.0685 Silicon Semiconductor Die 0.01555 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000311 g 20000 2 312 0.0312 Silicon Semiconductor Die Glass Silicon, doped - 0.015239 g 980000 98 15323 1.5323 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC33981ABHFK_IPC1752_v11.xml http://www.freescale.com/mcds/MC33981ABHFK_IPC1752A.xml